Heat insulation backlight module

Abstract

The utility model discloses a heat insulation backlight module which comprises a lower frame, a reflector plate, a light guide plate and an optical film set which are sequentially arranged in an overlapped mode from bottom to top, the lower frame comprises a bottom plate and a side wall extending upwards from the edge of the bottom plate, an FPC is arranged on the side wall and the light guide plate, an LED lamp is arranged on the lower surface of the FPC, and the LED lamp is connected with the reflector plate. Shading glue is arranged on the edge of the FPC and the edge of the optical film set, the shading glue extends to the outer surface of the side wall and the lower surface of the bottom plate, the shading glue comprises a heat conduction adhesive, a PET base material layer and a common adhesive which are sequentially arranged in an overlapped mode from bottom to top, and one face, provided with the heat conduction adhesive, of the shading glue is bonded with the bottom plate. The heat-conducting adhesive is arranged on the bottom plate, so that the heat radiated upwards by the LED lamp can be transmitted to the bottom plate through the heat-conducting adhesive, the heat on the LED lamp is directly and quickly conducted to the backlight glue iron frame through the heat-conducting adhesive and is dissipated out through the heat dissipation mechanism of the whole machine, and continuous upload of the heat is isolated.

Description

Technical Field

[0001] The utility model relates to the technical field of liquid crystal display, and more specifically to a heat-insulating backlight module. Background Art

[0002] The LCD module used in mobile phone displays is generally composed of a protective cover, OCA optical glue, LCD display and backlight module from top to bottom. The backlight module is composed of a light-enhancing film, a diffusion film, a light guide plate, a reflective film, an LED light and a glue iron frame from top to bottom. The backlight module is bonded to the LCD display through a circle of light-shielding glue on the outer circumference of the top layer.

[0003] The power consumption of the LCD screen of the liquid crystal display module is usually around 100mw, while the power consumption of the backlight module is around 900mw. The backlight module is the main heat-generating component of the liquid crystal display module, and the LED lamp in the backlight module is the largest heat source. In the overall structure of the liquid crystal display module, the area of ​​the LED lamp in the backlight module is just below the IC of the LCD screen. Because various thermal circuits are etched in the IC, the heat of the LED lamp in the backlight module radiates upward and conducts to the IC, which will cause the circuit characteristics of the IC circuit to drift, thereby causing changes in the voltage and control signal output by the IC to the LCD panel, resulting in changes in the contrast of the LCD screen, screen flickering and other problems. Utility Model Content

[0004] The technical problem to be solved by the utility model is how to prevent the heat emitted by the LED lamp from being radiated upwards to prevent the LCD liquid crystal display screen from being abnormal.

[0005] The technical problem to be solved by the utility model is achieved through the following technical solutions:

[0006] In order to solve the above technical problems, the utility model provides an insulating backlight module, which includes a lower frame, a reflective sheet, a light guide plate and an optical film group which are stacked in sequence from bottom to top, the lower frame includes a bottom plate and a side wall extending upward from the edge of the bottom plate, an FPC is arranged on the side wall and the light guide plate, an LED lamp is arranged on the lower surface of the FPC, and a light-shielding glue is arranged on the edges of the FPC and the optical film group, the light-shielding glue extends to the outer surface of the side wall and the lower surface of the bottom plate, the light-shielding glue includes a thermally conductive adhesive, a PET substrate layer and a common adhesive which are stacked in sequence from bottom to top, and one side of the thermally conductive adhesive of the light-shielding glue is bonded to the bottom plate.

[0007] As a preferred embodiment of the heat-insulating backlight module provided by the utility model, the FPC includes a substrate layer, a circuit layer arranged on the upper surface of the substrate layer, and a metal heat dissipation layer arranged on the lower surface of the substrate layer.

[0008] As a preferred embodiment of the thermal insulation backlight module provided by the utility model, the FPC also includes at least one through-hole penetrating the substrate layer, the circuit layer and the metal heat dissipation layer, and the inner wall of the through-hole is provided with a thermal conductive layer in contact with the circuit layer and the metal heat dissipation layer.

[0009] As a preferred implementation of the heat-insulating backlight module provided by the utility model, a heat conductor connected to an external heat-conducting structure is arranged in the through hole, and the heat conductor is in contact with the heat-conducting layer.

[0010] As a preferred implementation of the thermal insulation backlight module provided by the utility model, the structure of the metal heat dissipation layer is a mesh structure, a strip structure, a wavy structure or a honeycomb structure.

[0011] As a preferred implementation of the heat-insulating backlight module provided by the utility model, at least one elastic block is provided between the side of the light guide plate away from the light incident side and the side wall.

[0012] As a preferred implementation of the heat-insulating backlight module provided by the utility model, at least one protrusion is provided on both sides of the elastic block.

[0013] As a preferred implementation of the heat-insulating backlight module provided by the utility model, the elastic block is provided with a shock-absorbing hole between adjacent protrusions.

[0014] As a preferred implementation of the heat-insulating backlight module provided by the utility model, grooves are provided on the inner wall of the shock-absorbing hole close to the side of the protrusion, and shock-absorbing devices are provided between adjacent grooves.

[0015] As a preferred implementation of the heat-insulating backlight module provided by the utility model, the shock-absorbing device is a spring or two magnets with the same poles facing each other.

[0016] The utility model has the following beneficial effects:

[0017] Since the adhesive under the shading glue is a thermally conductive adhesive, and one side of the thermally conductive adhesive of the shading glue is bonded to the base plate, the heat radiated upward by the LED lamp can be transferred to the base plate through the thermally conductive adhesive, so that the heat on the LED lamp can be quickly conducted to the backlight glue iron frame through the thermally conductive adhesive, and dissipated through the heat dissipation mechanism of the whole machine, thereby isolating the heat from continuing to be uploaded, preventing the LCD display module IC from being affected by the heat of the backlight module and affecting its output; the shading glue is bent and wrapped and attached to better prevent light leakage from the bottom of the backlight module. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the scheme in the present application, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 The present invention is a schematic structural diagram of a heat-insulating backlight module provided by the present invention.

[0020] Figure 2 for Figure 1 Schematic diagram of the laminated structure of the medium shading glue.

[0021] Figure 3 This is a schematic diagram of the structure of Example 2.

[0022] Figure 4 This is a schematic diagram of the structure of Example 3.

[0023] Figure 5 for Figure 4 Schematic diagram of the structure of the elastic block.

[0024] Description of Figure Numbers:

[0025] Lower frame 1; reflective sheet 2; light guide plate 3; optical film group 4; bottom plate 11; side wall 12; FPC 5; LED lamp 6; light shielding glue 7; thermal conductive adhesive 71; PET substrate layer 72; common adhesive 73;

[0026] Base material layer 51; metal heat dissipation layer 52; circuit layer 53; through hole 54;

[0027] Elastic block 8; convex block 81; shock absorbing hole 82; groove 83; shock absorbing device 84. DETAILED DESCRIPTION

[0028] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0029] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0030] In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", and "third" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0031] The utility model provides a heat-insulating backlight module, which includes a lower frame, a reflective sheet, a light guide plate and an optical film group which are sequentially stacked from bottom to top, the lower frame includes a bottom plate and a side wall extending upward from the edge of the bottom plate, an FPC is arranged on the side wall and the light guide plate, an LED lamp is arranged on the lower surface of the FPC, a light-shielding glue is arranged on the edges of the FPC and the optical film group, the light-shielding glue extends to the outer surface of the side wall and the lower surface of the bottom plate, the light-shielding glue includes a thermally conductive adhesive, a PET substrate layer and a common adhesive which are sequentially stacked from bottom to top, and one side of the thermally conductive adhesive of the light-shielding glue is bonded to the bottom plate.

[0032] Since the adhesive under the shading glue is a thermally conductive adhesive, and one side of the thermally conductive adhesive of the shading glue is bonded to the base plate, the heat radiated upward by the LED lamp can be transferred to the base plate through the thermally conductive adhesive, so that the heat on the LED lamp can be quickly conducted to the backlight glue iron frame through the thermally conductive adhesive, and dissipated through the heat dissipation mechanism of the whole machine, thereby isolating the heat from continuing to be uploaded, preventing the LCD display module IC from being affected by the heat of the backlight module and affecting its output; the shading glue is bent and wrapped and attached to better prevent light leakage from the bottom of the backlight module.

[0033] In order to enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings. The present invention is described in detail below in conjunction with the accompanying drawings and embodiments, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limitations on the present invention.

[0034] Example 1

[0035] See also Figure 1 and Figure 2 , which is a heat-insulating backlight module provided by the utility model, comprising a lower frame 1, a reflective sheet 2, a light guide plate 3 and an optical film group 4 which are sequentially stacked from bottom to top, the lower frame 1 comprising a bottom plate 11 and a side wall 12, the side wall 12 is formed by extending upward from the edge of the bottom plate 11, an FPC 5 is arranged on the side wall 12 and on the upper surface of the light guide plate 3, an LED lamp 6 is arranged on the lower surface of the FPC5, a light-shielding glue 7 is arranged on the edge of the FPC5 and the optical film group 4, the light-shielding glue 7 extends to the outer surface of the side wall 12 and the lower surface of the bottom plate 11, the light-shielding glue 7 comprises a thermally conductive adhesive 71, a PET substrate layer 5172 and a common adhesive 73 which are sequentially stacked from bottom to top, and one side of the thermally conductive adhesive 71 of the light-shielding glue 7 is bonded to the bottom plate 11. Since the adhesive below the shading glue 7 is the thermal conductive adhesive 71, and one side of the thermal conductive adhesive 71 of the shading glue 7 is bonded to the base plate 11, the heat radiated upward by the LED lamp 6 can be transferred to the base plate 11 through the thermal conductive adhesive 71, so that the heat on the LED lamp 6 can be directly and quickly conducted to the backlight glue iron frame through the thermal conductive adhesive 71, and dissipated through the heat dissipation mechanism of the whole machine, thereby isolating the heat from continuing to be uploaded, and preventing the liquid crystal display module IC from being affected by the heat of the backlight module and affecting its output; the shading glue 7 is bent and wrapped and attached, which can better prevent light leakage from the bottom of the backlight module.

[0036] Example 2

[0037] See also Figure 3As a further optimization scheme of Example 1, in this embodiment, the FPC5 includes a substrate layer 51, a circuit layer 53 arranged on the upper surface of the substrate layer 51, and a metal heat dissipation layer 52 arranged on the lower surface of the substrate layer 51. The arrangement method can be that the circuit layer 53 and the metal heat dissipation layer 52 are respectively attached to the substrate layer 51 by double-sided adhesive. Since the thickness of the substrate layer 51 is relatively thin, the heat on the FPC5 can be diffused to the metal heat dissipation layer 52 through the substrate layer 51. The metal heat dissipation layer 52 can effectively increase the heat dissipation area of ​​the FPC5 and play a role in uniform heat dissipation, thereby improving the heat dissipation efficiency of the FPC5. The substrate layer 51 can be any one of polyimide, polyester, polysulfone or polytetrafluoroethylene, the double-sided adhesive is any one of an acrylic adhesive layer or an epoxy resin adhesive layer, and the metal heat dissipation layer 52 can be a copper foil layer.

[0038] Furthermore, the FPC 5 further includes at least one through-hole 54 penetrating the substrate layer 51, the circuit layer 53 and the metal heat dissipation layer 52, and the inner wall of the through-hole 54 is provided with a heat-conducting layer in contact with the circuit layer 53 and the metal heat dissipation layer 52. By utilizing the good thermal conductivity of the through-hole 54, the circuit layer 53 and the metal heat dissipation layer 52 on both sides of the substrate layer 51 can be electrically connected to play a good thermal conductivity function, and the thermal conductive layer can provide a thermal conductive function to achieve a good heat dissipation effect. Among them, the thermal conductive layer can be a copper glue conductive ink layer.

[0039] Furthermore, a heat conductor connected to an external heat-conducting structure is disposed in the through hole 54. The heat conductor is connected to the external heat-conducting structure from one side of the circuit layer 53 and is also in contact with the heat-conducting layer in the through hole 54, so that the circuit layer 53 and the metal heat dissipation layer 52 can be connected to the external heat-conducting structure through the through hole 54, so that the heat in the FPC 5 is diffused to the external heat-conducting structure through the heat conductor in the through hole 54, so as to further improve the heat dissipation efficiency of the FPC 5. Preferably, in order to enable the through hole 54 to be connected to the external heat-conducting structure, the through hole 54 is disposed at the edge of the FPC 5.

[0040] Furthermore, the metal heat dissipation layer 52 is a uniform heat dissipation structure, and its structure can be any one of a mesh structure, a strip structure, a wavy structure or a honeycomb structure. Through the uniform heat dissipation structure, the heat dissipation effect can be better improved.

[0041] Example 3

[0042] See also Figure 4 and Figure 5As a further optimization scheme of Example 1, in this embodiment, at least one elastic block 8 is provided between the side of the light guide plate 3 away from the light incident side and the side wall 12. The elastic block 8 can make the light guide plate 3 firmly abut against the elastic block 8, buffer the impact force of the light guide plate 3 on the lower frame 1, avoid the collision between the light guide plate 3 and the lower frame 1 and cause noise, and also can improve the service life of the light guide plate 3.

[0043] Furthermore, at least one protrusion 81 is provided on both sides of the elastic block 8, and the protrusion 81 directly abuts against the light guide plate 3 and the side wall 12 of the lower frame 1, which can align the elastic block 8 with the light guide plate 3 and the side wall 12, further improving the buffering performance of the elastic block 8.

[0044] As the elastic block 8 is used for a longer time, the elasticity of the elastic block 8 will also weaken due to aging. In order to increase the ability of the elastic block 8 to buffer the impact force and increase the service life of the elastic block 8, the elastic block 8 is provided with a shock-absorbing hole 82 between adjacent protrusions 81. In this embodiment, the shock-absorbing hole 82 is a square hole. When the light guide plate 3 hits the elastic block 8, the elastic block 8 will be concave and deformed in the direction of the shock-absorbing hole 82 to absorb the impact force of the light guide plate 3, thereby further achieving the purpose of shock absorption and noise reduction. It should be noted that the shock-absorbing hole 82 can be a through hole or a blind hole, or an inner hole built into the elastic block 8, which is not limited here and falls within the protection scope of the utility model. The present embodiment uses a through hole, which is easy to manufacture and has a low production cost. The shape of the shock-absorbing hole 82 can be a square hole or a round hole, which can be selected according to actual conditions and is not limited here.

[0045] In order to further increase the ability of the elastic block 8 to buffer the impact force, a groove 83 is provided on the inner wall of the shock-absorbing hole 82 close to the side of the protrusion 81. In this embodiment, there are only two protrusions 81, so there are only two grooves 83. It is possible to set multiple protrusions 81 and multiple grooves 83 according to actual conditions. A shock-absorbing device 84 is provided between adjacent grooves 83. The shock-absorbing device 84 can be used to further increase the ability of the elastic block 8 to buffer the impact force and absorb the impact force of the light guide plate 3, thereby further achieving the purpose of shock absorption and noise reduction.

[0046] Furthermore, the shock absorbing device 84 is any one of a spring or two magnets with the same poles facing each other. The elastic force of the spring or the repulsive force generated by the two magnets with the same poles facing each other is used to further increase the ability of the elastic block 8 to buffer the impact force. The spring and magnet are standard commodities that can be purchased on the market, and no special customization is required. The procurement cost is low and can be replaced at any time, which is cost-effective.

[0047] In order to further reduce the sound generated by the collision between the components, the elastic block 8 is interference fit with the light guide plate 3 and the side wall 12 of the lower frame 1. One protrusion 81 of the elastic block 8 abuts on the light guide plate 3, and the other protrusion 81 abuts on the side wall 12. Due to the interference fit, it can be regarded as a whole. When the speed of the external environment changes, the sound of the module can be reduced to a minimum, and the module can be completely prevented from making any sound, achieving zero noise and reducing vibration.

[0048] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0049] Obviously, the embodiments described above are only some embodiments of the present application, rather than all embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to perform equivalent replacement of some of the technical features therein. Any equivalent structure made using the contents of the specification and drawings of this application, directly or indirectly used in other related technical fields, is similarly within the scope of patent protection of this application.

Claims

1. A heat-insulating backlight module, It is characterized in that It includes a lower frame, a reflective sheet, a light guide plate and an optical film group which are stacked in sequence from bottom to top, the lower frame includes a bottom plate and a side wall extending upward from the edge of the bottom plate, an FPC is arranged on the side wall and the light guide plate, an LED lamp is arranged on the lower surface of the FPC, and a light-shielding glue is arranged on the edges of the FPC and the optical film group, the light-shielding glue extends to the outer surface of the side wall and the lower surface of the bottom plate, the light-shielding glue includes a thermally conductive adhesive, a PET base material layer and a common adhesive which are stacked in sequence from bottom to top, and one side of the thermally conductive adhesive of the light-shielding glue is bonded to the bottom plate.

2. The heat-insulating backlight module according to claim 1, It is characterized in that The FPC includes a substrate layer, a circuit layer disposed on an upper surface of the substrate layer, and a metal heat dissipation layer disposed on a lower surface of the substrate layer.

3. The heat-insulating backlight module according to claim 2, It is characterized in that The FPC further includes at least one through-hole penetrating the substrate layer, the circuit layer and the metal heat dissipation layer, and an inner wall of the through-hole is provided with a heat-conducting layer in contact with the circuit layer and the metal heat dissipation layer.

4. The heat-insulating backlight module according to claim 3, It is characterized in that A heat conductor connected to an external heat-conducting structure is arranged in the through hole, and the heat conductor is in contact with the heat-conducting layer.

5. The heat-insulating backlight module according to claim 2, It is characterized in that The structure of the metal heat dissipation layer is a mesh structure, a strip structure, a wave structure or a honeycomb structure.

6. The heat-insulating backlight module according to claim 1, It is characterized in that At least one elastic block is disposed between the side of the light guide plate away from the light incident side and the side wall.

7. The heat-insulating backlight module according to claim 6, It is characterized in that At least one protrusion is disposed on both sides of the elastic block.

8. The heat-insulating backlight module according to claim 7, It is characterized in that The elastic block is provided with a shock absorbing hole between adjacent protrusions.

9. The heat-insulating backlight module according to claim 8, It is characterized in that Grooves are arranged on the inner wall of the shock absorbing hole on one side close to the protrusion, and shock absorbing devices are arranged between adjacent grooves.

10. The heat-insulating backlight module according to claim 9, It is characterized in that The shock absorbing device is a spring or two magnets with the same poles facing each other.

Images