IC chip suction mechanism

Abstract

The utility model discloses an IC chip suction mechanism, and relates to the technical field of IC chip processing. Comprising a top plate, buffering mechanisms are fixedly installed at the four corners of the lower surface of the top plate in a rectangular shape, a transverse plate is fixedly installed between the lower surfaces of the buffering mechanisms, an adsorption head is fixedly installed on the lower surface of the transverse plate, and four adsorption cavities are formed between the peripheral side faces and the lower surface of the adsorption head; connecting mechanisms are fixedly mounted on the peripheral side faces, corresponding to the adsorption cavity, of the adsorption head, and the upper side ends of the connecting mechanisms communicate with air pipe joints; the attaching force between the suction mechanism and the IC chip can be monitored through the buffer mechanism, so that the attaching force between the suction mechanism and the IC chip is moderate, the problem that the IC chip is damaged due to the fact that attaching is not tight and the attaching force is too large is solved, meanwhile, the multiple suction cavities are arranged, when one suction cavity can suck the IC chip, the IC chip can be sucked, and the suction efficiency is improved. And the suction of the IC chip is more stable and efficient.

Description

Technical Field

[0001] The utility model relates to the technical field of IC chip processing, in particular to an IC chip suction mechanism. Background Art

[0002] An IC chip (Integrated Circuit) is an integrated circuit formed by placing a large number of microelectronic components (transistors, resistors, capacitors, etc.) on a plastic substrate to make a chip. Almost all chips seen today can be called IC chips.

[0003] In the prior art, an IC chip suction mechanism is used to suck the chip and cooperate with the movement of the relevant manipulator to realize the movement of the chip. When a conventional suction mechanism sucks the IC chip, it is necessary to attach the suction mechanism to the IC chip. However, there is an unstable bonding force between the suction mechanism and the IC chip. There is a problem that the bonding is not tight and cannot be sucked, or the bonding force is too large, causing damage to the IC chip. At the same time, the traditional suction mechanism has only one suction cavity. When there is a gap between the suction cavity and the IC chip, the IC chip cannot be sucked and the suction is unstable. Utility Model Content

[0004] The utility model provides an IC chip suction mechanism to solve the problems in the background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an IC chip suction mechanism, comprising a top plate, the four corners of the lower surface of the top plate are rectangular and fixedly installed with a buffer mechanism, a cross plate is fixedly installed between the lower surfaces of the buffer mechanism, an adsorption head is fixedly installed on the lower surface of the cross plate, four adsorption cavities are opened between the surrounding sides of the adsorption head and the lower surface, and connecting mechanisms are fixedly installed on the surrounding sides of the adsorption head corresponding to the adsorption cavity, and the upper side ends of the connecting mechanisms are connected to the air pipe joints, and the air pipe joints are fixedly installed on the lower side wall of the top plate.

[0006] Furthermore, a mounting frame is fixedly mounted on the upper surface of the top plate, and a mounting hole is formed on the upper side wall of the mounting frame.

[0007] Furthermore, the buffer mechanism includes a spring, a pressure sensor, a guide rod and a guide hole. The spring is fixedly installed on the lower surface of the top plate, the pressure sensor is fixedly installed on the lower surface of the spring, the guide rod is fixedly installed on the upper surface of the pressure sensor, a guide hole is opened on the top plate corresponding to the guide rod, and the guide rod is movably inserted in the guide hole.

[0008] Furthermore, a rubber pad is fixedly mounted on the lower surface of the adsorption head, and adsorption holes are provided on the rubber pad at positions corresponding to the four adsorption cavities.

[0009] Furthermore, the connecting mechanism includes a first hose, a solenoid valve and a second hose. The first hose is fixedly installed on the side of the adsorption head corresponding to the adsorption chamber. The upper end of the first hose is connected to the solenoid valve. The solenoid valve is installed on the upper surface of the horizontal plate. The upper port of the solenoid valve is connected to the air pipe joint through the second hose.

[0010] Furthermore, a through hole for the first hose to pass through is provided on the transverse plate at a position corresponding to the first hose.

[0011] Compared with the prior art, the utility model provides an IC chip suction mechanism, which has the following beneficial effects:

[0012] 1. The IC chip suction mechanism monitors the upward force of the horizontal plate by setting a buffer mechanism, that is, the upward force of the suction head on the lower surface of the horizontal plate is monitored, so that the bonding force between the suction mechanism and the IC chip can be monitored to make the bonding force between the two moderate, avoiding the problem that the bonding suction head and the IC chip are not tightly bonded and cannot be sucked, or the bonding force is too large to damage the IC chip, thereby ensuring the stability of suction.

[0013] 2. The IC chip suction mechanism is provided with four suction chambers, and the four suction chambers are connected to the air pipe joint through a separate connecting mechanism, so that the suction head has multiple suction chambers. When there is an suction chamber that can absorb the IC chip, the IC chip can be sucked, making the IC chip suction more stable and efficient. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the structure of the utility model;

[0015] Figure 2 It is a cross-sectional view of the utility model;

[0016] Figure 3 It is a cross-sectional view of the adsorption head of the utility model.

[0017] In the figure: 1. top plate; 2. buffer mechanism; 201. spring; 202. pressure sensor; 203. guide rod; 204. guide hole; 3. cross plate; 4. adsorption head; 5. adsorption chamber; 6. connecting mechanism; 601. first hose; 602. solenoid valve; 603. second hose; 7. air pipe joint; 8. mounting bracket; 9. mounting hole; 10. rubber pad; 11. adsorption hole; 12. through hole. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] See also Figure 1-Figure 3 The utility model discloses an IC chip suction mechanism, including a top plate 1, a buffer mechanism 2 is fixedly installed on the four corners of the lower surface of the top plate 1 in a rectangular shape, a horizontal plate 3 is fixedly installed between the lower surfaces of the buffer mechanism 2, an adsorption head 4 is fixedly installed on the lower surface of the horizontal plate 3, four adsorption cavities 5 are opened between the surrounding sides of the adsorption head 4 and the lower surface, and connecting mechanisms 6 are fixedly installed on the surrounding sides of the adsorption head 4 corresponding to the adsorption cavities 5, and the upper side ends of the connecting mechanisms 6 are connected with the air pipe joint 7, and the air pipe joint 7 is fixedly installed on the lower side wall of the top plate 1.

[0020] Specifically, a mounting frame 8 is fixedly mounted on the upper surface of the top plate 1 , and a mounting hole 9 is formed on the upper side wall of the mounting frame 8 .

[0021] In this embodiment, the mounting holes 9 on the mounting frame 8 are conveniently connected to the manipulator via screws, so that the manipulator drives the suction mechanism to move.

[0022] Specifically, the buffer mechanism 2 includes a spring 201, a pressure sensor 202, a guide rod 203 and a guide hole 204. The spring 201 is fixedly installed on the lower surface of the top plate 1, the pressure sensor 202 is fixedly installed on the lower surface of the spring 201, the guide rod 203 is fixedly installed on the upper surface of the pressure sensor 202, and a guide hole 204 is opened on the top plate 1 corresponding to the guide rod 203, and the guide rod 203 is movably inserted in the guide hole 204.

[0023] In this embodiment, the spring 201 pushes the pressure sensor 202 to move downward, so that the pressure sensor 202 monitors the upward force of the horizontal plate 3, that is, monitors the upward force of the adsorption head 4 on the lower surface of the horizontal plate 3. The guide rod 203 moves up and down in the guide hole 204 with the pressure sensor 202, so that the up and down movement process of the pressure sensor 202 is stable, that is, the up and down movement process of the adsorption head 4 on the lower surface of the horizontal plate 3 is stable.

[0024] Specifically, a rubber pad 10 is fixedly mounted on the lower surface of the adsorption head 4 , and adsorption holes 11 are provided on the rubber pad 10 at positions corresponding to the four adsorption cavities 5 .

[0025] In this embodiment, the rubber pad 10 allows the lower surface of the adsorption head 4 to be in flexible contact with the upper surface of the IC chip, which is not easy to damage the IC chip, and the adsorption holes 11 adsorb and fix the upper surface of the IC chip.

[0026] Specifically, the connecting mechanism 6 includes a first hose 601, a solenoid valve 602 and a second hose 603. The first hose 601 is fixedly installed on the side of the adsorption chamber 5 corresponding to the adsorption head 4. The upper end of the first hose 601 is connected to the solenoid valve 602. The solenoid valve 602 is installed on the upper surface of the horizontal plate 3. The upper port of the solenoid valve 602 is connected to the air pipe connector 7 through the second hose 603.

[0027] In this embodiment, the solenoid valve 602 is opened, and the air pipe connector 7 can evacuate the air in the adsorption chamber 5 through the first hose 601 and the second hose 603 .

[0028] Specifically, a through hole 12 for the first hose 601 to pass through is opened on the horizontal plate 3 at a position corresponding to the first hose 601 .

[0029] In this embodiment, the through hole 12 meets the requirement of the first hose 601 to pass through and be installed on the transverse plate 3 .

[0030] When in use, the mounting holes 9 on the mounting frame 8 are conveniently connected to the manipulator through screws, so that the manipulator drives the suction mechanism to move, and the manipulator drives the suction head 4 to move to the upper surface of the IC chip, and makes the lower surface of the rubber pad 10 on the lower surface of the suction head 4 fit with the upper surface of the IC chip. In the process of the two fitting together, the spring 201 in the buffer mechanism 2 pushes the pressure sensor 202 to move downward, and the pressure sensor 202 drives the rubber pad 10 on the lower surface of the suction head 4 to move downward through the cross plate 3. Then, the IC chip applies an upward force to the suction head 4 on the upper surface of the rubber pad 10, so that the pressure sensor 202 monitors the upward force of the suction head 4 on the lower surface of the cross plate 3. When the forces of the two reach the set value, the information is fed back to the controller, and the controller stops the manipulator from moving downward, so that the suction The fitting strength between the mechanism and the IC chip is monitored to ensure that the fitting strength between the two is moderate, to avoid the problem that the fitting adsorption head 4 and the IC chip are not tightly fitted and cannot be adsorbed, or the fitting strength is too large to damage the IC chip, to ensure the stability of absorption, the air pipe joint 7 is connected to the vacuum assembly, the solenoid valve 602 in the connecting mechanism 6 is opened, and the four adsorption chambers 5 are evacuated through the air pipe joint 7 and the first hose 601 and the second hose 603 in the four connecting mechanisms 6, so that the IC chip is adsorbed on the adsorption hole 11, and the four adsorption chambers 5 are connected to the air pipe joint 7 through a separate connecting mechanism 6, so that the adsorption head 4 has four adsorption chambers 5, when there is an adsorption chamber 5 that can adsorb the IC chip, the IC chip can be adsorbed, so that the IC chip absorption is more stable and efficient.

[0031] In summary, the IC chip suction mechanism can monitor the fitting strength between the suction mechanism and the IC chip through the buffer mechanism 2, so that the fitting strength between the two is moderate, avoiding the problems of loose fitting and excessive fitting strength that damages the IC chip. At the same time, it has four adsorption chambers 5. When there is an adsorption chamber 5 that can adsorb the IC chip, the IC chip can be sucked, making the IC chip suction more stable and efficient.

[0032] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An IC chip suction mechanism, comprising a top plate (1), characterized in that: The four corners of the lower surface of the top plate (1) are rectangular and fixedly mounted with a buffer mechanism (2); a horizontal plate (3) is fixedly mounted between the lower surfaces of the buffer mechanism (2); an adsorption head (4) is fixedly mounted on the lower surface of the horizontal plate (3); four adsorption cavities (5) are provided between the surrounding side surfaces of the adsorption head (4) and the lower surface; connecting mechanisms (6) are fixedly mounted on the surrounding side surfaces of the adsorption head (4) corresponding to the adsorption cavities (5); the upper ends of the connecting mechanisms (6) are connected to the air pipe joints (7); and the air pipe joints (7) are fixedly mounted on the lower side wall of the top plate (1).

2. The IC chip suction mechanism according to claim 1, characterized in that: A mounting frame (8) is fixedly mounted on the upper surface of the top plate (1), and a mounting hole (9) is formed on the upper side wall of the mounting frame (8).

3. The IC chip suction mechanism according to claim 1, characterized in that: The buffer mechanism (2) comprises a spring (201), a pressure sensor (202), a guide rod (203) and a guide hole (204); the spring (201) is fixedly mounted on the lower surface of the top plate (1); the pressure sensor (202) is fixedly mounted on the lower surface of the spring (201); the guide rod (203) is fixedly mounted on the upper surface of the pressure sensor (202); a guide hole (204) is provided on the top plate (1) corresponding to the guide rod (203); and the guide rod (203) is movably inserted into the guide hole (204).

4. The IC chip suction mechanism according to claim 1, characterized in that: A rubber pad (10) is fixedly mounted on the lower surface of the adsorption head (4), and adsorption holes (11) are provided on the rubber pad (10) at positions corresponding to the four adsorption chambers (5).

5. The IC chip suction mechanism according to claim 1, characterized in that: The connecting mechanism (6) comprises a first hose (601), a solenoid valve (602) and a second hose (603); the first hose (601) is fixedly mounted on the side of the adsorption chamber (5) corresponding to the adsorption head (4); the upper end of the first hose (601) is connected to the solenoid valve (602); the solenoid valve (602) is mounted on the upper surface of the transverse plate (3); the upper port of the solenoid valve (602) is connected to the air pipe connector (7) via the second hose (603).

6. The IC chip suction mechanism according to claim 5, characterized in that: A through hole (12) for the first hose (601) to pass through is provided on the horizontal plate (3) at a position corresponding to the first hose (601).

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