Single-chip electroplating machine

Abstract

The utility model relates to the field of wafer electrolytic plating equipment, in particular to a single-chip electroplating machine. A single-chip electroplating machine comprises a rectification structure and a shell structure, the rectification structure comprises an upper positive electrode plate and a positive electrode plate, the upper positive electrode plate and the positive electrode plate are porous plates, and pore channels are electroplating liquid flow channel holes; the electroplating liquid flow channel holes of the positive electrode plate comprise a main electroplating liquid flow channel hole and an auxiliary electroplating liquid flow channel hole, and the main electroplating liquid flow channel hole corresponds to the electroplating liquid flow channel hole of the upper positive electrode plate. The upper positive electrode plate and the positive electrode plate are provided with electroplating liquid runner holes for buffering electroplating liquid, and the upper positive electrode plate and the positive electrode plate adjust the uniformity of the electroplating liquid in a segmented manner, so that a good electroplating effect is achieved; and a plurality of annular first sealing ring grooves are adopted, so that the electroplating liquid passes through the upper positive electrode plate and the electroplating liquid runner holes of the positive electrode plate in a partitioned manner, the electroplating liquid can be distributed more uniformly, and the electroplating effect is improved.

Description

Technical Field

[0001] The utility model relates to the field of wafer electrolytic plating equipment, in particular to a single-chip electroplating machine. Background Art

[0002] Traditionally, in the process of electroplating semiconductor wafers using an electroplating machine, wafers are mostly transported to multiple electroplating tanks in sequence by means of a robot or an overhead crane, and different plating solutions are injected into each electroplating tank to immerse the wafer surface. First of all, each electroplating tank requires a large amount of plating solution, and the plant area with multiple electroplating tanks is very large. In addition, during the electroplating process, it is easy for the internal and external environments to communicate with each other. The plating solution in the electroplating machine has strict requirements on components, ratios, temperature and volatility. Once it communicates with the external environment, it will accelerate the volatilization of the chemical solution. At the same time, it is easy for tiny particles in the external environment to enter the core plating area of ​​the electroplating tank, thereby reducing the efficiency and pass rate of wafer electroplating. Utility Model Content

[0003] In order to solve the problems in the prior art that the amount of plating solution in the plating tank is large, the plating tank occupies a large area, the plating solution is easily contaminated, and tiny particles in the external environment enter the core plating area of ​​the plating tank, thereby reducing the efficiency and qualified rate of wafer plating, the utility model provides a single-chip electroplating machine, the electroplating machine includes a rectification structure and a shell structure, the rectification structure includes an upper positive electrode plate and a positive electrode plate, the upper positive electrode plate and the positive electrode plate are porous plates, and the channels are plating solution flow channel holes; a plurality of annular first sealing ring grooves are provided on one side of the positive electrode plate close to the upper positive electrode plate, and the number of plating solution flow channel holes of the positive electrode plate corresponding to the annular area formed by adjacent first sealing ring grooves is greater than the number of plating solution flow channel holes of the upper positive electrode plate; the plating solution flow channel holes of the positive electrode plate include main plating solution flow channel holes and auxiliary plating solution flow channel holes, and the main plating solution flow channel holes correspond to the plating solution flow channel holes of the upper positive electrode plate. The upper positive electrode plate and the positive electrode plate are used to set plating liquid flow channel holes to buffer the plating liquid. The upper positive electrode plate and the positive electrode plate are used to adjust the uniformity of the plating liquid in sections to achieve a good plating effect. A plurality of annular first sealing ring grooves are used to allow the plating liquid to pass through the plating liquid flow channel holes of the upper positive electrode plate and the positive electrode plate in sections, which can make the plating liquid more evenly distributed and improve the plating effect.

[0004] Preferably, the housing structure includes an electroplating carrier plate and an electroplating connecting piece, and the bottom of the electroplating carrier plate is connected to the electroplating connecting piece. The electroplating carrier plate is used to reduce the practical amount of electroplating solution and the volume of the electroplating machine. The electroplating connecting piece fixes the electroplating carrier plate, which is conducive to the stacking design of the electroplating machine.

[0005] Preferably, the diameter of the plating solution flow channel hole of the positive electrode plate is smaller than the diameter of the plating solution flow channel hole of the upper positive electrode plate. With the above arrangement, the plating solution flow channel hole of the positive electrode plate can slow down the flow rate of the plating solution flowing out of the plating solution flow channel hole of the upper positive electrode plate, so that the plating solution is evenly dispersed on the surface of the positive electrode plate, and flows out through the main plating solution flow channel hole and the auxiliary plating solution flow channel hole respectively, so as to adjust the uniformity of the plating solution and improve the electroplating effect.

[0006] Preferably, a plating liquid rib and a negative electrode plating head gasket are provided on one side of the plating carrier plate close to the positive electrode plate, and a plurality of annular second sealing ring grooves are provided on one side of the plating carrier plate close to the positive electrode plate, and the second sealing ring grooves are located between the plating liquid rib and the negative electrode plating head gasket. The plating liquid rib and the second sealing ring groove are used to prevent leakage of the plating liquid during the operation of the electroplating machine; at the same time, the plating liquid rib can guide the outer ring of the positive electrode head up and down.

[0007] Preferably, a carbon rod and a plurality of negative electrode plating heads are inserted into the negative electrode plating head gasket, the plurality of negative electrode plating heads are distributed on the negative electrode plating head gasket at equal angles, and the bottom of the negative electrode plating head is fixed on the plating carrier plate. The plurality of negative electrode plating heads are distributed on the negative electrode plating head gasket at equal angles to ensure the electroplating effect of the electroplating machine.

[0008] Preferably, the shell structure includes a positive electrode head outer ring, the outer diameter of which matches the electroplating liquid retaining edge, an upper positive electrode plate and a positive electrode plate are fixed inside the positive electrode head outer ring, and the positive electrode plate is located on the side of the positive electrode head outer ring close to the electroplating carrier. The positive electrode head outer ring is used to fix the upper positive electrode plate and the positive electrode plate, which is conducive to moving the electroplated body before or after the electroplating process.

[0009] Preferably, a step surface is provided inside the outer ring of the positive electrode head to avoid the negative electrode plating head gasket. When the electroplating machine is working, the positive electrode plate, the electroplating carrier plate and the negative electrode plating head gasket form a cavity, and the cavity contains the electroplating body immersed in the electroplating solution. The positive electrode plate, the electroplating carrier plate and the negative electrode plating head gasket are used to form the cavity, which reduces the required electroplating solution, improves the sealing of the electroplating area, reduces the influence of the outside world on the electroplating solution, and improves the electroplating effect.

[0010] Preferably, the area of ​​the positive electrode plate is larger than that of the upper positive electrode plate, the edge of the positive electrode plate is inserted into the outer ring of the positive electrode head, and a fixing member is used to fix the positive electrode plate from the side of the upper positive electrode plate away from the electroplating carrier. The fixing member and the positive electrode plate are inserted into the outer ring of the positive electrode head, and the upper positive electrode plate, the positive electrode plate and the outer ring of the positive electrode head are connected as a whole, which is convenient for taking out and storing the electroplated body.

[0011] The utility model adopts the above-mentioned arrangement to solve the problems in the prior art and has the following beneficial effects: the upper positive electrode plate and the positive electrode plate adjust the uniformity of the electroplating solution in sections to achieve a good electroplating effect; the electroplating solution is divided into sections and passes through the electroplating solution flow holes of the upper positive electrode plate and the positive electrode plate to make the distribution of the electroplating solution more uniform and improve the electroplating effect; the electroplating working area is small, which reduces the required electroplating solution, improves the sealing of the electroplating area, reduces the influence of the outside world on the electroplating solution, and improves the electroplating effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the structure of the utility model;

[0013] Figure 2 It is an exploded view of the utility model;

[0014] Figure 3 It is a cross-sectional view of the utility model.

[0015] Legend: positive electrode head outer ring 1; upper positive electrode plate 2; sealing ring 3; positive electrode plate 4; main plating liquid flow channel hole 4.1; secondary plating liquid flow channel hole 4.2; first sealing ring groove 4.3; negative electrode plating head gasket 5; carbon rod 6; negative electrode plating head 7; plating carrier plate 8; plating liquid rib 8.1; second sealing ring groove 8.2; plating connecting piece 9; fixing part 10. DETAILED DESCRIPTION

[0016] In order to make the purpose, technical scheme and advantages of the embodiments of the present invention clearer, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention.

[0017] Example 1

[0018] Combination Figure 1 and Figure 2 As shown, a single-chip electroplating machine includes a rectifying structure and a shell structure. The rectifying structure is the core part of the electroplating machine and is responsible for adjusting the uniformity of the electroplating solution. It has a significant impact on the electroplating effect of the wafer, not only affecting the uniformity and efficiency of the electroplating, but also directly related to the quality of the electroplated product. The rectifying structure includes an upper positive electrode plate 2, a positive electrode plate 4,

[0019] The upper positive electrode plate 2 and the positive electrode plate 4 are both porous plates, and these channels are the plating solution flow channel holes. The design of these channels allows the plating solution to flow evenly through the electrode plates, thereby ensuring the smooth progress of the electroplating process. Two annular first sealing ring grooves 4.3 are provided on the side of the positive electrode plate 4 close to the upper positive electrode plate 2. A sealing ring 3 is provided in the first sealing ring groove 4.3, which not only helps to ensure the sealing of the plating solution and prevent leakage, but more importantly, they allow the plating solution to pass through the plating solution flow channel holes of the upper positive electrode plate 2 and the positive electrode plate 4 in different areas. In this embodiment, there are 3 main plating solution flow channel holes 4.1 in the center circle, 6 main plating solution flow channel holes 4.1 in the sub-outer circle, and 12 main plating solution flow channel holes 4.1 in the outermost circle.

[0020] In the annular area formed by the adjacent first sealing ring grooves 4.3, the number of plating liquid flow channel holes of the positive electrode plate 4 is greater than the number of plating liquid flow channel holes of the upper positive electrode plate 2. This design enables the plating liquid to be effectively buffered and distributed when it flows through. In addition, the plating liquid flow channel holes of the positive electrode plate 4 include main plating liquid flow channel holes 4.1 and auxiliary plating liquid flow channel holes 4.2. In the present embodiment, each main plating liquid flow channel hole 4.1 is surrounded by 8 auxiliary plating liquid flow channel holes 4.2 at equal angles around the circumference, and the main plating liquid flow channel holes 4.1 correspond to the plating liquid flow channel holes of the upper positive electrode plate 2. This layout enables the plating liquid to be more evenly distributed on the surface of the electrode plate, thereby ensuring the stability and consistency of the electroplating process.

[0021] Through the above design, this electroplating machine can effectively buffer and adjust the uniformity of the electroplating solution during the electroplating process. The segmented adjustment of the upper positive electrode plate 2 and the positive electrode plate 4 allows the electroplating solution to be more finely controlled when it flows through. The design of several annular first sealing ring grooves 4.3 allows the electroplating solution to pass through the electroplating solution flow channel holes of the electrode plate in sections, further improving the uniformity of the electroplating solution. This optimized electroplating machine can not only improve the electroplating efficiency, but also improve the quality of the electroplated products, making the electroplating effect more ideal.

[0022] The shell structure includes a plating carrier plate 8, an electroplating connecting plate 9 and a positive head outer ring 1, wherein the bottom of the plating carrier plate 8 is connected to the plating connecting plate 9; the outer diameter of the positive head outer ring 1 matches the plating liquid retaining edge 8.1, and an upper positive electrode plate 2 and a positive electrode plate 4 are fixed inside the positive head outer ring 1, and the positive electrode plate 4 is located on the side of the positive head outer ring 1 close to the plating carrier plate 8; a step surface is provided inside the positive head outer ring 1 to avoid the negative electroplating head gasket 5, and when the electroplating machine is working, the positive electrode plate 4, the plating carrier plate 8 and the negative electroplating head gasket 5 form a cavity, and the inside of the cavity is an electroplating body immersed in the plating liquid.

[0023] Through the above-mentioned arrangement, the plating carrier plate 8 is used to reduce the practical amount of the plating solution and reduce the volume of the electroplating machine. The plating connecting piece 9 fixes the plating carrier plate 8, which is beneficial to the stacking design of the electroplating machine. The positive electrode head outer ring 1 is used to fix the upper positive electrode plate 2 and the positive electrode plate 4, which is beneficial to move the plating body before or after the electroplating process. The positive electrode plate 4, the plating carrier plate 8 and the negative plating head gasket 5 are used to form a cavity, which reduces the required plating solution, improves the sealing of the electroplating area, reduces the influence of the plating solution on the outside world, and improves the electroplating effect.

[0024] The diameter of the plating solution flow channel hole of the positive electrode plate 4 is smaller than the diameter of the plating solution flow channel hole of the upper positive electrode plate 2. The smaller diameter can significantly slow down the flow rate of the plating solution flowing out of the plating solution flow channel hole of the upper positive electrode plate 2. The slowing down of the flow rate means that the plating solution has more time to be evenly dispersed on the upper surface of the positive electrode plate 4. This design ensures that the plating solution can cover the surface of the positive electrode plate 4 more evenly, thereby improving the uniformity and effect of electroplating. The plating solution flow channel hole of the positive electrode plate 4 can slow down the flow rate of the plating solution flowing out of the plating solution flow channel hole of the upper positive electrode plate 2, so that the plating solution is evenly dispersed on the upper surface of the positive electrode plate 4. The main plating solution flow channel hole 4.1 is mainly responsible for conveying most of the plating solution, while the auxiliary plating solution flow channel hole 4.2 plays a role of supplementation and fine-tuning, and together ensures the uniformity of the plating solution on the positive electrode plate 4.

[0025] The electroplating carrier plate 8 is provided with a plating liquid rib 8.1 and a negative electrode plating head gasket 5 on one side close to the positive electrode plate 4, and the electroplating carrier plate 8 is provided with two annular second sealing ring grooves 8.2 on one side close to the positive electrode plate 4, and the second sealing ring grooves 8.2 are located between the plating liquid rib 8.1 and the negative electrode plating head gasket 5. The plating liquid rib 8.1 and the second sealing ring groove 8.2 are used to prevent the plating liquid from leaking during the operation of the electroplating machine; at the same time, the plating liquid rib 8.1 can guide the positive head outer ring 1 up and down.

[0026] A carbon rod 6 and six negative electrode plating heads 7 are inserted on the negative electrode plating head gasket 5. The six negative electrode plating heads 7 are distributed on the negative electrode plating head gasket 5 at equal angles. The bottom of the negative electrode plating head 7 is fixed on the plating carrier plate 8, which enhances its stability and durability. The six negative electrode plating heads 7 are distributed on the negative electrode plating head gasket 5 at equal angles to ensure the electroplating effect of the electroplating machine.

[0027] like Figure 3 As shown, the area of ​​the positive electrode plate 4 is larger than that of the upper positive electrode plate 2, the edge of the positive electrode plate 4 is inserted into the positive electrode head outer ring 1, and the fixing member 10 is used to fix the positive electrode plate 4 from the side of the upper positive electrode plate 2 away from the electroplating carrier plate 8. The fixing member 10 and the positive electrode plate 4 are inserted into the positive electrode head outer ring 1, and the upper positive electrode plate 2, the positive electrode plate 4 and the positive electrode head outer ring 1 are connected as a whole, which is convenient for taking out and storing the electroplated body.

[0028] Example 2

[0029] In this embodiment, a single-chip electroplating machine is provided, and the electroplating machine includes a rectifying structure and a shell structure. The rectifying structure is the core part of the electroplating machine, which is responsible for adjusting the uniformity of the electroplating solution and has a significant impact on the electroplating effect of the wafer. It not only affects the uniformity and efficiency of electroplating, but also directly relates to the quality of the electroplated product. The rectifying structure includes an upper positive electrode plate 2 and a positive electrode plate 4. The upper positive electrode plate 2 and the positive electrode plate 4 are both porous plates, and the area of ​​the positive electrode plate 4 is larger than that of the upper positive electrode plate 2. The edge of the positive electrode plate 4 is inserted into the positive electrode head outer ring 1, and the fixing member 10 is used to fix the positive electrode plate 4 from the side of the upper positive electrode plate 2 away from the electroplating carrier plate 8. The fixing member 10 and the positive electrode plate 4 are inserted into the positive electrode head outer ring 1, and the upper positive electrode plate 2, the positive electrode plate 4 and the positive electrode head outer ring 1 are connected as a whole, which is conducive to the removal and storage of the electroplated body. The holes of the upper electrode plate and the positive electrode plate 4 are electroplating liquid flow channel holes. The design of these channels allows the plating solution to flow evenly through the electrode plate, thus ensuring a smooth electroplating process.

[0030] A plurality of annular first sealing grooves 4.3 are provided on one side of the positive electrode plate 4 close to the upper positive electrode plate 2. The design of these sealing grooves not only helps to ensure the sealing of the plating solution and prevent leakage, but more importantly, they enable the plating solution to pass through the plating solution flow channel holes of the upper positive electrode plate 2 and the positive electrode plate 4 in a partitioned manner.

[0031] In the annular area formed by the adjacent first sealing ring grooves 4.3, the number of the plating liquid flow channel holes of the positive electrode plate 4 is greater than the number of the plating liquid flow channel holes of the upper positive electrode plate 2. This design enables the plating liquid to be effectively buffered and distributed when it flows through. In addition, the plating liquid flow channel holes of the positive electrode plate 4 include main plating liquid flow channel holes 4.1 and auxiliary plating liquid flow channel holes 4.2. In the present embodiment, each main plating liquid flow channel hole 4.1 is surrounded by 6 auxiliary plating liquid flow channel holes 4.2 at equal angles around the circumference, and the main plating liquid flow channel holes 4.1 correspond to the plating liquid flow channel holes of the upper positive electrode plate 2. This layout enables the plating liquid to be more evenly distributed on the surface of the electrode plate, thereby ensuring the stability and consistency of the electroplating process.

[0032] The diameter of the plating solution flow channel hole of the positive electrode plate 4 is smaller than the diameter of the plating solution flow channel hole of the upper positive electrode plate 2. The smaller diameter can significantly slow down the flow rate of the plating solution flowing out of the plating solution flow channel hole of the upper positive electrode plate 2. The slowing down of the flow rate means that the plating solution has more time to be evenly dispersed on the upper surface of the positive electrode plate 4.

[0033] Through the above design, the uniformity of the plating solution can be effectively buffered and adjusted during the electroplating process. The segmented adjustment of the upper positive electrode plate 2 and the positive electrode plate 4 enables the plating solution to be more finely controlled when flowing through. The design of several annular first sealing ring grooves 4.3 enables the plating solution to pass through the plating solution flow channel holes of the electrode plate in sections, further improving the uniformity of the plating solution. This electroplating machine with an optimized design can not only improve the electroplating efficiency, but also improve the quality of the electroplated products, making the electroplating effect more ideal. Flow rate control ensures that the plating solution can be more evenly covered on the surface of the positive electrode plate 4, thereby improving the uniformity and effect of electroplating. The plating solution flow channel holes of the positive electrode plate 4 can slow down the flow rate of the plating solution flowing out of the plating solution flow channel holes of the upper positive electrode plate 2, so that the plating solution is evenly dispersed on the upper surface of the positive electrode plate 4. The main plating liquid flow channel hole 4.1 is mainly responsible for conveying most of the plating liquid, while the auxiliary plating liquid flow channel hole 4.2 plays a role of supplementation and fine-tuning, and together ensures the uniformity of the plating liquid on the positive electrode plate 4.

[0034] The shell structure of the electroplating machine in this embodiment includes an electroplating carrier plate 8 and a positive head outer ring 1, the outer diameter of the positive head outer ring 1 matches the electroplating liquid retaining edge 8.1, and an upper positive electrode plate 2 and a positive electrode plate 4 are fixed inside the positive head outer ring 1. The positive electrode plate 4 is located on the side of the positive head outer ring 1 close to the electroplating carrier plate 8; a step surface is provided inside the positive head outer ring 1 to avoid the negative electrode plating head gasket 5. When the electroplating machine is working, the positive electrode plate 4, the electroplating carrier plate 8 and the negative electrode plating head gasket 5 form a cavity, and the inside of the cavity is an electroplating body immersed in the electroplating liquid.

[0035] Through the above-mentioned arrangement, the plating carrier plate 8 is used to reduce the practical amount of the plating solution and reduce the volume of the electroplating machine. The plating connecting piece 9 fixes the plating carrier plate 8, which is beneficial to the stacking design of the electroplating machine. The positive electrode head outer ring 1 is used to fix the upper positive electrode plate 2 and the positive electrode plate 4, which is beneficial to move the plating body before or after the electroplating process. The positive electrode plate 4, the plating carrier plate 8 and the negative plating head gasket 5 are used to form a cavity, which reduces the required plating solution, improves the sealing of the electroplating area, reduces the influence of the plating solution on the outside world, and improves the electroplating effect.

[0036] The electroplating carrier plate 8 is provided with a plating liquid rib 8.1 and a negative electrode plating head gasket 5 on one side close to the positive electrode plate 4, and the electroplating carrier plate 8 is provided with two annular second sealing ring grooves 8.2 on one side close to the positive electrode plate 4, and the second sealing ring grooves 8.2 are located between the plating liquid rib 8.1 and the negative electrode plating head gasket 5. The plating liquid rib 8.1 and the second sealing ring groove 8.2 are used to prevent the plating liquid from leaking during the operation of the electroplating machine; at the same time, the plating liquid rib 8.1 can guide the positive head outer ring 1 up and down.

[0037] Twelve carbon rods 6 and six negative electrode plating heads 7 are inserted on the negative electrode plating head gasket 5. The six negative electrode plating heads 7 are distributed on the negative electrode plating head gasket 5 at equal angles. The bottom of the negative electrode plating head 7 is fixed on the plating carrier plate 8, which enhances its stability and durability. The six negative electrode plating heads 7 are distributed on the negative electrode plating head gasket 5 at equal angles to ensure the electroplating effect of the electroplating machine.

[0038] The utility model adopts the above-mentioned arrangement to solve the problems in the prior art and has the following beneficial effects: the upper positive electrode plate 2 and the positive electrode plate 4 adjust the uniformity of the electroplating solution in sections to achieve a good electroplating effect; the electroplating solution is divided into sections and passes through the electroplating solution flow channel holes of the upper positive electrode plate 2 and the positive electrode plate 4 to make the distribution of the electroplating solution more uniform and improve the electroplating effect; the electroplating working area is small, which reduces the required electroplating solution, improves the sealing of the electroplating area, reduces the influence of the outside world on the electroplating solution, and improves the electroplating effect.

[0039] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can be modified and changed in various ways. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A single-chip electroplating machine, characterized in that: The electroplating machine comprises a rectifying structure and a shell structure, wherein the rectifying structure comprises an upper positive electrode plate and a positive electrode plate, wherein the upper positive electrode plate and the positive electrode plate are porous plates, and wherein the upper positive electrode plate and the positive electrode plate are provided with channels, wherein the channels are electroplating liquid flow channel holes; The positive electrode plate is provided with a plurality of annular first sealing ring grooves on one side close to the upper positive electrode plate, and the number of corresponding plating liquid flow channel holes of the positive electrode plate in the annular area formed by adjacent first sealing ring grooves is greater than the number of plating liquid flow channel holes of the upper positive electrode plate; The electroplating solution flow channel holes of the positive electrode plate include main electroplating solution flow channel holes and auxiliary electroplating solution flow channel holes, and the main electroplating solution flow channel holes correspond to the electroplating solution flow channel holes of the upper positive electrode plate.

2. A single-chip electroplating machine according to claim 1, characterized in that: The shell structure includes an electroplating carrier plate and an electroplating connecting piece, and the bottom of the electroplating carrier plate is connected to the electroplating connecting piece.

3. A single-chip electroplating machine according to claim 1, characterized in that: The diameter of the electroplating solution flow channel hole of the positive electrode plate is smaller than the diameter of the electroplating solution flow channel hole of the upper positive electrode plate.

4. A single-chip electroplating machine according to claim 2, characterized in that: The electroplating carrier plate is provided with a plating liquid rib and a negative electrode plating head gasket on the side close to the positive electrode plate, and the electroplating carrier plate is provided with a plurality of annular second sealing ring grooves on the side close to the positive electrode plate, and the second sealing ring grooves are located between the plating liquid rib and the negative electrode plating head gasket.

5. A single-chip electroplating machine according to claim 4, characterized in that: A plurality of carbon rods and negative electrode plating heads are inserted on the negative electrode plating head gasket, and the plurality of carbon rods and negative electrode plating heads are distributed on the negative electrode plating head gasket at equal angles around the circumference, and the bottom of the negative electrode plating head is fixed on the plating carrier plate.

6. A single-chip electroplating machine according to claim 4 or 5, characterized in that: The shell structure includes a positive electrode head outer ring, the outer diameter of which matches the electroplating liquid retaining edge, an upper positive electrode plate and a positive electrode plate are fixed inside the positive electrode head outer ring, and the positive electrode plate is located on the side of the positive electrode head outer ring close to the electroplating carrier disk.

7. A single-chip electroplating machine according to claim 6, characterized in that: A step surface is provided inside the outer ring of the positive electrode head to avoid the negative electrode plating head gasket. When the electroplating machine is working, the positive electrode plate, the plating carrier plate and the negative electrode plating head gasket form a cavity, and the inside of the cavity is an electroplating body immersed in the plating solution.

8. A single-chip electroplating machine according to claim 7, characterized in that: The area of ​​the positive electrode plate is larger than that of the upper positive electrode plate. The edge of the positive electrode plate is inserted into the outer ring of the positive electrode head. A fixing member is used to fix the positive electrode plate from the side of the upper positive electrode plate away from the electroplating carrier disk.

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