Test auxiliary device capable of compatibly testing multiple types of LGA (Line Grid Array) packaged chips

Abstract

The utility model discloses a test auxiliary device capable of compatibly testing multiple types of LGA packaged chips. The test auxiliary device comprises a test arm pressure head assembly, a rotary table assembly and a test socket butt plate assembly, a tested chip is conveyed into the rotary table assembly through the external selector, the rotary table assembly and the chip are integrally moved to the position below the test arm pressure head assembly, the test arm pressure head assembly is matched with an external vacuum generator to suck the tested chip and then place the tested chip into the test socket butt plate assembly, and a power-on test is carried out. And after the test is completed, the sorting machine takes back the chip and carries the chip to a discharging position, so that manual testing is turned into automatic testing. In order to meet the requirement for automatic testing of LGA packaging chips with different boundary dimensions and different pin numbers, compatibility of testing of multiple types of chips is achieved through the optimal design of replacing a detachable guide limiting frame or a guide column on the material conveying trolley, adjusting the limiting height of the butt joint plate and foot pads on the back face and the like, the manufacturing cost of the auxiliary device is reduced, and the testing efficiency of the LGA packaging chips is improved. And the test efficiency of the product is improved.

Description

Technical Field

[0001] The utility model relates to a test auxiliary device capable of compatibly testing multiple types of LGA packaged chips, belonging to the field of chip testing. Background Art

[0002] With the development of integrated circuit design and packaging technology, the integration of chips is constantly improving. In order to meet the requirements of reducing chip size, increasing the number of pins, and improving heat dissipation, LGA (grid array) packages with different sizes and pin numbers have emerged. In order to ensure the smooth progress of mass production testing of LGA packaged products and to ensure product quality and appearance, manual testing can no longer meet the testing requirements. In order to improve the testing efficiency of mass production, the test machine and the sorting machine are combined through the test device to realize automatic testing.

[0003] In the field of chip testing, plastic-encapsulated products usually use standard trays (such as JEDEC standard trays). Standard trays can only meet the needs of plastic-encapsulated chips of standard sizes, while ceramic-encapsulated chips have non-standard sizes and require customized non-standard special trays. The trays are used to package and transport chips between different processes, and the functional and electrical parameters of the encapsulated chips are tested. The testing process is as follows: the sorting machine installs the corresponding test device to transfer the tested chips to the test interface board station one by one, and the pins of the tested chips are connected to the hardware through the test sockets on the test interface board station. The dedicated connection line is connected to the functional module of the test machine for communication. The test machine applies input signals to the chip and collects output signals to determine whether the chip functions and performance meet the design specifications. The test results are transmitted to the sorting machine through the communication interface, and the sorting machine marks, sorts, and collects the tested chips accordingly.

[0004] LGA stands for Land Grid Array, which is directly translated as planar grid array package. This packaging technology is actually an improvement on the PGA package. Compared with the PGA package, LGA first removes all the pins at the bottom of the PGA and converts them into a large number of contacts on the plane, that is, the previous needle pins are replaced by metal contact packages. The LGA package can be directly tinned on the PCB, or it can be connected to the chip through the LGA test socket. After adopting this method, the distance between the chip and the PCB can be significantly shortened, and the mutual signal interference between the contacts is eliminated. The electrical performance is better than the PGA package, and the pin density is increased. According to the material, it can be divided into ceramic packaging and plastic packaging. The appearance is a square structure, and there are array-state metal contacts on the bottom of the chip. Before leaving the factory, the chip with LGA package needs to be assembled into the test socket for screening test to ensure the high quality and high reliability of the chip. However, the test devices of existing chips are either more complicated in structure, inconvenient to operate, and require a long time to replace. It is necessary to replace the traditional test structure with a new LGA package test device, and the test device must be simpler to install and operate, improve the automation test and test stability of LGA packaged chips, and at the same time be compatible with multiple chip tests to reduce the manufacturing cost of auxiliary devices. Utility Model Content

[0005] The technical problem solved by the utility model is: in view of the current existing technology, in order to meet the requirements of the installation and operation of the test device of the LGA packaged chip is simpler, the automatic test and test stability of the LGA packaged chip are improved, and at the same time, it is compatible with the testing of multiple chips of the same package type and different external sizes, and the manufacturing cost of the auxiliary device is reduced.

[0006] The utility model solves the above technical problems through the following scheme and method: a test auxiliary device capable of compatible testing of multiple LGA packaged chips, comprising: a rotating table assembly, a test socket docking plate assembly and a test arm pressure head assembly; the chip to be tested is placed on the rotating table assembly; the test arm pressure head assembly cooperates with an external vacuum generator to suck the chip to be tested on the rotating table assembly and then place it in the test socket docking plate assembly; the test socket docking plate assembly performs a power-on test on the chip placed on the test arm pressure head assembly.

[0007] Furthermore, the rotating table assembly includes a removable guide limit frame, a rotating table base plate, a guide column, a locking screw and a positioning pin hole; a removable guide limit frame is provided in the center of the rotating table base plate to limit the chip shape; a plurality of mounting holes are provided on the rotating table base plate, and guide columns and locking screws are installed in the mounting holes; a positioning pin hole is provided on the guide column, and when the test arm pressure head assembly absorbs the chip from the rotating table assembly, the guide column performs guiding positioning.

[0008] Furthermore, the test socket docking plate assembly includes a guide block, a second positioning pin, a limit block, a docking plate body, a PCB pad, a sealing strip and a gasket; a plurality of mounting holes are provided on the docking plate body, the second positioning pin is installed on both sides of the upper surface of the docking plate body, and is positioned when installed with the sorting machine, and the guide block, the limit block and the gasket are installed on the upper surface of the docking plate body; when the test arm pressure head assembly absorbs the material and presses down to the socket docking plate assembly, the guide block is positioned during the test, and the limit block is pressed down to limit the position; the PCB pad is installed on the lower surface of the docking plate body for installing the PCB board required for the test; the sealing strip is pasted around the lower surface of the docking plate body, and is fitted with the installed PCB board to form a cavity; when the test socket docking plate assembly is working on the sorting machine, a test socket is installed at the bottom, and the test arm pressure head assembly absorbs the material and presses down to the test socket installed below the socket docking plate assembly for testing.

[0009] Furthermore, the test arm pressure head assembly includes a hook, a pressure plate, a first positioning pin, a sealing ring and a suction vacuum hole; the hook is installed on the side of the pressure plate; the suction vacuum hole is a cylindrical structure, located at the bottom center of the pressure plate, to absorb the chip under test; two pin holes are provided on one side of the pressure plate for suction, and the first positioning pin is installed in the pin hole.

[0010] Furthermore, the test arm pressure head assembly fixes the pressure plate on the sorting machine test arm through a hook, the suction vacuum hole cooperates with the vacuum generator to absorb the chip, the pressure of the sorting machine test arm acts on the test arm pressure head, and the first positioning pin cooperates with the guide block in the test socket docking plate assembly to realize the calibration of the mechanical position and press the chip into the test socket docking plate assembly.

[0011] Furthermore, the positioning pin hole on the guide column of the rotating table assembly cooperates with the first positioning pin to calibrate the mechanical position and achieve docking.

[0012] Furthermore, the gasket is installed on the lower surface of the limit block. By adjusting the number of gaskets and the height of the limit block protruding from the upper surface of the docking plate body, the crimping height of the test arm pressure head assembly after sucking the material and pressing it down to the socket docking plate assembly is adjusted.

[0013] Furthermore, the size of the detachable guide limit frame is changed according to the chips of different outer dimensions installed inside.

[0014] Furthermore, the PCB pads are set in different sizes according to the test requirements.

[0015] Furthermore, the test auxiliary device is made of antistatic material.

[0016] The advantages of the utility model compared with the prior art are:

[0017] The utility model adopts a modular design structure with a simpler structure, lower cost and easy operation, and meets the compatibility of multiple chip tests. In order to meet the automated testing of LGA packaged chips with different external dimensions (length / width, thickness) and different numbers of pins, by replacing the detachable guide limit frame (limiting or expanding the cavity shape) or guide column on the material transport trolley, adjusting the limit height of the docking plate and replacing the pads on the back, etc., the compatibility of multiple chip tests is achieved, the manufacturing cost of the auxiliary device is reduced, and the test efficiency of the product is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the composition of the test device of the utility model;

[0019] Figure 2 It is an exploded schematic diagram of the rotating table assembly of the utility model;

[0020] Figure 3 It is an exploded schematic diagram of the test socket docking board assembly of the utility model;

[0021] Figure 4 It is an exploded schematic diagram of the test arm pressure head assembly of the utility model;

[0022] Figure 5 It is a cross-sectional schematic diagram of the test arm pressure head assembly of the utility model sucking / placing a chip from the chip placement groove of the rotating table assembly;

[0023] Figure 6 It is a cross-sectional schematic diagram of the test arm pressure head assembly of the utility model sucking a chip into the test socket docking board assembly for testing. DETAILED DESCRIPTION

[0024] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

[0025] like Figure 1 The figure shows a schematic diagram of the composition of the test device of the utility model, which is a test auxiliary device that can be compatible with testing multiple LGA packaged chips, including a test arm pressure head assembly 300, a rotating table assembly 100, and a test socket docking plate assembly 200; the chip under test is transferred to the rotating table assembly 100 through an external sorting machine, the rotating table assembly 100 and the chip are moved as a whole to the bottom of the test arm pressure head assembly 300, and the test arm pressure head assembly 300 cooperates with an external vacuum generator to suck the chip under test and place it in the test socket docking plate assembly 200 for power-on testing.

[0026] like Figure 2The figure shows an exploded schematic diagram of the rotating table assembly of the utility model. The rotating table assembly 100 includes a detachable guide limit frame 101, a rotating table base plate 102, a guide column 103, a locking screw 104, and a positioning pin hole 105. The rotating table base plate 102 is provided with a detachable guide limit frame 101 for limiting the chip shape. By replacing the detachable guide limit frames 101 of different sizes, the shape limiting of multiple chips of different dimensions can be achieved; the rotating table base plate 102 is provided with a plurality of installation holes for installing the guide column 103 and the locking screw 104; the guide column 103 is provided with a positioning pin hole 105 for guiding and positioning the test arm pressure head assembly 300 when sucking the chip from the rotating table assembly 100. The rotating table assembly 100 is provided with a plurality of guide columns 103 to cooperate with the first positioning pin 303 installed on the test arm pressure head assembly 300 to calibrate the mechanical position. The rotating table substrate 102 is provided with a placement slot with a detachable guide limit frame 101 for placing chips and limiting the chip shape. The shape of the placement slot is consistent with the chip shape and the chip is in an upright state with the pin facing downward. It is automatically rotated according to the different angles of the Pin1 position and then sent to the test area. At the same time, the tested chips can also be automatically transferred to the material arm pick-up and placement area one by one.

[0027] like Figure 3The figure shows an exploded schematic diagram of the test socket docking board assembly of the utility model. The test socket docking board assembly 200 includes a guide block 201, a second positioning pin 202, a limit block 203, a docking board body 204, a PCB pad 205, a sealing strip 206, and a gasket 207; a plurality of mounting holes are provided on the docking board body 204, and the second positioning pin 202 is installed on both sides of the upper surface of the docking board body 204 for positioning when installed with the sorting machine, and the guide block 201, the limit block 203, and the gasket 207 are installed on the upper surface of the docking board body 204. The block 201 is used to accurately position the test arm pressure head assembly 300 when it is pressed down to the socket docking board assembly 200 for testing after absorbing materials; the limit block 203 is used to limit the downward pressure when the test arm pressure head assembly 300 is pressed down to the socket docking board assembly 200 for testing after absorbing materials; the PCB pad 205 is installed on the lower surface of the docking board body 204, and is used to install the PCB board required for testing; the sealing strip 206 is pasted around the lower surface of the docking board body 204, and fits with the installed PCB board to form a cavity, and keeps the cavity sealed when dry air is needed. The gasket 207 is installed on the lower surface of the limit block 203. By adjusting the number of gaskets 207 and adjusting the height of the limit block 203 protruding from the upper surface of the docking board body 204, the crimping height of the test arm pressure head assembly 300 after absorbing materials and pressing down to the socket docking board assembly 200 can be adjusted. The test socket docking plate assembly 200 is installed with a limit block 203 and a plurality of high-precision gaskets 207 are installed under the limit block 203 to adjust the crimping height of the test arm pressure head assembly 300 to ensure normal chip testing, prevent chip damage caused by overpressure, and be compatible with chip testing of different thicknesses. When the test socket docking plate assembly 200 is working on the sorting machine, a test socket is installed at the bottom. After the test arm pressure head assembly 300 absorbs the material, it is pressed down into the test socket installed in the test socket docking plate assembly 200 for testing.

[0028] The PCB pad 205 is installed on the lower surface of the test socket docking board assembly 200, and is used to support the locking between the test socket docking board assembly 200 and the PCB board, and has the function of protecting the PCB board. When the PCB pad 205 on the back of the test socket docking board assembly 200 is inconsistent with the thickness of the test socket, it is necessary to replace the PCB pad 205 of different sizes to match the test socket that needs to be tested.

[0029] like Figure 3 As shown, the test socket docking board assembly 200 is combined with the interface board of the socket to be tested by screws, and the docking board body 204 is fixed to the sorting machine under the test arm by combining the second positioning pin 202 and the screws. The two guide blocks 201 on the docking board body 204 cooperate with the first positioning pin 303 installed on the test arm pressure head assembly 300 to calibrate the mechanical position. The sealing strip 206 has the function of maintaining the stable temperature of the chip test.

[0030] like Figure 4 The figure shows an exploded schematic diagram of the test arm pressure head assembly of the utility model. The test arm pressure head assembly 300 includes a hook 301, a pressure plate 302, a first positioning pin 303, a sealing ring 304, and a suction vacuum hole 305. The side of the pressure plate 302 is provided with screw holes for installing the hook 301. The suction vacuum hole 305 is a cylindrical structure, located at the bottom center of the pressure plate 302, and is used for sucking the chip under test. Two pin holes are provided on the suction side of the pressure plate 302 for installing the first positioning pin 303.

[0031] The test arm pressure head assembly 300 fixes the pressure plate 302 on the test arm of the sorting machine through the hook 301. The suction vacuum hole 305 cooperates with the vacuum generator to absorb the chip surface. The pressure of the test arm of the sorting machine acts on the test arm pressure head. The first positioning pin 303 is used to calibrate the mechanical position according to the principle of the guide block 201 in the test socket docking plate assembly 200, and the chip is pressed into the test socket.

[0032] The test arm press head assembly 300 uses the positioning pin hole 105 on the guide column 103 installed on the rotating table base block 102 to cooperate with the first positioning pin 303 of the test arm press head assembly 300 to calibrate the mechanical position to achieve docking.

[0033] like Figure 5 The figure shows a cross-sectional schematic diagram of the test arm pressure head assembly of the utility model sucking a position chip from the chip placement slot of the rotating table assembly, as shown in FIG. Figure 6 The figure shows a cross-sectional schematic diagram of the test arm pressure head assembly of the utility model sucking the chip into the test socket docking plate assembly for testing; the chips to be tested are automatically transferred one by one to the chip placement slot of the rotating table assembly by the sorting machine and moved to the bottom of the test arm pressure head assembly, and the vacuum generator is used to suck the chip and place it in the test socket under the test socket docking plate assembly for power-on testing. The pins of the chip to be tested are hardware connected through the probes in the test socket on the interface board station, and the dedicated connection line is connected to the functional module of the test machine for communication. After the test is completed, the chip will be retrieved and automatically transported to the discharge point by the sorting machine. Each component is made of anti-static material to avoid chip failure due to static electricity.

[0034] The contents not described in detail in the utility model specification belong to the common knowledge of those skilled in the art.

Claims

1. A test auxiliary device capable of testing multiple LGA packaged chips, characterized in that: include: A rotating table assembly (100), a test socket docking plate assembly (200) and a test arm pressure head assembly (300); a chip to be tested is placed on the rotating table assembly (100); the test arm pressure head assembly (300) cooperates with an external vacuum generator to suck the chip to be tested on the rotating table assembly (100) and then place it in the test socket docking plate assembly (200); the test socket docking plate assembly (200) performs a power-on test on the chip placed on the test arm pressure head assembly (300).

2. The test auxiliary device capable of testing multiple LGA packaged chips according to claim 1, characterized in that: The rotating table assembly (100) comprises a detachable guide limit frame (101), a rotating table base plate (102), a guide column (103), a locking screw (104) and a positioning pin hole (105); a detachable guide limit frame (101) is provided at the center of the rotating table base plate (102) to limit the chip shape; a plurality of mounting holes are provided on the rotating table base plate (102), and the guide column (103) and the locking screw (104) are installed in the mounting holes; a positioning pin hole (105) is provided on the guide column (103), and when the test arm pressure head assembly (300) absorbs the chip from the rotating table assembly (100), the guide column (103) performs guiding and positioning.

3. The test auxiliary device capable of testing multiple LGA packaged chips according to claim 2, characterized in that: The test socket docking plate assembly (200) comprises a guide block (201), a second positioning pin (202), a limit block (203), a docking plate body (204), a PCB pad (205), a sealing strip (206) and a gasket (207); a plurality of mounting holes are provided on the docking plate body (204); the second positioning pin (202) is mounted on both sides of the upper surface of the docking plate body (204) for positioning when mounted on a sorting machine; the guide block (201), the limit block (203) and the gasket (207) are mounted on the upper surface of the docking plate body (204); when the test arm pressure head assembly (300) absorbs material and presses down onto the socket docking plate assembly (200), the guide block (201) is positioned during testing, and the limit block (203) is pressed down for limiting; The PCB pad (205) is installed on the lower surface of the docking plate body (204) and is used to install the PCB board required for testing; the sealing strip (206) is adhered to the lower surface of the docking plate body (204) and fits with the installed PCB board to form a cavity; when the test socket docking plate assembly (200) is working on the sorting machine, a test socket is installed at the bottom, and the test arm pressure head assembly (300) sucks the material and presses it down into the test socket installed in the socket docking plate assembly (200) for testing.

4. The test auxiliary device capable of testing multiple LGA packaged chips according to claim 3, characterized in that: The test arm pressure head assembly (300) comprises a hook (301), a pressure plate (302), a first positioning pin (303), a sealing ring (304) and a material suction vacuum hole (305); the hook (301) is installed on the side of the pressure plate (302); the material suction vacuum hole (305) is a cylindrical structure, located at the bottom center of the pressure plate (302), and sucks the chip under test; two pin holes are provided on one side of the pressure plate (302) for material suction, and the first positioning pin (303) is installed in the pin holes.

5. The test auxiliary device capable of testing multiple LGA packaged chips according to claim 4, characterized in that: The test arm pressure head assembly (300) fixes the pressure plate (302) on the test arm of the sorting machine through a hook (301); the suction vacuum hole (305) cooperates with the vacuum generator to absorb the chip; the pressure of the test arm of the sorting machine acts on the test arm pressure head; the first positioning pin (303) cooperates with the guide block (201) in the test socket docking plate assembly (200) to achieve mechanical position calibration, and presses the chip into the test socket installed below the test socket docking plate assembly (200) for testing.

6. The test auxiliary device capable of testing multiple LGA packaged chips according to claim 4, characterized in that: The positioning pin hole (105) on the guide column (103) of the rotating platform assembly (100) cooperates with the first positioning pin (303) to calibrate the mechanical position and achieve docking.

7. The test auxiliary device capable of testing multiple types of LGA packaged chips according to claim 3, characterized in that: The gasket (207) is installed on the lower surface of the limit block (203), and the crimping height of the socket docking plate assembly (200) after the test arm pressure head assembly (300) sucks the material is adjusted by adjusting the number of gaskets (207) and adjusting the height of the limit block (203) protruding from the upper surface of the docking plate body (204).

8. The test auxiliary device capable of testing multiple LGA packaged chips according to claim 2, characterized in that: The size of the detachable guide limit frame (101) is changed according to the chips of different external dimensions installed inside.

9. The test auxiliary device capable of testing multiple LGA packaged chips according to claim 2, characterized in that: The PCB pad (205) is set to different sizes according to test requirements.

10. The test auxiliary device capable of testing multiple types of LGA packaged chips according to claim 1, characterized in that: The test auxiliary device is made of antistatic material.

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