Temperature control device and cleaning system

Abstract

The embodiment of the utility model provides a temperature control device and a cleaning system, and the temperature control device comprises a heat exchange chamber which comprises a chamber main body and a chamber cover plate; a heat exchange cavity is formed in the side face of the cavity body, a flow channel partition is arranged in the heat exchange cavity, and the heat exchange cavity is divided into coherent heat exchange flow channels through the flow channel partition. The cavity cover plate is arranged on the side, provided with the heat exchange cavity, of the cavity body, and the cavity cover plate is connected with the cavity body so as to seal the heat exchange cavity. One side of the heat conducting plate is attached to the cavity cover plate; the heat conducting plate is used for conducting heat exchange with the heat exchange runner through the cavity cover plate and evenly applying acting force to the cavity cover plate so as to enhance the pressure bearing capacity of the heat exchange cavity.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of liquid temperature control, and in particular, to a temperature control device and a cleaning system. Background Art

[0002] In semiconductor device manufacturing, after the wafer has completed chemical mechanical polishing (CMP), it is usually necessary to use chemical liquid to clean the wafer. The temperature of the chemical liquid is one of the important factors affecting the wafer cleaning effect, and the design of the chamber used to adjust the temperature of the chemical liquid is particularly important.

[0003] In the related art, the chamber for temperature adjustment of chemical liquid usually includes a cavity into which the liquid enters and a cover plate, and an intermediate seal such as a rubber sealing ring is arranged between the cavity and the cover plate to prevent the liquid in the cavity from flowing out from the gap between the cavity and the cover plate. However, this sealing method still has some defects. For example, due to the material of the intermediate seal itself, it usually produces precipitates, causing contamination of the chemical liquid in the cavity, and when the intermediate seal is unevenly stressed, it is easy to produce a gap between the intermediate seal and the cover plate, causing leakage of the chemical liquid, etc. Utility Model Content

[0004] In view of this, an embodiment of the present application provides a temperature control device and a cleaning system to at least partially solve the above problems.

[0005] According to a first aspect of an embodiment of the present application, a temperature control device is provided, comprising: a heat exchange chamber, the heat exchange chamber comprising a chamber body and a chamber cover; a heat exchange cavity is opened on the side of the chamber body, a flow channel partition is arranged in the heat exchange cavity, and the flow channel partition divides the heat exchange cavity into a coherent heat exchange flow channel; the chamber cover is arranged on a side of the chamber body where the heat exchange cavity is opened, and the chamber cover is connected to the chamber body to seal the heat exchange cavity; a heat conducting plate, one side of the heat conducting plate is in contact with the chamber cover; the heat conducting plate is used to exchange heat with the heat exchange flow channel through the chamber cover, and is used to uniformly apply force to the chamber cover to enhance the pressure bearing capacity of the heat exchange chamber.

[0006] In a possible implementation, the heat exchange chamber includes two heat exchange channels, and the two heat exchange channels are respectively arranged on two opposite sides of the chamber body.

[0007] In a possible implementation, the chamber body is further provided with a liquid inlet, a liquid outlet, a first diverter hole and a second diverter hole; the first diverter hole is connected to the liquid inlet, and the first diverter hole is respectively connected to one end of the two heat exchange channels; the second diverter hole is connected to the liquid outlet, and the second diverter hole is respectively connected to the other end of the two heat exchange channels.

[0008] In a possible implementation, in the two heat exchange channels, the first heat exchange channel exchanges heat with the first heat conductive plate through the first chamber cover plate; the second heat exchange channel exchanges heat with the second heat conductive plate through the second chamber cover plate; and the first heat conductive plate and the second heat conductive plate are connected by fasteners, and the heat exchange chamber is clamped between the first heat conductive plate and the second heat conductive plate.

[0009] In a possible implementation, the temperature control device further includes a temperature control execution unit, and the temperature control execution unit is attached to the heat conducting plate; the temperature control execution unit is used to release heat to the heat conducting plate, or absorb heat from the heat conducting plate.

[0010] In a possible implementation, the temperature control device further includes a control unit; the control unit is electrically connected to the temperature control execution unit; and the control unit is used to control the temperature of the temperature control execution unit.

[0011] In a possible implementation, the liquid inlet and the liquid outlet of the chamber body are respectively provided with temperature sensors, and the temperature sensors are electrically connected to the control unit; the control unit is used to adjust the temperature of the temperature control execution unit according to the temperature value output by the temperature sensor.

[0012] In a possible implementation, the connection between the chamber cover and the chamber body is a welding connection, and the chamber cover and the chamber body are made of fluoroplastic.

[0013] According to a second aspect of an embodiment of the present application, a cleaning system is provided, comprising: a circulation pump, a cleaning chamber, and a temperature control device as described in any embodiment of the first aspect; the circulation pump is respectively connected to the cleaning chamber and the temperature control device, and is used to transfer liquid discharged from the temperature control device to the cleaning chamber; the cleaning chamber is used to clean wafers with the liquid discharged from the temperature control device.

[0014] In a possible implementation, the circulation pump is further used to transfer the liquid in the cleaning chamber back to the temperature control device, so as to circulate the liquid in the cleaning chamber.

[0015] In the embodiment of the present application, a heat exchange cavity is provided on the side of the chamber body, and the heat exchange cavity is divided into a continuous heat exchange flow channel by a flow channel partition. The chamber cover is arranged on the side of the chamber body where the heat exchange cavity is provided, and the chamber cover can be directly connected to the chamber body to seal the heat exchange cavity, which can avoid the use of intermediate seals such as rubber sealing rings, thereby solving the problems that intermediate seals such as rubber sealing rings are easy to deform and easy to produce precipitates to pollute the heat exchange cavity. In addition, the temperature control device provided in the embodiment of the present application also includes a heat conducting plate, and the heat conducting plate and one side of the chamber cover are fitted, which can not only enable the heat conducting plate to exchange heat with the heat exchange flow channel on the other side of the chamber cover; but also can evenly apply a force to the chamber cover through the heat conducting plate, avoiding stress concentration when applying a force to the chamber cover, so as to enhance the pressure bearing capacity of the heat exchange chamber. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0017] Figure 1 is a structural schematic diagram of a temperature control device provided in an optional embodiment of the present application;

[0018] Figure 2 It is a schematic diagram of a heat exchange chamber of a temperature control device provided in an optional embodiment of the present application;

[0019] Figure 3 It is a schematic diagram of a chamber body of a heat exchange chamber provided in an optional embodiment of the present application;

[0020] Figure 4 is a schematic diagram of a chamber body of another heat exchange chamber provided in an optional embodiment of the present application;

[0021] Figure 5 is a structural schematic diagram of another temperature control device provided in an optional embodiment of the present application;

[0022] Figure 6 is a structural block diagram of a cleaning system provided by an optional embodiment of the present application;

[0023] Figure 7 It is a schematic diagram of the flow process of a chemical liquid provided in an optional embodiment of the present application;

[0024] Figure 8 This is a schematic diagram of the flow process of another chemical liquid provided in an optional embodiment of the present application.

[0025] Reference numerals:

[0026] 100, temperature control device; 110, heat exchange chamber; 111, chamber body; 1110, heat exchange cavity; 1111, flow channel partition; 1112, heat exchange flow channel; 1113, first diversion hole; 1114, second diversion hole; 1115, first conduit; 1116, second conduit; 112, chamber cover; 1121, first chamber cover; 120, heat conduction plate; 121, first heat conduction plate; 122, second heat conduction plate; 123, mounting hole; 200, cleaning system; 210, circulation pump; 220, cleaning chamber; 230, wafer. DETAILED DESCRIPTION

[0027] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the embodiments of the present application should fall within the scope of protection of the embodiments of the present application.

[0028] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The singular forms of "a", "an" and "the" used in this application and the appended claims are also intended to include plural forms unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0029] It should be understood that although the terms first, second, third, etc. may be used in the present application to describe various information, these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0030] According to a first aspect of an embodiment of the present application, a temperature control device is provided to solve the above-mentioned problem.

[0031] The temperature control device provided in the embodiments of the present application is described in detail below with reference to the accompanying drawings.

[0032] like Figure 1 and Figure 2 As shown, an embodiment of the present application provides a temperature control device 100 , including: a heat exchange chamber 110 and a heat conducting plate 120 .

[0033] The heat exchange chamber 110 includes a chamber body 111 and a chamber cover 112. A heat exchange cavity 1110 is opened on the side of the chamber body 111, and a flow channel partition 1111 is arranged in the heat exchange cavity 1110. In the heat exchange cavity 1110, the flow channel partition 1111 divides the heat exchange cavity 1110 into continuous heat exchange flow channels 1112.

[0034] The chamber cover 112 is disposed on one side of the chamber body 111 where the heat exchange cavity 1110 is opened, and the chamber cover 112 is connected to the chamber body 111 to seal the heat exchange cavity 1110, so that the liquid entering the heat exchange chamber 110 can only flow in the heat exchange flow channel 1112 formed in the heat exchange cavity 1110. The height of the flow channel partition 1111 can be the same as the depth of the heat exchange cavity 1110, so that the top surface of the flow channel partition 1111 is flush with the top of the cavity wall of the heat exchange cavity 1110, so that the chamber cover 112 can fit with the chamber body 111 and the flow channel partition 1111 at the same time, ensuring the sealing effect of the chamber cover 112 on the heat exchange cavity 1110. In the embodiment of the present application, the liquid processed by the temperature control device 100 can be a chemical liquid for cleaning wafers, or other suitable chemical liquids, and the embodiment of the present application does not limit the type of the liquid.

[0035] Optionally, the width of the heat exchange channel 1112 can be set to 20-40 mm, and the depth of the heat exchange channel 1112 or the heat exchange chamber 110 can be set to 2-3 mm; or, the ratio of the width to the depth of the heat exchange channel 1112 can be set between 20 / 3 and 20. For example, the ratio of the width to the depth of the heat exchange channel 1112 can be 20 / 3, 10, 40 / 3 or 20, etc., so as to ensure that the width of the heat exchange channel 1112 is much larger than its depth, so as to increase the contact area between the liquid in the heat exchange channel 1112 and the chamber cover 112, thereby improving the heat exchange efficiency of the liquid and the space utilization of the heat exchange chamber 110, which is conducive to reducing the volume of the heat exchange chamber 110 and realizing the miniaturization of the temperature control device 100.

[0036] One side of the heat conducting plate 120 is in contact with the chamber cover 112. The heat conducting plate 120 is used to exchange heat with the heat exchange channel 1112 through the chamber cover 112, and to apply a force to the chamber cover 112 uniformly to enhance the pressure bearing capacity of the heat exchange chamber. The heat conducting plate 120 of the embodiment of the present application can be a structural member of the temperature control device 100, thereby improving the structural strength of the temperature control device 100. In addition, since the heat conducting plate 120 is in contact with the chamber cover 112, the heat conducting plate 120 can uniformly apply a force to the chamber cover 112, avoiding stress concentration when applying a force to the chamber cover 112, and can increase the upper limit of the force applied to the chamber cover 112, thereby enhancing the pressure bearing capacity of the chamber cover 112 and the heat exchange chamber 110.

[0037] It should be understood that a heating or cooling element, such as a heating wire, a thermoelectric chip, etc., may be provided on the other side of the heat conducting plate 120. The thermoelectric chip may be made of a semiconductor thermoelectric material, so that the semiconductor thermoelectric material may be used to generate a refrigeration effect by using electrical energy, so as to heat or cool the liquid in the heat exchange chamber 110 through the heat conducting plate 120, thereby achieving a more comprehensive temperature control function.

[0038] In the embodiment of the present application, a heat exchange cavity 1110 is provided on the side of the chamber body 111, and the heat exchange cavity 1110 is divided into a continuous heat exchange flow channel 1112 by a flow channel partition 1111. The chamber cover plate 112 is arranged on the side of the chamber body 111 where the heat exchange cavity 1110 is provided, and the chamber cover plate 112 can be directly connected to the chamber body 111 to seal the heat exchange cavity 1110, thereby avoiding the use of intermediate seals such as rubber sealing rings, thereby solving the problems of intermediate seals such as rubber sealing rings being easily deformed and easily generating precipitates to contaminate the heat exchange cavity 1110. In addition, the temperature control device 100 provided in the embodiment of the present application also includes a heat conducting plate 120, and the heat conducting plate 120 is fitted to one side of the chamber cover 112, which not only enables the heat conducting plate 120 to exchange heat with the heat exchange channel 1112 on the other side of the chamber cover 112; but also allows the heat conducting plate 120 to evenly apply force to the chamber cover 112, thereby avoiding stress concentration when applying force to the chamber cover 112, so as to enhance the pressure-bearing capacity of the heat exchange chamber 110.

[0039] In the related art, a coating of materials such as PFA (Polyfluoroalkoxy, soluble polytetrafluoroethylene) is usually sprayed in a chamber for temperature adjustment of chemical liquids to prevent the chamber from being corroded by the processed liquid. However, the sprayed PFA is generally mixed with other substances such as adhesives. Although it has corrosion resistance, it usually contains precipitates due to the mixing of other substances, causing contamination of the processed liquid.

[0040] In some optional embodiments, the connection between the chamber cover 112 and the chamber body 111 is a welding connection, and the material of the chamber cover 112 and the chamber body 111 can be fluoroplastic.

[0041] Fluoroplastic is a plastic made of fluorine resin, which has good high temperature resistance and corrosion resistance. The fluoroplastic used in the embodiment of the present application can be PTFE (Polytetrafluoroethylene), PFA, FEP (Fluorinated ethylene propylene), etc.

[0042] The edge of the chamber cover 112 can be connected to the chamber body 111 by welding, so that the chamber cover 112 and the chamber body 111 have good integrity, thereby ensuring the sealing effect of the chamber cover 112 on the heat exchange cavity 1110, and reducing the intermediate seals such as rubber sealing rings, avoiding the intermediate seals from producing precipitates to contaminate the liquid in the heat exchange flow channel 1112 of the heat exchange cavity 1110. In addition, since the chamber cover 112 and the chamber body 111 are made of fluoroplastics as a whole, compared with the related art, there are no other substances such as adhesives, so that the precipitation of pollutants can be avoided on the basis of ensuring corrosion resistance, thereby better controlling the temperature of the liquid entering the heat exchange chamber 110.

[0043] As a feasible implementation method, the chamber cover plate 112 and the flow channel partition 1111 in the heat exchange cavity 1110 can be connected by welding, or can be connected by fitting only under the force of the heat conductive plate 120, so that the liquid entering the heat exchange cavity 1110 can only flow in the heat exchange flow channel 1112 along the direction in which the heat exchange flow channel 1112 extends, and cannot flow across the flow channel partition 1111 across the heat exchange flow channel 1112, so that the liquid entering the heat exchange cavity 1110 has sufficient time to exchange heat to ensure the effect of controlling the temperature of the liquid. In addition, in the embodiment of the present application, in addition to the welding connection, the chamber cover plate 112 and the chamber body 111 can also be integrally formed by 3D printing or other methods, thereby directly eliminating the gap at the connection between the chamber cover plate 112 and the chamber body 111, and further improving the sealing effect of the heat exchange cavity 1110 and the heat exchange flow channel 1112.

[0044] In some optional embodiments, the heat exchange chamber 110 includes two heat exchange channels 1112 , and the two heat exchange channels 1112 are respectively disposed on two opposite sides of the chamber body 111 .

[0045] like Figure 2 and Figure 3 As shown, heat exchange cavities 1110 can be provided on both the left and right sides of the chamber body 111 of the heat exchange chamber 110, and corresponding heat exchange channels 1112 can be formed in each heat exchange cavity 1110 by using channel partitions 1111, so that the space on the side of the chamber body 111 can be fully utilized to form the heat exchange channels 1112. In addition, by providing heat exchange channels 1112 on both opposite sides of the chamber body 111, the heat exchange area of ​​the heat exchange chamber 110 can be increased as much as possible, thereby improving the efficiency of heat exchange after the liquid enters the heat exchange chamber 110.

[0046] like Figure 2-Figure 4As shown, in some optional embodiments, the chamber body 111 is further provided with a liquid inlet, a liquid outlet, a first diverter hole 1113 and a second diverter hole 1114. The first diverter hole 1113 is connected to the liquid inlet, and the first diverter hole 1113 is respectively connected to one end of the two heat exchange channels 1112; the second diverter hole 1114 is connected to the liquid outlet, and the second diverter hole 1114 is respectively connected to the other end of the two heat exchange channels 1112. Among them, the two heat exchange channels 1112 are the heat exchange channels 1112 on both sides of the upper chamber body 111.

[0047] Optionally, the chamber body 111 may be connected to a first conduit 1115 and a second conduit 1116, wherein the first conduit 1115 is connected to the liquid inlet, and the second conduit 1116 is connected to the liquid outlet, so that the liquid to be treated can be introduced into the liquid inlet through the first conduit 1115, and the treated liquid can be discharged from the liquid outlet through the second conduit 1116.

[0048] In the embodiment of the present application, the chamber body 111 is further provided with a liquid inlet, a liquid outlet, a first diverter hole 1113 and a second diverter hole 1114. The first diverter hole 1113 is connected to the liquid inlet, and the first diverter hole 1113 is respectively connected to one end of the two heat exchange channels 1112, so that the liquid to be treated can enter the first diverter hole 1113 through the liquid inlet, and then can be evenly dispersed into the heat exchange channels 1112 on both sides of the chamber body 111 through the first diverter hole 1113, so that the liquid can fully utilize the heat exchange channels 1112 on both sides of the chamber body 111 for heat exchange. The second diverter hole 1114 is connected to the liquid outlet, and the second diverter hole 1114 is respectively connected to the other ends of the two heat exchange channels 1112, so that the liquid in the heat exchange channels 1112 on both sides of the chamber body 111 can be collected into a liquid outlet through the second diverter hole 1114 for discharge, without having to set up two liquid outlets for the heat exchange channels 1112 on both sides of the chamber body 111, which can greatly simplify the structure of the heat exchange chamber.

[0049] As a feasible implementation, the two heat exchange channels 1112 respectively arranged on both sides of the chamber body 111 may be the first heat exchange channel and the second heat exchange channel. The chamber cover 112 may include the first chamber cover and the second chamber cover. The heat conducting plate 120 may include the first heat conducting plate and the second heat conducting plate.

[0050] In some optional embodiments, the first heat exchange channel can exchange heat with the first heat conducting plate through the first chamber cover plate; the second heat exchange channel can exchange heat with the second heat conducting plate through the second chamber cover plate. The first heat conducting plate and the second heat conducting plate are connected by fasteners, and the heat exchange chamber is clamped between the first heat conducting plate and the second heat conducting plate. Optionally, the fasteners can be detachable fasteners or non-detachable fasteners, both of which are within the protection scope of the embodiments of the present application.

[0051] For example, Figure 5 As shown, the first heat conducting plate 121 and the second heat conducting plate 122 may be provided with mounting holes 123. After the heat exchange chamber 110 is placed between the first heat conducting plate 121 and the second heat conducting plate 122, the first heat conducting plate 121 and the second heat conducting plate 122 may be connected by passing fasteners such as bolts through the mounting holes 123, so that the heat exchange chamber 110 is clamped between the first heat conducting plate 121 and the second heat conducting plate 122. Thus, by twisting the bolts, the first heat conducting plate 121 and the second heat conducting plate 122 may be brought closer to each other, so that the first heat conducting plate 121 and the first chamber cover plate 1121 are closely fitted, and the second heat conducting plate 122 and the second chamber cover plate are closely fitted.

[0052] In addition, if the chamber cover plate is not directly connected to the flow channel partition in the heat exchange cavity, the first heat conductive plate 121 can apply a force to the first chamber cover plate 1121, and the second heat conductive plate 122 can apply a force to the second chamber cover plate, thereby achieving a fitting connection between the first chamber cover plate 1121 and the second chamber cover plate and the corresponding flow channel partition 1111.

[0053] In the embodiment of the present application, the heat exchange chamber 110 can be located between the first heat conductive plate 121 and the second heat conductive plate 122, and the first heat conductive plate 121 and the second heat conductive plate 122 are connected by fasteners, so that it is not necessary to respectively provide a structure for generating the above-mentioned force for each heat conductive plate 120. Only by adjusting the fasteners, the first heat conductive plate 121 and the second heat conductive plate 122 can clamp the heat exchange chamber 110 therebetween, thereby making the first heat conductive plate 121 and the first chamber cover 1121 fit tightly, and making the second heat conductive plate 122 and the second chamber cover fit tightly, thereby improving the efficiency of heat exchange between the first heat conductive plate 121 and the first heat exchange channel through the first chamber cover 1121, and the efficiency of heat exchange between the second heat conductive plate 122 and the second heat exchange channel through the second chamber cover. Furthermore, by adopting detachable fasteners, the first heat conducting plate 121 and the second heat conducting plate 122 can be easily disassembled, thereby improving the flexibility of combining the heat conducting plate 120 with the heat exchange chamber 110 .

[0054] In some optional embodiments, the temperature control device 100 further includes a temperature control execution unit, which is attached to the heat conducting plate 120 ; the temperature control execution unit is used to release heat to the heat conducting plate 120 , or absorb heat from the heat conducting plate 120 .

[0055] In the real-time example of the present application, the temperature control execution unit may include heating elements such as electric heating wires that generate heat through electric energy, cooling elements such as thermoelectric chips that generate cool through electric energy, etc., so that when it is necessary to heat the liquid in the heat exchange channel 1112, the temperature control execution unit can be used to release heat to the heat conducting plate 120, so that the heat conducting plate 120 heats the liquid in the heat exchange channel 1112 through the corresponding chamber cover 112. When it is necessary to cool the liquid in the heat exchange chamber 110, the temperature control execution unit is used to absorb heat from the heat conducting plate 120, so that the heat conducting plate 120 cools the liquid in the heat exchange channel 1112 through the corresponding chamber cover 112, so as to realize the function of the temperature control device 100 to control the temperature of the liquid.

[0056] In some optional embodiments, the temperature control device 100 further includes a control unit; the control unit is electrically connected to the temperature control execution unit; and the control unit is used to control the temperature of the temperature control execution unit.

[0057] In the embodiment of the present application, the control unit can be used to control the power of the heating element and the cooling element in the temperature control execution unit. By adjusting the power of the heating element and the cooling element in the temperature control execution unit, the temperature of the temperature control execution unit is adjusted so that the temperature control execution unit can release heat to the heat conducting plate 120 or absorb heat from the heat conducting plate 120. Among them, the control unit can automatically adjust the temperature of the temperature control execution unit by executing the corresponding automatic program, thereby realizing automatic control of the control execution unit and reducing manual operation. It is also possible to adjust the temperature of the temperature control execution unit under the control of a technician by receiving a manually input control instruction, thereby realizing manual control of the temperature control execution unit and improving the flexibility of temperature control.

[0058] In some optional embodiments, the liquid inlet and the liquid outlet of the chamber body 111 may be respectively provided with temperature sensors, and the temperature sensors are electrically connected to the control unit; the control unit is used to adjust the temperature of the temperature control execution unit according to the temperature value output by the temperature sensor.

[0059] The temperature sensors at the liquid inlet and the liquid outlet of the chamber body 111 can detect the initial temperature value of the liquid when it enters the chamber body 111 and the outflow temperature value of the liquid when it flows out of the chamber body 111. The control unit can obtain the initial temperature value and the outflow temperature value of the liquid by electrically connecting the temperature sensor, and adjust the temperature of the temperature control execution unit according to the difference between the target temperature value and the initial temperature value that the liquid needs to reach, so as to adjust the temperature of the liquid in the chamber body 111 until the outflow temperature value detected by the temperature sensor stabilizes to the target temperature.

[0060] The control unit of this embodiment may also include a temperature display unit, which displays in real time the initial temperature value of the liquid when it enters the chamber body 111 and the outflow temperature value of the liquid when it flows out of the chamber body 111, so that the technician can control the change of the liquid temperature in real time.

[0061] In the embodiment of the present application, the liquid inlet and the liquid outlet of the chamber body 111 may be respectively provided with temperature sensors, and the temperature sensors are electrically connected to the control unit. The control unit may be used to adjust the temperature of the temperature control execution unit according to the temperature value output by the temperature sensor, so that the temperature of the liquid flowing out of the liquid outlet of the chamber body 111 is maintained at the target temperature, and the temperature of the liquid flowing through the chamber body 111 can be controlled more accurately, and the effect of temperature control can be ensured.

[0062] like Figure 6 As shown, according to the second aspect of the embodiment of the present application, a cleaning system 200 is provided, comprising: a circulation pump 210, a cleaning chamber 220, and a temperature control device 100 as provided in any embodiment of the first aspect. The circulation pump 210 is communicated with the cleaning chamber 220 and the temperature control device 100, respectively, and is used to transfer the liquid discharged from the temperature control device 100 to the cleaning chamber 220. The cleaning chamber 220 is used to clean the wafer with the liquid discharged from the temperature control device 100.

[0063] The temperature control device 100 in the embodiment of the present application is used to process the chemical liquid for cleaning the wafer and control the temperature of the chemical liquid, so that the cleaning chamber 220 uses the chemical liquid with suitable temperature to clean the wafer. The circulation pump 210 can be arranged between the cleaning chamber 220 and the temperature control device 100, or it can not be arranged between the cleaning chamber 220 and the temperature control device 100, as long as it can push the chemical liquid to flow between the temperature control device 100 and the cleaning chamber 220. Under the suction / thrust action of the circulation pump 210, the chemical liquid enters the temperature control device 100 and is discharged from the temperature control device 100 until it is transported to the cleaning chamber 220.

[0064] The cleaning system 200 of this embodiment is based on the same utility model concept as the embodiment of the aforementioned temperature control device 100. The wafer is cleaned by the chemical liquid processed by the aforementioned temperature control device 100. Its specific implementation method and beneficial effects can be referred to the above embodiments and will not be repeated here.

[0065] In the implementation of this application, the cleaning chamber can be Figure 7 The cleaning chamber 220 shown in the figure uses a nozzle to clean the wafer 230; it can also be Figure 8The cleaning chamber shown uses chemical liquid to immerse the wafer 230 and uses ultrasonic vibration to clean the wafer 230. Of course, the cleaning chamber 220 can also use other suitable methods to clean the wafer, such as using a roller brush to clean the wafer.

[0066] like Figure 7 As shown, in some optional embodiments, before the chemical liquid enters the temperature control device 100, the temperature T1 of the chemical liquid before entering the temperature control device 100 can be detected by a temperature sensor at the liquid inlet of the temperature control device 100 or other suitable locations. When the chemical liquid flows out of the temperature control device 100, the temperature T2 of the chemical liquid when it flows out of the temperature control device 100 can be detected by a temperature sensor at the liquid outlet of the temperature control device 100 or other suitable locations. The temperature control device 100 can control the size of T2 so that the chemical liquid entering the cleaning chamber 220 maintains a suitable temperature. The chemical liquid can be a new liquid configured in the relevant factory building, or it can be a used circulating liquid flowing out of the cleaning chamber 220, as long as it meets the requirements for cleaning the wafers. It should be understood that in the embodiment of the present application, the circulating pump 210 can be arranged at Figure 7 between the “chemical liquid” in the cleaning chamber and the temperature control device 100 , or between the temperature control device 100 and the cleaning chamber 220 .

[0067] In some optional embodiments, the circulation pump 210 is further used to transfer the liquid in the cleaning chamber 220 back to the temperature control device 100 to circulate the liquid in the cleaning chamber 220 .

[0068] The liquid outlet of the temperature control device 100 may be connected to the liquid inlet of the cleaning chamber 220, and the liquid inlet of the temperature control device 100 may be connected to the liquid outlet of the cleaning chamber 220. Figure 8 As shown, the chemical liquid flowing out of the liquid outlet of the cleaning chamber 220 can be transferred back to the temperature control device 100 through the circulation pump 210, so as to recycle the chemical liquid retained in the cleaning chamber 220 and reduce the cleaning cost of the wafer. It should be noted that the chemical liquid flowing out of the cleaning chamber 220 can be precipitated and filtered before being transferred back to the temperature control device 100 to reduce impurities in the chemical liquid and avoid the impurities in the chemical liquid affecting the cleaning effect on the wafer.

[0069] It should be pointed out that, according to the needs of implementation, the various components / steps described in the embodiments of the present application can be split into more components / steps, or two or more components / steps or partial operations of components / steps can be combined into new components / steps to achieve the purpose of the embodiments of the present application.

[0070] The above-mentioned method or step according to the embodiment of the present application can be implemented in hardware, firmware, or implemented as software or computer code that can be stored in a recording medium (such as a CD-ROM, RAM, floppy disk, hard disk or magneto-optical disk), or implemented as a computer code originally stored in a remote recording medium or a non-temporary machine-readable medium downloaded through a network and stored in a local recording medium, so that the method described herein can be stored in such software processing on a recording medium using a general-purpose computer, a dedicated processor or programmable or dedicated hardware (such as an application-specific integrated circuit (ASIC) or a field programmable gate array (FPGA)). It can be understood that a computer, a processor, a microprocessor controller or programmable hardware includes a storage component (e.g., a random access memory (RAM), a read-only memory (ROM), a flash memory, etc.) that can store or receive software or computer code, and when the software or computer code is accessed and executed by a computer, a processor or hardware, the method described herein is implemented. In addition, when a general-purpose computer accesses the code for implementing the method shown here, the execution of the code converts the general-purpose computer into a dedicated computer for executing the method shown here.

[0071] Those of ordinary skill in the art will appreciate that the units and method steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the embodiments of the present application.

[0072] The above implementation methods are only used to illustrate the embodiments of the present application, and are not limitations on the embodiments of the present application. Ordinary technicians in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the embodiments of the present application. Therefore, all equivalent technical solutions also belong to the scope of the embodiments of the present application. The scope of patent protection of the embodiments of the present application should be limited by the claims.

Claims

1. A temperature control device, characterized in that: include: A heat exchange chamber, the heat exchange chamber comprising a chamber body and a chamber cover; a heat exchange cavity is opened on the side of the chamber body, a flow channel partition is arranged in the heat exchange cavity, and the flow channel partition divides the heat exchange cavity into continuous heat exchange flow channels; the chamber cover is arranged on the side of the chamber body where the heat exchange cavity is opened, and the chamber cover is connected to the chamber body to seal the heat exchange cavity; A heat conducting plate, one side of which is in contact with the chamber cover; the heat conducting plate is used to exchange heat with the heat exchange channel through the chamber cover, and to evenly apply force to the chamber cover to enhance the pressure bearing capacity of the heat exchange chamber.

2. The device according to claim 1, characterized in that The heat exchange chamber comprises two heat exchange channels, and the two heat exchange channels are respectively arranged on two opposite sides of the chamber body.

3. The device according to claim 2, characterized in that The chamber body is also provided with a liquid inlet, a liquid outlet, a first diversion hole and a second diversion hole; The first diverter hole is connected to the liquid inlet, and the first diverter hole is connected to one end of the two heat exchange channels respectively; the second diverter hole is connected to the liquid outlet, and the second diverter hole is connected to the other end of the two heat exchange channels respectively.

4. The device according to claim 2, characterized in that Of the two heat exchange channels, the first heat exchange channel exchanges heat with the first heat conducting plate through the first chamber cover plate; the second heat exchange channel exchanges heat with the second heat conducting plate through the second chamber cover plate; and, The first heat conducting plate and the second heat conducting plate are connected via fasteners, and the heat exchange chamber is clamped between the first heat conducting plate and the second heat conducting plate.

5. The device according to any one of claims 1 to 4, characterized in that The temperature control device further comprises a temperature control execution unit, and the temperature control execution unit is attached to the heat conducting plate; The temperature control execution unit is used to release heat to the heat conducting plate, or absorb heat from the heat conducting plate.

6. The device according to claim 5, characterized in that The temperature control device also includes a control unit; The control unit is electrically connected to the temperature control execution unit; and the control unit is used to control the temperature of the temperature control execution unit.

7. The device according to claim 6, characterized in that The liquid inlet and the liquid outlet of the chamber body are respectively provided with temperature sensors, and the temperature sensors are electrically connected to the control unit; The control unit is used to adjust the temperature of the temperature control execution unit according to the temperature value output by the temperature sensor.

8. The device according to any one of claims 1 to 4, characterized in that The connection between the chamber cover and the chamber body is a welding connection, and the chamber cover and the chamber body are made of fluoroplastic.

9. A cleaning system, characterized in that: include: A circulation pump, a cleaning chamber and a temperature control device as claimed in any one of claims 1 to 8; The circulation pump is communicated with the cleaning chamber and the temperature control device respectively, and is used to transfer the liquid discharged from the temperature control device to the cleaning chamber; The cleaning chamber is used to clean wafers using liquid discharged by the temperature control device.

10. The cleaning system according to claim 9, characterized in that: The circulation pump is also used to transmit the liquid in the cleaning chamber back to the temperature control device, so as to circulate the liquid in the cleaning chamber.

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