Liquid-cooled heat dissipation system

Abstract

The utility model discloses a liquid-cooled heat dissipation system, which comprises a liquid-cooled vapor chamber, a liquid-cooled heat dissipation plate, a first cooling liquid pipeline, a second cooling liquid pipeline, a cooling liquid circulator, a fan and cooling liquid, wherein the first cooling liquid pipeline and the second cooling liquid pipeline are connected between the liquid-cooled vapor chamber and the liquid-cooled heat dissipation plate. The liquid-cooled vapor chamber comprises a liquid-cooled cover, a metal upper cover plate, a metal lower cover plate, an air exhaust channel, a capillary structure and a working fluid. The liquid-cooled heat dissipation plate comprises a heat dissipation bottom plate and a heat dissipation outer cover. The cooling liquid circulating machine pumps cooling liquid to enter the liquid cooling cover of the liquid-cooled vapor chamber from the first cooling liquid pipeline, after heat is absorbed, the cooling liquid flows out to the second cooling liquid pipeline and then flows into the liquid-cooled heat dissipation plate, the outer surface of a bottom plate is blown and cooled through a fan locked and fixed to the outer surface of the bottom plate of the liquid-cooled heat dissipation plate, and the cooling effect is achieved. And the cooling liquid is cooled when flowing through the second accommodating space in the liquid-cooled heat dissipation plate, and then flows back to the cooling liquid circulating machine to be circulated again.

Description

Technical Field

[0001] The utility model relates to a heat dissipation system, in particular to a liquid cooling heat dissipation system. Background Art

[0002] The explosive development speed of Generative Artificial Intelligence (Generative AI) or AI Generated Content (AIGC) has greatly increased the demand for the development of high-speed computing power and high-end computing chip modules. The huge amount of data and processing speed that AIGC applications need to process continue to drive the demand for high-end AI servers. High-end AI servers use a large number of central processing units (CPUs) and graphics processing units (GPUs) at the same time, and in order to meet the high-speed and large-scale computing requirements of generative artificial intelligence (for example: ChatGPT), the number of transistors contained in the high-end chips used has reached 175 billion. Corresponding to the high efficiency and high power consumption of AI server chips, the accompanying large and high-density heat sources have become a major challenge to heat dissipation capabilities. For example, in 2018, the energy consumption of server processors was only about 180W to 280W, but by 2023, it would double to more than 500W. For example, the 5nm Genoa processor from AMD and the A100 chip from GPU giant NVIDIA in 2022 consume 400W of power, which is about 40% to 50% higher than the previous generation of processors. In 2023, the Bergamo processor will consume more than 500W of power; NVIDIA's new generation of high-end GPU H100 chip, designed specifically for AI servers, has a maximum power of 700W. As more and more chips are used in servers, the power consumption is further increased, and the module design complexity of the cooling solution is also increased.

[0003] With the upgrade of the new generation of GPUs and CPUs, server computing, AI image generation and e-sports applications will become the main growth drivers of the cooling industry. From the perspective of server cooling technology, it is mainly divided into air cooling, liquid cooling and immersion cooling. Generally speaking, when the thermal power consumption of the chip exceeds 300W, it is difficult to solve the heat problem through air cooling.

[0004] Immersion cooling can be divided into single-phase immersion liquid cooling and two-phase immersion liquid cooling. Immersion liquid cooling has the highest heat dissipation efficiency, which can even reach more than 1500W. However, since immersion liquid cooling is achieved by immersing the server in a tank with a large amount of coolant, the computer room architecture must be redesigned to meet its application. In addition, the coolant is not only very expensive, but there are also environmental concerns in its application. In addition, whether other peripheral components such as chips, PCB boards, network adapters, power supplies, etc. can maintain normal operation when immersed in coolant still requires more actual application data to further clarify.

[0005] As ChatGPT or higher-level AI servers continue to expand their computing power, their heat dissipation capacity must be at least higher than 700W to cope with it. For NVIDIA A100 or H100 AI servers, they are usually equipped with 4 to 8 GPUs, and each GPU will generate an additional 300W to 700W of heat energy. It is estimated that the thermal power consumption of the entire AI server will exceed 3000W. In view of the fact that traditional air cooling cannot provide such efficient heat dissipation, the introduction of "liquid cooling" technology has become a new trend in heat dissipation to solve heat consumption. Liquid cooling is to introduce the liquid cooling system into the server, and use the characteristics of liquid being more conductive than gas to quickly transfer the high-density heat energy generated by the heating element to the cooling liquid through the liquid cooling plate, and then guide the cooling liquid after heat absorption to the outdoor cooling tower or heat dissipation module, and further dissipate the heat energy into the atmosphere, so as to achieve the effect of rapid cooling and reduced energy consumption. At present, an open liquid cooling module commonly used in the industry is an efficient cooling method that combines liquid cooling and air cooling in the server cabinet. This open liquid cooling module includes: a cold plate module (Cold Plate), a coolant distribution unit (CDU), a cooling water manifold (Manifold), and cools the coolant through a radiator and a fan back door or a heat exchanger. When the open liquid cooling module is in operation, the coolant will be pumped out by the coolant distribution unit and flow into the cold plate close to the chip or processor through the cooling water manifold. At this time, the heat from the chip or processor will be conducted through the cold plate and absorbed by the coolant. The coolant after absorbing the heat will flow out from the heat pipe manifold at the other end of the cold plate. Then, the coolant after absorbing the heat will be transported to the cabinet back door and cooled by forced heat dissipation through the fan back door. The cooled coolant will flow back to the coolant distribution unit and be pumped to the cold plate again.

[0006] The miniaturization and high integration of AI computing chips are expected to lead to a significant increase in chip heat density. It is an important trend that heat dissipation solutions will be closer and closer to core heat sources such as chips. Liquid-cooled heat dissipation equipment modules can be divided into liquid-cooled heat dissipation equipment modules at the computer room level of large data centers, the cabinet level of servers, and the chip level used in AI computers in the future, according to the application scale. Compared with the computer room level and cabinet level, the liquid-cooled heat dissipation equipment modules required for AI computers are smaller in design, and the heat dissipation efficiency must be sufficient in an environment without starting an external chiller or air conditioner, so that the power usage efficiency (PUE) of the entire cooling system can be lower.

[0007] The liquid cooling plate module commonly seen in liquid cooling heat dissipation modules uses a liquid cooling cover to cover the heat dissipation structure of the radiator, and the liquid cooling cover and the radiator are locked together to form a cavity. The liquid cooling cover has a liquid inlet and a liquid outlet. The cooling liquid can enter the cavity formed by the locking of the liquid cooling cover and the radiator from the liquid inlet, flow through the heat dissipation structure, and then flow out from the liquid outlet, and then flow to the external heat dissipation system through the pipeline (for example: the pipeline flows through the fin-type heat sink and adds a forced cooling method of the fan) to dissipate the heat carried by the cooling liquid. However, when the metal bottom plate of the radiator of the liquid cooling plate module contacts the heating element, the large amount of heat generated by the heating element rapidly cannot be efficiently transversely conducted to the metal bottom plate of the entire radiator because the lateral heat conduction speed of the metal bottom plate is limited by the cross-sectional area, causing a large amount of heat to accumulate in the local area where the radiator and the heating element are in contact. Even with the addition of liquid cooling, the heat dissipation capacity that can be improved is very limited. In addition, the external cooling system uses heat exchange between pipes and fin-type heat sinks, coupled with fan air cooling. The area where the cooling liquid directly dissipates heat is limited, and the cooling efficiency may also be insufficient. Utility Model Content

[0008] In view of the above problems, the purpose of the utility model is to provide a liquid-cooled heat dissipation system, which includes a liquid-cooled vapor chamber, the metal bottom plate of the radiator in the above-mentioned liquid-cooled heat dissipation module is designed as a vapor chamber, and the heat dissipation structure of the radiator is integrated with the heat dissipation surface of the vapor chamber in an integral molding manner, and then a liquid cooling cover is used to cover the heat dissipation structure in its cavity to form a liquid-cooled vapor chamber with the bottom plate as a vapor chamber. The liquid cooling cover has a first liquid inlet and a first liquid outlet, so that the cooling liquid can enter and exit and flow through these heat dissipation structures in the liquid cooling cover to increase the heat exchange efficiency. The vapor chamber has the characteristics of high thermal conductivity, strong lateral heat uniformity, and high thermal diffusion coefficient, and its thermal diffusion capacity is significantly better than that of a general metal bottom plate (for example: copper base plate, aluminum alloy bottom plate, etc.). When the heat-generating electronic component attached to the heat-absorbing surface of the vapor chamber generates a large amount of heat source, the heat will be quickly transferred to the vapor chamber. At this time, the working fluid in the internal space of the vapor chamber will quickly absorb the heat and quickly vaporize to form steam. The heat dissipation surface of the vapor chamber is connected to the radiator and the liquid cooling cover. Therefore, when the vapor rises rapidly and contacts the cooler metal surface with the radiator, the vapor will condense into a working fluid, and quickly absorb and release a large amount of heat through this liquid-gas-liquid phase change cycle. Compared with the traditional use of a metal base plate, the vapor chamber can more quickly diffuse a large amount of concentrated heat source to a larger area of ​​the radiator, thereby obtaining a larger effective heat dissipation area and faster heat dissipation.

[0009] The vapor chamber uses the phase change of the working fluid in its closed working chamber to quickly dissipate heat. It is the most efficient heat dissipation method at present. It uses the large amount of latent heat of vaporization involved in the rapid vaporization and condensation process of the working fluid in the near-vacuum chamber to achieve the purpose of rapid heat dissipation. The thermal conductivity of the vapor chamber can reach 10000W / (m 2 ·℃) or above, which is dozens of times higher than the thermal conductivity of traditional air convection or liquid convection. When the above-mentioned heat sink is integrated into the heat dissipation surface of the heat spreader in an integrated manner, a large amount of heat from the inside of the heat spreader can be more quickly and effectively conducted and dispersed to the heat dissipation structure, greatly improving the heat dissipation efficiency.

[0010] In addition, the liquid-cooled heat dissipation system of the utility model further includes a liquid-cooled heat sink. The liquid-cooled heat sink is a plate-like structure with a hollow cavity, and a plurality of convex heat dissipation columns are arranged on the inner surface of the hollow cavity. At least one second liquid inlet and at least one second liquid outlet are arranged on the frame of the liquid-cooled heat sink. The second liquid inlet and the second liquid outlet are respectively connected to the first liquid outlet and the first liquid inlet of the liquid-cooled heat sink through the cooling liquid pipeline, so that the cooling liquid circulates repeatedly between the liquid-cooled heat sink and the liquid-cooled heat sink. After the cooling liquid absorbs heat in the liquid-cooled heat sink of the liquid-cooled heat sink, it is then transported into the cavity of the liquid-cooled heat sink and flows between the heat dissipation columns in the cavity. Many heat dissipation columns can provide a large heat exchange area, and the fan installed outside the liquid-cooled heat sink forces air to dissipate heat on its outer surface, so that the cooling liquid after absorbing heat can be quickly dispersed to the liquid-cooled heat sink and quickly dissipate heat.

[0011] To achieve the above objectives, the utility model provides a liquid cooling and heat dissipation system, which includes at least one liquid-cooled heat spreader, a liquid-cooled heat sink, at least one first coolant pipeline and at least one second coolant pipeline connecting the two, a coolant circulator, at least one fan and cooling liquid.

[0012] Further explanation, the above-mentioned liquid-cooled heat spreader is a high-efficiency liquid-cooled heat spreader composed of a liquid-cooled cover and an integrated heat spreader. The liquid-cooled heat spreader of the utility model includes: a liquid-cooled cover, an integrated heat spreader. The liquid-cooled cover includes a top and a side wall connected to the top, the side wall surrounds the top to form a first accommodation space, the side wall is provided with at least one first liquid inlet and at least one first liquid outlet, and the first liquid inlet and the first liquid outlet are connected to the first accommodation space. The integrated heat spreader includes: a metal upper cover, a metal lower cover, a working space, an exhaust channel, a capillary structure and a working fluid. The metal upper cover includes a heat dissipation outer surface and a condensation inner surface, the heat dissipation outer surface has a plurality of first heat dissipation columns, and the condensation inner surface is provided with an upper frame of appropriate height around the condensation inner surface, and an upper channel groove is provided on the upper frame, and the condensation inner surface has a plurality of upper grooves arranged parallel to each other; wherein, the metal upper cover as a whole including the first heat dissipation column is manufactured by an integral molding method of a metal sheet (or a metal block).

[0013] The metal lower cover plate includes a heat-absorbing outer surface and an evaporation inner surface. The heat-absorbing outer surface is used to contact the heat-releasing electronic component. The evaporation inner surface is surrounded by a lower frame of appropriate height, which surrounds the evaporation inner surface. The lower frame is provided with a lower channel groove. The evaporation inner surface has a plurality of lower grooves arranged in parallel with each other and a plurality of columnar support structures protruding between the lower grooves. The metal lower cover plate as a whole including the columnar support structure is manufactured by an integral molding method of a metal sheet (or a metal block). The upper frame of the metal upper cover plate and the lower frame of the metal lower cover plate are mutually joined to form a working space. The plurality of columnar support structures protrude from the evaporation inner surface and abut between the upper grooves of the condensation inner surface to support the working space. The exhaust channel is formed by the corresponding joint of the upper channel groove and the lower channel groove, which can be used to exhaust the working space and is sealed after exhaustion to keep the working space in a near-vacuum state. The capillary structure is arranged in the lower groove or in the upper groove and the lower groove. The working fluid exists in the working space and the capillary structure. The liquid cooling cover is connected to the heat dissipation outer surface of the metal upper cover plate, and the first heat dissipation column is arranged in the first accommodating space to form the liquid cooling type heat spreader.

[0014] According to the above embodiment, the liquid-cooled heat sink comprises: a heat sink base plate and a heat sink cover. The heat sink base plate has a base plate inner surface and an opposite base plate outer surface. The base plate inner surface is provided with a plurality of second heat sinks that are raised and arranged roughly in a matrix manner, at least one guide plate slot, in the shape of a long groove, the protrusion is formed on the base plate inner surface and is arranged between the plurality of second heat sinks for inserting and installing at least one long sheet-shaped guide plate, and the outer cover joint slot, which is raised and arranged around the periphery of the base plate inner surface. A plurality of fan screw holes are provided on the base plate outer surface, which are raised on the base plate outer surface for locking at least one fan so that it blows air to cool the base plate outer surface. The heat sink base plate as a whole includes the plurality of second heat sinks, the guide plate slot, the outer cover joint slot, and the fan screw hole, which are made of the same metal sheet (or a metal block) in an integrated molding manner.

[0015] The heat dissipation outer cover has an outer cover top and an outer cover side wall connected to the outer cover top. The outer cover side wall surrounds the outer cover top to form a second accommodating space. The outer cover side wall is provided with at least one second liquid inlet and at least one second liquid outlet, and the second liquid inlet and the second liquid outlet are connected to the second accommodating space. When the heat dissipation outer cover is covered with the heat dissipation base plate, the outer cover side wall of the heat dissipation outer cover is inserted into the outer cover joint slot of the heat dissipation base plate and welded, and the plurality of second heat dissipation columns are arranged in the second accommodating space to form the liquid-cooled heat sink. In this embodiment, one end of the first cooling liquid pipeline is connected to the first liquid inlet of the liquid-cooled heat sink, and the other end is connected to the second liquid outlet of the liquid-cooled heat sink; one end of the second cooling liquid pipeline is connected to the first liquid outlet of the liquid-cooled heat sink, and the other end is connected to the second liquid inlet of the liquid-cooled heat sink. The cooling liquid circulator is arranged between the first cooling liquid pipeline or the second cooling liquid pipeline to pump the cooling liquid so that the cooling liquid circulates between the liquid-cooled heat spreader and the liquid-cooled heat sink to form the liquid-cooled heat dissipation system.

[0016] In one embodiment of the present invention, the heat-absorbing outer surface of the metal lower cover of the liquid-cooled vapor chamber is a flat surface for contacting the heat-releasing electronic components.

[0017] In one embodiment of the present invention, the metal lower cover plate of the above-mentioned liquid-cooled heat sink further has at least one recessed space on its heat-absorbing outer surface for accommodating at least one heat-releasing electronic component, and the recessed space is recessed from the heat-absorbing outer surface toward the evaporating inner surface but does not protrude from the corresponding evaporating inner surface.

[0018] In the above-mentioned embodiment, there are a plurality of recessed spaces, which can be used to accommodate a plurality of heat-dissipating electronic components.

[0019] In another embodiment described above, there are a plurality of recessed spaces having the same or different shapes and volumes, so as to simultaneously accommodate a plurality of heat-dissipating electronic components having the same or different shapes and volumes.

[0020] In one embodiment of the present invention, the metal lower cover plate of the above-mentioned liquid-cooled heat sink further has at least one screw hole on its heat-absorbing outer surface for locking at least one heat-releasing electronic component, wherein the screw hole is recessed from the heat-absorbing outer surface toward the evaporating inner surface and protrudes from the evaporating inner surface but does not penetrate through to form a screw hole protrusion, and the height of the screw hole protrusion is not greater than the height of the columnar support structure.

[0021] In one embodiment of the utility model, in the liquid-cooled heat dissipation system, the number of the liquid-cooled heat sinks can be plural, such as 2, 3 or 4, and the first coolant pipeline and the second coolant pipeline are branch pipes having branch pipes corresponding to the number of the liquid-cooled heat sinks, and the coolant circulator is a coolant distributor.

[0022] In one embodiment of the utility model, in the liquid-cooled heat dissipation system, the liquid cooling cover, the metal upper cover plate, the metal lower cover plate, the heat dissipation bottom plate, and the heat dissipation outer cover are made of copper, aluminum, aluminum alloy or magnesium alloy.

[0023] In an embodiment of the present invention, in the liquid-cooled heat dissipation system, the working fluid is water.

[0024] In an embodiment of the present invention, in the liquid-cooled heat sink, a plurality of second liquid inlets and a plurality of second liquid outlets are disposed on the side wall of the outer cover.

[0025] In the above-mentioned embodiment, in the liquid-cooled heat sink, the number of the second liquid inlets and the second liquid outlets disposed on the side wall of the outer cover are 2, 3 or 4 respectively.

[0026] In one embodiment of the present invention, the liquid-cooled heat sink is a plate-shaped structure with a length of 250 mm-600 mm, a width of 150 mm-450 mm, and a thickness of 10 mm-30 mm.

[0027] In an embodiment of the present invention, the cooling liquid is water.

[0028] In an embodiment of the present invention, the cooling liquid is water, and the volume is about 1 liter to 6 liters. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a structural schematic diagram of an embodiment of the liquid cooling heat dissipation system of the utility model.

[0030] Figure 2 It is a structural schematic diagram of a liquid-cooled heat sink described in the first embodiment of the liquid-cooled heat dissipation system of the utility model.

[0031] Figure 3 This is a structural cross-sectional view of a liquid-cooled heat sink described in the first embodiment of the liquid-cooled heat dissipation system of the utility model.

[0032] Figure 4 This is a schematic diagram of the metal upper cover structure of the liquid-cooled heat sink described in the first embodiment of the liquid-cooled heat dissipation system of the utility model.

[0033] Figure 5This is a schematic diagram of the metal lower cover structure of the liquid-cooled heat sink described in the first embodiment of the liquid-cooled heat dissipation system of the utility model.

[0034] Fig. 6A , Figure 6B This is a schematic diagram of the metal lower cover structure of the liquid-cooled heat sink described in the second embodiment of the liquid-cooled heat dissipation system of the utility model and its structural cross-sectional view.

[0035] Fig. 7A , Figure 7B This is a schematic diagram of the metal lower cover structure of the liquid-cooled heat sink described in the third embodiment of the liquid-cooled heat dissipation system of the utility model and its structural cross-sectional view.

[0036] Fig. 8A , Figure 8B This is a schematic diagram of the metal lower cover structure of the liquid-cooled heat sink described in the fourth embodiment of the liquid-cooled heat dissipation system of the utility model and its structural cross-sectional view.

[0037] Fig.9A , Fig. 9B This is a schematic diagram of the metal lower cover structure of the liquid-cooled heat sink described in the fifth embodiment of the liquid-cooled heat dissipation system of the utility model and its structural cross-sectional view.

[0038] Fig.10 It is a structural schematic diagram of a liquid-cooled heat sink described in an embodiment of the liquid-cooled heat dissipation system of the utility model.

[0039] Fig.11 The top view and side view are of the heat dissipation base plate structure of the liquid-cooled heat dissipation plate described in one embodiment of the liquid-cooled heat dissipation system of the utility model.

[0040] Fig.12 The figure is a schematic diagram of the heat dissipation cover structure of a liquid-cooled heat dissipation plate according to an embodiment of the liquid-cooled heat dissipation system of the present utility model.

[0041] Fig.13 It is a structural schematic diagram of another embodiment of the liquid cooling heat dissipation system of the utility model.

[0042] Description of reference numerals: 10, 20-liquid-cooling heat dissipation system; 100-liquid-cooling heat sink; 110-liquid-cooling cover; 1101-top; 1102-side wall; 1103-first accommodating space; 1104-first liquid inlet; 1105-first liquid outlet; 120-metal upper cover plate; 1201-heat dissipation outer surface; 1202-condensation inner surface; 1203-first heat dissipation column; 1204-upper frame; 1205-upper channel groove; 1206 - upper groove; 130, 131, 132, 133, 134 - metal lower cover; 1301, 1311, 1321, 1331, 1341 - heat absorbing outer surface; 1302, 1312, 1322, 1332, 1342 - evaporation inner surface; 1303 - lower frame; 1304 - lower channel groove; 1305 - lower groove; 1306 - columnar support structure; 1307 - working space; 1313, 1323 - recessed space 1333, 1343-screw hole; 1334, 1344-screw hole protrusion; 140-exhaust channel; 150-capillary structure; 160-working fluid; 200, 201-liquid cooling heat sink; 210-heat sink; 2101-inner surface of the bottom plate; 2102-outer surface of the bottom plate; 2103-second heat sink; 2104-guide plate slot; 2105-long sheet guide plate; 2106-outer cover joint slot; 2107 -fan screw hole; 220, 221-heat dissipation cover; 2201-top of the cover; 2202, 2212-side wall of the cover; 2203-second accommodating space; 2204, 2214-second liquid inlet; 2205, 2215-second liquid outlet; 300, 301-first coolant pipeline; 400, 401-second coolant pipeline; 500-coolant circulation machine; 600-fan; 700-cooling liquid; 1010-welding groove. DETAILED DESCRIPTION

[0043] The following will refer to the relevant drawings to illustrate the embodiments of the liquid cooling system of the utility model. For the sake of clarity and convenience of the illustration, the components in the drawings may be exaggerated or reduced in size and proportion. In the following description and / or claims, the technical terms used should be interpreted in the sense known and commonly used by ordinary technicians with common knowledge in the technical field. For ease of understanding, the same elements in the following embodiments are illustrated with the same symbols. In the description of the utility model, the word "about" usually refers to the actual value within plus or minus 10%, 5%, 1% or 0.5% of a specific value or range. The word "about" in the utility model means that the actual value falls within the acceptable standard error of the mean value, depending on the consideration of ordinary technicians with common knowledge in the technical field to which the utility model belongs. Except for the embodiments, or unless otherwise explicitly stated, it should be understood that the ranges, quantities, values ​​and percentages used herein are all modified by "about". Therefore, unless otherwise stated, the values ​​or parameters disclosed in the utility model description and the attached claims are approximate values ​​and can be changed as needed.

[0044] See also Figure 1 , which is a schematic structural diagram of an embodiment of the liquid-cooled heat dissipation system 10 of the utility model. In this embodiment, the liquid-cooled heat dissipation system 10 includes: at least one liquid-cooled heat sink 100, a liquid-cooled heat sink 200, at least one first coolant pipeline 300, at least one second coolant pipeline 400, a coolant circulation machine 500, at least one fan 600 and cooling liquid 700.

[0045] Six embodiments are schematically listed below, wherein the difference between the first embodiment to the fifth embodiment lies in the different structural aspects of the liquid-cooled vapor chamber 100; the sixth embodiment is another implementation aspect of the liquid-cooled heat dissipation system.

[0046] First embodiment

[0047] Please also see Figures 2 to 5 . Figure 2 Schematic diagram of the structure of the liquid-cooled heat sink 100 according to the first embodiment of the liquid-cooled heat dissipation system 10 of the present invention. Figure 3 for Figure 2 A structural cross-sectional view of a liquid-cooled heat sink 100. Figure 4 Schematic diagram of the structure of the metal upper cover plate 120 of the liquid-cooled heat sink 100 described in the first embodiment of the liquid-cooled heat dissipation system 10 of the present invention. Figure 5The schematic diagram of the structure of the metal lower cover plate 130 of the liquid-cooled heat spreader 100 described in the first embodiment of the liquid-cooled heat dissipation system 10 of the utility model is shown in FIG. The liquid-cooled heat spreader 100 described in the first embodiment of the liquid-cooled heat dissipation system 10 of the utility model comprises: a liquid-cooling cover 110, a metal upper cover plate 120, a metal lower cover plate 130, an exhaust channel 140, a capillary structure 150 and a working fluid 160. The liquid-cooling cover 110 comprises a top 1101 and a side wall 1102 connected to the top 1101, the side wall 1102 surrounds the top 1101 to form a first accommodating space 1103, and the side wall 1102 is provided with at least one first liquid inlet 1104 and at least one first liquid outlet 1105, and the first liquid inlet 1104 and the first liquid outlet 1105 are connected to the first accommodating space 1103. The metal upper cover plate 120 includes a heat dissipation outer surface 1201 and a condensation inner surface 1202. The heat dissipation outer surface 1201 has a plurality of first heat dissipation columns 1203. The condensation inner surface 1202 is surrounded by an upper frame 1204 of appropriate height, which surrounds the condensation inner surface 1202. The upper frame 1204 is provided with an upper channel groove 1205, and the condensation inner surface 1202 has a plurality of upper grooves 1206 arranged parallel to each other. The metal upper cover plate 120 as a whole including the first heat dissipation columns 1203 is manufactured by a metal sheet (or a metal block) in an integral molding manner. The metal lower cover plate 130 includes a heat absorption outer surface 1301 and an evaporation inner surface 1302. The heat-absorbing outer surface 1301 is used to contact a heat-releasing electronic component (not shown in the figure), and a lower frame 1303 of appropriate height is provided at the periphery of the evaporation inner surface 1302 to surround the evaporation inner surface 1302. A lower channel groove 1304 is provided on the lower frame 1303, and the evaporation inner surface 1302 has a plurality of lower grooves 1305 arranged in parallel with each other and a plurality of columnar support structures 1306 protruding between the lower grooves 1305, wherein the metal lower cover plate 130 as a whole including the columnar support structure 1306 is manufactured by a metal sheet (or a metal block) in an integrated molding manner. The upper frame 1204 of the metal upper cover plate 120 and the lower frame 1303 of the metal lower cover plate 130 are joined to form a working space 1307. The columnar support structures 1306 protrude from the evaporation inner surface 1302 and abut between the upper grooves 1206 of the condensation inner surface 1202 to support the working space 1307. The exhaust channel 140 is formed by the corresponding joint of the upper channel groove 1205 and the lower channel groove 1304, which is used to exhaust the working space 1307 and seal after exhausting the air so that the working space 1307 maintains a near vacuum state. The capillary structure 150 is disposed in the lower groove 1305 or in the upper groove 1206 and the lower groove 1305. The working fluid 160 exists in the working space 1307 and the capillary structure 150.

[0048] See also Figures 10 to 12 . Fig.10Schematic diagram of the structure of the liquid-cooled heat sink 200 described in one embodiment of the liquid-cooled heat dissipation system 10 of the present invention. Fig.11 1 and 2 are a top view and a side view of the heat dissipation base plate 210 of the liquid-cooled heat dissipation plate 200 described in an embodiment of the liquid-cooled heat dissipation system 10 of the present invention. Fig.12 Schematic diagram of the heat dissipation cover 220 of the liquid-cooled heat dissipation plate 200 in one embodiment of the liquid-cooled heat dissipation system 10 of the utility model. The liquid-cooled heat dissipation plate 200 in the first embodiment of the liquid-cooled heat dissipation system 10 of the utility model comprises: a heat dissipation base plate 210 and a heat dissipation cover 220. Please refer to Fig.10 and Fig.11 The heat dissipation base plate 210 has a base plate inner surface 2101 and an opposite base plate outer surface 2102; the base plate inner surface 2101 is provided with a plurality of second heat dissipation columns 2103 protruding and arranged in a matrix, at least one guide plate slot 2104 in the form of a long groove, the protrusion is formed on the base plate inner surface 2101 and arranged between the plurality of second heat dissipation columns 2103, for inserting and installing at least one long sheet-shaped guide plate 2105, and an outer cover joint slot 2106, which is protruding and arranged around the periphery of the base plate inner surface 2101. The base plate outer surface 2102 is provided with a plurality of fan screw holes 2107 protruding on the base plate outer surface 2102, for locking at least one fan 600 so that it blows air to cool the base plate outer surface 2102. The heat dissipation base plate 210 as a whole includes a plurality of second heat dissipation columns 2103, guide plate slots 2104, cover joint slots 2106, and fan screw holes 2107, which are made of the same metal sheet (or a metal block) in an integrated manner. In this embodiment, the number of guide plate slots 2104 can be made according to actual application requirements, for example, it can be 1, 2, 3, 4, 5, 6, 7 or 8, and is matched with a corresponding number of long sheet-shaped guide plates 2105. For example, in Fig.10 and Fig.11 There are five guide plate slots 2104 shown in the figure, and five long sheet-shaped guide plates 2105 are respectively inserted and installed in the five guide plate slots 2104.

[0049] Please continue reading Fig.10 and Fig.12In this embodiment, the heat dissipation outer cover 220 has an outer cover top 2201 and an outer cover side wall 2202 connected to the outer cover top 2201, and the outer cover side wall 2202 surrounds the outer cover top 2201 to form a second accommodation space 2203. The outer cover side wall 2202 is also provided with at least one second liquid inlet 2204 and at least one second liquid outlet 2205, and the second liquid inlet 2204 and the second liquid outlet 2205 are connected to the second accommodation space 2203. When the heat dissipation outer cover 220 is covered with the heat dissipation bottom plate 210, the outer cover side wall 2202 of the heat dissipation outer cover 220 is inserted into the outer cover joint slot 2106 of the heat dissipation bottom plate 210 and welded, and the plurality of second heat dissipation columns 2103 are arranged in the second accommodation space 2203 to form the liquid-cooled heat dissipation plate 200. In this embodiment, the number of the second inlet 2204 and the second liquid outlet 2205 can be made according to actual application requirements, for example, it can be 1, 2, 3, 4, 5 or 6. It should be understood that increasing the number of the second inlet 2204 and the second liquid outlet 2205 can not only increase the number of connected liquid-cooled heat sinks 100, but also increase the flow rate of the cooling liquid 700 in and out of the liquid-cooled heat sink 200 through the branch pipe, thereby improving the heat dissipation efficiency.

[0050] Please refer to Figure 1 In the first embodiment of the liquid-cooled heat dissipation system 10 of the present invention, the first cooling liquid pipeline 300 is connected at one end to the first liquid inlet 1104 of the liquid-cooled heat spreader 100, and at the other end to the second liquid outlet 2205 of the liquid-cooled heat sink 200. The second cooling liquid pipeline 400 is connected at one end to the first liquid outlet 1105 of the liquid-cooled heat spreader 100, and at the other end to the second liquid inlet 2204 of the liquid-cooled heat sink 200. The cooling liquid circulator 500 is disposed between the first cooling liquid pipelines 300 or between the second cooling liquid pipelines 400 to pump the cooling liquid 700 so that the cooling liquid 700 circulates between the liquid-cooled heat spreader 100 and the liquid-cooled heat sink 200 to form the liquid-cooled heat dissipation system 10 of the present invention.

[0051] In the liquid-cooled vapor chamber 100 described in the first embodiment of the liquid-cooled heat dissipation system 10 of the present invention, the heat-absorbing outer surface 1301 of the metal lower cover plate 130 is a flat surface for contacting the heat-releasing electronic components.

[0052] Second embodiment

[0053] See also Fig. 6A , Figure 6B . Fig. 6A , Figure 6BThe schematic diagram of the structure of the metal lower cover plate 131 of the liquid-cooled heat spreader 100 and its structural cross-sectional diagram are shown in the second embodiment of the liquid-cooled heat dissipation system 10 of the utility model. As shown in the figure, in the second embodiment, the difference from the first embodiment is that the heat-absorbing outer surface 1311 of the metal lower cover plate 131 further has at least one recessed space 1313 for accommodating at least one heat-releasing electronic component, and the recessed space 1313 is recessed from the heat-absorbing outer surface 1311 to the evaporation inner surface 1312 but does not protrude from the corresponding evaporation inner surface 1312. In this embodiment, the thickness of the liquid-cooled heat spreader 100 from the heat-dissipating outer surface 1201 (excluding the first heat dissipation column 1203) to the heat-absorbing outer surface 1311 does not exceed 6 mm. In another embodiment, the above thickness does not exceed 5 mm, does not exceed 4 mm, or does not exceed 3.5 mm. It should be understood that in this embodiment, the shape and volume of the recessed space 1313 provided on the heat-absorbing outer surface 1311 of the metal lower cover plate 131 can be determined by the shape and volume of the heat-dissipating electronic component attached thereto. The design of this recessed space 1313 has the following advantages: (i) the heat-dissipating electronic component can be accommodated in the recessed space 1313 (or partially accommodated in the recessed space), so that the heat-dissipating electronic component and the liquid-cooled heat spreader 100 have a closer contact and a larger contact area (lateral contact area), which can improve the heat dissipation efficiency; (ii) the heat-dissipating electronic component is accommodated in the recessed space 1313, which can reduce the overall thickness during application.

[0054] Third embodiment

[0055] See also Fig. 7A , Figure 7B . Fig. 7A , Figure 7BThe schematic diagram of the structure of the metal lower cover plate 132 of the liquid-cooled heat spreader 100 and its structural cross-sectional diagram are shown in the third embodiment of the liquid-cooled heat dissipation system 10 of the utility model. As shown in the figure, in the third embodiment, the difference from the first embodiment is that the heat-absorbing outer surface 1321 of the metal lower cover plate 132 further has a plurality of recessed spaces 1323 for accommodating a plurality of heat-releasing electronic components, and the recessed spaces 1323 are recessed from the heat-absorbing outer surface 1321 to the evaporation inner surface 1322 but do not protrude from the corresponding evaporation inner surface 1322. In this embodiment, the thickness of the liquid-cooled heat spreader 100 from the heat-dissipating outer surface 1201 (excluding the first heat dissipation column 1203) to the heat-absorbing outer surface 1321 does not exceed 6 mm. In another embodiment, the above thickness does not exceed 5 mm, does not exceed 4 mm, or does not exceed 3.5 mm. Further explanation, as shown in the figure, in this embodiment, the plurality of recessed spaces 1323 provided on the heat-absorbing outer surface 1321 of the metal lower cover plate 132 is intended to be applied to the small chip packaging (chiplet) products that are becoming the mainstream in the market. Small chip packaging refers to integrating several or even dozens of small chips of the same or different functions, sizes, and volumes together using packaging technology. However, when several or even dozens of chips are packaged in the same small space, the connection lines between them are extremely short, the operating frequency is higher, the heat and heat density generated are also higher, and the heat dissipation problem will be more difficult. The plurality of recessed spaces 1323 designed in the metal lower cover plate of this embodiment can be designed according to the overall size, contour, and overall volume of the small chip after packaging, so that the small chip can be more closely fitted and accommodated in the plurality of recessed spaces 1323. The rapid lateral heat diffusion and high heat dissipation efficiency of the liquid-cooled heat spreader 100, coupled with the high heat exchange efficiency of the first heat dissipation column 1203 and the cooling liquid 700, can more effectively solve the heat dissipation problem of the small chip. Based on the above, it should be understood that in this embodiment, the plurality of recessed spaces 1323 may have the same or different shapes and volumes, so as to simultaneously accommodate a plurality of heat-dissipating electronic components of the same or different shapes and volumes. Fig. 7A shown.

[0056] Fourth embodiment

[0057] See also Fig. 8A , Figure 8B . Fig. 8A , Figure 8BThe schematic diagram of the structure of the metal lower cover plate 133 of the liquid-cooled heat spreader 100 and its structural cross-sectional diagram are shown in the fourth embodiment of the liquid-cooled heat dissipation system 10 of the utility model. As shown in the figure, in the fourth embodiment, the difference from the first embodiment is that the heat-absorbing outer surface 1331 of the metal lower cover plate 133 further has at least one screw hole 1333 for locking at least one heat-releasing electronic component, wherein the screw hole 1333 is recessed from the heat-absorbing outer surface 1331 to the evaporation inner surface 1332 and protrudes from the evaporation inner surface 1332 but does not penetrate, so as to form a screw hole protrusion 1334, and the height of the screw hole protrusion 1334 is not greater than the height of the columnar support structure 1306. To further illustrate, in order to enable the chip to be in closer contact with the metal lower cover 133 of the liquid-cooled heat spreader 100, in the present embodiment, at least one screw hole 1333 is provided on the heat absorbing outer surface 1331 of the metal lower cover 133, so that the chip (heat-releasing electronic component) can be locked on the heat absorbing outer surface 1331, without the need to use thermal conductive paste to adhere the chip to the heat absorbing outer surface 1331, thereby avoiding a heterogeneous interface with low thermal conductivity efficiency and improving the heat dissipation efficiency.

[0058] Fifth embodiment

[0059] See also Fig.9A , Fig. 9B . Fig.9A , Fig. 9B The schematic diagram of the structure of the metal lower cover plate 134 of the liquid-cooled heat spreader 100 and its structural cross-sectional diagram are shown in the fifth embodiment of the liquid-cooled heat dissipation system 10 of the utility model. As shown in the figure, in the fifth embodiment, the difference from the first embodiment is that the heat-absorbing outer surface 1341 of the metal lower cover plate 134 further has a plurality of screw holes 1343 for locking a plurality of heat-releasing electronic components, wherein each of the plurality of screw holes 1343 is recessed from the heat-absorbing outer surface 1341 to the evaporating inner surface 1342 and protrudes from the evaporating inner surface 1342 but does not penetrate, so as to form a plurality of screw hole protrusions 1344, and the height of each of the plurality of screw hole protrusions 1344 is not greater than the height of the columnar support structure 1306. The number of the plurality of screw holes 1343 can be made according to the actual application situation, for example, it can be 2, 3, 4, 5, 6, 7, 8, 9, 10, 11 or 12. Fig.9A As shown, in this example, the number of the plurality of screw holes 1343 is 10, which can be used to fix 10 heat-dissipating electronic components.

[0060] Sixth embodiment

[0061] See also Fig.13 , which is a schematic diagram of the structure of another embodiment of the liquid cooling heat dissipation system 20 of the utility model. In this embodiment, Fig.13As shown, the liquid-cooled heat dissipation system 20 includes 4 liquid-cooled heat sinks 100, a liquid-cooled heat sink 201 with 4 second liquid inlets 2214 and 4 second liquid outlets 2215, a first coolant pipeline 301, which is a branch pipe with 4 branches, a second coolant pipeline 401, which is a branch pipe with 4 branches, a coolant circulation machine 500 (or a coolant distribution unit, CDU), 4 fans 600, which are locked to the outer surface 2102 of the bottom plate 210 of the liquid-cooled heat sink 201 through fan screw holes 2107, and cooling liquid 700. Each first liquid inlet 1104 of the four liquid-cooled heat spreaders 100 is connected to the four second liquid outlets 2215 of the liquid-cooled heat sink 200 through a first cooling liquid pipeline 301 having four branch pipes, and each first liquid outlet 1105 of the four liquid-cooled heat spreaders 100 is connected to the four second liquid inlets 2214 of the liquid-cooled heat sink 200 through a second cooling liquid pipeline 401 having four branch pipes. In this embodiment, the cooling liquid circulator 500 is disposed between the first cooling liquid pipeline 301 connecting the second liquid outlet 2215 of the liquid-cooled heat sink 201 and the first liquid inlet 1104 of the liquid-cooled heat spreader 100, that is, inserted between the first cooling liquid pipeline 301. The cooling liquid 700 is pumped through the cooling liquid circulation machine 500 (or cooling liquid distribution unit, CDU) and flows into the first accommodation space 1103 of each liquid-cooled heat spreader 100 for heat exchange. After absorbing the heat, the cooling liquid 700 then flows out of the first accommodation space 1103, and is transported through the second cooling liquid pipeline 401 and flows into the second accommodation space 2203 of the liquid-cooled heat sink 201. As the cooling liquid 700 flows in the liquid-cooled heat sink 200, the liquid-cooled heat sink 201 and the cooling liquid 700 are cooled and lowered by forced air cooling through a plurality of fans 600.

[0062] Further explanation, in Fig.13The structures or sizes of the multiple liquid-cooled heat spreaders 100 used in the embodiments may be the same or different, for example, they may be selected from any liquid-cooled heat spreader 100 having a metal lower cover plate (130, 131, 132, 133, 134) as described in the first to fifth embodiments. Each liquid-cooled heat spreader 100 can be applied to the same or different chipsets or heat-dissipating electronic components at the same time, and the amount of heat absorbed by each liquid-cooled heat spreader 100 may also be different, so the flow rate of the cooling liquid 700 required for cooling may also be different. The cooling liquid circulator 500 (CDU) can adjust the flow rate of the cooling liquid 700 flowing into each liquid-cooled heat spreader 100 according to the actual temperature conditions of each liquid-cooled heat spreader 100 to more accurately control the temperature of the chipset or heat-dissipating electronic components. In this embodiment, the number of liquid-cooled heat sinks 100 used is 2, 3 or 4, and the first coolant pipeline 301 and the second coolant pipeline 401 are branch pipes with branch pipes corresponding to the number of liquid-cooled heat sinks 100, and the coolant circulator 500 is a coolant distribution unit (CDU).

[0063] In addition, through the use of branch pipes, the number of the liquid-cooled vapor chamber 100 and the number of the second liquid inlets 2214 and the second liquid outlets 2215 of the liquid-cooled heat sink 201 can be equal or unequal.

[0064] In one embodiment of the present invention, in the liquid-cooled heat dissipation system 10 (20), the liquid cooling cover 110, the metal upper cover 120, the metal lower cover (130, 131, 132, 133, 134), the heat dissipation base plate 210, and the heat dissipation outer cover 220, 221 are made of copper, aluminum, aluminum alloy or magnesium alloy.

[0065] In any embodiment of the present invention, the working fluid 160 is water.

[0066] In an embodiment of the present invention, in the liquid-cooled heat sink 201 , the outer cover side wall 2202 is provided with a plurality of second liquid inlets 2214 and a plurality of second liquid outlets 2215 .

[0067] In the above-mentioned embodiment, in the liquid-cooled heat sink 200 , the number of the second liquid inlets 2214 and the second liquid outlets 2215 disposed on the outer cover side wall 2202 are 2, 3 or 4 respectively.

[0068] In an embodiment of the present invention, the liquid-cooled heat sink 200 is a plate-shaped structure with a length of 250 mm-600 mm, a width of 150 mm-450 mm, and a thickness of 10 mm-30 mm.

[0069] In one embodiment of the present invention, in the liquid-cooled heat dissipation system 10 (20), the cooling liquid 700 is water. In another embodiment, in the liquid-cooled heat dissipation system 10 (20), the cooling liquid 700 is water, especially softened water, to avoid scale formation after long-term use. In other embodiments, in the liquid-cooled heat dissipation system 10 (20), the cooling liquid may also be added with an antifreeze agent (e.g., ethylene glycol) depending on the actual application situation, to prevent the cooling liquid from solidifying and becoming ineffective when the ambient temperature is below zero degrees Celsius.

[0070] In one embodiment of the present invention, in the liquid-cooled heat dissipation system 10 (20), the cooling liquid 700 is water, and the volume is about 1 liter to 6 liters. It should be understood that in the liquid-cooled heat dissipation system 10 (20) of the present invention, according to the heat generated by the heat-generating electronic components to be cooled, the size, volume, number and size of the second liquid inlet 2214 and the second liquid outlet 2215 of the liquid-cooled heat sink 200, the number of guide plate slots 2104 and the long sheet guide plates 2105, etc., can all be designed according to the actual application situation, and the volume of the cooling liquid 700 required to be used will also vary accordingly. The larger the volume of the cooling liquid 700 used, the more heat can be absorbed.

[0071] It should be understood that the structures of the liquid-cooled vapor chamber 100 and the liquid-cooled heat sink 200 provided in any of the above embodiments of the liquid-cooled heat dissipation system 10, 20 of the present invention are exemplary descriptions and are not intended to limit the scope of the liquid-cooled heat dissipation system 10, 20 of the present invention. After referring to the various embodiments of the present invention, a person skilled in the art with ordinary knowledge in the technical field to which the present invention belongs should be able to set the number, position, size, shape, and structure of the liquid-cooled vapor chamber 100 and the liquid-cooled heat sink 200 according to the actual application situation to achieve the expected heat dissipation efficiency.

[0072] The above embodiments are only used for illustration and are not intended to limit the scope of the present invention. Any equivalent modifications or changes made to the liquid-cooled heat dissipation systems 10 and 20 according to the above embodiments should still be included in the scope of the present invention.

[0073] It is worth mentioning that 2024 is known as the first year of AI computers (AIPC). The industry currently believes that both commercial and consumer computers will have the need to operate generative AI, which will also become a key turning point for generative AI to move from the "cloud" to the "edge". The huge "computing power" of AI chip modules will lead to higher and higher power consumption and generate a lot of heat, requiring more effective heat dissipation modules to help cool down. As AI chip modules continue to upgrade, the requirements for heat dissipation modules will also become higher and higher.

[0074] AI computers can be considered as an upgraded version of existing computers. However, most current computer CPUs or GPUs use air-cooled radiators, or are composed in the form of AI servers and use cabinets with liquid-cooled heat dissipation modules to enhance heat dissipation efficiency. The liquid-cooled heat dissipation system proposed in the present invention is a high-heat dissipation efficiency liquid-cooled heat dissipation system that can be applied to stand-alone AI computers. Compared with air-cooled heat dissipation, it has the following advantages:

[0075] (1) High heat dissipation efficiency: Liquid coolant can quickly absorb and transport large amounts of heat, and has a cooling efficiency that is superior to traditional air cooling.

[0076] (ii) Low noise: Compared with air-cooled cooling systems with high-speed cooling fans, liquid cooling is usually quieter and helps create a low-noise working environment.

[0077] (III) Reduce energy consumption: Liquid cooling can more effectively reduce the temperature of working system equipment than air cooling, allowing the equipment to maintain lower operation and improve energy efficiency.

[0078] It can be seen that the present invention has indeed achieved the desired improved effect by breaking through the existing technology, and it is not easy for those familiar with the art to think of it.

[0079] The above description is for illustrative purposes only and is not intended to be limiting. Any other equivalent modifications or changes made to the present invention without departing from the spirit and scope of the present invention should be included in the appended claims.

Claims

1. A liquid cooling system, characterized in that: include: At least one liquid-cooled heat sink, a liquid-cooled heat sink, at least one first cooling liquid pipeline, at least one second cooling liquid pipeline, a cooling liquid circulator, at least one fan and a cooling liquid; The liquid-cooled vapor chamber includes: A liquid cooling cover, comprising a top and a side wall connected to the top, the side wall surrounds the top to form a first accommodating space, the side wall is provided with at least one first liquid inlet and at least one first liquid outlet, the first liquid inlet and the first liquid outlet are connected to the first accommodating space; A metal upper cover plate, including a heat dissipation outer surface and a condensation inner surface, the heat dissipation outer surface has a plurality of first heat dissipation columns, and the condensation inner surface is provided with an upper frame of appropriate height surrounding the condensation inner surface, the upper frame is provided with an upper channel groove, and the condensation inner surface has a plurality of upper grooves arranged parallel to each other, wherein the metal upper cover plate as a whole including the first heat dissipation columns is made of a metal sheet / block in an integral molding manner; A metal lower cover plate, comprising a heat-absorbing outer surface and an evaporation inner surface, the heat-absorbing outer surface is used to contact a heat-releasing electronic component, the periphery of the evaporation inner surface is provided with a lower frame of appropriate height surrounding the evaporation inner surface, the lower frame is provided with a lower channel groove, and the evaporation inner surface has a plurality of lower grooves arranged in parallel with each other and a plurality of columnar support structures protruding between the lower grooves, wherein the metal lower cover plate as a whole including the columnar support structure is made of a metal sheet / block in an integral molding manner; the upper frame of the metal upper cover plate and the lower frame of the metal lower cover plate are mutually joined to form a working space; the plurality of columnar support structures protrude from the evaporation inner surface and abut between the upper grooves of the condensation inner surface to support the working space; An exhaust channel, formed by the corresponding connection of the upper channel groove and the lower channel groove, is used to exhaust the working space and is sealed after exhausting the air so that the working space maintains a near vacuum state; a capillary structure disposed in the lower groove or in the upper groove and the lower groove; and A working fluid exists in the working space and the capillary structure; The liquid cooling cover is connected to the heat dissipation outer surface of the metal upper cover plate, and the first heat dissipation column is arranged in the first accommodating space to form the liquid cooling type heat sink; The liquid cooling heat sink includes: A heat dissipation base plate, comprising an inner surface of the base plate and an opposite outer surface of the base plate; the inner surface of the base plate is provided with a plurality of second heat dissipation columns which are protruded and arranged in a matrix manner, at least one guide plate slot which is in the shape of a long groove, the protrusion being formed on the inner surface of the base plate and arranged between the plurality of second heat dissipation columns for inserting and installing at least one long sheet-shaped guide plate, and an outer cover joint slot which is protruded and arranged around the periphery of the inner surface of the base plate; the outer surface of the base plate is provided with a plurality of fan screw holes which are protruded on the outer surface of the base plate for locking at least one fan so that it blows air to cool the outer surface of the base plate; wherein the heat dissipation base plate as a whole including the plurality of second heat dissipation columns, the guide plate slot, the outer cover joint slot, and the fan screw holes are made of the same metal sheet / block in an integral molding manner; and A heat dissipation outer cover, comprising an outer cover top and an outer cover side wall connected to the outer cover top, the outer cover side wall surrounds the outer cover top to form a second accommodating space, the outer cover side wall is provided with at least one second liquid inlet and at least one second liquid outlet, the second liquid inlet and the second liquid outlet are connected to the second accommodating space; When the heat dissipation cover is covered with the heat dissipation base plate, the cover side wall of the heat dissipation cover is inserted into the cover joint slot of the heat dissipation base plate and welded, and the plurality of second heat dissipation columns are arranged in the second accommodating space to form the liquid-cooled heat dissipation plate; Among them, one end of the first cooling liquid pipeline is connected to the first liquid inlet of the liquid-cooled heat spreader, and the other end is connected to the second liquid outlet of the liquid-cooled heat sink; one end of the second cooling liquid pipeline is connected to the first liquid outlet of the liquid-cooled heat spreader, and the other end is connected to the second liquid inlet of the liquid-cooled heat sink; the cooling liquid circulator is arranged between the first cooling liquid pipelines or between the second cooling liquid pipelines to pump the cooling liquid so that the cooling liquid circulates between the liquid-cooled heat spreader and the liquid-cooled heat sink to form the liquid-cooled heat dissipation system.

2. The liquid cooling heat dissipation system according to claim 1, characterized in that: The heat absorbing outer surface of the metal lower cover plate is a flat surface for contacting the heat releasing electronic element.

3. The liquid cooling system according to claim 1, characterized in that: The heat-absorbing outer surface of the metal lower cover plate has at least one recessed space for accommodating at least one heat-releasing electronic element, and the recessed space is recessed from the heat-absorbing outer surface toward the evaporation inner surface but does not protrude from the corresponding evaporation inner surface.

4. The liquid cooling heat dissipation system according to claim 3, characterized in that: The recessed spaces are multiple and are used to accommodate multiple heat-dissipating electronic components.

5. The liquid cooling system according to claim 4, characterized in that: Each of the recessed spaces has the same or different shapes and volumes, and is used to simultaneously accommodate a plurality of the heat-dissipating electronic components of the same or different shapes and volumes.

6. The liquid cooling heat dissipation system according to claim 1, characterized in that: The heat-absorbing outer surface of the metal lower cover plate has at least one screw hole for locking at least one of the heat-releasing electronic components, wherein the screw hole is recessed from the heat-absorbing outer surface toward the evaporation inner surface and protrudes from the evaporation inner surface but does not penetrate through, so as to form a screw hole protrusion, and the height of the screw hole protrusion is not greater than the height of the columnar support structure.

7. The liquid cooling system according to claim 1, characterized in that: The number of the liquid-cooled heat spreaders is 2, 3 or 4, and the first cooling liquid pipeline and the second cooling liquid pipeline are branch pipes with branch pipes corresponding to the number of the liquid-cooled heat spreaders, and the cooling liquid circulation machine is a cooling liquid distributor.

8. The liquid cooling heat dissipation system according to claim 1, characterized in that: The liquid cooling cover, the metal upper cover plate, the metal lower cover plate, the heat dissipation bottom plate and the heat dissipation outer cover are made of copper, aluminum, aluminum alloy or magnesium alloy.

9. The liquid cooling system according to claim 1, characterized in that: The working fluid is water.

10. The liquid cooling system according to claim 1, characterized in that: The side wall of the outer cover is provided with a plurality of the second liquid inlets and a plurality of the second liquid outlets.

11. The liquid cooling system according to claim 10, characterized in that: The number of the second liquid inlet and the second liquid outlet are 2, 3 or 4 respectively.

12. The liquid cooling heat dissipation system according to claim 1, characterized in that: The liquid-cooled heat sink is a plate-shaped structure with a length of 250mm-600mm, a width of 150mm-450mm, and a thickness of 10mm-30mm.

13. The liquid cooling system according to claim 1, characterized in that: The cooling liquid is water.

14. The liquid cooling heat dissipation system according to claim 1, characterized in that: The cooling liquid is water, and the volume is about 1 liter to 6 liters.

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