Small sputtering instrument for film coating

Abstract

The utility model relates to the technical field of sputtering instruments, and discloses a small sputtering instrument for film coating, which comprises a working box, a magnetic control target, a substrate fixing plate, a limiting component and a driving component, the magnetic control target is mounted at the inner bottom of the working box, the substrate fixing plate is rotatably mounted at the inner top of the working box, the limiting component is mounted on the substrate fixing plate, and the driving component is mounted on the working box. A substrate to be coated is limited through the limiting assembly, the driving assembly is connected between the substrate fixing plate and the working box, and the substrate fixing plate is driven to rotate through the driving assembly. According to the utility model, in the whole use process, as the limiting component is positioned on the upper surface of the substrate fixing plate, namely the surface deviating from the magnetron target, the limiting component cannot be plated on a movable part of the limiting component in the film plating process, so that the clamping condition can be avoided, and the function is relatively perfect.

Description

Technical Field

[0001] The utility model relates to the technical field of film coating sputtering instruments, and more specifically to a small film coating sputtering instrument. Background Art

[0002] In the manufacturing process of electronic products, it is often necessary to coat their surfaces. At this time, a related coating sputtering device is needed, also known as a sputtering coating device. Its main function is to bombard the target surface with an inert gas ion beam after electric field acceleration and magnetic field confinement under vacuum, so that the target atoms are separated from the target and overflow to the surface of the substrate to be coated for deposition, thereby generating thin film layers of different thicknesses and different materials on the substrate surface.

[0003] In the prior art, the Chinese patent publication number CN220503174U discloses an integrated magnetron sputtering coating machine. The utility model controls the rotation of a bidirectional screw to allow the upper and lower substrate placement frames to move toward or away from each other, so that the upper and lower substrate placement frames can limit the sample to prevent the sample from shifting due to external impact and affecting the coating effect. The rotating rod, connecting block and motor can be used to control the sample on the substrate placement frame to flip, so that different surfaces of the sample can be coated.

[0004] However, in the above-mentioned prior art, a screw is used to drive the substrate placement frame to move to fix the substrate to be coated, and its screw and related moving parts are exposed in the equipment. As a result, during the coating process, target ions will also be plated on the surface of moving parts such as the screw, which can easily cause the related moving parts to get stuck. Overall, it has certain defects in use. Utility Model Content

[0005] In order to overcome the above-mentioned defects of the prior art, the utility model provides a small sputtering apparatus for coating to solve the problems existing in the above-mentioned background technology.

[0006] The utility model provides the following technical solutions: a small sputtering instrument for coating, comprising: a working box, a magnetron target, a substrate fixing plate, a limiting assembly, and a driving assembly, wherein the magnetron target is installed at the inner bottom of the working box, the substrate fixing plate is rotatably installed at the inner top of the working box, the limiting assembly is installed on the substrate fixing plate, the substrate to be coated is limited by the limiting assembly, the driving assembly is connected between the substrate fixing plate and the working box, and the substrate fixing plate is driven to rotate by the driving assembly.

[0007] Furthermore, the limit assembly includes a limit bar, which is located on the lower surface of the substrate fixing plate and can slide up and down. The end of the limit bar away from the substrate fixing plate is rotatably installed with a connecting shaft, the top of the connecting shaft is fixedly installed with a connecting rod, and the end of the connecting rod away from the connecting shaft is fixedly installed with a ring, the ring is arranged above the substrate fixing plate, and the ring is slidably sleeved on the rotating shaft of the substrate fixing plate.

[0008] Furthermore, the limiting assembly also includes a compression spring, which is installed between the collar and the substrate fixing plate, and the compression spring is sleeved on the rotating shaft of the substrate fixing plate.

[0009] Furthermore, there are multiple limit bars, connecting shafts and connecting rods, and they are distributed symmetrically around the cylindrical surface of the ring.

[0010] Furthermore, a plurality of guide blocks are fixedly mounted on the upper surface of the substrate fixing plate, and the connecting rods are slidably mounted between the guide blocks.

[0011] Furthermore, the driving assembly includes a motor, and the rotating shaft of the motor is detachably coaxially connected to the rotating shaft of the substrate fixing plate.

[0012] Furthermore, a socket is provided at the end of the output shaft of the motor, the end of the rotating shaft of the substrate fixing plate is inserted into the socket, a pin hole is provided on the surface of the motor output shaft, and the pin hole passes through the rotating shaft of the substrate fixing plate, and a limiting bolt is inserted in the pin hole.

[0013] Furthermore, a plurality of grooves are provided on the lower surface of the substrate fixing plate, and the grooves and the limiting strips are staggered, and a limiting ring is fixedly installed on the rotating shaft surface of the substrate fixing plate.

[0014] Technical effects and advantages of the utility model:

[0015] 1. In the utility model, during the entire use process, since the limit assembly is located on the upper surface of the substrate fixing plate, that is, the side away from the magnetron target, during the coating process, it will not be coated on the movable parts of the limit assembly, thereby avoiding the situation of jamming. Relatively speaking, the function is more perfect.

[0016] 2. In the use of the utility model, the user can arbitrarily rotate the limit bar and press the connecting rod to drive the limit bar to descend. In this way, substrates of different thicknesses and shapes can be fixed, which greatly increases the application range of the entire device and is more convenient to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the three-dimensional structure of the utility model from the first viewing angle;

[0018] Figure 2 This is a schematic diagram of the internal structure of the utility model;

[0019] Figure 3 For this utility model Figure 2 The enlarged structural diagram at A in the middle;

[0020] Figure 4 It is a schematic diagram of the second viewing angle of the three-dimensional structure of the utility model.

[0021] The accompanying drawings are marked as follows: 1. working box; 2. magnetron target; 3. substrate fixing plate; 4. limit strip; 5. connecting shaft; 6. connecting rod; 7. collar; 8. compression spring; 9. guide block; 10. motor; 11. socket; 12. pin hole; 13. limit bolt; 14. groove; 15. limit ring. DETAILED DESCRIPTION

[0022] The technical solution of the present invention will be clearly and completely described below in conjunction with the drawings in the present invention. In addition, the forms of the various structures recorded in the following embodiments are merely illustrative. The small sputtering device for coating involved in the present invention is not limited to the various structures recorded in the following embodiments. All other implementations obtained by ordinary technicians in this field without making creative work belong to the scope of protection of the present invention.

[0023] Reference Figure 1-4 The utility model provides a small sputtering apparatus for coating, comprising: a working box 1, a magnetron target 2, a substrate fixing plate 3, a limiting component, and a driving component. The magnetron target 2 is installed at the inner bottom of the working box 1, the substrate fixing plate 3 is rotatably installed at the inner top of the working box 1, the limiting component is installed on the substrate fixing plate 3, the substrate to be coated is limited by the limiting component, the driving component is connected between the substrate fixing plate 3 and the working box 1, and the substrate fixing plate 3 is driven to rotate by the driving component.

[0024] The limiting assembly includes a limiting bar 4, which is on the lower surface of the substrate fixing plate 3, and the limiting bar 4 can slide up and down. The end of the limiting bar 4 away from the substrate fixing plate 3 is rotatably installed with a connecting shaft 5, and the top of the connecting shaft 5 is fixedly installed with a connecting rod 6. The end of the connecting rod 6 away from the connecting shaft 5 is fixedly installed with a sleeve ring 7, which is arranged above the substrate fixing plate 3, and the sleeve ring 7 is slidably sleeved on the rotating shaft of the substrate fixing plate 3. In this way, it is only necessary to press the connecting rod 6 to drive the connecting shaft 5 and the limiting bar 4 to move downward until the limiting bar 4 is below the substrate, and then the back of the substrate to be coated is fitted with the lower surface of the substrate fixing plate 3, and then the limiting bar 4 is rotated to make the end of the limiting bar 4 away from the connecting shaft 5 below the substrate, so that the substrate can be limited.

[0025] The limiting assembly also includes a compression spring 8, which is installed between the ring 7 and the substrate fixing plate 3, and the compression spring 8 is sleeved on the rotating shaft of the substrate fixing plate 3. In this way, under the action of the compression spring 8, the connecting rod 6 will be driven to rise, thereby driving the limiting bar 4 to rise, so that the substrate can be clamped, thereby further improving the limiting ability of the substrate.

[0026] There are multiple limiting strips 4, connecting shafts 5 and connecting rods 6, and they are symmetrically distributed around the cylindrical surface of the ring 7. In this way, the substrate can be limited in multiple directions.

[0027] A plurality of guide blocks 9 are fixedly mounted on the upper surface of the substrate fixing plate 3, and the connecting rod 6 is slidably mounted between the guide blocks 9. In this way, the limiting strip 4 is prevented from moving and scratching the substrate surface after the connecting rod 6 and the substrate fixing plate 3 rotate relative to each other, which makes the use safer.

[0028] The driving assembly includes a motor 10, the rotating shaft of the motor 10 is detachably coaxially connected to the rotating shaft of the substrate fixing plate 3, a socket 11 is provided at the end of the output shaft of the motor 10, the end of the rotating shaft of the substrate fixing plate 3 is inserted into the socket 11, a pin hole 12 is provided on the surface of the output shaft of the motor 10, and the pin hole 12 passes through the rotating shaft of the substrate fixing plate 3, and a limiting bolt 13 is inserted in the pin hole 12, so that after a period of use, the limiting bolt 13 can be pulled out to remove the substrate fixing plate 3, so that the surface of the substrate fixing plate 3 can be conveniently cleaned.

[0029] A plurality of grooves 14 are provided on the lower surface of the substrate fixing plate 3, and the grooves 14 and the limiting strips 4 are staggered. A limiting ring 15 is fixedly installed on the rotating shaft surface of the substrate fixing plate 3, so that the substrate and the substrate fixing plate 3 can be prevented from being attracted to each other, thereby facilitating the removal of the substrate.

[0030] Therefore, the complete usage process is that when coating is required, only the back of the substrate to be coated needs to be fitted with the lower surface of the substrate fixing plate 3, and then the connecting rod 6 is pressed to drive the connecting shaft 5 and the limit bar 4 to move downward until the limit bar 4 is under the substrate. At this time, the limit bar 4 is rotated so that the end of the limit bar 4 away from the connecting shaft 5 is under the substrate, and then the connecting rod 6 is slowly released. At this time, under the action of the compression spring 8, the connecting rod 6 will rise to reset, thereby driving the limit bar 4 to rise until the substrate is clamped. At this time, the working box 1 is closed, and the magnetron target 2 and the motor 10 are started to perform the coating work, wherein the motor 10 will drive the substrate fixing plate 3 to rotate, and then drive the substrate to rotate, so that the coating is more uniform.

[0031] In summary, during the entire use process, since the limiting component is located on the upper surface of the substrate fixing plate 3, that is, the side away from the magnetron target 2, during the coating process, it will not be coated on the movable parts of the limiting component, thereby avoiding jamming. Relatively speaking, the function is more complete.

[0032] In addition, during use, the user can arbitrarily rotate the limit bar 4 and press the connecting rod 6 to drive the limit bar 4 to descend. In this way, substrates of different thicknesses and shapes can be fixed, which greatly increases the application range of the entire device and is more convenient to use.

[0033] Finally, it should be noted that: the drawings of the embodiments disclosed in the present utility model only involve structures related to the embodiments disclosed in the present utility model, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present utility model can be combined with each other;

[0034] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A small sputtering device for coating, characterized in that: include: A working box (1), a magnetron target (2), a substrate fixing plate (3), a limiting assembly, and a driving assembly. The magnetron target (2) is mounted on the inner bottom of the working box (1), the substrate fixing plate (3) is rotatably mounted on the inner top of the working box (1), the limiting assembly is mounted on the substrate fixing plate (3), and the substrate to be coated is limited by the limiting assembly. The driving assembly is connected between the substrate fixing plate (3) and the working box (1), and the substrate fixing plate (3) is driven to rotate by the driving assembly.

2. A small sputtering device for coating according to claim 1, characterized in that: The limiting assembly comprises a limiting bar (4), the limiting bar (4) is located on the lower surface of the substrate fixing plate (3), and the limiting bar (4) can slide up and down, and the end of the limiting bar (4) away from the substrate fixing plate (3) is rotatably mounted with a connecting shaft (5), the top end of the connecting shaft (5) is fixedly mounted with a connecting rod (6), and the end of the connecting rod (6) away from the connecting shaft (5) is fixedly mounted with a sleeve ring (7), the sleeve ring (7) is arranged above the substrate fixing plate (3), and the sleeve ring (7) is slidably sleeved on the rotating shaft of the substrate fixing plate (3).

3. A small sputtering device for coating according to claim 2, characterized in that: The limiting assembly also includes a compression spring (8), which is installed between the collar (7) and the substrate fixing plate (3), and the compression spring (8) is sleeved on the rotating shaft of the substrate fixing plate (3).

4. A small sputtering device for coating according to claim 2 or 3, characterized in that: There are a plurality of limit strips (4), connecting shafts (5) and connecting rods (6), which are symmetrically distributed around the cylindrical surface of the collar (7).

5. The small sputtering device for coating according to claim 4, characterized in that: A plurality of guide blocks (9) are fixedly mounted on the upper surface of the substrate fixing plate (3), and the connecting rods (6) are slidably mounted between pairs of the guide blocks (9).

6. The small sputtering device for coating according to claim 5, characterized in that: The driving assembly comprises a motor (10), and the rotating shaft of the motor (10) and the rotating shaft of the substrate fixing plate (3) are detachably coaxially connected.

7. A small sputtering device for coating according to claim 6, characterized in that: The output shaft end of the motor (10) is provided with an insertion hole (11), the rotating shaft end of the substrate fixing plate (3) is inserted into the insertion hole (11), the surface of the output shaft of the motor (10) is provided with a pin hole (12), and the pin hole (12) passes through the rotating shaft of the substrate fixing plate (3), and a limiting bolt (13) is inserted into the pin hole (12).

8. The small sputtering device for coating according to claim 1, characterized in that: The lower surface of the substrate fixing plate (3) is provided with a plurality of grooves (14), and the grooves (14) and the limiting strips (4) are arranged in a staggered manner. A limiting ring (15) is fixedly mounted on the rotating shaft surface of the substrate fixing plate (3).

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