Mode field adapter packaging base

Abstract

The embodiment of the utility model provides a mode field adapter packaging base. The mode field adapter packaging base comprises a substrate base; the optical fiber placing groove is embedded into the substrate base, and the optical fiber placing groove is used for placing an optical fiber to be packaged; the positioning grooves are formed in the left side and the right side, which are oppositely arranged, of the substrate base; and the positioning pin holes are arranged along the optical fiber placing grooves, and the substrate base is fixed on the material disc through the positioning pin holes. According to the mode field adapter packaging base provided by the utility model, the mode field adapter is fixed on the charging tray through the positioning pin holes arranged on the mode field adapter packaging base, so that the positioning and automatic packaging of the mode field adapter packaging base can be realized more simply and efficiently.

Description

Technical Field

[0001] The utility model relates to the technical field of optical device packaging, in particular to a mode field adapter packaging base. Background Art

[0002] High-power fiber lasers are increasingly used in industrial processing, optoelectronic countermeasures and other fields. At present, the scheme of achieving high-power and high-beam-quality output through the master oscillator power amplifier (MOPA) structure is widely adopted. The initial laser seed source of the fiber laser is output in single mode or quasi-single mode and amplified in the subsequent optical fiber with a larger core size to reduce the influence of nonlinear effects and obtain higher power.

[0003] In the amplification system, in order to solve the problem of fusion loss of optical fibers with different mode field diameters, a fiber mode field adapter (MFA) should be added between the two stages. A well-packaged fiber mode field adapter can effectively reduce the loss of the laser output from the front-stage fiber core entering the back-stage fiber core, reduce the excitation of high-order modes in the back-stage fiber, and improve the coupling efficiency of the fiber core light between the two stages. Therefore, the packaging of the fiber mode field adapter is very important. Utility Model Content

[0004] The embodiment of the utility model provides a mold field adapter packaging base, which can well connect and fix the mold field adapter packaging base and the material tray by using the positioning pin hole.

[0005] In one aspect, the utility model provides a mode field adapter package base, comprising: a substrate base;

[0006] An optical fiber placement groove, wherein the optical fiber placement groove is embedded in the substrate base and is used to place the optical fiber to be packaged;

[0007] A positioning groove, wherein the positioning groove is arranged on the left and right sides of the substrate base which are arranged opposite to each other;

[0008] A positioning pin hole is provided along the optical fiber placement groove, and the substrate base is positioned in the positioning pin on the material tray through the positioning pin hole.

[0009] In some embodiments of the present invention, there are multiple positioning pin holes, and the multiple positioning pin holes are respectively arranged on the upper and lower sides of the optical fiber placement groove.

[0010] In some embodiments of the present invention, a plurality of positioning pin holes located on different sides are arranged diagonally.

[0011] In some embodiments of the present invention, the mode field adapter packaging base further includes a threaded hole, into which a screw can be inserted to package the optical fiber.

[0012] In some embodiments of the present invention, there are multiple threaded holes, and the multiple threaded holes are respectively arranged on the upper and lower sides of the optical fiber placement groove, and the multiple threaded holes located on different sides are arranged diagonally.

[0013] In some embodiments of the present invention, the plurality of positioning pin holes and the plurality of threaded holes located on the same side are evenly spaced apart.

[0014] In some embodiments of the present invention, the positioning groove is a cross-shaped groove.

[0015] In some embodiments of the present invention, the substrate base is a rectangular structure, the positioning groove is connected to the optical fiber placement groove, and the positioning groove extends along the long side of the substrate base to penetrate the substrate base.

[0016] In some embodiments of the present invention, the substrate base is made of metal material.

[0017] In some embodiments of the present invention, the mode field adapter further includes a glue coating area, and the glue coating area is located on a side of the positioning groove close to the central area of ​​the substrate base.

[0018] The embodiment of the utility model provides a mode field adapter packaging base, including: a substrate base; an optical fiber placement groove, the optical fiber placement groove is embedded in the substrate base, and the optical fiber placement groove is used to place the optical fiber to be packaged; a positioning groove, the positioning groove is arranged on the left and right sides of the substrate base that are relatively arranged; a positioning pin hole, the positioning pin hole is arranged along the optical fiber placement groove, and the substrate base is fixed to the material tray through the positioning pin hole. The mode field adapter packaging base provided by the utility model fixes the mode field adapter to the material tray through the positioning pin hole arranged on the mode field adapter packaging base, so as to realize the positioning and automatic packaging of the mode field adapter packaging base more simply and efficiently. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 It is a top view of an embodiment of a mode field adapter packaging base provided by an embodiment of the utility model;

[0021] Figure 2It is a schematic diagram of an embodiment of a positioning groove provided in an embodiment of the utility model. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.

[0023] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0024] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0025] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0026] The disclosure below provides many different embodiments or examples for realizing different structures of the utility model. In order to simplify the disclosure of the utility model, the components and settings of specific examples are described below. Of course, they are merely examples, and the purpose is not to limit the utility model. In addition, the utility model may repeat reference numbers and / or reference letters in different examples, and such repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the utility model provides various specific examples of processes and materials, but those of ordinary skill in the art may be aware of the application of other processes and / or the use of other materials.

[0027] For details, please refer to Figure 1 The present utility model provides a mode field adapter packaging base, and the mode field adapter packaging base may include:

[0028] A substrate base 10;

[0029] An optical fiber placement groove 20, the optical fiber placement groove is embedded in the substrate base 10, and the optical fiber placement groove 20 is used to place the optical fiber to be packaged;

[0030] Positioning grooves 30, the positioning grooves 30 are arranged on the left and right sides of the substrate base 10 which are arranged oppositely;

[0031] The positioning pin hole 40 is arranged along the optical fiber placement groove 20 , and the substrate base 10 is fixed on the material tray through the positioning pin hole 40 .

[0032] The embodiment of the utility model provides a mode field adapter packaging base, including: a substrate base; an optical fiber placement groove, the optical fiber placement groove is embedded in the substrate base, and the optical fiber placement groove is used to place the optical fiber to be packaged; a positioning groove, the positioning groove is arranged on the left and right sides of the substrate base that are relatively arranged; a positioning pin hole, the positioning pin hole is arranged along the optical fiber placement groove, and the substrate base is fixed to the material tray through the positioning pin hole. The mode field adapter packaging base provided by the utility model fixes the mode field adapter to the material tray through the positioning pin hole arranged on the mode field adapter packaging base, so as to realize the positioning and automatic packaging of the mode field adapter packaging base more simply and efficiently.

[0033] The following combination Figure 1 The mode field adapter packaging base provided by the utility model is described in detail. Please refer to Figure 1 ,exist Figure 1 In the embodiment, the top view structure of the substrate base 10 is a rectangular structure, and the optical fiber placement groove 20 is formed on the substrate base 10. The optical fiber placement groove 20 is arranged along the long side of the substrate base 10, and the length of the optical fiber placement groove 20 is generally greater than the length of the long side of the substrate base 10. Figure 1 For example, the fiber placement groove 20 usually runs through the entire substrate base from left to right. This is because when using the mode field adapter to package the optical fiber, a certain length of optical fiber needs to be reserved for dispensing and packaging at the head and tail of the optical fiber; therefore, the length of the fiber placement groove 20 is greater than the length of the long side of the substrate base 10.

[0034] The positioning grooves 30 are arranged on the left and right sides of the substrate base 10, that is, the positioning grooves 30 are arranged on the two short sides of the substrate base 10. In the actual process of packaging optical fibers, the positioning grooves 30 need to be filled with glue to connect the optical fibers and other packaging structures. At the same time, the positioning grooves 30 can also limit the optical fibers placed in the optical fiber positioning grooves 30.

[0035] like Figure 2 The figure is a schematic diagram of the structure of an embodiment of the positioning groove provided by the utility model. Figure 2 In the embodiment, the positioning groove 30 can be a cross-shaped groove. Figure 1 and Figure 2 , the optical fiber placement groove 20 and the positioning groove 30 are actually connected. The above embodiments have shown that the length of the optical fiber placement groove 20 is greater than the length of the long side of the substrate base 10, and the positioning groove 30 also extends along the long side direction of the substrate base 10 to penetrate the substrate base. In other words, there is an overlapping part between the positioning groove 30 and the optical fiber placement groove 20, and one groove in the cross-shaped positioning groove 30 overlaps with the direction of the optical fiber placement groove 20. Figure 1Taking the angle shown as an example, the positioning groove 30 can limit the optical fiber in the up and down directions, and the bottom of the optical fiber is also limited by the positioning groove 30, and the top of the optical fiber can be limited by other packaging components covering the optical fiber.

[0036] exist Figure 1 In the embodiment shown, the positioning grooves 30 are arranged near the two short sides on the left and right sides of the substrate base 10; in other embodiments, the positioning grooves 30 may also be arranged near the central area of ​​the substrate base 10, as long as the optical fiber can be limited. However, it should be noted that the positioning grooves 30 are usually an even number, and the even number of positioning grooves 30 are symmetrically arranged on the substrate base 10.

[0037] Please refer to Figure 1 , the mode field adapter packaging base also includes a positioning pin hole 40, which is arranged along the direction of the optical fiber placement groove 20. The substrate base 10 is fixed on the tray through the positioning pin hole 40. Specifically, when the optical fiber is actually packaged, the optical fiber is placed on the substrate base 10, and the substrate base 10 also needs to be placed on the tray to cover the cover plate above the tray to achieve packaging; therefore, the substrate base 10 also needs to be fixed on the tray to prevent the substrate base 10 from being displaced during the packaging process, affecting the packaging. In an embodiment of the utility model, a positioning pin hole 40 can be formed on the substrate base 10, and a positioning pin is formed on the tray; the positioning pin on the tray is inserted into the positioning pin hole 40 on the substrate base 10, so that the substrate base 10 is fixed on the tray. Since the tray is usually below the substrate base 10 to carry the substrate base 10, the positioning pin hole 40 is usually formed on the substrate base 10, and the positioning pin is formed on the tray, rather than forming the positioning pin on the substrate base and forming the positioning pin hole on the tray.

[0038] Please continue reading Figure 1 ,exist Figure 1 In the illustrated mode field adapter packaging base, there can be multiple positioning pin holes 40, and the multiple positioning pin holes 40 are respectively arranged on the upper and lower sides of the optical fiber placement groove 20; if the mode field adapter packaging base is observed from the side, the multiple positioning pin holes 40 are arranged on the left and right sides of the optical fiber placement groove 20. Figure 1 In the illustrated embodiment, the plurality of locating pin holes 40 located on different sides are arranged at diagonal positions. Figure 1 The positioning pin holes 401 and 402 located at the upper and lower sides of the optical fiber placement groove 20 are respectively arranged in diagonal directions and are not on the same straight line. The positioning pin holes arranged in this way have low positioning accuracy, but high degree of freedom and are easy to connect with the positioning pins; they are suitable for scenarios such as mode field adapter packaging, which require frequent connection and disconnection of positioning pins and do not require high positioning accuracy.

[0039] In some embodiments, when there are only one or two positioning pin holes 40, it is convenient to frequently install and disassemble the mold field adapter packaging base, which can improve the packaging efficiency. If there are multiple positioning pin holes 40, the mold field adapter packaging base can be better fixed, avoiding displacement between the material tray and the mold field adapter packaging base, and improving the accuracy of subsequent packaging; at the same time, appropriately increasing the number of positioning pin holes 40 can also reduce the weight of the mold field packaging adapter base to a certain extent, which is beneficial to the subsequent packaging process. Therefore, in the embodiment of the utility model, the number of positioning pin holes can be set according to actual needs.

[0040] It should be noted that in some embodiments, if there are multiple positioning pin holes 40, multiple positioning pin holes on different sides can also be arranged in parallel; but the positioning pins on the tray are usually arranged diagonally. In this way, when the tray and the mold field adapter packaging base are actually fixedly connected, since the positioning pins are arranged diagonally, even if multiple positioning pin holes are arranged in parallel, the positioning pin holes actually used are also arranged diagonally, and the tray and the mold field adapter packaging base can also be fixedly connected; in this way, there is no need to use all the positioning pin holes 40, which can also improve the efficiency of packaging.

[0041] exist Figure 1 In the embodiment shown, the mode field adapter packaging base is further provided with threaded holes 50, which are also provided on the upper and lower sides of the optical fiber placement groove 20. In the embodiment of the utility model, screws can be inserted into the threaded holes to fix the cover plate and the substrate base 10 to achieve the packaging of the optical fiber. In some embodiments, there are multiple threaded holes 50, which are evenly distributed on the upper and lower sides of the optical fiber placement groove 20, and on the same side of the optical fiber placement groove 20, the threaded holes 50 and the positioning pin holes 40 can be evenly and alternately distributed; that is, multiple threaded holes located on different sides can also be arranged at diagonal positions.

[0042] In other embodiments, the multiple threaded holes 50 on different sides may be located on the same straight line, rather than being arranged at diagonal positions; similarly, the multiple positioning pin holes 40 on different sides may also be located on the same straight line, rather than being arranged at diagonal positions. However, the multiple threaded holes 50 and the multiple positioning pin holes 40 on the same side may be arranged at evenly alternating intervals.

[0043] It should be noted that the mode field adapter package base provided in the embodiment of the present utility model also includes a glue-coated area; and there are usually two glue-coated areas, and the two glue-coated areas are respectively arranged close to the short sides of the substrate base 10. At the same time, compared with the positioning groove 30, the two glue-coated areas are located around the positioning groove 30 and away from the side of the short side of the substrate base 10; that is, the two glue-coated areas are closer to the central area of ​​the substrate base 10.

[0044] An embodiment of the present application also provides a mode field adapter packaging tray. The mode field adapter packaging base described in any of the aforementioned embodiments can be placed on the mode field adapter packaging tray. Specifically, a positioning pin hole 40 is provided on the mode field adapter packaging base, and a positioning pin is formed on the mode field adapter packaging tray. The mode field adapter packaging tray and the mode field adapter packaging base can be connected and fixed by the positioning pin and the positioning pin hole.

[0045] At the same time, the mode field packaging adapter packaging tray can also include a glass tube positioning seat, and a glass tube positioning seat groove is formed on the glass tube positioning seat; the optical fiber can be placed in the glass tube, and the glass tube can be clamped in the glass tube positioning seat groove to achieve positioning of the glass tube, and the optical fiber can also be fixed on the mode field adapter packaging tray through the glass tube positioning seat.

[0046] There are usually multiple glass tube positioning seats, which are usually respectively arranged on the left and right sides of the substrate base 10, that is, on the two short sides of the substrate base 10. Figure 1 As shown in the positioning groove 30 , when the mode field adapter package base includes both the positioning groove and the glass tube positioning seat, the positioning groove and the glass tube positioning seat can be located on the same straight line.

[0047] In an embodiment of the utility model, the mode field adapter packaging tray may include a mode field adapter packaging base and a glass tube positioning seat at the same time, so as to realize the packaging of ordinary optical fibers and the packaging of optical fibers in glass tubes. The size of the optical fiber placement groove and the size of the glass tube can be selected according to actual needs to adapt to optical fibers of different sizes. In a specific embodiment, the mode field adapter packaging base may include multiple optical fiber placement grooves of different sizes and multiple glass tubes of different sizes at the same time, so that multiple optical fibers of different sizes can be packaged at the same time.

[0048] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0049] The electronic device provided by an embodiment of the utility model is introduced in detail above. Specific examples are used in this article to illustrate the principle and implementation mode of the utility model. The description of the above embodiments is only used to help understand the technical solution and core idea of ​​the utility model. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the utility model.

Claims

1. A mode field adapter packaging base, characterized in that: include: substrate base; An optical fiber placement groove, wherein the optical fiber placement groove is embedded in the substrate base and is used to place the optical fiber to be packaged; A positioning groove, wherein the positioning groove is arranged on the left and right sides of the substrate base which are arranged opposite to each other; A positioning pin hole is provided along the optical fiber placement groove, and the substrate base is positioned in the positioning pin on the material tray through the positioning pin hole.

2. The mode field adapter package base according to claim 1, characterized in that: There are multiple positioning pin holes, which are respectively arranged on the upper and lower sides of the optical fiber placement groove.

3. The mode field adapter package base according to claim 2, characterized in that: A plurality of positioning pin holes located on different sides are arranged diagonally.

4. The mode field adapter package base according to claim 2, characterized in that: The mode field adapter packaging base also includes a threaded hole, and a screw can be inserted into the threaded hole to package the optical fiber.

5. The mode field adapter package base according to claim 4, characterized in that: There are multiple threaded holes, which are respectively arranged on the upper and lower sides of the optical fiber placement groove, and the multiple threaded holes located on different sides are arranged diagonally.

6. The mode field adapter package base according to claim 5, characterized in that: A plurality of positioning pin holes and a plurality of threaded holes located on the same side are evenly spaced and arranged.

7. The mode field adapter package base according to claim 1, characterized in that: The positioning groove is a cross-shaped groove.

8. The mode field adapter package base according to claim 7, characterized in that: The substrate base is a rectangular structure, the positioning groove is connected to the optical fiber placement groove, and the positioning groove extends along the long side of the substrate base to penetrate the substrate base.

9. The mode field adapter package base according to claim 1, characterized in that: The substrate base is made of metal material.

10. The mode field adapter package base according to claim 1, characterized in that: The mode field adapter further comprises a glue coating area, and the glue coating area is located on a side of the positioning groove close to the central area of ​​the substrate base.

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