Temperature detection structure for chip packaging

Abstract

The utility model relates to the technical field of chip packaging, discloses a temperature detection structure for chip packaging, and solves the problem that heat cannot be dissipated in time when the temperature is too high. The temperature detection structure for chip packaging comprises a packaging base, a packaging cover plate is arranged above the packaging base, and the packaging cover plate is arranged above the packaging base. A temperature monitor used for detecting a chip is arranged in the packaging base, a lower-layer cooling assembly used for cooling the bottom surface of the chip is arranged in the packaging base, the lower-layer cooling assembly comprises an inner groove formed in the packaging base, an annular liquid storage pipe is fixedly connected to the inner wall of the inner groove, and a water pump is fixedly connected to the outer side of the annular liquid storage pipe; a liquid discharging pipe is further fixedly connected to the outer side of the inner groove, the liquid discharging pipe penetrates through the packaging base and communicates with the upper surface of the packaging base, one end of the liquid discharging pipe is in threaded connection with a sealing cover, the temperature monitor is electrically connected with the water pump, the annular liquid storage pipe is filled with cooling liquid, and the purposes of timely temperature detection and rapid heat dissipation are achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, in particular to a temperature detection structure for chip packaging. Background Art

[0002] Chip packaging is the process of connecting an integrated circuit chip to a packaging material and providing protection and connection functions through the packaging material. The purpose of packaging is to protect the chip, provide circuit connection and heat dissipation functions. Temperature detection is very important in chip packaging. The chip will generate heat during operation. If the temperature is too high, it may cause the chip performance to decline or even be damaged. Therefore, temperature detection can be used to monitor the operating temperature of the chip in a timely manner to avoid problems caused by excessive temperature. However, when the existing temperature detection structure detects that the temperature is too high, it uses ventilation slots and fans to cool the outside of the chip. The cooling speed of this method is slow, and if this method is used for cooling, the heat cannot be dissipated in time, resulting in abnormal temperature and affecting the normal use of the chip.

[0003] In view of the above problems, a temperature detection structure for chip packaging is proposed to solve the above problems. Utility Model Content

[0004] The utility model aims to provide a temperature detection structure for chip packaging. The device is used to work, thereby solving the problem that heat cannot be dissipated in time when the temperature is too high.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a temperature detection structure for chip packaging, comprising a packaging base, a packaging cover plate is arranged above the packaging base, a temperature monitor for detecting the chip is arranged inside the packaging base, a lower cooling component for cooling the bottom surface of the chip is also arranged inside the packaging base, and an upper cooling component for cooling the upper surface of the chip is arranged on the bottom surface of the packaging cover plate;

[0006] The lower cooling component includes an inner groove opened inside the packaging base, an annular liquid storage tube is fixedly connected to the inner wall of the inner groove, a water pump is fixedly connected to the outside of the annular liquid storage tube, a drainage pipe is also fixedly connected to the outside of the inner groove, the drainage pipe passes through the packaging base and is connected to the upper surface of the packaging base, a sealing cover is threadedly connected to one end of the drainage pipe, the temperature monitor is electrically connected to the water pump, and the annular liquid storage tube is filled with coolant.

[0007] Preferably, the upper cooling component includes a mounting plate fixedly connected to the bottom surface of the packaging cover plate, the inner wall of the mounting plate is fixedly connected to a cooling liquid tank, the cooling liquid tank is arranged corresponding to the upper surface of the chip, and the cooling liquid tank is filled with cooling liquid.

[0008] Preferably, a sealing ring is fixedly connected to the bottom surface of the mounting plate, a mounting groove is provided on the upper surface of the packaging base, a sealing groove is provided on the inner wall of the mounting groove, and the sealing groove and the sealing ring are arranged correspondingly.

[0009] Preferably, a chip slot is formed on the inner wall of the mounting slot, a side slot is formed on one side of the chip slot, the temperature monitor is fixedly connected to the inner wall of the side slot, a protection plate is hinged on the inner wall of the side slot, and the protection plate covers the top of the temperature monitor.

[0010] Preferably, a clamping assembly for limiting and fixing the chip is provided inside the chip slot, the clamping assembly includes a shrinkage groove opened on the inner wall of the chip slot, a spring is fixedly connected to the inner wall of the shrinkage groove, a clamping plate is fixedly connected to one end of the spring, a buffer pad is fixedly connected to one side of the clamping plate, and there are two groups of the clamping assemblies, which are symmetrically arranged.

[0011] Preferably, a threaded hole A is provided on the upper surface of the packaging base, and a threaded groove B is provided on the upper surface of the packaging cover plate, and the threaded hole A and the threaded groove B are arranged correspondingly.

[0012] Preferably, a heat dissipation fan is fixedly connected to the upper surface of the packaging cover plate, and a dust screen is fixedly connected to the inner wall of the heat dissipation fan. Through the arrangement of the heat dissipation fan and the dust screen, the exhaust gas can be used to cool the coolant tank, and the dust screen prevents dust from entering the interior of the mounting plate.

[0013] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0014] The utility model proposes a temperature detection structure for chip packaging. When abnormal temperature is detected, the temperature monitor sends an electrical signal to a water pump to start the water pump. The water pump drives the coolant in the annular liquid storage pipe to flow, thereby achieving the purpose of cooling by circulating the coolant. The coolant tank cools the chip from above, and at the same time, the bottom of the chip is cooled during packaging and subsequent use. The heat dissipation fan cooperates to dissipate heat and cool down, ultimately achieving the purpose of timely temperature detection and rapid heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the structure of the upper cooling component of the utility model;

[0017] Figure 3 It is a schematic plan view of the structure of the lower cooling component of the utility model;

[0018] Figure 4 This is a schematic diagram of the structure of the clamping assembly of the utility model;

[0019] Figure 5For the utility model Figure 1 An enlarged schematic diagram of point A.

[0020] In the figure: 1. Package base; 11. Mounting groove; 12. Chip groove; 13. Threaded hole A; 14. Sealing groove; 15. Protective plate; 16. Side groove; 2. Package cover; 21. Cooling fan; 22. Dust screen; 23. Threaded groove B; 3. Clamping assembly; 31. Shrinkage groove; 32. Spring; 33. Clamp; 34. Buffer pad; 4. Upper cooling assembly; 41. Mounting plate; 42. Sealing ring; 43. Coolant tank; 5. Lower cooling assembly; 51. Inner groove; 52. Annular liquid storage pipe; 53. Water pump; 54. Drain pipe; 55. Sealing cover; 6. Temperature monitor. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] In order to further understand the content of the utility model, the utility model is described in detail in conjunction with the accompanying drawings.

[0023] Combination Figure 1 A temperature detection structure for chip packaging includes a packaging base 1, a packaging cover plate 2 is arranged above the packaging base 1, a temperature monitor 6 for detecting the chip is arranged inside the packaging base 1, a lower cooling component 5 for cooling the bottom surface of the chip is also arranged inside the packaging base 1, and an upper cooling component 4 for cooling the upper surface of the chip is arranged on the bottom surface of the packaging cover plate 2.

[0024] The utility model is further described below in conjunction with embodiments.

[0025] Combination Figure 2-Figure 5The lower cooling component 5 includes an inner groove 51 opened inside the packaging base 1, an annular liquid storage pipe 52 is fixedly connected to the inner wall of the inner groove 51, a water pump 53 is fixedly connected to the outer side of the annular liquid storage pipe 52, a drain pipe 54 is also fixedly connected to the outer side of the inner groove 51, the drain pipe 54 passes through the packaging base 1 and is connected to the upper surface of the packaging base 1, a sealing cover 55 is threadedly connected to one end of the drain pipe 54, the temperature monitor 6 is electrically connected to the water pump 53, the annular liquid storage pipe 52 is filled with coolant, through the arrangement of the inner groove 51, the annular liquid storage pipe 52, the water pump 53, the drain pipe 54 and the sealing cover 55, when the temperature monitor 6 detects that the temperature is too high, the temperature monitor 6 generates an electrical signal to the water pump 53 and starts the water pump 53, and the water pump 53 drives the coolant in the annular liquid storage pipe 52 to flow, thereby achieving the purpose of cooling the bottom surface of the chip during packaging and subsequent use.

[0026] The upper cooling component 4 includes a mounting plate 41 fixedly connected to the bottom surface of the packaging cover plate 2, and a cooling liquid tank 43 is fixedly connected to the inner wall of the mounting plate 41. The cooling liquid tank 43 is arranged corresponding to the upper surface of the chip, and the cooling liquid tank 43 is filled with cooling liquid. Through the arrangement of the mounting plate 41, the sealing ring 42 and the cooling liquid tank 43, the upper surface of the chip is cooled during the packaging process and subsequent use to ensure the normal operation of the chip.

[0027] A sealing ring 42 is fixedly connected to the bottom surface of the mounting plate 41, a mounting groove 11 is provided on the upper surface of the packaging base 1, a sealing groove 14 is provided on the inner wall of the mounting groove 11, and the sealing groove 14 is arranged corresponding to the sealing ring 42. The installation of the mounting groove 11, the sealing groove 14 and the sealing ring 42 achieves the purpose of sealing the chip.

[0028] A chip slot 12 is provided on the inner wall of the mounting slot 11, and a side slot 16 is provided on one side of the chip slot 12. The temperature monitor 6 is fixedly connected to the inner wall of the side slot 16, and a protective plate 15 is hinged on the inner wall of the side slot 16. The protective plate 15 covers the temperature monitor 6. Through the arrangement of the chip slot 12, the side slot 16 and the protective plate 15, the chip slot 12 is used to place the chip. With the cooperation of the side slot 16 and the protective plate 15, the temperature monitor 6 is placed and protected to ensure that the temperature monitor 6 can detect the temperature of the chip in time.

[0029] A clamping assembly 3 for limiting and fixing the chip is arranged inside the chip slot 12, and the clamping assembly 3 includes a shrinkage groove 31 opened on the inner wall of the chip slot 12, and a spring 32 is fixedly connected to the inner wall of the shrinkage groove 31, and a clamping plate 33 is fixedly connected to one end of the spring 32, and a buffer pad 34 is fixedly connected to one side of the clamping plate 33. There are two groups of the clamping assembly 3, and the two groups of the clamping assembly 3 are symmetrically arranged. Through the arrangement of the shrinkage groove 31, the spring 32, the clamping plate 33 and the buffer pad 34, the clamping plate 33 is compressed into the shrinkage groove 31 before installing the chip, and the clamping plate 33 is loosened when fixing the chip, and the buffer pad 34 is used to clamp and buffer the chip.

[0030] A threaded hole A13 is provided on the upper surface of the packaging base 1, and a threaded groove B23 is provided on the upper surface of the packaging cover plate 2. The threaded hole A13 and the threaded groove B23 are arranged correspondingly. Through the arrangement of the threaded hole A13 and the threaded groove B23, other fixing parts can be used to fix the packaging base 1 and the packaging cover plate 2 to complete the final packaging operation.

[0031] A heat dissipation fan 21 is fixedly connected to the upper surface of the packaging cover plate 2, and a dust-proof net 22 is fixedly connected to the inner wall of the heat dissipation fan 21. By setting the heat dissipation fan 21 and the dust-proof net 22, the exhaust gas can be used to cool the coolant tank 43, and the dust-proof net 22 prevents dust from entering the interior of the mounting plate 41.

[0032] Specifically, when a temperature abnormality is detected, the temperature monitor 6 sends an electrical signal to the water pump 53 to start the water pump 53. The water pump 53 drives the coolant in the annular liquid storage tube 52 to flow, thereby achieving the purpose of cooling by circulating the coolant. The coolant tank 43 cools the chip from above, and at the same time achieves cooling of the bottom surface of the chip during packaging and subsequent use. The heat dissipation fan 21 cooperates to dissipate heat and cool down, ultimately achieving the purpose of timely temperature detection and rapid heat dissipation.

[0033] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0034] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A temperature detection structure for chip packaging, comprising a packaging base (1), a packaging cover plate (2) being arranged above the packaging base (1), Features: The packaging base (1) is provided with a temperature monitor (6) for detecting the chip, the packaging base (1) is also provided with a lower cooling component (5) for cooling the bottom surface of the chip, and the bottom surface of the packaging cover plate (2) is provided with an upper cooling component (4) for cooling the upper surface of the chip; The lower cooling component (5) comprises an inner groove (51) disposed inside the packaging base (1); an annular liquid storage pipe (52) is fixedly connected to the inner wall of the inner groove (51); a water pump (53) is fixedly connected to the outer side of the annular liquid storage pipe (52); a liquid discharge pipe (54) is also fixedly connected to the outer side of the inner groove (51); the liquid discharge pipe (54) passes through the packaging base (1) and is connected to the upper surface of the packaging base (1); a sealing cover (55) is threadedly connected to one end of the liquid discharge pipe (54); the temperature monitor (6) is electrically connected to the water pump (53); and the inside of the annular liquid storage pipe (52) is filled with cooling liquid.

2. A temperature detection structure for chip packaging according to claim 1, Features: The upper cooling component (4) comprises a mounting plate (41) fixedly connected to the bottom surface of the packaging cover plate (2); a cooling liquid tank (43) is fixedly connected to the inner wall of the mounting plate (41); the cooling liquid tank (43) is arranged corresponding to the upper surface of the chip; and the cooling liquid tank (43) is filled with cooling liquid.

3. A temperature detection structure for chip packaging according to claim 2, Features: The bottom surface of the mounting plate (41) is fixedly connected with a sealing ring (42); the upper surface of the packaging base (1) is provided with a mounting groove (11); the inner wall of the mounting groove (11) is provided with a sealing groove (14); the sealing groove (14) and the sealing ring (42) are arranged correspondingly.

4. A temperature detection structure for chip packaging according to claim 3, Features: The inner wall of the installation groove (11) is provided with a chip groove (12), one side of the chip groove (12) is provided with a side groove (16), the temperature monitor (6) is fixedly connected to the inner wall of the side groove (16), the inner wall of the side groove (16) is hinged with a protection plate (15), and the protection plate (15) covers the top of the temperature monitor (6).

5. A temperature detection structure for chip packaging according to claim 4, Features: A clamping assembly (3) for limiting and fixing the chip is arranged inside the chip slot (12), the clamping assembly (3) comprising a contraction groove (31) provided on the inner wall of the chip slot (12), a spring (32) being fixedly connected to the inner wall of the contraction groove (31), a clamping plate (33) being fixedly connected to one end of the spring (32), and a buffer pad (34) being fixedly connected to one side of the clamping plate (33), and two groups of the clamping assemblies (3) are arranged symmetrically.

6. A temperature detection structure for chip packaging according to claim 1, Features: The upper surface of the packaging base (1) is provided with a threaded hole A (13), and the upper surface of the packaging cover plate (2) is provided with a threaded groove B (23), and the threaded hole A (13) and the threaded groove B (23) are arranged correspondingly.

7. A temperature detection structure for chip packaging according to claim 2, Features: The upper surface of the packaging cover plate (2) is fixedly connected to a heat dissipation fan (21), and the inner wall of the heat dissipation fan (21) is fixedly connected to a dust isolation net (22).

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