Positioning sticker and positioning system

Abstract

The embodiment of the utility model provides a positioning sticker and a positioning system. The positioning sticker comprises a sticker body and a positioning chip. The positioning chip is arranged on the sticker main body, the positioning chip comprises a plurality of transistors, the plurality of transistors are arranged into a plurality of rows along the thickness direction of the sticker main body, and are also arranged into a plurality of columns at least along a first direction, vertical to the thickness direction, of the sticker main body; the area between every two transistors on the positioning chip is isolated through insulation; wherein the positioning chip is used for being in communication connection with external equipment so as to send a position signal of the positioning sticker to the external equipment. The positioning sticker can realize convenient tracking of articles.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of positioning technology, and in particular to a positioning sticker and a positioning system. Background Art

[0002] People often lose or misplace items for various reasons. For example, losing keys or ID cards outside, or not being able to find the remote control, glasses, or the book you were reading recently at home, are all common. Therefore, how to conveniently track items and minimize the impact on them has become a technical problem that needs to be solved. Utility Model Content

[0003] The embodiments of the present application provide a positioning sticker and a positioning system to at least partially solve the above-mentioned problems.

[0004] According to a first aspect of an embodiment of the present application, a positioning sticker is provided, comprising: a sticker body and a positioning chip; the positioning chip is arranged on the sticker body, the positioning chip comprises a plurality of transistors, the plurality of transistors are arranged into a plurality of rows along a thickness direction of the sticker body, and are also arranged into a plurality of columns at least along a first direction perpendicular to the thickness direction of the sticker body, and the area between every two transistors on the positioning chip is isolated by insulation; wherein the positioning chip is used to communicate with an external device so as to send a position signal of the positioning sticker to the external device.

[0005] In some optional embodiments, the positioning chip is wrapped inside the sticker body.

[0006] In some optional embodiments, a receiving groove is provided on one side of the sticker body along the thickness direction, the positioning chip is embedded in the receiving groove, and the positioning chip does not exceed the receiving groove.

[0007] In some optional embodiments, an identification structure is provided on the surface of the sticker body, and the identification structure corresponds to the positioning chip, and different identification structures correspond to different positioning chips; the identification structure can be identified by an external device, so that the external device can achieve communication connection with the positioning chip corresponding to the identification structure.

[0008] In some optional embodiments, the identification structure records the unique identifier of the positioning chip, and the external device determines the unique identifier of the positioning chip by identifying the identification structure, so as to establish a communication connection with the positioning chip through the unique identifier.

[0009] In some optional embodiments, the unique identifier includes at least one of a physical address of the positioning chip and a universal unique identification code of the positioning chip.

[0010] In some optional embodiments, the identification structure includes at least one of a QR code and a barcode that is disposed on the surface of the sticker body and generated based on the unique identifier.

[0011] In some optional embodiments, the thickness of the sticker body is less than or equal to 1 mm; and / or the width of the transistor is less than or equal to 5 nm.

[0012] According to the second aspect of the embodiment of the present application, a positioning system is provided, which includes: a positioning sticker as described in any one of the first aspect, and an external device; wherein the sticker body of the positioning sticker is adhered to the object to be adhered, the positioning chip is communicatively connected with the external device, and sends a position signal of the positioning sticker to the external device.

[0013] In some optional embodiments, the external device includes a display device, and the display device is used to display the position of the positioning sticker indicated by the position signal.

[0014] The positioning sticker provided in the embodiment of the present application, on the one hand, includes a positioning chip. After being bonded to the object to be bonded (which can be any object), the position signal of the positioning sticker sent by the positioning chip can be received by an external device, and the position of the object to be bonded can be accurately and conveniently determined by the position signal, thereby effectively realizing convenient tracking of the object; on the other hand, since the multiple transistors of the positioning chip of the positioning sticker are arranged in multiple rows along the thickness direction of the sticker body, and are also arranged in multiple columns along at least a first direction perpendicular to the thickness direction of the sticker body, the transistors of the positioning chip are stacked along the thickness direction of the sticker body, thereby effectively increasing the positioning chip. The number of transistors integrated within a unit volume makes it easier to reduce and control the overall width and length of the positioning chip, so that the width and length of the positioning sticker can also be better reduced and controlled, thereby facilitating the reduction of the bonding space of the positioning sticker on the object to be bonded, adapting to the different requirements of different objects to be bonded, so as to minimize the impact on the objects; on the other hand, since the area between every two transistors of the positioning chip of the positioning sticker is isolated by insulation, the parasitic capacitance between the transistors can be reduced, which makes it easier to reduce the size of the transistor, thereby further facilitating the reduction and control of the size of the positioning chip, thereby further reducing the impact on the objects. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0016] Figure 1 A schematic diagram of a positioning sticker of an example in an embodiment of the present application is shown.

[0017] Figure 2 A schematic diagram of a positioning sticker of another example in an embodiment of the present application is shown.

[0018] Figure 3 A schematic diagram of a positioning system of an example in an embodiment of the present application is shown.

[0019] Figure 4 A schematic diagram of a client interface of an example scenario in an embodiment of the present application is shown.

[0020] Description of reference numerals:

[0021] 100. Positioning sticker; 1. Sticker body; 11. Identification structure; 2. Positioning chip; 3. Battery; 200. External device; 300. Positioning system. DETAILED DESCRIPTION

[0022] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the embodiments of the present application should fall within the scope of protection of the embodiments of the present application.

[0023] The specific implementation of the positioning sticker and positioning system of the embodiment of the present application is described below in conjunction with the accompanying drawings. It should be noted that for the sake of convenience in illustrating, the structures in the following drawings are not necessarily drawn according to the actual proportions.

[0024] Reference Figure 1As shown, according to the first aspect of an embodiment of the present application, a positioning sticker 100 is provided, which includes: a sticker body 1 and a positioning chip 2, the positioning chip 2 is arranged on the sticker body 1, the positioning chip 2 includes a plurality of transistors, the plurality of transistors are arranged into a plurality of rows along the thickness direction of the sticker body 1, and are also arranged into a plurality of columns along at least a first direction perpendicular to the thickness direction of the sticker body 1, and the area between each two transistors on the positioning chip 2 is isolated by insulation; wherein the positioning chip 2 is used to communicate with an external device 200 to send a position signal of the positioning sticker 100 to the external device 200.

[0025] The positioning sticker 100 provided in the embodiment of the present application, on the one hand, includes a positioning chip 2. After being bonded to the object to be bonded (which can be any object), the position signal of the positioning sticker 100 sent by the positioning chip 2 can be received by the external device 200, and the position of the object to be bonded can be accurately and conveniently determined through the position signal, thereby effectively realizing convenient tracking of the object; on the other hand, since the multiple transistors of the positioning chip 2 of the positioning sticker 100 are arranged in multiple rows along the thickness direction of the sticker body 1, and are also arranged in multiple columns along at least the first direction perpendicular to the thickness direction of the sticker body 1, the transistors of the positioning chip 2 are stacked along the thickness direction of the sticker body 1, thereby effectively increasing the positioning accuracy. The number of transistors integrated within the unit volume of the chip 2 makes it easier to reduce and control the overall width and length of the positioning chip 2, so that the width and length of the positioning sticker 100 can also be better reduced and controlled, thereby making it easier to reduce the bonding space of the positioning sticker 100 on the object to be bonded, adapting to the different needs of different objects to be bonded, so as to minimize the impact on the objects; on the other hand, since the area between every two transistors of the positioning chip 2 of the positioning sticker 100 is isolated by insulation, the parasitic capacitance between the transistors can be reduced, which makes it easier to reduce the size of the transistor, thereby further making it easier to reduce and control the size of the positioning chip 2, thereby further reducing the impact on the objects.

[0026] The positioning sticker 100 in the embodiment of the present application is described in detail below.

[0027] In the embodiment of the present application, the object to be bonded by the positioning sticker 100 can be determined according to different usage scenarios, and can include any item, or a person, an animal, etc.

[0028] In the embodiment of the present application, at least one surface of the positioning sticker 100 along the thickness direction may be provided with an adhesive structure to facilitate bonding the positioning sticker 100 to the object to be bonded. The adhesive structure may include but is not limited to any adhesive (including but not limited to glue), double-sided tape, or adsorbent, etc. For example, a glue that can be bonded repeatedly may be used so that the user can bond the positioning sticker 100 to different objects to be bonded, thereby realizing repeated use of the positioning sticker 100.

[0029] In the embodiment of the present application, the size of the sticker body 1 of the positioning sticker 100 can be set as needed, and can be designed to be smaller if the needs are met. For example, in some optional embodiments, the sticker body 1 can be designed to be within the size of 1.5 cm*1.5 cm*0.1 cm (length*width*thickness).

[0030] This exemplary size range also shows an optional embodiment in the present application, that is, the thickness of the sticker body 1 is less than or equal to 1 mm. Within this thickness range, the positioning sticker 100 can occupy less space in the thickness direction and has less impact on the object to be bonded.

[0031] In the embodiment of the present application, the positioning chip 2 can be any type of chip that can achieve positioning. For example, it can be a Bluetooth chip, a GPS chip, a WIFI chip, etc., as long as it can meet the needs. In order to facilitate the description of the embodiment of the present application, the positioning chip 2 is taken as an example of a Bluetooth chip.

[0032] In the embodiment of the present application, the positioning chip 2 can be obtained by packaging multiple transistors, and the multiple transistors are arranged in multiple rows along the thickness direction of the sticker body 1, and are also arranged in multiple columns along at least a first direction perpendicular to the thickness direction of the sticker body 1. The first direction can be the width direction or the length direction of the sticker body 1.

[0033] Preferably, the plurality of transistors can be arranged in a plurality of rows along the thickness direction of the sticker body 1, and can also be arranged in a plurality of columns along a first direction perpendicular to the thickness direction of the sticker body 1, and can be arranged in a plurality of rows along a second direction perpendicular to the thickness direction and the first direction. When the first direction is the width direction of the sticker body 1, the second direction is the length direction of the sticker body 1. When the first direction is the length direction of the sticker body 1, the second direction is the width direction of the sticker body 1.

[0034] Optionally, when manufacturing the positioning chip 2, 3D integration technology can be used to manufacture the positioning chip. The 3D integration technology can include stacked transistors, through silicon via technology (TSV, Through Silicon Via), etc., to stack multiple transistors in the vertical direction, effectively increasing the number of transistors integrated in a unit volume. When using the positioning chip 2, place the positioning chip 2 on the sticker body 1, and overlap the vertical direction with the thickness direction of the sticker body 1.

[0035] In some optional embodiments, the width of the transistor is less than or equal to 5 nm. Such a range of transistor width allows more transistors to be integrated per unit volume of the positioning chip 2, thereby making it easier to miniaturize the positioning chip 100, so that the positioning sticker 100 can have less impact on the object to be bonded.

[0036] In the embodiment of the present application, the region between each two transistors on the positioning chip 2 is isolated by insulation. Optionally, when manufacturing the positioning chip 2, silicon-on-insulator technology (SOI) can be used to achieve insulation isolation between the region between each two transistors on the positioning chip 2. Integrated circuit chips (such as the positioning chip 2) produced by SOI silicon wafers can run at a higher frequency without increasing power consumption, can reduce parasitic capacitance between transistors, and further reduce the size of transistors.

[0037] Optionally, the positioning chip 2 may be manufactured not only from silicon semiconductor materials but also from other suitable materials, such as graphene, MoS2 and the like, to provide advanced characteristics in terms of size, speed and energy consumption.

[0038] In the embodiment of the present application, the positioning chip 2 can be connected to the external device 200 for communication, so as to send the location signal of the positioning sticker 100 to the external device 200. The user can know the location of the positioning chip 2 and the object to be bonded to it through the location signal obtained by the external device 200, so as to realize convenient tracking of the object. The external device 200 can be any electronic device, including but not limited to mobile terminals such as mobile phones, computers, wearable devices, vehicle terminals, servers, etc.

[0039] Optionally, the positioning chip 2 can be packaged by WLCSP (Wafer Level Chip Scale Packaging) packaging technology. The positioning chip 2 obtained by such packaging method reduces the redundant packaging materials, and the packaging size can be almost the same as that of a bare chip. Therefore, compared with the positioning chip 2 obtained by traditional packaged chips, the size is smaller and lighter. In addition, the WLCSP packaging method provides a shorter interconnection path, which helps to reduce the electrical signal conduction delay of the packaged positioning chip 2, improve the frequency response, and reduce electromagnetic interference.

[0040] In the present application, refer to Figure 2 The positioning sticker 100 shown may further include a battery 3, which is disposed inside the sticker body 1 and has a thickness less than that of the sticker body 1. The battery 3 is used to supply power to the positioning chip 2 so that the positioning chip 2 can work normally.

[0041] In the embodiment of the present application, the positioning sticker 100 can be set at any suitable position of the sticker body 1. For example, in some optional embodiments, the positioning chip 2 is wrapped inside the sticker body 1. Based on this, the sticker body 1 can effectively protect the positioning chip 2, prevent the positioning chip 2 from being damaged, and increase the life of the positioning sticker 100. In addition, the positioning chip 2 will not occupy additional space outside the sticker body 1, thereby reducing the impact on the object to be bonded.

[0042] In some other optional embodiments, a receiving groove is provided on one side of the sticker body 1 along the thickness direction, and the positioning chip 2 is embedded in the receiving groove, and the positioning chip 2 does not exceed the receiving groove. Based on this, the sticker body 1 can at least protect a part of the positioning chip 2, and can also reduce the possibility of damage to the positioning chip 2, thereby increasing the life of the positioning sticker 100, and because the positioning chip 2 does not exceed the receiving groove, the positioning chip 2 will not occupy additional space outside the sticker body 1, thereby reducing the impact on the object to be bonded. The receiving groove can be designed into a suitable shape as needed.

[0043] In some optional embodiments, referring to Figure 2 The positioning sticker 100 shown in the figure has an identification structure 11 on the surface of the sticker body 1, and the identification structure 11 corresponds to the positioning chip 2, and different identification structures 11 correspond to different positioning chips 2; the identification structure 11 can be identified by the external device 200, so that the external device 200 can achieve communication connection with the positioning chip 2 corresponding to the identification structure 11.

[0044] Based on this, through the identification structure 11 on the surface of the sticker body 1, the communication connection between the external device 200 and the positioning chip 2 can be effectively realized, thereby realizing the convenient object tracking function of the positioning sticker 100 in the embodiment of the present application.

[0045] In the embodiment of the present application, the identification structure 11 can be implemented in any suitable manner. For example, in some optional embodiments, the identification structure 11 records the unique identification of the positioning chip 2, and the external device 200 determines the unique identification of the positioning chip 2 by identifying the identification structure, so as to communicate with the positioning chip 2 through the unique identification.

[0046] Based on this, the unique identification of the positioning chip 2 recorded by the identification structure 11 can be effectively realized, and the communication connection between the external device 200 and the positioning chip 2 can be realized, thereby realizing the convenient object tracking function of the positioning sticker 100 in the embodiment of the present application.

[0047] Optionally, the unique identifier may include at least one of the physical address of the positioning chip 2 and the universal unique identifier of the positioning chip 2. The physical address, i.e., the MAC address of the positioning chip 2, and the universal unique identifier, i.e., the UUID of the positioning chip 2, can both uniquely correspond to the positioning chip 2. Different positioning chips 2 have different physical addresses, and different positioning chips 2 have different universal unique identifiers. Therefore, through such a unique identifier, the communication connection between the external device 200 and the positioning chip 2 can be effectively achieved, thereby realizing the convenient item tracking function of the positioning sticker 100 in the embodiment of the present application.

[0048] The specific structure of the identification structure is not limited in the embodiment of the present application. Optionally, the identification structure 11 includes at least one of a QR code and a barcode provided on the surface of the sticker body 1 and generated according to the unique identifier.

[0049] Based on this, the external device can effectively realize the communication connection between the external device 200 and the positioning chip 2 by identifying at least one of the QR code and barcode generated according to the unique identifier set on the surface of the sticker body 1, thereby realizing the convenient object tracking function of the positioning sticker 100 in the embodiment of the present application.

[0050] Optionally, after the QR code and / or barcode is generated according to the unique identifier, it can be printed on the surface of the sticker body 1, or a sticker including the QR code and / or barcode can be made and pasted on the surface of the sticker body 1. Alternatively, the QR code and / or barcode can be set on the surface of the sticker body 1 in other ways.

[0051] Optionally, taking the identification structure as a two-dimensional code, the positioning chip as a Bluetooth chip, and the unique identifier as a physical address (MAC address) as an example, an application App or a small program may be run on the external device 200, and the camera on the external device 200 may be called through the application App or the small program to scan the two-dimensional code (i.e., the identification structure) of the sticker body 1 of the positioning sticker 100 to extract the physical address (MAC address) of the Bluetooth chip (i.e., the positioning chip 2), so that the physical address (MAC address) of the Bluetooth chip (i.e., the positioning chip 2) can be used to achieve a Bluetooth-based communication connection with the Bluetooth chip (i.e., the positioning chip 2). The Bluetooth chip (i.e., the positioning chip 2) can achieve positioning, determine the position signal of the positioning sticker 100 in real time, and send the position signal to the external device 200 via Bluetooth. Thereby, the real-time and convenient tracking of the positioning sticker 100 and the objects to be bonded to it can be achieved. Optionally, the external device 200 may include a display device that can display the position of the positioning sticker 100 indicated by the position signal. For example, the display device may be a display included in the external device 200. Optionally, the display can display the position of the positioning sticker 100 indicated by the position signal through the display interface of the application App or mini-program displayed on the display, so that the user can know the position of the positioning sticker 100 and the object to be adhered to it.

[0052] Some exemplary application methods of the positioning sticker 100 in the embodiment of the present application are described below.

[0053] Application example 1: The positioning sticker 100 can be attached to ordinary objects to realize real-time and convenient tracking of ordinary objects.

[0054] Application example 2: The positioning sticker 100 can be attached to ordinary objects, collars of pets such as cats and dogs, or other objects to track the location of the pet in real time, providing a safe and convenient pet management function.

[0055] Application Example 3: The positioning sticker 100 can be attached to the clothing or body of children or the elderly to track their location in real time, providing safety monitoring and emergency rescue functions.

[0056] Application Example 4: The positioning sticker 100 can be affixed to equipment, tools or other valuables to track their location and status, thereby improving asset visibility and management efficiency.

[0057] Application Example 5: The positioning sticker 100 can be affixed to a vehicle to track the location of the vehicle and provide alarm or positioning services when necessary to help users protect the safety of the vehicle.

[0058] Application Example 6: The positioning sticker 100 can be pasted on buildings, landmarks or other locations of interest, and users can view relevant information, navigation routes and guide content on the mobile phone application App, providing a richer map experience and realizing map navigation and other functions.

[0059] Examples of commercial applications: The positioning sticker 100 can also realize the following commercial applications: For merchants (B-end), an external device 200 that is communicatively connected to the positioning sticker 100 can be used to implement advertisement distribution, LBS (Location Based Services) recommendations (such as nearby restaurants / shopping malls / cinemas, etc.), application recommendations, etc., and then charge merchants for promotion fees; For users (C-end), value-added service fees can be charged for user value-added services, such as historical location records, customization of the style and size of the positioning sticker 100, and removal of advertisements. Furthermore, the selling price of the positioning sticker 100 can be reasonably reduced through the increase in revenue brought by commercial value, so that users can be more receptive to the use of the positioning sticker 100, which is conducive to the promotion of the positioning sticker 100.

[0060] It should be understood that the application methods of the above examples are merely some optional examples in the embodiments of the present application and do not constitute any limitation to the embodiments of the present application.

[0061] In summary, the positioning sticker 100 provided in the embodiment of the present application, on the one hand, because it includes a positioning chip 2, after being bonded to the object to be bonded (which can be any object), the position signal of the positioning sticker 100 sent by the positioning chip 2 can be received by the external device 200, and the position of the object to be bonded can be accurately and conveniently determined through the position signal, thereby effectively realizing convenient tracking of the object; on the other hand, because the multiple transistors of the positioning chip 2 of the positioning sticker 100 are arranged in multiple rows along the thickness direction of the sticker body 1, and are also arranged in multiple columns along at least the first direction perpendicular to the thickness direction of the sticker body 1, the transistors of the positioning chip 2 are stacked along the thickness direction of the sticker body 1, thereby effectively increasing The number of transistors integrated within the unit volume of the positioning chip 2 makes it easier to reduce and control the overall width and length of the positioning chip 2, so that the width and length of the positioning sticker 100 can also be better reduced and controlled, thereby facilitating the reduction of the bonding space of the positioning sticker 100 on the object to be bonded, adapting to the different requirements of different objects to be bonded, so as to minimize the impact on the objects; on the other hand, since the area between every two transistors of the positioning chip 2 of the positioning sticker 100 is isolated by insulation, the parasitic capacitance between the transistors can be reduced, which makes it easier to reduce the size of the transistor, thereby further facilitating the reduction and control of the size of the positioning chip 2, thereby further reducing the impact on the objects.

[0062] It can be understood that the above contents are merely some optional embodiments of the positioning sticker 100 in the embodiment of the present application, and they are not intended to be any limitation to the embodiment of the present application.

[0063] Reference Figure 3 As shown, according to the second aspect of the embodiment of the present application, a positioning system 300 is also provided, which includes: a positioning sticker 100 as any one of the first aspect, and an external device 200; wherein, the sticker body 1 of the positioning sticker 100 is adhered to the object to be adhered, the positioning chip 2 is communicated with the external device 200, and sends a position signal of the positioning sticker 100 to the external device 200.

[0064] In some optional embodiments, the external device 200 includes a display device, and the display device is used to display the position of the positioning sticker 100 indicated by the position signal.

[0065] For example, the display device may be a display included in the external device 200. Optionally, the display may display the position of the positioning sticker 100 indicated by the position signal through a display interface of an application App or a mini-program displayed on the display, so that the user can know the position of the positioning sticker 100 and the object to be bonded thereto.

[0066] The positioning system 300 provided in the second aspect of the embodiment of the present application has been described in detail in the embodiment of the positioning sticker 100 provided in the first aspect above, so it can be understood by referring to the relevant content in the previous text and will not be repeated here.

[0067] The following uses a scenario as an example to exemplify the above positioning system.

[0068] In this example, the positioning sticker 100 is set to be pasted on a wallet (i.e., the item to be adhered), and the external device 200 is implemented as a smart phone, which has a client (such as an application App or a mini-program) installed in it that can locate the item based on the positioning sticker 100.

[0069] In a feasible manner, the client can be implemented in the form of a flat or three-dimensional map, and the client can locate the smartphone and receive the location information sent by the positioning sticker 100. Based on the locations of the two, a corresponding route is generated to guide the user to find the wallet (i.e., the object to be attached) to which the positioning sticker 100 is attached. The indoor map can be generated in advance based on any appropriate method.

[0070] In another feasible manner, the client may have AR (Augmented Reality) or VR (Virtual Reality) functions. In this manner, the client acquires image modeling data (for example, images and video data corresponding to the wallet (i.e., the item to be bonded)) in an appropriate manner, and then performs 3D modeling in advance based on the image modeling data, for example, 3D modeling of the indoor environment to obtain a virtual indoor environment. On this basis, when searching for a target such as a wallet, guidance information to guide the user to the wallet may be generated based on the current location of the smartphone, including but not limited to: guidance direction, guidance path, etc., so that the user can immersively search for the wallet, such as Figure 4 The wallet location is as shown. Figure 4 Framed by the dotted oval.

[0071] In another feasible manner, the client can locate the smartphone. After determining the current location of the smartphone (i.e., the external device 200), the route from the smartphone (i.e., the external device 200) to the wallet (i.e., the object to be bonded) can be displayed in the virtual indoor environment displayed in the client interface, and the distance can be calculated based on the locations of the two, and the distance can be displayed in the client interface to make it easier for the user to find the wallet (i.e., the object to be bonded). Figure 4 As shown, the route is shown and the distance is shown to be approximately 1.3 meters.

[0072] In another feasible manner, the client can simultaneously display buttons corresponding to multiple positioning stickers 100, and the user can trigger options corresponding to different positioning stickers 100 through the client to view the positions of different objects to be bonded. Figure 4 As shown, there are three options for positioning stickers, Sticker 1, Sticker 2, and Sticker 3. Figure 4 The example triggers the option corresponding to sticker 2 so that the position of sticker 2 can be viewed.

[0073] It should be understood that the above scenario examples do not constitute any limitation to the embodiments of the present application.

[0074] The term "including" and its variations used in this document are open inclusions, that is, "including but not limited to". The term "based on" means "based at least in part on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one other embodiment"; the term "some embodiments" means "at least some embodiments". It should be noted that the concepts of "first", "second", etc. mentioned in the embodiments of the present application are only used to distinguish different devices, modules or units, and are not used to limit the order or interdependence of the functions performed by these devices, modules or units. It should be noted that the modifications of "one" and "multiple" mentioned in the embodiments of the present application are illustrative rather than restrictive. Those skilled in the art should understand that unless otherwise clearly indicated in the context, it should be understood as "one or more".

[0075] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, rather than to limit them. Although the embodiments of the present application have been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the embodiments of the present application.

Claims

1. A positioning sticker (100), characterized in that: include: Sticker body (1); A positioning chip (2), the positioning chip (2) being arranged on the sticker body (1), the positioning chip (2) comprising a plurality of transistors, the plurality of transistors being arranged in a plurality of rows along the thickness direction of the sticker body (1), and also being arranged in a plurality of columns along at least a first direction perpendicular to the thickness direction of the sticker body (1), the region between every two transistors on the positioning chip (2) being isolated by insulation; The positioning chip (2) is used to communicate with an external device (200) so as to send a position signal of the positioning sticker (100) to the external device (200).

2. The positioning sticker (100) according to claim 1, characterized in that: The positioning chip (2) is wrapped inside the sticker body (1).

3. The positioning sticker (100) according to claim 1, characterized in that: The sticker body (1) is provided with a receiving groove on one side along the thickness direction, the positioning chip (2) is embedded in the receiving groove, and the positioning chip (2) does not exceed the receiving groove.

4. The positioning sticker (100) according to claim 1, characterized in that: The surface of the sticker body (1) is provided with an identification structure (11), the identification structure (11) corresponds to the positioning chip (2), and different identification structures (11) correspond to different positioning chips (2); The identification structure (11) can be identified by an external device (200), so that the external device (200) can achieve communication connection with a positioning chip (2) corresponding to the identification structure (11).

5. The positioning sticker (100) according to claim 4, characterized in that: The identification structure (11) records the unique identification of the positioning chip (2), and the external device (200) determines the unique identification of the positioning chip (2) by identifying the identification structure (11), so as to establish a communication connection with the positioning chip (2) through the unique identification.

6. The positioning sticker (100) according to claim 5, characterized in that: The unique identifier includes at least one of a physical address of the positioning chip and a universal unique identification code of the positioning chip.

7. The positioning sticker (100) according to claim 5, characterized in that: The identification structure (11) comprises at least one of a two-dimensional code and a barcode, which is arranged on the surface of the sticker body (1) and is generated according to the unique identifier.

8. The positioning sticker (100) according to any one of claims 1 to 7, characterized in that: The thickness of the sticker body (1) is less than or equal to 1 mm; and / or the width of the transistor is less than or equal to 5 nm.

9. A positioning system (300), characterized in that: include: The positioning sticker (100) as claimed in any one of claims 1 to 8, and the external device (200); wherein: The sticker body (1) of the positioning sticker (100) is adhered to the object to be adhered, and the positioning chip (2) is connected to the external device (200) for communication and sends a position signal of the positioning sticker (100) to the external device (200).

10. The positioning system (300) according to claim 9, characterized in that: The external device (200) comprises a display device, and the display device is used to display the position of the positioning sticker (100) indicated by the position signal.

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