Vibration sensor and electronic device
By burying the ASIC chip in the substrate and setting the MEMS chip on the connector, connecting the MEMS chip and the vibration assembly with through holes, forming a second chamber to expand the perceived area of the MEMS chip, the problem of limited size of the MEMS chip is solved. , improves the performance and recognition accuracy of vibration sensors.
Patent Information
- Application Number
- CN202420444956.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-07
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2034-03-07
AI Technical Summary
In existing vibration sensors, the size of the MEMS chip is limited, resulting in a small perceived area, which in turn limits the sensitivity and performance of the product.
By burying the ASIC chip in the substrate, the MEMS chip is placed on the side where the connector is away from the substrate, and connecting the MEMS chip and the vibration assembly through the through holes, forming a second chamber to expand the perceived area of the MEMS chip, achieving effective chip Electrical connection.
It effectively improves the performance of vibration sensors, expands the perception area of MEMS chips, and improves the recognition accuracy and recognition capabilities of the product.
Smart Images
Figure CN222211954U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of sensors, in particular to a vibration sensor and electronic equipment. Background Art
[0002] The vibration sensor includes but is not limited to structures such as a shell, a PCB substrate, a vibration component, a MEMS chip, an ASIC chip, and a metal wire. The vibration component uses the inertial characteristics of the mass unit to generate a displacement △d, compresses the air △V, and forms an air pressure difference signal △P; there is an air pressure difference sensing area on the MEMS (such as capacitance / piezoresistance / piezoelectricity, etc., similar to a MIC sensing structure), which can sense the air pressure difference signal and convert the displacement into an electrical signal through an ASIC signal processing unit to detect a vibration signal.
[0003] In the existing technology, a MEMS chip and an ASIC chip are usually arranged side by side in a packaging cavity inside a shell, which limits the size of the MEMS chip that senses signals, thereby limiting the sensitivity and other performance of the product. Utility Model Content
[0004] The main purpose of the utility model is to provide a vibration sensor and electronic equipment, aiming to expand the sensing area of the MEMS chip and effectively improve product performance.
[0005] In order to achieve the above-mentioned object, the vibration sensor proposed in the utility model comprises:
[0006] substrate;
[0007] A vibration component, wherein the vibration component is disposed on the substrate, and the vibration component and the substrate enclose a first chamber;
[0008] A connecting member, the connecting member is arranged on a side of the vibration component away from the substrate, and the connecting member is provided with a through hole; and
[0009] The chip comprises a MEMS chip and an ASIC chip, wherein the MEMS chip is arranged on a side of the connecting member away from the substrate, the ASIC chip is buried in the substrate, the ASIC chip is electrically connected to the MEMS chip and the substrate, the through hole connects the MEMS chip and the vibration component, and the MEMS chip, the connecting member and the vibration component enclose a second chamber.
[0010] In some embodiments, the MEMS chip is set to one, and the through hole is correspondingly set to one; the MEMS chip includes a stacked silicon substrate, a first insulating layer, a separation membrane, a second insulating layer and a back plate, and the number of the separation membrane is one.
[0011] In some embodiments, the MEMS chip is set to one, and the through hole is correspondingly set to one; the MEMS chip includes a stacked silicon substrate, a first insulating layer, a separation membrane, a second insulating layer and a back plate, and the number of the separation membranes is multiple, and the multiple separation membranes are distributed side by side.
[0012] In some embodiments, the MEMS chip is arranged in plurality, and the plurality of MEMS chips are arranged in series; the through holes are correspondingly arranged in plurality, and the plurality of through holes are arranged relative to the plurality of MEMS chips, and one through hole connects one MEMS chip and the vibration component.
[0013] In some embodiments, a buried space is provided in the substrate, the ASIC chip is buried in the buried space, a metal trace connected to the ASIC chip is provided in the substrate, the metal trace is at least partially exposed on a surface of the substrate close to the vibration component, and the MEMS chip is connected to the exposed portion of the metal trace through a connecting wire.
[0014] In some embodiments, the vibration sensor further includes a packaging shell, which is covered on the substrate and enclosed with the substrate to form a packaging cavity, and the vibration component, the connector and the MEMS chip are all located in the packaging cavity.
[0015] In some embodiments, the packaging shell is provided with a pressure relief hole connecting the packaging cavity and the outside.
[0016] In some embodiments, the vibration assembly includes:
[0017] A vibration ring, wherein the vibration ring is arranged on the substrate;
[0018] a diaphragm, the diaphragm being arranged on a side of the diaphragm away from the substrate; and
[0019] A mass block, wherein the mass block is attached to a surface of the diaphragm close to the substrate;
[0020] The vibration ring, the vibration membrane, the mass block and the substrate together form the first chamber, and the MEMS chip, the connecting member and the vibration membrane together form the second chamber.
[0021] In some embodiments, the vibration assembly is further provided with an air hole connecting the first chamber and the second chamber, and the air hole is located on the diaphragm and the mass block and passes through the diaphragm and the mass block.
[0022] The utility model also provides an electronic device, which comprises the vibration sensor as mentioned above.
[0023] The technical solution of the utility model buries the ASIC chip in the substrate and arranges the MEMS chip on the side of the connector away from the substrate, thereby expanding the sensing area of the MEMS chip and effectively improving the performance of the vibration sensor product. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.
[0025] Figure 1 It is a cross-sectional structural diagram of an embodiment of a vibration sensor of the utility model;
[0026] Figure 2 It is a cross-sectional structural schematic diagram of another embodiment of the vibration sensor of the utility model;
[0027] Figure 3 This is a schematic cross-sectional structure diagram of another embodiment of the vibration sensor of the utility model.
[0028] Description of Figure Numbers:
[0029] name Label name Label Vibration Sensor 100 Ventilation holes 24 substrate 10 Connectors 30 Metal wiring 11 Through Hole 31 Avoidance slot 12 MEMS Chips 40 Vibration components 20 ASIC Chip 50 Vibration Ring 21 Package 60 Diaphragm 22 Pressure relief hole 61 Mass 23
[0030] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0031] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0032] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0033] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0034] In addition, in the present utility model, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.
[0035] In order to expand the sensing area of the MEMS chip 40 and effectively improve the product performance of the vibration sensor 100 , the utility model provides a vibration sensor 100 .
[0036] Please refer to Figures 1 to 3 In an embodiment of the present utility model, the vibration sensor 100 comprises:
[0037] substrate 10;
[0038] A vibration component 20, wherein the vibration component 20 is disposed on the substrate 10, and the vibration component 20 and the substrate 10 enclose a first chamber;
[0039] A connecting member 30 , which is disposed on a side of the vibration assembly 20 away from the substrate 10 , and is provided with a through hole 31 ; and
[0040] The chip includes a MEMS chip 40 and an ASIC chip 50. The MEMS chip 40 is arranged on a side of the connector 30 away from the substrate 10. The ASIC chip 50 is buried in the substrate 10. The ASIC chip 50 is electrically connected to the MEMS chip 40 and the substrate 10. The through hole 31 connects the MEMS chip 40 and the vibration component 20, and the MEMS chip 40, the connector 30 and the vibration component 20 enclose a second chamber.
[0041] In the vibration sensor 100 provided by the utility model, the chip includes a MEMS (Micro Electro Mechanical System) chip and an ASIC (Application Specific Integrated Circuit) chip. The MEMS chip 40 can sense the fluctuation of the air in the second chamber through the through hole 31 on the connector 30 and output an electrical signal accordingly, and transmit the electrical signal to the ASIC chip 50, so that the ASIC chip 50 can process and output the electrical signal. The MEMS chip 40 is arranged on the connector 30, which can make full use of the reliable supporting ability of the connector 30, and the MEMS chip 40 is opposite to the through hole 31, and the vibration cavity of the MEMS chip 40 and the vibration component 20 are directly connected by the through hole 3131, so that the second chamber is enclosed between the MEMS chip 40, the connector 30 and the vibration component 20. At the same time, the ASIC chip 50 is buried in the substrate 10, so that the sensing area of the MEMS chip 40 can be expanded, and the product performance of the vibration sensor 100 can be effectively improved.
[0042] When the vibration component 20 vibrates, the vibration component 20 can move away from or close to the connecting member 30 to compress or stretch the air in the second chamber accordingly, that is, it can cause the air in the second chamber to fluctuate. The MEMS chip 40 can sense the air fluctuation through the through hole 31 on the connecting member 30 and output an electrical signal, and transmit the electrical signal to the ASIC chip 50, thereby realizing the recognition function of the vibration sensor 100.
[0043] It should be noted that when manufacturing the substrate 10, a buried space is reserved inside the substrate 10, and the ASIC chip 50 is buried in the buried space. At the same time, a walkway connected to the buried space is reserved for laying the metal wiring 11, and then the substrate 10 is pressed. In this way, the ASIC chip 50 can be electrically connected to the substrate 10 through the metal wiring 11, and the ASIC chip 50 can be electrically connected to the MEMS chip 40 by using connecting wires and the metal wiring 11.
[0044] In the vibration sensor 100 provided by the utility model, the vibration component 20 is arranged on the substrate 10, and the substrate 10 can use a PCB (Printed Circuit Board) as a support body for electronic components, which is convenient for arranging other electronic components on the substrate 10. In addition, the vibration component 20 and the substrate 10 enclose a first chamber, which is the vibration space of the vibration component 20, so that the vibration component 20 can pick up external vibration signals and vibrate accordingly.
[0045] Furthermore, an avoidance groove 12 is provided on the surface of the substrate 10 corresponding to the vibration component 20. The setting of the avoidance groove 12 can expand the volume of the first chamber, ensuring that the vibration component 20 has sufficient vibration space, and facilitating the vibration component 20 to accurately pick up external vibration signals, thereby improving the recognition accuracy and recognition ability of the vibration sensor 100.
[0046] like Figures 1 to 3 As shown, in the embodiment of the utility model, the connector 30 is arranged on the side of the vibration component 20 away from the substrate 10, that is, the connector 30 is located on the vibration component 20, so that the MEMS chip 40 can be easily arranged on the connector 30, and the arrangement of the connector 30 plays a role in providing reliable support for the MEMS chip 40. The connector 30 includes a connecting portion and a supporting portion connected to each other, and the connecting portion is an annular structure, and the side away from the supporting portion is connected to the vibration component 20, and the MEMS chip 40 is arranged on the supporting portion. Furthermore, a through hole 31 is provided on the connector 30, and the through hole 31 is provided in the supporting portion and passes through the supporting portion, and is used to connect the chip MEMS chip 40 and the vibration component 20.
[0047] like Figure 1 As shown, in some embodiments of the utility model, the MEMS chip 40 is set to one; the through hole 31 is correspondingly set to one; the MEMS chip 40 includes a stacked silicon substrate 10, a first insulating layer, a separation membrane, a second insulating layer and a back plate, and the number of separation membranes is one. In this embodiment, a single MEMS chip 40 and a single separation membrane are used. In this way, the sensing area of the separation membrane is relatively large, thereby effectively improving the product performance. It should be noted that the specific structural setting of the MEMS chip 40 is the prior art, which will not be repeated here one by one.
[0048] like Figure 2 As shown, in other embodiments of the utility model, one MEMS chip 40 is provided, and one through hole 31 is provided correspondingly; the MEMS chip 40 includes a stacked silicon substrate 10, a first insulating layer, a separation membrane, a second insulating layer and a back plate, and the number of separation membranes is multiple, and multiple separation membranes are distributed side by side. In this embodiment, a single MEMS chip 40 and multiple (including two or more) separation membranes distributed side by side are used. This method not only has a relatively large sensing area and effectively improves product performance, but also facilitates the production of the MEMS chip 40.
[0049] like Figure 3As shown, in some other embodiments of the utility model, the MEMS chip 40 is set to be multiple, and the multiple MEMS chips 40 are arranged in series; the through holes 31 are correspondingly set to be multiple, and the multiple through holes 31 are arranged relative to the multiple MEMS chips 40, and one through hole 31 connects one MEMS chip 40 and the vibration component 20. This embodiment adopts a method of multiple (including two or more) MEMS chips 40 connected in series, wherein the multiple MEMS chips 40 are connected in series by connecting wires. This method can also make its sensing area relatively large, effectively improve product performance, and at the same time, the size of a single MEMS chip 40 is small, which is convenient for its production.
[0050] It can be understood that when there are multiple MEMS chips 40, multiple through holes 31 are correspondingly set, and multiple through holes 31 can be used to connect the vibration cavities of multiple MEMS chips 40 to the vibration component 20, so that multiple MEMS chips 40, connectors 30 and vibration components 20 are enclosed together to form a second chamber. When the vibration component 20 vibrates, the vibration component 20 can move away from or close to the connector 30 to compress or stretch the air in the second chamber accordingly, that is, it can drive the air in the second chamber to fluctuate, and each MEMS chip 40 can sense the air fluctuation in the corresponding area through the corresponding through hole 31 on the connector 30 and output an electrical signal, and transmit the electrical signal to the ASIC chip 50, thereby realizing the recognition function of the vibration sensor 100, and the recognition sensitivity is high.
[0051] like Figures 1 to 3 As shown, in the embodiment of the utility model, a buried space is provided in the substrate 10, and the ASIC chip 50 is buried in the buried space. A metal trace 11 connected to the ASIC chip 50 is provided in the substrate 10, and the metal trace 11 is at least partially exposed on the surface of the substrate 10 close to the vibration component 20, and the MEMS chip 40 is connected to the exposed part of the metal trace 11 through a connecting wire. It should be noted that the exposed part of the metal trace 11 is located outside the vibration component 20 to facilitate the connection of the MEMS chip 40 through the connecting wire. In this embodiment, the electrical connection between the ASIC chip 50 and the substrate 10 can be achieved through the provision of the metal trace 11, and the electrical connection between the ASIC chip 50 and the MEMS chip 40 can be achieved through the metal trace 11 and the connecting wire.
[0052] like Figures 1 to 3As shown, in some embodiments of the utility model, the vibration sensor 100 further includes a packaging shell 60, which is covered on the substrate 10 and enclosed with the substrate 10 to form a packaging cavity, and the vibration component 20, the connector 30 and the MEMS chip 40 are all located in the packaging cavity. In this embodiment, the packaging shell 60 can be a metal shell or a metal-plated shell, which is usually welded or bonded to the substrate 10. Specifically, the packaging shell 60 can be connected to the substrate 10 by solder paste, silver paste or DAF glue. The packaging shell 60 forms an electromagnetic shielding cover, which can improve the electromagnetic stability of the product.
[0053] Furthermore, the packaging shell 60 is provided with a pressure relief hole 61 connecting the packaging cavity and the outside. The pressure relief hole 61 is a micron-sized hole processed by laser, which plays a role of pressure relief during packaging and can be blocked after packaging is completed to isolate the outside air.
[0054] like Figures 1 to 3 As shown, in the embodiment of the present utility model, the vibration assembly 20 includes:
[0055] A vibration ring 21, wherein the vibration ring 21 is disposed on the substrate 10;
[0056] a diaphragm 22 , which is disposed on a side of the diaphragm ring 21 away from the substrate 10 ; and
[0057] A mass block 23, where the mass block 23 is attached to the surface of the diaphragm 22 close to the substrate 10;
[0058] The vibration ring 21 , the vibration membrane 22 , the mass block 23 and the substrate 10 enclose a first chamber, and the MEMS chip 40 , the connecting member 30 and the vibration membrane 22 enclose a second chamber.
[0059] Specifically, the vibration ring 21 is arranged on the substrate 10, and is used to connect and support the diaphragm 22. The diaphragm 22 is arranged on the side of the vibration ring 21 away from the substrate 10, that is, the diaphragm 22 is arranged on the vibration ring 21, and the mass block 23 is arranged on the surface of the diaphragm 22 close to the substrate 10. The above-mentioned setting methods can all be selected to be glued, which is simple to operate and relatively firm. When the vibration sensor 100 vibrates, it can drive the internal mass block 23 and the diaphragm 22 to vibrate together, so that the mass block 23 and the diaphragm 22 can be away from or close to the connector 30 to compress or stretch the air in the second chamber accordingly, that is, it can drive the air in the second chamber to fluctuate, and the MEMS chip 40 can sense the air fluctuation in the second chamber through the through hole 31 on the connector 30 and output an electrical signal accordingly, thereby realizing the recognition function of the vibration sensor 100. When the mass block 23 vibrates, the air in the first chamber and the second chamber on both sides of the mass block 23 and the diaphragm 22 change in opposite directions. For example, when the mass block 23 vibrates toward the substrate 10, the air in the first chamber is compressed, while the air in the second chamber is stretched; when the mass block 23 vibrates away from the substrate 10, the air in the first chamber is stretched, while the air in the second chamber is compressed.
[0060] Furthermore, in the embodiment of the utility model, the vibration assembly 20 is further provided with an air hole 24 connecting the first chamber and the second chamber, and the air hole 24 is located on the diaphragm 22 and the mass block 23, and penetrates the diaphragm 22 and the mass block 23. The provision of the air hole 24 plays a role in balancing the air pressure.
[0061] The utility model also proposes an electronic device, including the vibration sensor 100 as described above, and the electronic device includes but is not limited to an electric toothbrush, a mobile phone, a laptop computer, a tablet computer, a wearable device, a navigator, a handheld game console, etc.
[0062] The specific structure of the vibration sensor 100 refers to the above embodiments. Since the electronic device proposed by the present invention adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by all the above technical solutions, which will not be described one by one here.
[0063] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.
Claims
1. A vibration sensor, characterized in that: The vibration sensor comprises: substrate; A vibration component, wherein the vibration component is disposed on the substrate, and the vibration component and the substrate enclose a first chamber; A connecting member, the connecting member being arranged on a side of the vibration component away from the substrate, the connecting member being provided with a through hole; and The chip comprises a MEMS chip and an ASIC chip, wherein the MEMS chip is arranged on a side of the connecting member away from the substrate, the ASIC chip is buried in the substrate, the ASIC chip is electrically connected to the MEMS chip and the substrate, the through hole connects the MEMS chip and the vibration component, and the MEMS chip, the connecting member and the vibration component enclose a second chamber.
2. The vibration sensor according to claim 1, characterized in that The MEMS chip is provided as one, and the through hole is correspondingly provided as one; The MEMS chip comprises a stacked silicon substrate, a first insulating layer, a separation membrane, a second insulating layer and a back plate, and the number of the separation membrane is one.
3. The vibration sensor according to claim 1, characterized in that The MEMS chip is provided as one, and the through hole is correspondingly provided as one; The MEMS chip comprises a stacked silicon substrate, a first insulating layer, a separation membrane, a second insulating layer and a back plate. There are multiple separation membranes, which are arranged side by side.
4. The vibration sensor according to claim 1, characterized in that The MEMS chip is provided in plurality, and the plurality of MEMS chips are arranged in series; The through holes are arranged in a plurality, and the plurality of through holes are arranged opposite to the plurality of MEMS chips. One through hole connects one MEMS chip and the vibration component.
5. The vibration sensor according to claim 1, characterized in that The substrate is provided with an embedded space, the ASIC chip is embedded in the embedded space, the substrate is provided with a metal trace connected to the ASIC chip, the metal trace is at least partially exposed on the surface of the substrate close to the vibration component, and the MEMS chip is connected to the exposed part of the metal trace through a connecting wire.
6. The vibration sensor according to claim 1, characterized in that The vibration sensor further comprises a packaging shell, wherein the packaging shell is disposed on the substrate and enclosed with the substrate to form a packaging cavity, and the vibration component, the connector and the MEMS chip are all located in the packaging cavity.
7. The vibration sensor according to claim 6, characterized in that The packaging shell is provided with a pressure relief hole communicating with the packaging cavity and the outside.
8. The vibration sensor according to any one of claims 1 to 7, characterized in that: The vibration assembly comprises: A vibration ring, wherein the vibration ring is arranged on the substrate; a diaphragm, the diaphragm being arranged on a side of the diaphragm away from the substrate; and A mass block, wherein the mass block is attached to a surface of the diaphragm close to the substrate; The vibration ring, the vibration membrane, the mass block and the substrate together form the first chamber, and the MEMS chip, the connecting member and the vibration membrane together form the second chamber.
9. The vibration sensor according to claim 8, characterized in that The vibration component is further provided with an air hole connecting the first chamber and the second chamber. The air hole is located on the diaphragm and the mass block and passes through the diaphragm and the mass block.
10. An electronic device, characterized in that: The electronic device comprises the vibration sensor according to any one of claims 1-9.