Ceramic packaging device for chip packaging

Abstract

The utility model relates to a ceramic packaging device for chip packaging, which comprises a packaging shell with an opening on one side wall, a mounting plate for mounting a chip is arranged in the packaging shell in a sliding manner, and a shell cover for covering the opening is arranged on one side wall of the mounting plate. The end, away from the opening, of the shell cover is provided with a pin used for being electrically connected with the chip, clamping grooves are formed in the two side walls, adjacent to the shell cover, of the mounting plate, and sliding grooves extending in the sliding direction of the mounting plate are formed in the two outer side walls, adjacent to the opening, of the packaging shell. The two sliding grooves are located at the positions opposite to the corresponding clamping grooves when the shell cover covers the opening, a sliding block clamped with the corresponding clamping groove in a sliding mode is arranged in each sliding groove in a sliding mode, and by means of the sliding blocks and the clamping grooves which are clamped in a sliding mode, the installation plate can be conveniently pulled out to check and maintain the chips on the installation plate.

Description

Technical Field

[0001] The utility model relates to the field of chip packaging, and more specifically, to a ceramic packaging device for chip packaging. Background Art

[0002] The so-called ceramic packaging refers to a type of semiconductor assembly process that uses a ceramic packaging shell (CPS) or a ceramic substrate as a packaging carrier, adheres or welds the chip to the core cavity of the ceramic shell or the chip mounting area of ​​the ceramic substrate, and then interconnects the chip and the shell or substrate through wire bonding or flip-chip welding. The chip is then sealed in the cavity with a metal or ceramic cover or cap. This can prevent impurities in the air from corroding the chip circuit and causing a decrease in electrical performance, and the packaged chip is also easier to install and transport.

[0003] For example, a Chinese utility model patent discloses a ceramic packaging device for chips (application number: CN201920892395.9), which uses pins, springs and slots on two clamping covers and chip mounting plates to fix the chip mounting plates that slide into the packaging shell, while the threaded grooves and the heat dissipation cover threadedly connected in the threaded grooves are used for heat dissipation. However, when repairing the chip, the staff needs to remove the heat dissipation cover to cut off the connection between the chip and the pins, and then pull the two clamping covers with both hands and keep each pin out of the slot before pulling out the chip mounting plate and inspecting and repairing the chip. Keeping each pin out of the slot and pulling out the chip mounting plate need to be done at the same time, which requires additional tools to keep pulling the two clamping covers or the assistance of a second staff member, which is very inconvenient. Utility Model Content

[0004] In view of the above-mentioned defects in the prior art, a ceramic packaging device for chip packaging is provided.

[0005] The technical solution adopted by the utility model to solve its technical problems is: a ceramic packaging device for chip packaging, comprising a packaging shell with an opening on one side wall, a mounting plate for mounting the chip slidably arranged in the packaging shell, a shell cover covering the opening is arranged on one side wall of the mounting plate, a pin for electrically connecting to the chip is arranged at one end of the shell cover away from the opening, card grooves are arranged on both side walls adjacent to the mounting plate and the shell cover, and slide grooves extending along the sliding direction of the mounting plate are arranged on both outer side walls adjacent to the opening of the packaging shell, the two slide grooves are located at positions opposite to the corresponding slots when the shell cover covers the opening, and a slider slidably arranged in each of the slide grooves for slidably engaging with the corresponding slot.

[0006] Preferably, a slider groove is provided at one end of the slider close to the bottom of the slide groove; an elastically retractable snap block is provided in the slider groove; the surface of the snap block at one end away from the slider groove is an inclined surface; the inclined surface is inclined toward the center of the packaging shell from the end close to the opening to the end away from the opening; and a slide groove through hole is provided at the bottom of the slide groove for the snap block to extend out.

[0007] Preferably, a spring is arranged between the buckle block and the bottom of the slider groove; one end of the spring is connected to the bottom of the slider groove; the other end of the spring is connected to the surface of the buckle block opposite to the bottom of the slider groove.

[0008] Preferably, one end of the slide slot through hole close to the opening and located inside the packaging shell is chamfered.

[0009] Preferably, a chip groove for mounting a chip is provided at the top of the mounting plate.

[0010] Preferably, a avoidance groove for avoiding the pin is provided at the top of the mounting plate, and the avoidance groove is communicated with the chip groove.

[0011] Preferably, a heat dissipation through hole is provided at the top of the packaging shell, and a dustproof net is provided in the heat dissipation through hole.

[0012] Preferably, an end of the sliding block away from the bottom of the corresponding sliding groove is provided with anti-slip stripes.

[0013] Preferably, a slide rail and a slide rail groove which slide in cooperation with each other are arranged between the slider and the slide groove.

[0014] The beneficial effect of the utility model is that: the mounting plate slidably arranged in the packaging shell is fixed by using the snap block, the spring and the slot, and the two sliders are slid toward the opening direction of the packaging shell, and the snap block moves into the corresponding slider groove through the wedge structure. When the snap block completely enters the slider groove, the groove bottom of the slide groove keeps the snap block away from the slot, and the pin is arranged on the shell cover and moves with the mounting plate. In summary, the utility model does not require the staff to use both hands or use additional tools to keep the snap block away from the slot, and at the same time, there is no need to cut off the chip and the pin, and the mounting plate can be pulled out to inspect and repair the chip thereon. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the utility model;

[0016] Figure 2 It is a cross-sectional structural schematic diagram of an embodiment of the utility model

[0017] Figure 3 This utility model embodiment Figure 2A magnified schematic diagram of the middle A area;

[0018] Figure 4 This is a schematic diagram of the structure of the mounting plate and the housing cover of the embodiment of the utility model;

[0019] Figure 5 This is a schematic diagram of the packaging shell structure of an embodiment of the utility model;

[0020] Figure 6 This utility model embodiment Figure 5 A magnified schematic diagram of the middle B area;

[0021] Figure 7 It is a schematic diagram of the structure of a slider in an embodiment of the utility model.

[0022] Figure numerals: 1 packaging shell, 10 slide groove, 100 slide rail, 11 slider, 110 slider groove, 111 snap block, 112 spring, 113 slide rail groove, 113 anti-slip stripe, 12 slide groove through hole, 120 chamfer structure, 2 mounting plate, 20 chip groove, 21 avoidance groove, 22 card slot, 3 shell cover, 30 pin, 4 heat dissipation through hole, 40 dustproof net. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the embodiments of the utility model clearer, the following will be clearly and completely described in combination with the technical solution in the embodiments of the utility model. Obviously, the described embodiments are partial embodiments of the utility model, rather than all embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work belong to the protection scope of the utility model. In addition, the directional terms mentioned in the utility model, such as "up", "down", "front", "back", "left", "right", "inside", "outside", etc., are only referenced to the directions of the attached diagrams. The directional terms used are for better and clearer explanation and understanding of the utility model, rather than indicating or implying the orientation that the utility model must have, and therefore cannot be understood as a limitation on the utility model.

[0024] The utility model is implemented as follows Figures 1 to 7As shown in the figure, a ceramic packaging device for chip packaging comprises a packaging shell 1 with an opening at the front end, a mounting plate 2 for mounting the chip is slidably arranged in the packaging shell 1, the packaging shell 1 or the mounting plate 2 is made of ceramic material, a shell cover 3 covering the opening is arranged on the front side wall of the mounting plate 2, a pin 30 for electrically connecting to the chip is arranged at the front end of the shell cover 3, a card slot 22 is arranged on both side walls adjacent to the mounting plate 2 and the shell cover 3, a slide slot 10 extending in the front-to-back direction is arranged on the left and right outer side walls of the packaging shell 1, the two slide slots 10 are correspondingly located at the rear side of the left and right outer side walls of the packaging shell 1 and opposite to the left and right side walls of the mounting plate 2, and a slider 1 is slidably arranged in each of the slide slots 10 to slide and engage with the card slot 22 1. A slide rail 100 and a slide rail groove 113 that slide in cooperation with each other are arranged between the slider 11 and the slide groove 10, that is, the slide rails 100 are arranged on the upper and lower side walls of the slide groove 10 in the front-back direction, and the slide rail grooves 113 that slide in cooperation with the slide rail 100 are arranged on the upper and lower ends of the slider 11, and a slider groove 110 is arranged at one end of the slider 11 close to the bottom of the slide groove 10, that is, the slider groove 110 is arranged at the right end of the slider 11 on the left side, and the slider groove 110 is arranged at the left end of the slider 11 on the right side, and a buckle block 111 is elastically arranged in the slider groove 110, and a spring 112 is arranged between the buckle block 111 and the bottom of the slider groove 110; one end of the spring 112 is connected to the bottom of the slider groove 110;The other end of the spring 112 is connected to the surface of the buckle block 111 opposite to the bottom of the slider groove 110, and the surface of the buckle block 111 at the end away from the slider groove 110 is an inclined surface, and the inclined surface is inclined toward the center of the packaging shell 1 from the end close to the opening to the end away from the opening, that is, the right end of the left buckle block 111 is an inclined surface structure, and the left end of the right buckle block 111 is an inclined surface structure, and the front end of the inclined surface to the rear end of the inclined surface is inclined toward the center of the packaging shell 1, and the bottom of the slide groove 10 is provided with a slide groove through hole 12 for the buckle block 111 to extend out, and the end of the slide groove through hole 12 close to the opening side and located inside the packaging shell 1 is a chamfered structure 120. When the mounting plate 2 is installed, the front ends of the inclined surfaces of the left and right buckle blocks 111 are located in the corresponding slider grooves 110, and the left and right buckle blocks 1 The rear end of the inclined surface of 11 is located on the inner side of the left and right inner sides of the packaging shell 1, and the rear end of the inclined surface is located in the card slot 22. At this time, the rear end of the inclined surface of the buckle block 111 cooperates with the card slot 22 to fix the mounting plate 2, so that the mounting plate 2 cannot be pulled out forward. When the mounting plate 2 needs to be pulled out, the sliders 11 on the left and right sides are slid forward to make the two buckle blocks 111 move into the corresponding slider grooves 110 through the inclined surface and chamfered structure 120, that is, the left buckle block 111 slides into the left slider groove 110, and the right buckle block 111 slides into the right slider groove 110. When the two buckle blocks 111 completely enter the corresponding slider grooves 110, the groove bottom prevention spring 112 of the slide groove 10 makes the buckle block 111 slide, that is, the groove bottom of the slide groove 10 keeps the buckle block 111 away from the card slot 22, and the mounting plate 2 can be pulled out forward at this time. ;

[0025] Further improvements such as Figure 2 and Figure 4 As shown in the figure, a chip groove 20 for installing the chip is set at the center position of the top of the mounting plate 2, and a avoidance groove 21 for avoiding the pin 30 is set on the front side of the top of the mounting plate 2. The avoidance groove 21 is connected with the chip groove 20. The chip is prevented from shaking and falling off through the chip groove 20, which facilitates the installation of the chip. The avoidance groove 21 connected with the chip groove 20 facilitates the connection between the chip and the pin 30 when installing the chip.

[0026] Further improvements such as Figure 1 and Figure 5 As shown in the figure, a heat dissipation through hole 4 is arranged at the top center position of the packaging shell 1, and a dustproof net 40 is arranged in the heat dissipation through hole 4. The heat dissipation through hole 4 and the dustproof net 40 effectively improve the heat dissipation capacity and prevent dust from entering the packaging shell 1 and affecting the use of the chip.

[0027] Further improvements such as Figure 1As shown in the figure, the end of the slider 11 away from the bottom of the corresponding slide groove 10 is provided with an anti-slip stripe 113, that is, the left end of the slider 11 on the left is provided with an anti-slip stripe 113, and the right end of the slider 11 on the right is provided with an anti-slip stripe 113. The anti-slip stripe 113 facilitates the user to slide the slider 11.

[0028] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to the utility model.

Claims

1. A ceramic packaging device for chip packaging, comprising a packaging shell with an opening on one side wall; characterized in that: A mounting plate for mounting the chip is slidably arranged in the package shell; a shell cover covering the opening is arranged on one side wall of the mounting plate; a pin for electrically connecting to the chip is arranged at the end of the shell cover away from the opening; a card slot is arranged on both side walls adjacent to the mounting plate and the shell cover; a slide slot extending along the sliding direction of the mounting plate is arranged on both outer side walls adjacent to the opening of the package shell; the two slide slots are located at positions opposite to the corresponding slots when the shell cover covers the opening; a slider is slidably arranged in each slide slot and slidably engages with the corresponding slot, so that The end of the slider close to the bottom of the slide groove is provided with a slider groove; an elastically retractable buckle block is provided in the slider groove; the surface of the buckle block at the end away from the slider groove is an inclined surface; the inclined surface is inclined toward the center of the packaging shell from the end close to the opening to the end away from the opening; the bottom of the slide groove is provided with a slide groove through hole for the buckle block to extend out, and a spring is provided between the buckle block and the bottom of the slider groove; one end of the spring is connected to the bottom of the slider groove; the other end of the spring is connected to the surface of the buckle block opposite to the bottom of the slider groove.

2. A ceramic packaging device for chip packaging according to claim 1, characterized in that: The end of the slide slot through hole close to the opening and located inside the packaging shell is in a chamfered structure.

3. A ceramic packaging device for chip packaging according to claim 1, characterized in that: The top of the mounting plate is provided with a chip groove for mounting a chip.

4. According to the ceramic packaging device for chip packaging as described in claim 3, a avoidance groove for avoiding the pins is provided on the top of the mounting plate; the avoidance groove is connected to the chip groove.

5. The ceramic packaging device for chip packaging according to claim 1, characterized in that: A heat dissipation through hole is arranged at the top of the packaging shell; a dustproof net is arranged in the heat dissipation through hole.

6. The ceramic packaging device for chip packaging according to claim 1, characterized in that: An end of the sliding block away from the bottom of the corresponding sliding groove is provided with an anti-slip stripe.

7. A ceramic packaging device for chip packaging according to claim 1, characterized in that: A slide rail and a slide rail groove which slide in cooperation with each other are arranged between the sliding block and the slide groove.

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