Combined planar target material

Abstract

The utility model relates to the technical field of target materials, in particular to a combined plane target material. Comprising a target material, a convex ring is arranged on the outer side of the lower portion of the target material, a back ring is further included, a plurality of counter bores are formed in the periphery of the back ring, a containing concave table matched with the convex ring is arranged on one side of the back ring, the target material penetrates into the back ring, the convex ring is located in the containing concave table, and the target material is flush with the bottom face of the back ring. According to the utility model, the sputtering power is higher.

Description

Technical Field

[0001] The utility model relates to the technical field of target materials, in particular to a combined planar target material. Background Art

[0002] Figure 3 It is a commonly used planar binding target material, which includes a disc-shaped backing plate 1, and a plurality of countersunk holes 11 are arranged around the backing plate 1. A disc-shaped target material 2 is bound to the backing plate 1. When in use, the binding target material is fixed to the vacuum sputtering equipment with a countersunk bolt passing through the countersunk hole 11. After sputtering, Figure 4 As shown, the material on the target material 2 is consumed to form a cylindrical sputtering concave platform 21. This type of binding target material can meet the needs of normal use, but the binding layer is generally a metal with a low melting point (commonly used is indium). When the power is high, the binding layer will melt and cause the target material 2 to separate from the backing plate 1. Therefore, this type of target material can only be sputtered at a relatively low power. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide a combined planar target material in view of the above-mentioned technical deficiencies.

[0004] In order to solve the above technical problems, the technical solution adopted by the utility model is: a combined planar target material, including a target material, a convex ring is arranged on the outer side of the lower part of the target material, and also includes a back ring, a plurality of countersunk holes are arranged around the back ring, and a accommodating recess matching the convex ring is arranged on one side of the back ring, the target material penetrates into the back ring and the convex ring is located in the accommodating recess, and the target material is flush with the bottom surface of the back ring.

[0005] To further optimize the technical solution, the target material is provided with a cutout surrounding the target material, and the cutout is located above the back ring.

[0006] Compared with the prior art, the utility model has the following advantages: 1. A convex ring is provided on the outer side of the lower part of the target material, and a accommodating recess is provided on one side of the back ring. The back ring can press the target material onto the vacuum sputtering equipment. Since there is no binding layer, there is no need to worry about the melting of the binding layer, so that the sputtering power can be greater than that of the prior art; 2. A cut is provided on the target material surrounding it. When the sputtering recess is deep, it is convenient to remove some of the residual target cylindrical part. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 It is a schematic diagram of the structure of a combined planar target.

[0008] Figure 2 for Figure 1 Magnified view of point I in the middle.

[0009] Figure 3 This is a schematic diagram of the structure of the plane binding target material in the prior art.

[0010] Figure 4 This is a schematic diagram of the structure of the prior art flat binding target after use.

[0011] In the figure: 1, back plate; 11, countersunk hole; 2, target material; 21, sputtering concave platform; 22, convex ring; 23, cutout; 3, back ring; 31, accommodating concave platform. DETAILED DESCRIPTION

[0012] In order to make the purpose, technical solution and advantages of the utility model clearer, the utility model is further described in detail below in combination with specific implementation methods and with reference to the accompanying drawings. It should be understood that these descriptions are only exemplary and are not intended to limit the scope of the utility model. In addition, in the following description, the description of well-known structures and technologies is omitted to avoid unnecessary confusion of the concept of the utility model.

[0013] Specific implementation method: Combination Figure 1-2 As shown, a combined planar target comprises a target material 2, a convex ring 22 is arranged on the outer side of the lower part of the target material 2, and a back ring 3, which is annular and has a plurality of countersunk holes 11 arranged around the back ring 3, a receiving recess 31 matched with the convex ring 22 is arranged on one side of the back ring 3, the diameter of the receiving recess 31 is equal to or slightly larger than the diameter of the convex ring 22 and the heights of the two are equal, the target material 2 penetrates into the back ring 3 and the convex ring 22 is located in the receiving recess 31, a step is formed at the position where the back ring 3 is provided with the receiving recess 31, and the step can press the upper side of the convex ring 22 to press the target material 2 onto the vacuum sputtering device (in order to make the target material 2 contact more closely with the vacuum sputtering device, a layer of flexible graphite paper is placed between the vacuum sputtering device and the combined planar target), and the target material 2 is flush with the bottom surface of the back ring 3. The back ring 3 and the target material 2 can be separated during transportation and storage, and then combined when in use, and the combined planar target is fixed to the vacuum sputtering device with a countersunk bolt passing through the countersunk hole 11. Since there is no binding layer, there is no need to worry about the binding layer melting, so the sputtering power can be greater than that of the prior art. The back ring 3 can be reused, and when a new target is replaced, only the target material 2 needs to be replaced.

[0014] In addition, after use, the depth of the sputtering concave platform 21 on the residual target is less than the thickness of the target material 2 by about 2 mm, that is, the thickness of the bottom of the target material 2 is about 2 mm. Figure 1It can be seen that the thickness of the target material 2 of the present application can be larger than the thickness of the target material 2 of the prior art by a dimension equivalent to the thickness of the back plate 1. Therefore, during sputtering, the available thickness of the target material 2 is much larger than that of the prior art, and can be used for a longer time. In addition, the material utilization rate is higher when the remaining thickness at the bottom of the target material 2 is the same. However, when the thickness of the target material 2 is thicker, the depth of the sputtering recess 21 will also be deeper in the later stage of sputtering. When the depth exceeds about 10 mm, it will have a certain negative impact on sputtering. In order to solve this problem, the target material 2 is provided with a cut 23 surrounding it (of course, the thickness of the target material 2 of the present application can also be selected to be less than the thickness of the target material 2 of the prior art, in which case the cut 23 is not required. In this case, the target material 2 is also less exposed from the back ring 3), and the cut 23 is located above the back ring 3. Preferably, the depth of the cut 23 is greater than or slightly less than Figure 4 The wall thickness of the cylindrical part of the residual target. When the depth of the cutout 23 is greater than the wall thickness of the cylindrical part of the residual target, when the depth of the sputtering recess 21 is greater than the position of the cutout 23, the cylindrical part of the residual target will be separated from the target material 2 below. At this time, the machine should be stopped immediately to remove the cylindrical object, and then sputtering can be continued; when the depth of the cutout 23 is slightly less than the wall thickness of the cylindrical part of the residual target, when the depth of the sputtering recess 21 is greater than the position of the cutout 23, the cylindrical part of the residual target will not separate from the target material 2 below by itself. At this time, the operator can stop the machine at an appropriate time, and then tap the cylindrical part to knock it off (the target material 2 is a brittle ceramic), and then sputtering can be continued.

[0015] It should be understood that the above specific embodiments of the present invention are only used to illustrate or explain the principles of the present invention, and do not constitute a limitation on the present invention. Therefore, any modifications, equivalent substitutions, improvements, etc. made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. In addition, the claims attached to the present invention are intended to cover all changes and modifications that fall within the scope and boundaries of the attached claims, or the equivalent forms of such scope and boundaries.

Claims

1. A combined planar target, comprising a target material (2), Features: The target material (2) is provided with a convex ring (22) on the outer side of the lower part, and also includes a back ring (3), a plurality of countersunk holes (11) are provided around the back ring (3), and a receiving recess (31) matching with the convex ring (22) is provided on one side of the back ring (3), the target material (2) penetrates into the back ring (3) and the convex ring (22) is located in the receiving recess (31), and the target material (2) is flush with the bottom surface of the back ring (3).

2. A combined planar target according to claim 1, Features: The target material (2) is provided with a cutout (23) surrounding the target material (2), and the cutout (23) is located above the back ring (3).

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