Electronic device

Abstract

The utility model provides electronic equipment, and relates to the technical field of electronic equipment. The electronic equipment comprises a first antenna and a second antenna which are arranged at different positions, the sensing module is used for sensing that an object approaches the sensing area; the processing chip comprises a first detection channel, a second detection channel and a reference channel; the first detection channel is connected with the first antenna through a first line, the second detection channel is connected with the second antenna through a second line, and the reference channel is connected with the sensing module through a third line; wherein the first detection channel and the second detection channel correct signals through the reference channel; the difference value of the temperature change trend of the paths through which the first line, the second line and the third line pass is within a preset range.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic equipment. Background Art

[0002] The current maximum number of channels of the Cap sensor is 7. In the traditional design, one reference channel is provided for the main board and one reference channel for the small board, that is, two reference channels are needed to meet the temperature chamber test requirements, while the maximum number of channels provided for ANT detection is only 5. Therefore, how to reduce the number of reference channels and increase the number of channels for antenna detection while meeting the temperature chamber test requirements is a technical problem that needs to be solved urgently. Utility Model Content

[0003] The purpose of the embodiments of the present application is to provide an electronic device, which mainly provides the following technical solutions:

[0004] The present application provides an electronic device, the electronic device comprising: a first antenna and a second antenna deployed at different positions;

[0005] A sensing module, used to sense an object approaching a sensing area;

[0006] A processing chip, comprising a first detection channel, a second detection channel, and a reference channel;

[0007] The first detection channel is connected to the first antenna through a first line, the second detection channel is connected to the second antenna through a second line, and the reference channel is connected to the sensing module through a third line;

[0008] The first detection channel and the second detection channel both calibrate signals through the reference channel; and the difference in temperature change trends of the paths passed by the first line, the second line, and the third line is within a preset range.

[0009] In some modified implementations of the present application, the sensing area is disposed near the first antenna;

[0010] The overlap rate between the paths of the third line and the first line is not less than a first preset overlap value; or

[0011] The sensing area is arranged near the second antenna;

[0012] The overlap rate of the paths of the third line and the second line is not less than a second preset overlap value.

[0013] In some modified implementations of the present application, the overlap rate of the third line with the paths of the first line and the second line respectively is not less than a third preset overlap value.

[0014] In some modified implementations of the present application, the following are also included:

[0015] A carrier for carrying and conducting electronic components;

[0016] A heating element is disposed on the carrier;

[0017] The first circuit, the second circuit, and the third circuit are arranged on the carrier;

[0018] The distance between the third line and the heating element in the line segment that overlaps with the first line and the second line is a first distance value; the distance between the third line and the heating element in the line segment that does not overlap with the first line and the second line is a second distance value;

[0019] The second distance value is greater than the first distance value.

[0020] In some modified implementations of the present application, a distance value between a line segment of the third line that does not overlap with the first line and the second line and an edge of the carrier is less than a third distance value.

[0021] In some modified implementations of the present application, the following are also included:

[0022] A carrier for carrying and conducting electronic components;

[0023] The first circuit, the second circuit, and the third circuit are arranged on the carrier;

[0024] The distances between the paths of the first circuit, the second circuit, and the third circuit and the edge of the carrier are respectively less than a fourth distance value.

[0025] In some modified implementations of the present application, the following are also included:

[0026] A carrier for carrying and conducting electronic components;

[0027] A heating element is disposed on the carrier;

[0028] The first circuit, the second circuit, and the third circuit are arranged on the carrier;

[0029] The distances between the paths of the first circuit, the second circuit, and the third circuit and the heating element are not less than a fifth distance value.

[0030] In some modified implementations of the present application, the carrier includes a first main board and a second main board;

[0031] The first antenna and the second antenna are respectively disposed on the first mainboard and the second mainboard.

[0032] In some modified implementations of the present application, the number of the first detection channel and the number of the second detection channel are 3 respectively.

[0033] In some modified implementations of the present application, the sensing module includes a sensing capacitor, which is disposed near the first antenna or near the second antenna. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] By reading the detailed description below with reference to the accompanying drawings, the above and other purposes, features and advantages of the exemplary embodiments of the present application will become easy to understand. In the accompanying drawings, several embodiments of the present application are shown in an exemplary and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0035] Figure 1 A schematic diagram of circuit distribution on a first mainboard of an electronic device provided in an embodiment of the present application is schematically shown;

[0036] Figure 2 A schematic diagram of circuit distribution on a second mainboard of an electronic device provided in an embodiment of the present application is schematically shown;

[0037] Description of Figure Numbers:

[0038] The first antenna 1 , the second antenna 2 , the sensing module 3 , the processing chip 4 , the first circuit 401 , the second circuit 402 , the third circuit 403 , the first mainboard 5 , the second mainboard 6 , and the heating element 7 . DETAILED DESCRIPTION

[0039] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0040] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in this application should have the common meanings understood by technicians in the field to which this application belongs.

[0041] Example

[0042] Reference Figure 1 and attached Figure 2An embodiment of the present application proposes an electronic device, which includes: a first antenna 1 and a second antenna 2 deployed at different positions; a sensing module 3, used to sense an object approaching a sensing area; a processing chip 4, including a first detection channel, a second detection channel, and a reference channel; the first detection channel is connected to the first antenna 1 through a first line 401, the second detection channel is connected to the second antenna 2 through a second line 402, and the reference channel is connected to the sensing module 3 through a third line 403; wherein the first detection channel and the second detection channel both calibrate signals through the reference channel; the difference in temperature change trends of the paths passed by the first line 401, the second line 402, and the third line 403 is within a preset range.

[0043] Specifically, this embodiment provides an electronic device, which can be, but is not limited to, a mobile phone, a tablet computer, or other device having an antenna for wireless communication; the electronic device includes: a first antenna 1, a second antenna 2, a sensing module 3, and a processing chip 4, wherein the first antenna 1 and the second antenna 2 are deployed at different positions of the electronic device, for example: the first antenna 1 and the second antenna 2 can be arranged at different positions in the thickness direction of the electronic device, that is, they are respectively deployed on two stacked carriers inside the electronic device; the sensing module 3 and the processing chip 4 are used to realize proximity sensing of the electronic device, where the proximity sensing is used to limit the radiation dose, detect the proximity of a user's body part, etc., wherein the sensing module 3 is used to sense the proximity of an object to a sensing area, and sense and detect the proximity of a user's hand or body part through a change in capacitance; the processing chip 4 includes a plurality of channels, which are specifically allocated as a first detection channel, a second detection channel, and a reference channel, wherein the first detection channel and the second detection channel correspond to the first antenna 1 and the second antenna 2, respectively, specifically: the first detection channel is connected to the first antenna 1 through a first line 401, and the second detection channel is connected to the second antenna 2 through a second line 402.

[0044] In extreme environments such as high or low temperatures, the performance of the antenna module may deteriorate sharply, affecting the stability of the antenna module. Therefore, it is usually necessary to perform a temperature chamber test on the electronic device. The reference channel is used to calibrate the temperature of the detection channel in the temperature chamber test. Since the total number of channels of the processing chip 4 is fixed, if the number of reference channels occupied is large, the number of detection channels will decrease accordingly. The reduction in the number of detection channels will affect the proximity sensing function of the electronic device. For this reason, in the technical solution adopted by the present application, the reference channel is connected to the sensing module 3 via a third line 403, and the first detection channel and the second detection channel both calibrate the signal through the reference channel, that is, the first detection channel and the second detection channel. The channels share a reference channel. In order to enable the reference channel to accurately serve as the temperature reference benchmark for the first detection channel and the second detection channel, the difference in temperature change trends of the paths passed by the first line 401, the second line 402, and the third line 403 is set within a preset range. In this way, it is possible to ensure that the performance can be guaranteed by using one reference channel, and the less occupied channel can be used for the arrangement of the detection channels; wherein, the sensing module 3 can specifically be a sensing capacitor, that is, a capacitive sensor, which can not only sense the temperature, but also has the function of proximity sensing, so as to realize the sensing of the object approaching the sensing area, and the sensing of temperature and proximity are both reflected through the capacitance change of the sensing capacitor.

[0045] The number of the first detection channel and the number of the second detection channel can be 3 respectively; Figure 1 and attached Figure 2 The lines in the figure are only used to illustrate the approximate paths of each line, and the attached Figure 1 The position of the first antenna 1 in the figure is the position of the spring of the first antenna 1. Similarly, Figure 2 The position indicated by the second antenna 2 in is the shrapnel position of the second antenna 2.

[0046] According to the above, an embodiment of the present application proposes an electronic device, which includes a first antenna 1 and a second antenna 2 deployed at different positions, and a processing chip 4 includes a first detection channel and a second detection channel corresponding to the first antenna 1 and the second antenna 2, respectively, and also includes a reference channel, and the first detection channel and the second detection channel both correct signals through the reference channel. Since each circuit is affected by external temperature changes or by temperature changes of a component inside the electronic device at different times, the temperatures of the three circuits will change. Therefore, the first detection channel and the second detection channel correct the signals through a reference channel, and it is necessary to ensure that the first circuit 401, the second circuit 402, and the third circuit 403 are corrected through the reference channel at the same time. The difference of the temperature change trend of the paths is within the preset range. The temperature change trend refers to the temperature change showing an upward trend or a downward trend. The limitation of the preset range limits the temperature change trend of the paths passed by the three to be consistent or close. The difference of the temperature change trend here is within the preset range with time and temperature as reference. In the same period, the temperature change values ​​of the three paths are similar, that is, the overall trend of the temperature change of the paths of the three paths in the period is similar; in other words, no matter how the external temperature or the temperature of a certain component inside the electronic device changes, at any time, the temperature difference between the three is within the preset range, for example, at any time, the temperature difference of the three at any time is within 1°C. Such a design enables the temperature change of the third line 403 corresponding to the reference channel to reflect the temperature change of the first line 401 and the second line 402 corresponding to the first detection channel and the second detection channel, respectively, that is, the reference channel can be used as the temperature reference and calibration standard of the first detection channel and the second detection channel at the same time, thereby reducing the occupation of the reference channel for the number of channels, thereby increasing the number of channels used for antenna detection, and more conducive to the effectiveness and stability of the proximity sensing function of the electronic device.

[0047] It should be noted that the temperature of the path through which the line passes mentioned above can be the average temperature of each position point on the path through which the line passes, or it can be the temperature of the position point with the highest temperature on the path. However, no matter what the temperature of the path through which the line passes is, the temperature measurement benchmarks of the three paths through which the line passes are consistent.

[0048] Furthermore, in a specific implementation, according to the arrangement position of the sensing area, the following settings are specifically included:

[0049] The first case is: the sensing area is set near the first antenna 1, and the overlap rate of the path of the third line 403 and the first line 401 is not lower than the first preset overlap value, that is, the third line 403 needs to ensure a higher overlap rate with the layout path of the first line 401, and can be routed close to the deployment position of the first antenna 1.

[0050] The second situation is: the sensing area is set near the second antenna 2, and the overlap rate of the paths of the third line 403 and the second line 402 is not less than the second preset overlap value, that is, the third line 403 needs to ensure a higher overlap rate with the layout path of the second line 402, and can be routed close to the deployment position of the second antenna 2.

[0051] In addition to the above two situations, the third situation is: the overlap rate of the third line 403 with the paths of the first line 401 and the second line 402 can be set to be not less than the third preset overlap value, that is, ensuring that the path arrangements of the three lines, namely the first line 401, the second line 402 and the third line 403, all maintain a relatively high overlap value, thereby ensuring the accuracy of the temperature chamber test and the signal correction of the first detection channel and the second detection channel to a greater extent.

[0052] Among them, the above-mentioned overlap value refers to the overlap rate of the paths of two or three lines. The schemes adopted in the above three situations all limit the overlap rate between the paths of the lines by limiting the lower limit of the overlap rate between the paths of the lines to maintain a high overlap rate between the paths of the lines. In the case of high overlap of the paths of the lines, it can be ensured that the difference in the temperature change trend of the paths passed by the first line 401, the second line 402, and the third line 403 is small. Within the preset range, that is, the higher the overlap rate, the more consistent the temperature change trend of the paths passed by the first line 401, the second line 402, and the third line 403. The higher the accuracy of the temperature chamber test and signal correction, the more difficult it is to completely overlap the paths of the three lines due to limitations such as deployment space during actual line deployment. Therefore, the overlap rate of the three lines and the accuracy of the correction can be combined to determine the actual test. It should be noted that the first preset overlap value and the second preset overlap value may be equal or unequal, and the sizes of the first preset overlap value, the second preset overlap value and the third overlap value may be determined through testing. For example, the first preset overlap value, the second preset overlap value and the third overlap value may be set to 90%, respectively, but are not limited to this.

[0053] Furthermore, in a specific implementation, the electronic device provided in this embodiment further includes: a carrier for carrying and conducting electronic components; the first circuit 401, the second circuit 402, and the third circuit 403 are arranged on the carrier.

[0054] Specifically, in the technical solution adopted by the present application, the electronic device has a carrier inside for carrying and conducting electronic components, and the carrier may specifically include at least one mainboard structure; in this case, the solution that may be adopted by the present application is: the distance values ​​of the paths of the first line 401, the second line 402, and the third line 403 from the edge of the carrier are respectively set to be less than the fourth distance value, as shown in the attached Figure 1 and attached Figure 2As shown, such a design can make the difference in temperature change trends of the paths of the three routes smaller and within a preset range, and can also make the temperatures of the paths of the three routes closer to the external temperature, which is beneficial to improving the accuracy of temperature chamber testing and signal correction.

[0055] For further information, see Attachment Figure 1 and attached Figure 2 In a specific implementation, the electronic device provided in this embodiment also includes: a carrier for carrying and conducting electronic components; and a heating element 7, which is arranged on the carrier; the first circuit 401, the second circuit 402, and the third circuit 403 are arranged on the carrier.

[0056] Specifically, the electronic device has a carrier inside for carrying and conducting electronic components, and the carrier may specifically include at least one mainboard structure; the heating element 7 is an electronic component on the carrier that generates high heat in the working state. Since the heating element 7 and the first circuit 401, the second circuit 402, and the third circuit 403 are arranged on the carrier, and the temperature of the heating element 7 is not constant, it does not generate heat in the non-working state, and the heating temperature is low when working under low power or short duration, and the heating temperature is high under high power or long-term working conditions. Therefore, the temperature of the heating element 7 at different times cannot be determined and there are changes. The temperature change of the heating element 7 will bring temperature noise to each circuit. Considering the influence of the temperature change of the heating element 7 on the first circuit 401, the second circuit 402, and the third circuit 403, among the technical solutions adopted by the present application, the present application may adopt the following technical solutions:

[0057] The first solution is to set the overlap rate of the third line 403 with the first line 401 and the second line 402 to be not less than the third preset overlap value, that is, to achieve the difference of the temperature change trend of the paths passed by the three within the preset range through the high overlap rate, and to ensure that the line section where the third line 403 overlaps with the first line 401 and the second line 402 is at a first distance value from the heating element 7, and to set the line section where the third line 403 does not overlap with the first line 401 and the second line 402 to be at a second distance value from the heating element 7; the second distance value here is greater than the first distance value, specifically: the overlapped section of the three lines is closer to the heating element 7 than the non-overlapped section, so that even if affected by the temperature of the heating element 7, the influence on each line is synchronous; of course, when the line deployment position on the mainboard allows, each line section is arranged as far away from the heating element 7 as possible to reduce the temperature noise caused by the temperature change of the heating element 7 inside the electronic device.

[0058] Among them, in order to further reduce the difference in the temperature change trend of the paths passed by the three lines, the distance value of the line segment that does not overlap with the first line 401 and the second line 402 from the edge of the carrier can be further set to be less than the third distance value, that is, the non-overlapping line segments of the three lines are arranged as close to the edge as possible, thereby making the temperature of the non-overlapping line segments of the three lines closer to the edge of the carrier, that is, closer to the external temperature, which is beneficial to improving the accuracy of the temperature box test and signal correction.

[0059] The second solution: the distances between the first line 401, the second line 402, and the third line 403 and the heating element 7 can be no less than the fifth distance value, see the attached Figure 1 and attached Figure 2 That is, no matter the overlapping line segments or non-overlapping line segments of the three lines, they are all arranged far away from the heating element 7, that is, they are all arranged close to the edge of the carrier. This can not only reduce the difference in temperature change trends of the paths passed by the first line, the second line, and the third line, but also avoid the temperature noise caused by the temperature change of the heating element 7 to the greatest extent, and make the temperature of the paths passed by the three lines close to the external temperature, which is beneficial to improving the accuracy of temperature box testing and signal correction.

[0060] Among them, the carrier may specifically include a first main board 5 and a second main board 6, and the two are located at different positions inside the electronic device. For example, the two can be stacked and arranged at intervals in the thickness direction of the electronic device, and the first antenna 1 and the second antenna 2 are respectively arranged on the first main board 5 and the second main board 6; it should be noted that when setting a scheme in which the carrier includes the first main board 5 and the second main board 6, the paths of the first line 401, the second line 402, and the third line 403 can be arranged according to any of the above schemes, for example, at least the non-overlapping sections of the first line 401, the second line 402, and the third line 403 can be set away from the heating element 7, or all sections of the first line 401, the second line 402, and the third line 403 can be set away from the heating element 7, and arranged close to the edge of the corresponding main board.

[0061] It should be noted that in the description of this specification, the terms "upper", "lower", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application; the terms "connect", "install", "fixed", etc. should be understood in a broad sense, for example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0062] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0063] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. An electronic device, characterized in that: include: The first antenna and the second antenna are deployed at different locations; A sensing module, used to sense an object approaching a sensing area; A processing chip, comprising a first detection channel, a second detection channel, and a reference channel; The first detection channel is connected to the first antenna through a first line, the second detection channel is connected to the second antenna through a second line, and the reference channel is connected to the sensing module through a third line; The first detection channel and the second detection channel both calibrate signals through the reference channel; and the difference in temperature change trends of the paths passed by the first line, the second line, and the third line is within a preset range.

2. The electronic device according to claim 1, characterized in that: The sensing area is arranged near the first antenna; The overlap rate between the paths of the third line and the first line is not less than a first preset overlap value; or The sensing area is arranged near the second antenna; The overlap rate of the paths of the third line and the second line is not less than a second preset overlap value.

3. The electronic device according to claim 1, characterized in that: The overlap rate of the third line with the paths of the first line and the second line is not less than a third preset overlap value.

4. The electronic device according to claim 3, characterized in that: Also includes: A carrier for carrying and conducting electronic components; A heating element is disposed on the carrier; The first circuit, the second circuit, and the third circuit are arranged on the carrier; The distance between the third line and the heating element in the line segment that overlaps with the first line and the second line is a first distance value; the distance between the third line and the heating element in the line segment that does not overlap with the first line and the second line is a second distance value; The second distance value is greater than the first distance value.

5. The electronic device according to claim 4, characterized in that: A distance between a line segment of the third line that does not overlap with the first line and the second line and an edge of the carrier is less than a third distance value.

6. The electronic device according to claim 1, characterized in that: Also includes: A carrier for carrying and conducting electronic components; The first circuit, the second circuit, and the third circuit are arranged on the carrier; The distances between the paths of the first circuit, the second circuit, and the third circuit and the edge of the carrier are respectively less than a fourth distance value.

7. The electronic device according to claim 1, characterized in that: Also includes: A carrier for carrying and conducting electronic components; A heating element is disposed on the carrier; The first circuit, the second circuit, and the third circuit are arranged on the carrier; The distances between the paths of the first circuit, the second circuit, and the third circuit and the heating element are not less than a fifth distance value.

8. The electronic device according to claim 7, characterized in that: The carrier includes a first main board and a second main board; The first antenna and the second antenna are respectively disposed on the first mainboard and the second mainboard.

9. The electronic device according to claim 1, characterized in that: The number of the first detection channel and the number of the second detection channel are 3 respectively.

10. The electronic device according to claim 1, characterized in that: The sensing module includes a sensing capacitor, which is arranged near the first antenna or near the second antenna.

Images