Positioning mechanism

Abstract

The utility model discloses a positioning mechanism, the positioning mechanism comprises a fixing frame, a forward pushing device and a downward pressing device, the forward pushing device and the downward pressing device are used for positioning a semiconductor component, the forward pushing device and the downward pressing device are installed on the fixing frame, the forward pushing device comprises a first air cylinder, a first sliding block, a first buffering piece and a first pushing block, the first air cylinder is provided with a linear sliding rail, the first sliding block is arranged on the linear sliding rail in a matched mode, the first pushing block is installed on the first sliding block through the first buffering piece, and when the semiconductor component arrives at a designated position, the first pushing block pushes the semiconductor component to move. The first pushing block pushes the semiconductor component to a preset position through the first air cylinder and cooperates with the downward pressing device and the first buffering piece to conduct limiting and buffering, the semiconductor component is prevented from being damaged, and more positioning accuracy is guaranteed.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor component positioning mechanisms, and more specifically, to a positioning mechanism. Background Art

[0002] Semiconductors refer to materials whose electrical conductivity at room temperature is between that of conductors and insulators. They are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, circuit board chips are devices made of semiconductors.

[0003] At present, the existing positioning mechanism is generally static positioning, which produces inaccurate positioning and unsatisfactory positioning effect, thereby affecting the stability of subsequent workstations and easily causing machine failure. Therefore, a positioning mechanism with accurate positioning and good compatibility is designed. Utility Model Content

[0004] The technical problem to be solved by the utility model is to provide a positioning mechanism with accurate positioning and good compatibility.

[0005] The purpose of this utility model is achieved through the following technical solutions:

[0006] A positioning mechanism comprises a fixed frame, a forward pushing device and a downward pressing device for positioning semiconductor components, the forward pushing device and the downward pressing device are installed on the fixed frame, the forward pushing device comprises a first cylinder, a first slider, a first buffer and a first pushing block, the first cylinder is provided with a linear slide rail, the first slider is cooperated with the linear slide rail, the first pushing block is installed on the first slider through the first buffer, when the semiconductor component reaches the specified position, the first pushing block pushes the semiconductor component to a preset position through the first cylinder, and cooperates with the downward pressing device and the first buffer for limiting and buffering.

[0007] Furthermore, the first buffer member includes a compression spring, the first sliding block is provided with at least one shaft rod, the compression spring is sleeved on the shaft rod, and the first push block is installed on the shaft rod sleeved with the compression spring.

[0008] Furthermore, the pressing device comprises a second cylinder, a second buffer and a second pressing block, the second buffer is sleeved on the piston of the second cylinder, and the second pressing block is arranged on the second buffer.

[0009] Furthermore, the pressing device includes a fixed block and a fixed plate, the fixed plate is arranged on the fixed frame, a fixed groove is arranged on the fixed plate, the second cylinder is fixed to the fixed groove through the fixed block, and a strip-shaped limiting hole is arranged at the bottom of the fixed groove.

[0010] Furthermore, the second buffer member includes a silicone sleeve.

[0011] The utility model provides a forward pushing device and a downward pressing device. The forward pushing device pushes the semiconductor component to the bottom edge of the placement groove for placing the semiconductor component to achieve alignment and positioning. The semiconductor component can be accurately positioned in the placement groove of the corresponding workstation, so that the semiconductor component reaches the required positioning position. At the same time, the downward pressing device exerts a downward force on the semiconductor component, so that the semiconductor component is not ejected, thereby ensuring the stability of the semiconductor component in the subsequent workstation and not prone to machine failure; when the first cylinder pushes the first pushing block to apply force to the semiconductor component, the first buffer will buffer it to avoid damage to the semiconductor component and ensure greater positioning accuracy; and the first pushing block only needs to push the semiconductor component to the bottom edge of the corresponding placement groove for alignment, and there are no special requirements for the specifications of the placement groove and the specifications of the semiconductor component, so the positioning of the semiconductor component can be well completed, with better compatibility. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a structural schematic diagram of a positioning device according to an embodiment of the utility model;

[0013] Figure 2 It is an exploded schematic diagram of the positioning device of an embodiment of the utility model;

[0014] Wherein: 10, positioning mechanism, 11, fixing frame, 20, forward pushing device, 21, first cylinder, 211, linear guide rail, 22, first slider, 23, first buffer, 24, first pushing block, 25, shaft rod, 30, pressing device, 31, second cylinder, 32, second buffer, 33, second pressing block, 34, fixing block, 35, fixing plate, 351, fixing groove, 352, strip limiting hole. DETAILED DESCRIPTION

[0015] In the description of the present utility model, it should be understood that the terms "center", "lateral", "up", "down", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.

[0016] In the description of the present invention, unless otherwise specified, "plurality" means two or more. In addition, the term "include" and any variation thereof are intended to cover non-exclusive inclusions.

[0017] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0018] The utility model is further described below in conjunction with the accompanying drawings and preferred embodiments.

[0019] like Figure 1 and Figure 2 As described, the present embodiment discloses a positioning mechanism 10, which includes a fixed frame 11, a forward pushing device 20 and a downward pressing device 30 for positioning semiconductor components. The forward pushing device 20 and the downward pressing device 30 are installed on the fixed frame 11. The forward pushing device 20 includes a first cylinder 21, a first slider 22, a first buffer 23 and a first push block 24. The first cylinder 21 is provided with a linear slide rail 211, and the first slider 22 is cooperated with the linear slide rail 211. The first push block 24 is installed on the first slider 22 through the first buffer 23. When the semiconductor component reaches the specified position, the first push block 24 pushes the semiconductor component to a preset position through the first cylinder 21, and cooperates with the downward pressing device 30 and the first buffer 23 for limiting and buffering.

[0020] By setting a forward pushing device 20 and a downward pressing device 30, the forward pushing device 20 pushes the semiconductor component to the bottom edge of the placement groove for placing the semiconductor component to achieve alignment and positioning. The semiconductor component can be accurately positioned in the placement groove of the corresponding workstation, so that the semiconductor component reaches the required positioning position. At the same time, the downward pressing device 30 will exert a downward force on the semiconductor component so that the semiconductor component will not be ejected, thereby ensuring the stability of the semiconductor component in the subsequent workstation and not prone to machine failure; when the first cylinder 21 pushes the first pushing block 24 to apply force to the semiconductor component, the first buffer member 23 will buffer it to avoid damage to the semiconductor component, ensure the accuracy of positioning, and make the positioning effect better; and the first pushing block 24 only needs to push the semiconductor component to the bottom edge of the corresponding placement groove for alignment, and there are no special requirements for the specifications of the placement groove and the specifications of the semiconductor component, so the positioning of the semiconductor component can be well completed, with better compatibility.

[0021] Among them, the first buffer member 23 includes a compression spring, and at least one shaft rod 25 is provided on the first slider 22. The compression spring is sleeved on the shaft rod 25. The first push block 24 is installed on the shaft rod 25 sleeved with the compression spring. Generally, two shaft rods 25 are provided. The first push block 24 is sleeved on the shaft rod 25. When the first cylinder 21 applies force to the semiconductor components through the first push block 24, the compression spring will buffer the semiconductor components to avoid damage to the semiconductor components and ensure the stability of the processing of subsequent workstations; of course, the first buffer member 23 can also adopt components with buffering function, such as silicone sleeves, rubber sleeves, etc.

[0022] Among them, the pressing device 30 includes a second cylinder 31, a second buffer 32 and a second pressure block 33. The second buffer 32 is sleeved on the piston of the second cylinder 31, and the second pressure block 33 is arranged on the second buffer 32. Directly pressing the second buffer 32 on the piston of the second cylinder 31 can further reduce the overall volume of the positioning mechanism 10 while ensuring a better buffering effect, thereby better protecting the semiconductor components. When the pressing device 30 is working, it will apply a downward force to the semiconductor components, so that the semiconductor components will not be ejected, thereby avoiding damage to the semiconductor components; optionally, the second buffer 32 includes a silicone sleeve, which can ensure a better buffering effect and further reduce the volume of the positioning mechanism 10.

[0023] Among them, the pressing device 30 includes a fixed block 34 and a fixed plate 35. The fixed plate 35 is arranged on the fixed frame 11. The fixed plate 35 is provided with a fixing groove 351. The second cylinder 31 is fixed to the fixing groove 351 through the fixing block 34. The bottom of the fixing groove 351 is provided with a strip limiting hole 352. Through the coordinated setting of the fixing groove 351 and the fixing block 34, it is convenient to adjust the installation position of the fixing block 34 according to semiconductor components of different thicknesses, so that the pressing device 30 can better adapt to the positioning of semiconductor components of different models. The installation position of the fixing block 34 is adjusted by the strip limiting hole 352, so that the positioning mechanism 10 has better compatibility.

[0024] The above contents are further detailed descriptions of the present invention in combination with specific preferred implementations, and the specific implementation of the present invention cannot be considered to be limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.

Claims

1. A positioning mechanism, It is characterized in that The positioning mechanism includes a fixed frame, a forward pushing device and a downward pressing device for positioning semiconductor components, the forward pushing device and the downward pressing device are installed on the fixed frame, the forward pushing device includes a first cylinder, a first slider, a first buffer and a first pushing block, the first cylinder is provided with a linear slide rail, the first slider is cooperated with the linear slide rail, the first pushing block is installed on the first slider through the first buffer, when the semiconductor component reaches the specified position, the first pushing block pushes the semiconductor component to a preset position through the first cylinder, and cooperates with the downward pressing device and the first buffer for limiting and buffering.

2. A positioning mechanism as claimed in claim 1, It is characterized in that The first buffer member comprises a compression spring, the first sliding block is provided with at least one shaft rod, the compression spring is sleeved on the shaft rod, and the first pushing block is mounted on the shaft rod sleeved with the compression spring.

3. A positioning mechanism as claimed in claim 1, It is characterized in that The pressing device comprises a second cylinder, a second buffer and a second pressing block. The second buffer is sleeved on the piston of the second cylinder, and the second pressing block is arranged on the second buffer.

4. A positioning mechanism as claimed in claim 3, It is characterized in that The pressing device comprises a fixing block and a fixing plate, wherein the fixing plate is arranged on the fixing frame, a fixing groove is arranged on the fixing plate, the second cylinder is fixed to the fixing groove through the fixing block, and a strip-shaped limiting hole is arranged at the bottom of the fixing groove.

5. A positioning mechanism as claimed in claim 3, It is characterized in that The second buffer member includes a silicone sleeve.

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