Audio module and electronic equipment

Abstract

The utility model relates to an audio module and electronic equipment, the audio module is used for the electronic equipment, and the audio module comprises a body, a sound production assembly and a microphone. The body comprises a first mounting part and a sound production channel communicated with the first mounting part; the sounding assembly is arranged on the first mounting part; the microphone is configured to be capable of receiving audio of the sound production assembly in the sound production channel. When the sound production assembly produces sound, the microphone can detect the performance / quality of the sound in real time and transmit data such as distortion / loudness and the like to the electronic equipment controller and the signal regulator, so that a sound production signal given to the sound production assembly is readjusted, and the audio performance / quality of the sound production assembly is improved. Meanwhile, the microphone does not need to be provided with a hole independently, and the overall structure is simplified.

Description

Technical Field

[0001] The present disclosure relates to the field of audio technology, and in particular, to an audio module and an electronic device. Background Art

[0002] Currently, electronic devices are equipped with microphones and sound-emitting components (including speakers and receivers), and in related technologies, the microphones and sound-emitting components are respectively provided with sound receiving holes and sound emitting holes for receiving audio and generating audio. On the one hand, they take up a large space, and on the other hand, the working state of the sound-emitting component (such as noise reduction, etc.) cannot be adjusted in real time. Utility Model Content

[0003] The purpose of the present disclosure is to provide an audio module and an electronic device, wherein the audio module is used in the electronic device, and a microphone is connected to a sound channel to at least partially solve the related problems.

[0004] In order to achieve the above object, the present disclosure provides, in a first aspect, an audio module, including:

[0005] A body, comprising a first mounting portion and a sound-generating channel communicating with the first mounting portion;

[0006] a sound-generating component, disposed on the first mounting portion; and

[0007] A microphone is configured to receive audio from the sound emitting component in the sound emitting channel.

[0008] Optionally, the body includes a second mounting portion and a connecting channel connecting the second mounting portion and the sound channel;

[0009] The microphone is arranged on the second mounting portion, so that the audio generated by the sound-emitting component can be received by the microphone after passing through the sound-emitting channel and the connecting channel.

[0010] Optionally, the second mounting portion is located lateral to the first mounting portion.

[0011] Optionally, the microphone is arranged in the sound emitting channel.

[0012] Optionally, the microphone is also configured to receive external audio.

[0013] According to a second aspect of the present disclosure, an electronic device is also provided, and the electronic device includes the above-mentioned audio module.

[0014] Optionally, the electronic device further comprises a shell arranged around the audio module, the shell being formed with a sound outlet hole communicating with the sound emitting channel.

[0015] Optionally, the sound outlet hole is respectively connected to the sound emitting channel and the sound receiving channel of the microphone.

[0016] Optionally, the sound receiving channel at least partially overlaps with the sound emitting channel; or

[0017] The sound receiving channel and the sound emitting channel are respectively communicated with the sound outlet through a common channel.

[0018] Optionally, the sound-emitting component and the microphone are respectively connected to a mainboard of the electronic device via a flexible printed circuit board.

[0019] Optionally, the distance between the microphone and the sound outlet is smaller than the distance between the sound-emitting component and the sound outlet.

[0020] Optionally, the electronic device further includes a controller;

[0021] The microphone and the sound-generating component are both connected to the controller for communication.

[0022] Optionally, the electronic device further includes a signal conditioner, and the signal conditioner is communicatively connected to the controller and the sound-generating component respectively.

[0023] Through the above technical solution, the audio module of the present disclosure is used in electronic equipment, including a sound component, a microphone and a body, wherein the body includes a first mounting portion and a sound channel for mounting the sound component, so that the sound emitted by the sound component can be transmitted outward through the sound channel, and the microphone can receive the audio of the sound component in the sound channel, that is, the microphone and the sound component can share the sound channel, when the sound component emits sound, the microphone can detect the performance / quality of the sound in real time, and transmit the distortion / loudness and other data to the electronic device controller and signal conditioner, so as to readjust the sound signal given to the sound component and improve the audio performance / quality of the sound component. At the same time, the microphone does not need to be opened separately, simplifying the overall structure.

[0024] Other features and advantages of the present disclosure will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings:

[0026] Figure 1 It is a structural diagram of the audio module provided in some embodiments of the present disclosure.

[0027] Figure 2 It is a structural diagram of the audio module provided in other embodiments of the present disclosure.

[0028] Figure 3This is a diagram of the working principle of the audio module provided in some embodiments of the present disclosure.

[0029] Figure 4 It is a schematic diagram of the structure of an electronic device provided in some embodiments of the present disclosure.

[0030] Figure 5 is based on Figure 4 Enlarged view of part A in the middle.

[0031] Figure 6 It is a schematic diagram of the structure of an electronic device provided in some other embodiments of the present disclosure.

[0032] Figure 7 It is a partial cross-sectional view of an electronic device provided by some embodiments of the present disclosure.

[0033] Figure 8 It is a partial cross-sectional view of an electronic device provided by some other embodiments of the present disclosure.

[0034] Fig. 9 It is a partial cross-sectional view of an electronic device provided in some other embodiments of the present disclosure.

[0035] Description of Reference Numerals

[0036] 10-electronic device; 100-audio module; 110-main body; 111-first mounting part; 112-sound channel; 113-second mounting part; 114-connecting channel; 115-common channel; 116-receiving channel; 120-sound component; 130-microphone; 200-housing; 210-sound outlet; 300-controller; 400-signal conditioner; 500-flexible circuit board. DETAILED DESCRIPTION

[0037] The specific implementation of the present disclosure is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described herein is only used to illustrate and explain the present disclosure, and is not used to limit the present disclosure.

[0038] In the present disclosure, unless otherwise stated, directional words such as "up, down, left, right" generally refer to up, down, left, and right relative to the accompanying drawings; "inside and outside" refer to the inside and outside of the outline of the corresponding component; "far and near" refer to the corresponding structure or the corresponding component being far away from or close to another structure or component. X in the drawings of the present disclosure represents a first direction; Y represents a second direction. In addition, the terms "first", "second", etc. used in the present disclosure are to distinguish one element from another and do not have order and importance. In addition, in the following description, when referring to the drawings, unless otherwise explained, the same figure numbers in different drawings represent the same or similar elements. The above definitions are only used to explain and illustrate the present disclosure and should not be construed as limitations on the present disclosure.

[0039] At present, electronic devices are equipped with microphones and sound-generating components (including speakers and receivers), and in the related art, the microphones and sound-generating components are respectively provided with sound receiving holes and sound-generating holes for receiving audio and generating audio. For example, a mobile phone has two microphones, one at the bottom and one at the top, for handheld calls and hands-free calls. The speaker and the receiver are also arranged at the bottom and top of the mobile phone respectively. On the one hand, it takes up a large space, and on the other hand, the working state of the sound-generating component (such as noise reduction, etc.) cannot be adjusted in real time.

[0040] In order to achieve the above purpose, Figures 1 to 5 As shown, in the first aspect of the present disclosure, an audio module 100 is provided, which is used in an electronic device 10. The audio module 100 includes a body 110, a sound component 120 and a microphone 130. The body 110 includes a first mounting portion 111 and a sound channel 112 connected to the first mounting portion 111; the sound component 120 is disposed on the first mounting portion 111; and the microphone 130 is configured to receive the audio of the sound component 120 in the sound channel 112.

[0041] Through the above technical solution, the audio module 100 of the present disclosure is used for the electronic device 10, including the sound component 120, the microphone 130 and the body 110, wherein the body 110 includes a first mounting portion 111 and a sound channel 112 for mounting the sound component 120, so that the sound emitted by the sound component 120 can be transmitted outward through the sound channel 112, and the microphone 130 can receive the audio of the sound component 120 in the sound channel 112, that is, the microphone 130 and the sound component 120 can share the sound channel 112, when the sound component 120 emits sound, the microphone 130 can detect the performance / quality of the sound in real time, and transmit the distortion / loudness and other data to the controller 300 and the signal conditioner 400 of the electronic device 10, so as to readjust the sound signal given to the sound component 120, and improve the audio performance / quality of the sound component 120. At the same time, there is no need to open a separate hole for the microphone 130, simplifying the overall structure of the electronic device.

[0042] It should be noted that the sound component 120 may include a speaker and / or a receiver. For example, when the electronic device 10 is a mobile phone, the sound component 120 is a speaker, which can form the above-mentioned audio module 100 with the microphone 130 at the bottom of the mobile phone, and optimize the audio performance and quality of the speaker by sharing a sound channel 112. In addition, the sound component 120 is a receiver, which can form the above-mentioned audio module 100 with the microphone 130 at the top of the mobile phone, and optimize the audio performance and quality of the receiver by sharing a sound channel 112.

[0043] Currently, there are two common ways to fix the microphone 130: one is to fix it on the motherboard; the other is to fix it on the middle frame of the mobile phone. In the solution of fixing it on the motherboard, the motherboard area needs to be occupied, and an additional channel for the microphone 130 in the middle frame needs to be added; and the channel is too long, which affects the performance of the microphone 130; in the solution of fixing it on the middle frame of the mobile phone, the microphone 130 needs additional space to be fixed on the middle frame, and a pressing design is required; there are higher requirements for the pressing force and sealing area of ​​the microphone 130.

[0044] In the audio component provided in the embodiment of the present disclosure, the microphone 130 and the sound component 120 can share the sound channel 112, that is, the microphone 130 and the sound component 120 are integrated into one, which can not only improve the performance of the sound component 120, but also reduce the space occupied by the mainboard and simplify the assembly process of the electronic device 10.

[0045] In some embodiments, the microphone 130 is also configured to receive external audio. The microphone 130 can not only adjust the performance and quality of the sound component 120 by detecting the audio, but also receive external audio, such as the user's voice, and then collect the audio for calls or video recording.

[0046] The microphone 130 can be arranged at any suitable position as long as it can receive the audio of the sound component 120. For example, in some embodiments, the body 110 includes a second mounting portion 113 and a connecting channel 114 connecting the second mounting portion 113 and the sound channel 112; the microphone 130 is arranged at the second mounting portion 113, so that the audio generated by the sound component 120 can be received by the microphone 130 after passing through the sound channel 112 and the connecting channel 114.

[0047] A first mounting portion 111 and a second mounting portion 113 are formed on the main body 110, wherein a sound component 120, for example, a speaker or a receiver is arranged in the first mounting portion 111, and a microphone 130 is arranged in the second mounting portion 113, and a sound channel 112 connected to the first mounting portion 111 is also provided on the main body 110 for transmitting the audio of the speaker or the receiver to the outside, and the second mounting portion 113 is connected to the sound channel 112 through a connecting channel 114, so that the audio of the speaker or the receiver can be transmitted to the microphone 130 through the connecting channel 114 and received by it, and the microphone 130 detects the performance / quality of the sound in real time, and transmits the distortion / loudness and other data to the controller 300 and the signal conditioner 400 of the electronic device 10, thereby re-adjusting the sound signal given to the sound component 120 and improving the audio performance / quality of the sound component 120.

[0048] like Figure 1 and Figure 2As shown, in some embodiments, the second mounting portion 113 is located lateral to the first mounting portion 111. The second mounting portion 113 may be located on one side of the first mounting portion 111 in the first direction, for example, Figure 1 The left side shown in Figure 2 That is, the two are arranged at intervals in the first direction, and such arrangement can make it more convenient to install the sound generating assembly 120 and the microphone 130.

[0049] Of course, the microphone 130 may also be disposed in any suitable area inside the sound channel 112, and the audio performance and quality of the sound receiving component 120 may also be achieved. Figure 8 As shown, the microphone 130 is disposed in the sound channel 112 near the sound outlet 210 , and can receive the audio of the sound component 120 while also receiving the external audio to collect sound.

[0050] like Figures 3 to 9 As shown, an embodiment of the present disclosure further provides an electronic device 10, which includes the above-mentioned audio module 100. Therefore, the electronic device 10 also has all the advantages of the above-mentioned audio module 100, which will not be repeated here.

[0051] The electronic device 10 includes but is not limited to a mobile phone, and may also be an electronic device 10 such as a tablet computer and a notebook computer.

[0052] In some embodiments, the electronic device 10 further includes a housing 200 surrounding the audio module 100, and the housing 200 is formed with a sound outlet 210 connected to the sound channel 112. For example, the electronic device 10 is a mobile phone, and the housing 200 can be a circumferential shell of the mobile phone. In order to transmit sound upward and receive external sound, the housing 200 is provided with a sound outlet 210, and the sound outlet 210 is connected to the sound channel 112. Among them, there can be multiple sound outlets 210, which are arranged at intervals along the extension direction of the housing, and the sound outlets 210 can be of any suitable shape, and in order to prevent external dust or foreign matter from entering the sound channel 112, the sound outlets 210 can be provided with a filter and other structures.

[0053] In some embodiments, the sound outlet 210 is respectively connected to the sound channel 112 and the sound receiving channel 116 of the microphone 130. In this way, the sound outlet 210 provided on the housing 200 can simultaneously meet the sound production of the sound component (including the speaker and the receiver). In addition, the sound outside the electronic device 10 can also enter the sound receiving channel 116 of the microphone 130 through the sound outlet 210, thereby realizing the function of the microphone 130 receiving external audio.

[0054] like Figure 7 and Figure 8As shown, in some embodiments, the sound receiving channel 116 at least partially overlaps with the sound emitting channel 112, that is, the sound emitting channel 112 connects the sound emitting component 120 and the sound outlet 210, so that the audio of the sound emitting component 120 can be diffused to the outside of the electronic device. At the same time, the microphone 130 is arranged in the middle of the sound emitting channel 112, and the sound emitting channel 112 can be directly connected to the microphone 130 or connected to the microphone 130 through a connecting channel 114 to meet the sound emitting and receiving functions of the sound outlet 210.

[0055] like Figure 6 As shown, in other embodiments, the sound receiving channel 116 and the sound emitting channel 112 are respectively connected to the sound outlet 210 through a common channel 115. For example, the microphone 130 can be arranged on one side of the sound emitting component 120, the sound emitting component 120 is connected to the sound emitting channel 112, the microphone 130 is connected to the sound receiving channel 116, and the sound emitting channel 112, the sound receiving channel 116 and the sound outlet 210 are all connected to the common channel 115, so that the sound emitting and receiving functions of the sound outlet 210 can also be realized.

[0056] like Fig. 9 As shown, in some embodiments, the sound component 120 and the microphone 130 are respectively connected to the mainboard of the electronic device 10 through a flexible circuit board 500. Thus, the electrical connection and communication connection between the sound component 120 and the microphone 130 are achieved, wherein a controller 300 may be provided on the mainboard, and the audio volume and quality of the sound component 120 and the microphone 130 may also be controlled.

[0057] In some embodiments, the distance between the microphone 130 and the sound outlet 210 is smaller than the distance between the sound-emitting component 120 and the sound outlet 210. That is, the speaker and / or the receiver forming the sound-emitting component 120 can be arranged at a position farther from the sound outlet 210 in the second direction, and the microphone 130 can be arranged at a position relatively close to the sound outlet 210 in the second direction. In this way, the performance of the microphone 130 is improved by reducing the distance between the microphone 130 and the appearance surface of the electronic device 10 (such as a mobile phone).

[0058] like Figure 3 As shown, in some embodiments, the electronic device 10 further includes a controller 300; the microphone 130 and the sound component 120 are both in communication connection with the controller 300. For example, the microphone 130 in the mobile phone shares the sound channel 112 with the speaker / receiver. When the speaker / receiver initially emits a sound, the microphone 130 will detect the sound performance / quality in real time, and transmit the distortion / loudness and other data back to the controller 300. The controller 300 will readjust the sound signal given to the speaker / receiver according to the algorithm to obtain audio with better performance and quality.

[0059] In some embodiments, in order to enable the controller 300 to readjust the sound signal given to the speaker / receiver, the electronic device 10 further includes a signal conditioner 400, which is communicatively connected to the controller 300 and the sound component 120 respectively.

[0060] When the speaker / receiver is working, the microphone 130 receives sound, and the digital microphone 130 converts the sound signal into an electrical signal and sends the signal to the controller 300. The controller 300 detects whether the sound is distorted, and through analysis, transmits the repair signal to the signal conditioner 400. The signal conditioner 400 adjusts the working state of the speaker and the receiver in real time to regain audio with better performance / quality. It can be understood that the signal conditioner 400 is an electrical device known in the relevant art for adjusting the working state of the sound generating component 120, including but not limited to a signal amplifier.

[0061] The audio module 100 and the electronic device 10 disclosed in the present invention include a sound component 120, a microphone 130 and a body 110, wherein the body 110 includes a first mounting portion 111 and a sound channel 112 for mounting the sound component 120, so that the sound emitted by the sound component 120 can be transmitted outward through the sound channel 112, and the microphone 130 can receive the audio of the sound component 120 in the sound channel 112, that is, the microphone 130 and the sound component 120 can share the sound channel 112, when the sound component 120 emits a sound, the microphone 130 can detect the performance / quality of the sound in real time, and transmit the distortion / loudness and other data to the controller 300 and the signal conditioner 400 of the electronic device 10, so as to readjust the sound signal given to the sound component 120, and improve the audio performance / quality of the sound component 120. Further, the space occupied by the main board can also be reduced. In addition, the performance of the microphone 130 can be improved, and the assembly process of the electronic device 10 (such as a mobile phone) can be simplified.

[0062] The preferred embodiments of the present disclosure are described in detail above in conjunction with the accompanying drawings; however, the present disclosure is not limited to the specific details in the above embodiments. Within the technical concept of the present disclosure, a variety of simple modifications can be made to the technical solution of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure.

[0063] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.

[0064] In addition, various embodiments of the present disclosure may be arbitrarily combined, and as long as they do not violate the concept of the present disclosure, they should also be regarded as the contents disclosed by the present disclosure.

Claims

1. An audio module, characterized in that: include: A body, comprising a first mounting portion and a sound-generating channel communicating with the first mounting portion; A sound-generating component, disposed on the first mounting portion; as well as A microphone is configured to receive audio from the sound emitting component in the sound emitting channel.

2. The audio module according to claim 1, characterized in that: The body includes a second mounting portion and a connecting channel connecting the second mounting portion and the sound channel; The microphone is arranged on the second mounting portion, so that the audio generated by the sound-emitting component can be received by the microphone after passing through the sound-emitting channel and the connecting channel.

3. The audio module according to claim 2, characterized in that: The second mounting portion is located at a side of the first mounting portion.

4. The audio module according to claim 1, characterized in that: The microphone is arranged in the sound emitting channel.

5. The audio module according to any one of claims 1 to 4, characterized in that: The microphone is also configured to receive external audio.

6. An electronic device, characterized in that: The electronic device comprises the audio module described in any one of claims 1-5.

7. The electronic device according to claim 6, characterized in that: The electronic device further comprises a shell which is arranged around the audio module, and the shell is formed with a sound outlet hole which is connected with the sound emitting channel.

8. The electronic device according to claim 7, characterized in that: The sound outlet holes are respectively connected to the sound emitting channel and the sound receiving channel of the microphone.

9. The electronic device according to claim 8, characterized in that: The sound receiving channel and the sound emitting channel at least partially overlap; or The sound receiving channel and the sound emitting channel are respectively communicated with the sound outlet through a common channel.

10. The electronic device according to claim 6, characterized in that: The sound-generating component and the microphone are respectively connected to the mainboard of the electronic device through a flexible circuit board.

11. The electronic device according to claim 7, characterized in that: The distance between the microphone and the sound outlet is smaller than the distance between the sound-emitting component and the sound outlet.

12. The electronic device according to claim 6, characterized in that: The electronic device further comprises a controller; The microphone and the sound-generating component are both connected to the controller for communication.

13. The electronic device according to claim 12, characterized in that: The electronic device further includes a signal conditioner, which is communicatively connected to the controller and the sound generating component respectively.

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