Lead frame deformation inspection jig

Abstract

The utility model discloses a lead frame deformation inspection jig, which comprises a base, the upper surface of the base is provided with a first plane, the first plane can support a lead pin on a lead frame and enable the lead pin to linearly slide on the first plane, at least one side of the first plane is provided with a sliding chute, the bottom of the sliding chute is provided with a second plane, and the second plane is provided with a first through hole. The second plane can support a chip carrier on the lead frame and enable the chip carrier to linearly slide on the second plane, a plurality of grooves are formed in the second plane in a downward concave mode, the grooves are formed at intervals in the extending direction of the sliding groove, and the deformed chip carrier can extend into the grooves; according to the utility model, whether the chip carrier is deformed can be quickly detected by utilizing whether the lead frame moves left and right smoothly.

Description

Technical Field

[0001] The utility model relates to the technical field of lead frame inspection, in particular to a lead frame deformation inspection jig. Background Art

[0002] Lead frame is a key structural component that uses bonding materials (aluminum wire, copper wire) to achieve electrical connection between the internal circuit lead end of the chip and the external lead to form an electrical circuit. It plays a bridge role in connecting with external wires. Lead frame is required in most semiconductor integrated blocks. Lead frame (such as TO220F type) has lead pins and chip carrier connected to the lead pins. The chip is mounted on the front of the chip carrier and then plastic encapsulated and cut to obtain a semiconductor device.

[0003] Since the chip carrier of the lead frame is prone to deformation during processing, the deformation is mainly manifested as the chip carrier tilting toward the side away from the chip mounting, that is, the chip carrier is not parallel to the lead frame. The deformation of the chip carrier will cause unqualified chip mounting and low packaging yield. Therefore, it is necessary to set up a fixture that can quickly check whether the chip carrier is deformed. Utility Model Content

[0004] The utility model aims at the defects of the prior art and provides a lead frame deformation inspection tool, which can quickly inspect whether a chip carrier is deformed by using whether the lead frame moves left and right smoothly.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A lead frame deformation inspection jig comprises a base, wherein a first plane is provided on the upper surface of the base, the first plane can support lead pins on the lead frame and enable the lead pins to slide linearly on the first plane, at least one side of the first plane is provided with a slide groove, the bottom of the slide groove is provided with a second plane, the second plane can support a chip carrier on the lead frame and enable the chip carrier to slide linearly on the second plane, the second plane is concavely provided with a plurality of grooves, the plurality of grooves are arranged at intervals along the extension direction of the slide groove, and the grooves can allow the deformed chip carrier to extend into.

[0007] A first plane is set on the base, a slide groove is set on one side of the first plane, a second plane is set at the bottom of the slide groove, and a plurality of spaced grooves are set on the second plane. During inspection, the lead pins of the lead frame are placed on the first plane, the chip carrier is placed in the slide groove, and the chip carrier is abutted against the second plane. The lead frame is moved left and right. If the chip carrier is not deformed, the undeformed chip carrier can be flat on the second plane and slide smoothly. At this time, the lead frame moves left and right smoothly; if the chip carrier is deformed, the deformed chip carrier will sink and extend into the groove when passing through the groove position. When the lead frame is moved left and right, the deformed chip carrier will collide with the left and right edges of the groove to generate friction resistance, resulting in the lead frame not moving left and right smoothly. At this time, it can be detected that the chip carrier has abnormal deformation, so that the fixture can quickly detect whether the chip carrier is deformed by using whether the lead frame moves left and right smoothly.

[0008] As a preferred solution, the second plane can support the plate portion on the chip carrier, a third plane is provided on the side of the second plane away from the first plane, the third plane is higher than the second plane, the third plane can support the head portion on the chip carrier, and the groove runs upward through the second plane and the third plane.

[0009] As a preferred solution, the height difference between the third plane and the second plane is 0.5mm-1.0mm.

[0010] As a preferred solution, the first plane is higher than the third plane.

[0011] As a preferred solution, two ends of the slide groove respectively pass through two end surfaces of the base.

[0012] As a preferred solution, the depth h of the groove is ≥ 1 mm.

[0013] As a preferred solution, the length of the groove is 20mm-40mm.

[0014] As a preferred solution, the width of the groove is equal to the width of the chip carrier.

[0015] As a preferred solution, two slide grooves are provided, a convex strip is provided on the base, the convex strip is located between the two slide grooves, and the first plane is provided on the upper surface of the convex strip.

[0016] Compared with the prior art, the utility model has obvious advantages and beneficial effects. Specifically, by setting a first plane on the base, setting a slide groove on one side of the first plane, setting a second plane at the bottom of the slide groove, and setting a plurality of spaced grooves on the second plane, during inspection, the lead pins of the lead frame are placed on the first plane, the chip carrier is placed in the slide groove, and the chip carrier is abutted against the second plane, and the lead frame is moved left and right. If the chip carrier is not deformed, the undeformed chip carrier can be flat on the second plane and slide smoothly, and the lead frame moves left and right smoothly at this time; if the chip carrier is deformed, the deformed chip carrier will sink and extend into the groove when passing through the groove position. When the lead frame is moved left and right, the deformed chip carrier will collide with the left and right edges of the groove to generate friction resistance, resulting in the lead frame not moving left and right smoothly. At this time, it can be detected that the chip carrier has abnormal deformation, so that the fixture can quickly detect whether the chip carrier is deformed by using whether the lead frame moves left and right smoothly.

[0017] In order to more clearly explain the structural features, technical means and specific purposes and functions achieved by the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments: BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a top view of the lead frame of the embodiment of the utility model;

[0019] Figure 2 It is a top side view of a lead frame of an embodiment of the utility model;

[0020] Figure 3 This is a top view of a lead frame deformation inspection jig according to an embodiment of the utility model;

[0021] Figure 4 It is a side view of a lead frame deformation inspection jig according to an embodiment of the utility model;

[0022] Figure 5 yes Figure 3 Schematic diagram of the cross section at AA in the middle;

[0023] Figure 6 This is a schematic diagram of a normal lead frame inspection state of an embodiment of the utility model;

[0024] Figure 7 It is a schematic diagram of the inspection state of the deformed lead frame of the embodiment of the utility model.

[0025] Description of the accompanying drawings:

[0026] 10-base; 11-first plane; 12-slideway; 13-second plane; 14-groove; 15-third plane;

[0027] 16- convex strip; 20- lead frame; 21- lead pin; 22- chip carrier; 221- plate portion; 222- head portion. DETAILED DESCRIPTION

[0028] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the position or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.

[0029] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0030] like Figure 1-7 As shown, the utility model discloses a lead frame deformation inspection jig, including a base 10, the upper surface of the base 10 is provided with a first plane 11, the first plane 11 can support the lead pin 21 on the lead frame 20 and make the lead pin 21 slide linearly on the first plane 11, at least one side of the first plane 11 is provided with a slide groove 12, the bottom of the slide groove 12 is provided with a second plane 13, the second plane 13 can support the chip carrier 22 on the lead frame 20 and make the chip carrier 22 slide linearly on the second plane 13, the second plane 13 is downwardly concave with a plurality of grooves 14, the plurality of grooves 14 are spaced apart along the extension direction of the slide groove 12, the grooves 14 can be inserted into the deformed chip carrier 22, and specifically, the number of the grooves 14 is three.

[0031] The second plane 13 can support the plate portion 221 on the chip carrier 22, and a third plane 15 is provided on the side of the second plane 13 away from the first plane 11, the third plane 15 is higher than the second plane 13, the first plane 11 is higher than the third plane 15, and the third plane 15 can support the head 222 on the chip carrier 22, and the groove 14 penetrates the second plane 13 and the third plane 15 upward; by providing the third plane 15 on the second plane 13, the third plane 15 is higher than the second plane 13, and during inspection, the second plane 13 is used to support the plate portion 221 on the chip carrier 22, and the third plane 15 is used to support the head 222 on the chip carrier 22, so that the plate portion 221 and the head 222 on the chip carrier 22 can slide in the slide groove 12, thereby more comprehensively and accurately inspecting the deformed chip carrier 22.

[0032] The height difference between the third plane 15 and the second plane 13 is 0.5 mm-1.0 mm, and preferably the height difference between the third plane 15 and the second plane 13 is 0.7 mm.

[0033] The two ends of the slide groove 12 respectively penetrate the two end surfaces of the base 10; by setting the two ends of the slide groove 12 to respectively penetrate the two end surfaces of the base 10, the chip carrier 22 on the lead frame 20 can extend out of the slide groove 12, thereby facilitating the chip carrier 22 to slide back and forth left and right during inspection.

[0034] The depth h of the groove 14 is ≥1 mm, wherein the depth h is the distance between the bottom of the groove 14 and the second plane 13 .

[0035] The length L of the groove 14 is 20 mm-40 mm, and preferably the length of the groove 14 is 22 mm-35 mm.

[0036] The width B1 of the groove 14 is equal to the width B2 of the chip carrier 22 .

[0037] The slide grooves 12 are provided with two, and the base 10 is provided with a convex strip 16, the convex strip 16 is located between the two slide grooves 12, and the first plane 11 is provided on the upper surface of the convex strip 16; by providing double slide grooves 12, double-row chip carriers 22 can be inspected at one time, and the inspection efficiency is high.

[0038] It should be noted that the utility model can set a corresponding number of slide grooves 12 according to the number of rows of chip carriers 22 on the lead frame 20, that is, the slide groove 12 can be set as a single row corresponding to a single row of chip carriers 22, or multiple rows corresponding to multiple rows of chip carriers 22.

[0039] The method of using the utility model is as follows: the lead pin 21 on the lead frame 20 is placed on the first plane 11, and the chip carrier 22 is placed in the slide groove 12, the plate portion 221 on the chip carrier 22 is abutted on the second plane 13, and the head portion 222 on the chip carrier 22 is abutted on the third plane 15, and then the lead frame 20 is moved back and forth left and right; if the chip carrier 22 is not deformed, the plate portion 221 on the undeformed chip carrier 22 can be flat on the second plane 13 and slide smoothly, and the undeformed chip carrier The head 222 on 22 can be flat on the third plane 15 and slide smoothly, and the lead frame 20 can move smoothly left and right; if the chip carrier 22 is deformed (the plate portion 221 and / or the head 222 are deformed), the deformed chip carrier 22 will sink and extend into the groove 14 when passing the position of the groove 14. When the lead frame 20 is moved left and right, the deformed chip carrier 22 will collide with the left and right edges of the groove 14 to generate friction resistance, resulting in the lead frame 20 not moving smoothly left and right. At this time, it can be detected that the chip carrier 22 has abnormal deformation.

[0040] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Therefore, any modification, equivalent replacement, improvement, etc. made to the above embodiment based on the technical practice of the present invention still falls within the scope of the technical solution of the present invention.

Claims

1. A lead frame deformation inspection jig, characterized in that: It includes a base, the upper surface of which is provided with a first plane, the first plane can support the lead pins on the lead frame and make the lead pins slide linearly on the first plane, at least one side of the first plane is provided with a slide groove, the bottom of the slide groove is provided with a second plane, the second plane can support the chip carrier on the lead frame and make the chip carrier slide linearly on the second plane, the second plane is downwardly concave with a plurality of grooves, the plurality of grooves are spaced apart along the extension direction of the slide groove, and the grooves can allow the deformed chip carrier to extend into.

2. The lead frame deformation inspection jig according to claim 1, characterized in that: The second plane can support the plate portion on the chip carrier, a third plane is provided on the second plane at a side away from the first plane, the third plane is higher than the second plane, and the third plane can support the head portion on the chip carrier, and the groove runs through the second plane and the third plane upward.

3. The lead frame deformation inspection jig according to claim 2, characterized in that: The height difference between the third plane and the second plane is 0.5mm-1.0mm.

4. The lead frame deformation inspection jig according to claim 2, characterized in that: The first plane is higher than the third plane.

5. The lead frame deformation inspection jig according to claim 1, characterized in that: The two ends of the slide groove respectively penetrate the two end surfaces of the base.

6. The lead frame deformation inspection jig according to claim 2, characterized in that: The depth of the groove h≥1mm.

7. The lead frame deformation inspection jig according to claim 1, characterized in that: The length of the groove is 20mm-40mm.

8. The lead frame deformation inspection jig according to claim 1, characterized in that: The width of the groove is equal to the width of the chip carrier.

9. The lead frame deformation inspection jig according to any one of claims 1 to 8, characterized in that: The slide grooves are provided with two, the base is provided with a convex strip, the convex strip is located between the two slide grooves, and the first plane is arranged on the upper surface of the convex strip.

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