Detection device for LED chip

Abstract

The utility model discloses a detection device used for an LED chip, comprising a pedestal, the top of the pedestal is provided with a placing rack, the placing rack comprises a placing plate, the top of the placing plate is provided with a first groove, the center of the bottom of the first groove is provided with a through groove penetrating up and down, the top of the pedestal located in the through groove is embedded with an adsorption bench, and the adsorption bench is provided with an adsorption groove. Second grooves penetrating through the first grooves are formed in the left side face and the right side face of the containing plate correspondingly, detection assemblies are arranged at the positions, located on the two sides of the adsorption table, of the top of the base correspondingly, and a control panel is arranged at the top of the base. The utility model solves the problems that the adhesive strength cannot be reflected by a uniform numerical value due to different force mastering degrees of each person at present, the manual prying by tweezers is generally difficult to operate, and the labor intensity of operators is greatly increased due to the adoption of the method for detecting for a long time.

Description

Technical Field

[0001] The utility model relates to the technical field of micro display device detection, in particular to a detection device for LED chips. Background Art

[0002] Micro-LED display technology refers to a display technology that uses naturally luminous micron-sized LEDs as light-emitting pixel units and assembles them on a drive panel to form a high-density LED array. Due to the small size, high integration and self-luminescence of Micro-LED chips, it has greater advantages than LCD and OLED in terms of brightness and resolution, contrast, energy consumption, service life, response speed and thermal stability.

[0003] The production process of micro display chips on the market is complicated. When encapsulating silicon-based micro LED display chips, it is necessary to use glue dispensing equipment to dispense glue in the glass patch lead frame, and use auxiliary production jigs to patch and install silicon-based micro LED display chips. After the glue is cured, it is necessary to sample and test it, mainly to test the bonding strength between the silicon-based micro LED display chip and the glass patch. Most of the existing tests use manual testing, using handheld tweezers to pry open the silicon-based micro LED display chip and the glass patch, but this method often has several shortcomings: 1. Everyone has a different grasp of force, and it is impossible to use a unified value to reflect the bonding strength; 2. Manual prying with tweezers is usually difficult to operate, and long-term use of this method for testing greatly increases the labor intensity of the operator. In this regard, a detection device for LED chips is proposed to solve the above problems. Summary of the invention

[0004] The purpose of the utility model is to provide a detection device for LED chips, so as to solve the problems mentioned in the background technology.

[0005] In order to achieve the above object, the technical solution of the utility model is:

[0006] A detection device for LED chips, comprising a base, a placement rack is arranged on the top of the base, the placement rack comprises a placement plate, a first groove is opened on the top of the placement plate, a through groove penetrating up and down is opened at the center of the bottom of the first groove, an adsorption platform is embedded on the top of the base located in the through groove, second grooves penetrating to the first groove are opened on the left and right sides of the placement plate, detection components are arranged on the top of the base located on both sides of the adsorption platform, and a control panel is arranged on the top of the base.

[0007] Furthermore, a third groove is provided on the top of the adsorption platform, and the third groove is a cross-shaped groove. An air outlet is provided in the center of the top of the third groove and passes through the third groove from top to bottom.

[0008] Furthermore, the detection component includes a connecting plate arranged on the top of the base, a fourth groove extending from the edge of the base toward the adsorption platform is opened on the top of the connecting plate, a motor is arranged on the side of the connecting plate away from the adsorption platform, and one end of the output shaft of the motor extends into the fourth groove and is coaxially connected to a screw rod, the other end of the screw rod is rotatably connected to the fourth groove, a slider is slidably connected to the screw rod, the slider is slidably connected to the bottom of the fourth groove, and a connecting block is arranged on the top of the slider.

[0009] Furthermore, the connecting block can be slidably connected to the bottom of the second groove, and a cylinder is vertically arranged on the top of the connecting block, and a pressure gauge electrically connected to the control panel is arranged on the cylinder. A top plate is arranged on the top of the telescopic rod of the cylinder, and the edge of the top plate close to the adsorption platform is located between the adsorption platform and the through groove on the same side.

[0010] Furthermore, a plurality of electric cylinders arranged in a rectangular shape are vertically upwardly arranged on the top of the base below the placement plate, the top of the telescopic rod of each electric cylinder is connected to the bottom of the placement plate, and a first arc-shaped through hole extending to the bottom of the first groove is provided at the four corners of the first groove, and a second arc-shaped through hole extending from top to bottom is provided at the four corners of the through groove.

[0011] The beneficial effects of the utility model are:

[0012] When the utility model is in use, the telescopic rod of the electric cylinder is extended to place the bonded silicon-based micro LED display chip and the glass patch on the placement rack, so that the silicon-based micro LED display chip is located in the through groove and the glass patch is located in the first groove. After the position is properly placed, the external vacuum is started, and the adsorption platform firmly adsorbs the side of the silicon-based micro LED display chip through negative pressure. At this time, the telescopic rod of the electric cylinder is shortened, so that the entire placement rack leaves the silicon-based micro LED display chip, and the motor is started to rotate, driving the slider to move toward the adsorption platform until the connecting block moves to the bottom of the second groove and then the motor stops rotating. The telescopic rod of the cylinder is extended to drive the top plate to rise to the glass patch close to the outside of the silicon-based micro LED display chip. The telescopic rod of the cylinder continues to extend until the glass patch is detached from the silicon-based micro LED display chip. The numbers on the pressure gauge can reflect the pressure value at this moment, and then by feeding back this information to the control panel, the pressure value can be reflected by the thrust value and then viewed on the control panel by setting the program. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the structure of the utility model;

[0014] Figure 2 This is a schematic diagram of the structure of the placement rack of the utility model;

[0015] Figure 3 It is a structural schematic diagram of the detection component of the utility model. DETAILED DESCRIPTION

[0016] In order to enable those skilled in the art to better understand the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and implementation methods.

[0017] like Figure 1-3 As shown, a detection device for LED chips includes a base 1, a placement frame 3 is arranged on the top of the base 1, and the placement frame 3 includes a placement plate 32. A first groove 33 is opened on the top of the placement plate 32, and a through groove 35 penetrating from top to bottom is opened at the bottom center of the first groove 33. An adsorption platform 4 is embedded on the top of the base 1 located in the through groove 35, and second grooves 37 penetrating to the first groove 33 are opened on the left and right sides of the placement plate 32. Detection components 2 are arranged on the top of the base 1 on both sides of the adsorption platform 4, and a control panel 11 is arranged on the top of the base 1.

[0018] A third groove 41 is formed on the top of the adsorption platform 4 . The third groove 41 is a cross-shaped groove. An air outlet 42 is formed at the top center of the third groove 41 and runs through the groove 41 from top to bottom.

[0019] The detection component 2 includes a connecting plate 22 arranged on the top of the base 1, and a fourth groove 29 extending from the edge of the base 1 toward the adsorption platform 4 is opened on the top of the connecting plate 22. A motor 21 is arranged on the side of the connecting plate 22 away from the adsorption platform 4. The output shaft of the motor 21 extends into the fourth groove 29 and is coaxially connected to one end of a lead screw 28. The other end of the lead screw 28 is rotatably connected to the fourth groove 29. A slider 23 is slidably connected to the lead screw 28. The slider 23 is slidably connected to the bottom of the fourth groove 29, and a connecting block 24 is arranged on the top of the slider 23.

[0020] The connecting block 24 can be slidably connected to the bottom of the second groove 37, and a cylinder 25 is vertically arranged on the top of the connecting block 24. A pressure gauge 27 electrically connected to the control panel 11 is arranged on the cylinder 25, and a top plate 26 is arranged on the top of the telescopic rod of the cylinder 25. The edge of the top plate 26 close to the adsorption platform 4 is located between the adsorption platform 4 and the through groove 35 on the same side. During the implementation process, since the pressure gauge is arranged on the cylinder, the pressure of the cylinder can be checked at any time. At the same time, the pressure is calculated into thrust and reflected on the control panel through the formula: thrust = pressure × cylinder piston area, which is more intuitive during the detection process and facilitates understanding of the bonding strength between the silicon-based micro LED display chip and the glass patch.

[0021] A plurality of electric cylinders 31 arranged in a rectangular shape are vertically arranged on the top of the base 1 below the placement plate 32, and the top of the telescopic rod of each electric cylinder 31 is connected to the bottom of the placement plate 32. The four corners of the first groove 33 are provided with first arc-shaped through holes 34 extending to the bottom of the first groove 33, and the four corners of the through groove 35 are provided with second arc-shaped through holes 36 extending from top to bottom.

[0022] Working principle: When in use, the telescopic rod of the electric cylinder is extended to place the bonded silicon-based micro LED display chip and glass patch on the placement rack, so that the silicon-based micro LED display chip is located in the through groove and the glass patch is located in the first groove. After placing the position, start the external vacuum, and the adsorption table firmly adsorbs the side of the silicon-based micro LED display chip through negative pressure. At this time, the telescopic rod of the electric cylinder is shortened, so that the entire placement rack leaves the silicon-based micro LED display chip, and the motor is started to rotate, driving the slider to move toward the adsorption table until the connecting block moves to the bottom of the second groove and the motor stops rotating. The telescopic rod of the cylinder is extended, driving the top plate to rise to the glass patch close to the outside of the silicon-based micro LED display chip. The telescopic rod of the cylinder continues to extend until the glass patch is detached from the silicon-based micro LED display chip. The numbers on the pressure gauge can reflect the pressure value at this moment, and then by feeding back this information to the control panel, by setting the program, the pressure value can be reflected through the thrust value and then viewed on the control panel. The utility model has a simple structure and is easy to operate, and solves the existing problems that each person has a different grasp of force, and it is impossible to use a unified value to reflect the bonding strength, and that it is usually difficult to manually pry it open with tweezers, and that using this method for detection for a long time greatly increases the labor intensity of the operator.

[0023] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A detection device for LED chips, comprising a base (1), characterized in that: A placement frame (3) is arranged on the top of the base (1), and the placement frame (3) includes a placement plate (32). A first groove (33) is provided on the top of the placement plate (32), and a through groove (35) penetrating from top to bottom is provided at the bottom center of the first groove (33). An adsorption platform (4) is embedded on the top of the base (1) located in the through groove (35), and second grooves (37) penetrating to the first groove (33) are provided on the left and right sides of the placement plate (32). Detection components (2) are provided on the top of the base (1) located on both sides of the adsorption platform (4), and a control panel (11) is provided on the top of the base (1).

2. The detection device for LED chips according to claim 1, characterized in that: A third groove (41) is provided on the top of the adsorption platform (4), and the third groove (41) is a cross-shaped groove. An air outlet hole (42) penetrating from top to bottom is provided at the center of the top of the third groove (41).

3. The detection device for LED chips according to claim 1, characterized in that: The detection component (2) comprises a connecting plate (22) arranged on the top of the base (1); a fourth groove (29) extending from the edge of the base (1) toward the adsorption platform (4) is opened on the top of the connecting plate (22); a motor (21) is arranged on the side of the connecting plate (22) away from the adsorption platform (4); an end of the output shaft of the motor (21) extending into the fourth groove (29) is coaxially connected to a lead screw (28); the other end of the lead screw (28) is rotatably connected to the fourth groove (29); a slider (23) is slidably connected to the lead screw (28); the slider (23) is slidably connected to the bottom of the fourth groove (29); and a connecting block (24) is arranged on the top of the slider (23).

4. The detection device for LED chips according to claim 3, characterized in that: The connecting block (24) can be slidably connected to the bottom of the second groove (37); a cylinder (25) is vertically arranged on the top of the connecting block (24); a pressure gauge (27) electrically connected to the control panel (11) is arranged on the cylinder (25); a top plate (26) is arranged on the top of the telescopic rod of the cylinder (25); the edge of the top plate (26) close to the adsorption platform (4) is located between the adsorption platform (4) and the through groove (35) on the same side.

5. The detection device for LED chips according to claim 1, characterized in that: A plurality of electric cylinders (31) arranged in a rectangular shape are vertically arranged on the top of the base (1) below the placement plate (32); the top of the telescopic rod of each electric cylinder (31) is connected to the bottom of the placement plate (32); the first groove (33) is provided with first arc-shaped through holes (34) extending to the bottom of the first groove (33) at four corners; and the through groove (35) is provided with second arc-shaped through holes (36) extending from top to bottom at four corners.

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