Tinning device for SMD (Surface Mount Device) diode
By designing a patch diode plating device containing multiple mechanical components, the problem of the inability to plating tin at one time in the prior art is solved, the working efficiency is improved and the cleaning process is simplified.
Patent Information
- Application Number
- CN202420215196.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-30
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2034-01-30
AI Technical Summary
The existing chip diode tin plating device cannot tin plating multiple chip diodes at once, resulting in low working efficiency.
A tin plated box door including a base, a tin-plated pool, hinged connection, a support top block, a lifting cylinder, a telescopic rod, a support block, a connecting column, a support rail, a connecting block, a limit support block and a drain hole were designed. The device, through the mutual cooperation of these components, tin plating of multiple patch diodes at once and facilitates cleaning.
It realizes tin plating of multiple patch diodes simultaneously, improving working efficiency and simplifying the cleaning process.
Smart Images
Figure CN222205510U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of tinning devices, in particular to a tinning device for a patch diode. Background Art
[0002] SMD diodes generally refer to crystal diodes, which are semiconductor two-terminal devices in solid-state electronic devices. The main feature of these devices is that they have nonlinear current-voltage characteristics. Since then, with the development of semiconductor materials and process technology, a variety of crystal diodes with various structures and functions have been developed using different semiconductor materials, doping distributions, and geometric structures. When tinning the pins of SMD diodes, a tinning device is used.
[0003] The existing tin-plating device for SMD diodes cannot tin multiple SMD diodes at one time when in use, resulting in low work efficiency. Therefore, there is an urgent need for a tin-plating device for SMD diodes to solve the above technical problems. Utility Model Content
[0004] The purpose of the utility model is to provide a tin-plating device for chip diodes to solve the problem that the existing tin-plating device for chip diodes proposed in the above background technology cannot tin-plate multiple chip diodes at the same time when in use, resulting in low working efficiency.
[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0006] A tinning device for a surface mount diode comprises a device body, a base is arranged at the bottom of the device body, a tinning pool is arranged at the bottom of the device body, the interior of the tinning pool is filled with a tinning solution, both sides of the front end surface of the device body are connected to box doors through hinges, a supporting top block is arranged at the top of the device body, a lifting cylinder is arranged at the middle of the bottom of the supporting top block, the lower end of the lifting cylinder is connected to the supporting block, a telescopic rod is arranged at the bottom of the supporting top block and on the side of the lifting cylinder, the lower end of the telescopic rod is connected to the top of the supporting block, a connecting column is connected to the bottom of the supporting block, and a supporting guide rail is connected to the lower end of the connecting column, a first connecting block is inserted into the interior of the supporting guide rail, a rear limit support block is connected to one side of the first connecting block, a front limit support block is arranged on the left side of the rear limit support block, the bottoms of the rear limit support block and the front limit support block are connected by a second connecting block, and a plurality of drainage holes are opened at the bottom of the second connecting block.
[0007] As a preferred technical solution of the utility model, the number of the telescopic rods is set to two, and the two telescopic rods are symmetrically arranged about the lifting cylinder.
[0008] As a preferred technical solution of the present utility model, the rear limit support block and the front limit support block are axially symmetrically arranged with respect to the second connecting block.
[0009] As a preferred technical solution of the utility model, the number of the connecting columns is set to two, and the two connecting columns are symmetrically arranged with respect to the left and right axes of the supporting block.
[0010] As a preferred technical solution of the present utility model, a groove is provided at the bottom of the first connecting block.
[0011] As a preferred technical solution of the utility model, there is a space between the rear limit support block and the front limit support block that only accommodates the SMD diode package chip.
[0012] Compared with the prior art, the utility model has the following beneficial effects:
[0013] 1. The utility model provides a second connection block, a rear limit support block and a front limit support block, and utilizes the cooperation between them, so that multiple SMD diodes can be tinned at the same time, thereby improving work efficiency.
[0014] 2. The utility model provides a first connecting block, a groove and a supporting guide rail, and utilizes the interaction between them, so that the second connecting block, the rear limit support block and the front limit support block can be conveniently disassembled as a whole for cleaning, making cleaning convenient. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Other features, objects and advantages of the present application will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings:
[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0017] Figure 2 It is a schematic cross-sectional view of the overall structure of the utility model;
[0018] Figure 3 It is a right side sectional schematic diagram of part of the structure of the utility model.
[0019] In the figure: 1. device body; 2. base; 3. hinge; 4. base; 5. support top block; 6. telescopic rod; 7. lifting cylinder; 8. support block; 9. connecting column; 10. front limit support block; 11. second connecting block; 12. tinning pool; 13. tinning solution; 14. support guide rail; 15. first connecting block; 16. drainage hole; 17. rear limit support block. DETAILED DESCRIPTION
[0020] The present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It is understood that the specific embodiments described herein are only used to explain the relevant utility model, rather than to limit the utility model. It should also be noted that, for ease of description, only the parts related to the utility model are shown in the accompanying drawings. The different types of section lines in the drawings in the embodiments of the utility model are not marked according to the national standard, nor are there any requirements for the materials of the components, but are used to distinguish the cross-sectional views of the components in the drawings.
[0021] See also Figure 1-3 A tinning device for a patch diode comprises a device body 1, a base 4 is arranged at the bottom of the device body 1, a tinning pool 12 is arranged at the bottom of the device body 1, and the inside of the tinning pool 12 is filled with a tinning solution 13, both sides of the front end surface of the device body 1 are connected with a box door 2 through a hinge 3, a supporting top block 5 is arranged at the top of the device body 1, a lifting cylinder 7 is arranged at the middle of the bottom of the supporting top block 5, a supporting block 8 is connected to the lower end of the lifting cylinder 7, and an extension is arranged at the bottom of the supporting top block 5 and on the side of the lifting cylinder 7 The retractable rod 6, the lower end of the telescopic rod 6 is connected to the top of the support block 8, the bottom of the support block 8 is connected to a connecting column 9, the lower end of the connecting column 9 is connected to a support guide rail 14, a first connecting block 15 is inserted inside the support guide rail 14, one side of the first connecting block 15 is connected to a rear limit support block 17, a front limit support block 10 is arranged on the left side of the rear limit support block 17, the rear limit support block 17 and the bottom of the front limit support block 10 are connected by a second connecting block 11, and a plurality of drainage holes 16 are provided at the bottom of the second connecting block 11.
[0022] The number of telescopic rods 6 is set to two, and the two telescopic rods 6 are symmetrically arranged about the lifting cylinder 7 .
[0023] The rear limit support block 17 and the front limit support block 10 are axially symmetrically arranged with respect to the second connection block 11 .
[0024] The number of the connecting columns 9 is set to two, and the two connecting columns 9 are symmetrically arranged with respect to the supporting block 8 .
[0025] A groove is formed at the bottom of the first connecting block 15 .
[0026] There is a space between the rear limit support block 17 and the front limit support block 10 that can only accommodate the SMD diode package chip.
[0027] The working principle and use process of the utility model are as follows: first, the box door 2 is opened by the hinges 3 on both sides, and multiple SMD diodes are placed in sequence in the space between the rear limit support block 17 and the front limit support block 10 that only accommodates the SMD diode packaged chips, and are arranged in a row. At this time, the pins of the SMD diodes extend downward, and the SMD diodes are limited between the rear limit support block 17 and the front limit support block 10, and then the lifting cylinder 7 is started to drive the support block 8 to move downward, so that the entire support block 8 moves downward, thereby causing the rear limit support block 17 and the front limit support block 10 to move downward, driving the pins of the multiple SMD diodes between the rear limit support block 17 and the front limit support block 10 to move downward and until they are inserted into the tinning solution 13 in the tinning pool 12, thereby completing the tinning, so that multiple SMD diodes can be tinned at the same time, thereby improving the work efficiency;
[0028] When it is necessary to disassemble and clean the second connecting block 11, the rear limit support block 17 and the front limit support block 10 as a whole, the first connecting block 15 is pulled out to one side along the support guide rail 14, so that the support guide rail 14 is separated from the first connecting block 15. At this time, the disassembly of the whole composed of the second connecting block 11, the rear limit support block 17 and the front limit support block 10 is completed. The contents not described in detail in this specification belong to the existing technology known to professional and technical personnel in this field.
[0029] The above description is only a preferred embodiment of the present application and an explanation of the technical principles used. Those skilled in the art should understand that the scope of the utility model involved in the present application is not limited to the technical solution formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the concept of the utility model. For example, the above features are replaced with the technical features with similar functions disclosed in the present application (but not limited to) by each other to form a technical solution.
Claims
1. A tinning device for a chip diode, comprising a device body (1), characterized in that: A base (4) is provided at the bottom of the device body (1), a tinning pool (12) is provided at the bottom of the device body (1), the interior of the tinning pool (12) is filled with a tinning solution (13), both sides of the front end surface of the device body (1) are connected to a box door (2) via hinges (3), a supporting top block (5) is provided at the top of the device body (1), a lifting cylinder (7) is provided at the middle of the bottom of the supporting top block (5), the lower end of the lifting cylinder (7) is connected to a supporting block (8), a telescopic rod (6) is provided at the bottom of the supporting top block (5) and located on the side of the lifting cylinder (7), and the telescopic rod ( The lower end of the support block (6) is connected to the top of the support block (8), the bottom of the support block (8) is connected to a connecting column (9), the lower end of the connecting column (9) is connected to a support guide rail (14), a first connecting block (15) is inserted into the interior of the support guide rail (14), one side of the first connecting block (15) is connected to a rear limit support block (17), a front limit support block (10) is arranged on the left side of the rear limit support block (17), the bottom of the rear limit support block (17) and the front limit support block (10) are connected via a second connecting block (11), and a plurality of drainage holes (16) are provided at the bottom of the second connecting block (11).
2. The tinning device for a SMD diode according to claim 1, characterized in that: The number of the telescopic rods (6) is set to two, and the two telescopic rods (6) are arranged symmetrically about the lifting cylinder (7) with respect to the left and right axes.
3. The tinning device for a SMD diode according to claim 1, characterized in that: The rear limit support block (17) and the front limit support block (10) are arranged in an axisymmetric manner with respect to the second connection block (11).
4. The tinning device for a SMD diode according to claim 1, characterized in that: The number of the connecting columns (9) is set to two, and the two connecting columns (9) are arranged symmetrically about the left and right axes of the supporting block (8).
5. The tinning device for a SMD diode according to claim 1, characterized in that: A groove is formed at the bottom of the first connecting block (15).
6. The tinning device for a SMD diode according to claim 1, characterized in that: There is a space between the rear limit support block (17) and the front limit support block (10) that can only accommodate the SMD diode package chip.