Circuit board

Abstract

The utility model discloses a circuit board. The circuit board comprises a circuit structure; the circuit structure comprises an interconnection line between the elements and convex structures located on the two sides of the interconnection line; the interconnection lines are connected with the convex structures; the convex structures are connected with the correspondingly arranged interconnection lines; the vertical distance between the farthest ends of the protruding structures and the interconnection lines and the interconnection lines is S1, the vertical distance between the adjacent protruding structures between the adjacent different interconnection lines is S2, the height of the protruding structures is H, and S1, S2 and H are set to be equal. According to the utility model, the purpose of adjusting the impedance of the line structure is realized by adjusting the transverse side length of the top surface and / or the transverse side length of the bottom surface of the convex structure, so that the impedance matching between the line structure and the line 2 arranged close to the memory is realized, and the signal transmission quality is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of printed circuit boards, in particular to a circuit board. Background Art

[0002] Impedance is an important indicator in circuit board design. Impedance is mainly related to line width, line distance, line thickness, dielectric layer thickness and dielectric layer dielectric constant. The larger the line width, the smaller the impedance; the larger the line distance, the greater the impedance; the thicker the line thickness, the smaller the impedance; the thicker the dielectric layer thickness, the greater the impedance; the greater the dielectric constant of the dielectric layer, the smaller the impedance.

[0003] At present, the circuit structure of conventional circuit boards is a smooth single line or differential line. With the upgrading of server products, the signal transmission rate is getting faster and faster, and the lines that need to be laid out per unit area are becoming more and more dense. Figure 1 As shown, especially for the wiring near the main chip, the space becomes smaller and smaller, the line width W1 corresponding to line 1 also becomes smaller and smaller, and the corresponding impedance will become higher and higher; while near the memory position, because there is enough space, the line width corresponding to line 2 can be designed to be W2, and the line width W2 can meet the conventional impedance requirements. Due to the impedance mismatch between line 1 and line 2, the signal transmission quality is reduced. Utility Model Content

[0004] The utility model provides a circuit board to solve the problem of impedance mismatch between different circuits.

[0005] According to one aspect of the utility model, a circuit board is provided, the circuit board comprising: a circuit structure;

[0006] The circuit structure includes interconnection lines between components and protrusion-shaped structures located on both sides of the interconnection lines; the interconnection lines are connected to the protrusion-shaped structures;

[0007] The protruding structure is connected to the corresponding interconnection line; the vertical distance between the farthest end of the protruding structure and the interconnection line is S1, the vertical distance between adjacent protruding structures of different adjacent interconnections is S2, the height of the protruding structure is H, and S1, S2 and H are set to be equal.

[0008] Optionally, the cross-sectional shape of the protruding structure includes: a trapezoid; the protruding structure includes a top surface and a bottom surface, the area of ​​the bottom surface is larger than the area of ​​the top surface, and the bottom surface is in contact with the interconnection line.

[0009] Optionally, the cross-sectional shape of the protrusion-shaped structure includes: a rectangle.

[0010] Optionally, the cross-sectional shape of the protruding structure includes: an isosceles triangle; the base of the isosceles triangle contacts the interconnection line.

[0011] Optionally, S1, S2, and H are all set to 4 mil.

[0012] Optionally, the width of the interconnection line is W, and S1, S2, H and W are set to be equal.

[0013] Optionally, S1, S2, H, and W are all set to 4 mil.

[0014] Optionally, the interconnect comprises a first side and a second side;

[0015] The protrusion-shaped structure arranged on the first side and the adjacent protrusion-shaped structure arranged on the second side are arranged at intervals.

[0016] Optionally, the cross-sectional shapes of the protrusion-like structures are the same in size.

[0017] Optionally, the circuit board's circuit structure connects the chip and the memory, and the protruding structure is disposed close to the chip.

[0018] The technical solution of the utility model provides a circuit board, the circuit board includes a circuit structure, the circuit structure includes interconnection lines and a protruding structure. The circuit structure can be arranged between a main chip and a memory, and is arranged close to the main chip. By arranging the protruding structure, under the premise of ensuring that the vertical distance between the farthest end of the protruding structure and the interconnection line, the height of the protruding structure, and the vertical distance between adjacent protruding structures between adjacent interconnection lines are set to be the same, the purpose of adjusting the impedance of the circuit structure is achieved by adjusting the lateral side length of the top surface of the protruding structure and / or the lateral side length of the bottom surface, thereby achieving impedance matching between the circuit structure and the circuit 2 arranged close to the memory, and improving the signal transmission quality.

[0019] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present utility model, nor are they intended to limit the scope of the present utility model. Other features of the present utility model will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 It is a cross-sectional schematic diagram of a circuit structure in a circuit board in the prior art;

[0022] Figure 2It is a cross-sectional schematic diagram of a circuit structure in a circuit board provided by an embodiment of the utility model;

[0023] Figure 3 It is a cross-sectional schematic diagram of another circuit structure in a circuit board provided by an embodiment of the utility model;

[0024] Figure 4 It is a cross-sectional schematic diagram of another circuit structure in a circuit board provided by an embodiment of the utility model;

[0025] Figure 5 It is a cross-sectional schematic diagram of another circuit structure in a circuit board provided in an embodiment of the utility model. DETAILED DESCRIPTION

[0026] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0027] It should be noted that the terms "first", "second", etc. in the specification and claims of the utility model and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the utility model described here can be implemented in an order other than those illustrated or described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0028] Figure 2 1 is a cross-sectional schematic diagram of a circuit structure in a circuit board provided by an embodiment of the utility model. The circuit board may include a circuit structure 1. Figure 2 As shown, the circuit structure 1 includes an interconnection line 11 between components and a protrusion-shaped structure 12 located on both sides of the interconnection line 11 ; the interconnection line 11 is connected to the protrusion-shaped structure 12 .

[0029] The protruding structure 12 is connected to the corresponding interconnection line 11; the vertical distance between the farthest end of the protruding structure 12 and the interconnection line 11 is S1, the vertical distance between adjacent protruding structures 12 of different adjacent interconnection lines 11 is S2, the height of the protruding structure 12 is H, and S1, S2 and H are set to be equal.

[0030] In the embodiment of the utility model, the interconnection line 11 includes a smooth single line or differential line structure conventionally designed in current circuit boards. The interconnection line 11 may be line 1.

[0031] Specifically, the circuit board can be arranged with a circuit structure 1, the circuit structure 1 includes an interconnection line 11 and a protruding structure 12, the protruding structure 12 is arranged on both sides of the interconnection line 11, and the protruding structure 12 on one side of the interconnection line 11 can be arranged at a first preset distance interval, and the first preset distance can be preset according to specific product requirements. And adjacent protruding structures 12 arranged on different sides of the interconnection line 11 can be arranged at a second preset distance interval, and the second preset distance can be preset according to specific product requirements. For example, the second preset distance can be set to 0, that is, adjacent protruding structures 12 arranged on different sides of the interconnection line 11 can also be arranged relative to each other. The protruding structure 12 is connected to the interconnection line 11 to form a complete circuit structure 1. The protruding structures 12 are arranged on both sides of the interconnection line 11 in sequence, which can increase the overall circuit area of ​​the circuit structure 1 on the basis of ensuring the minimum circuit spacing, thereby reducing the impedance of the circuit structure 1.

[0032] The vertical distance between the farthest end of the protruding structure 12 and the interconnection line 11 and the interconnection line 11 is set to S1, the height of the protruding structure 12 is set to H, the vertical distance between adjacent protruding structures 12 between adjacent interconnections 11 is set to S2, and the sizes of S1, S2 and H are set to be the same. When the sizes of S1, S2 and H are the same, the impedance design effect of the circuit structure 1 is the best. The protruding structure 12 may include a top surface and a bottom surface, or only include a bottom surface, and the bottom surface is a surface connected to the interconnection line 11. The purpose of adjusting the impedance of the circuit structure 1 can be achieved by continuing to adjust the lateral side length h2 of the top surface and / or the lateral side length h1 of the bottom surface.

[0033] Continue to refer Figure 2 The circuit structure 1 can be arranged between the main chip and the memory, and the circuit structure 1 is arranged close to the main chip to realize the electrical connection between the main chip and the memory. The circuit structure 1 can also be arranged between other electronic components on the circuit board to realize the electrical connection between other different components. It can also be arranged on the inner core board in the circuit board to realize the interconnection of multi-layer circuit boards. No specific limitation is made here.

[0034] The technical solution of the embodiment of the utility model provides a circuit board, the circuit board includes a circuit structure, the circuit structure includes interconnection lines and a protruding structure. The circuit structure can be arranged between the main chip and the memory, and is arranged close to the main chip. By setting the protruding structure, under the premise of ensuring that the vertical distance between the farthest end of the protruding structure and the interconnection line, the height of the protruding structure, and the vertical distance between adjacent protruding structures between adjacent interconnection lines are set to be the same, the purpose of adjusting the impedance of the circuit structure is achieved by adjusting the lateral side length of the top surface of the protruding structure and / or the lateral side length of the bottom surface, thereby achieving impedance matching between the circuit structure and the circuit 2 arranged close to the memory, and improving the signal transmission quality.

[0035] Figure 3 FIG. 1 is a cross-sectional schematic diagram of another circuit structure in a circuit board provided by an embodiment of the present utility model. Figure 3 As shown, the cross-sectional shape of the protruding structure 12 includes: a trapezoid; the protruding structure 12 includes a top surface and a bottom surface, the area of ​​the bottom surface is larger than the area of ​​the top surface, and the bottom surface contacts the interconnection line 11.

[0036] Specifically, the cross-sectional shape of the protruding structure 12 can be a trapezoid, in which case the protruding structure 12 includes a top surface and a bottom surface, and the area of ​​the bottom surface is larger than the area of ​​the top surface. The trapezoid includes an upper base and a lower base, and the cross-sectional shape of the top surface of the protruding structure 12 corresponds to the upper base of the trapezoid, and the cross-sectional shape of the bottom surface of the protruding structure 12 corresponds to the lower base of the trapezoid. The area of ​​the bottom surface of the protruding structure 12 is larger than the area of ​​the top surface, which also indicates that the length W1 of the lower base of the trapezoid is larger than the length W2 of the upper base.

[0037] The vertical distance between the farthest end of the protruding structure 12 and the interconnection line 11 is set to S1, that is, the vertical distance between the upper base of the trapezoid and the interconnection line 11 is S1; the height of the protruding structure 12 is set to H, that is, the height of the trapezoid is H; the vertical distance between adjacent protruding structures 12 between adjacent interconnections 11 is set to S2. S1, S2 and H are set to be the same. The length of the lower base of the trapezoid corresponds to the lateral length of the bottom surface of the protruding structure 12, and the length of the upper base of the trapezoid corresponds to the lateral length of the top surface of the protruding structure 12. The purpose of adjusting the impedance of the circuit structure 1 is achieved by adjusting the length W1 of the lower base and the length W2 of the upper base of the trapezoid. The larger the length W1 of the lower base and the length W2 of the upper base, the smaller the impedance value of the corresponding circuit structure 1.

[0038] Figure 4 FIG. 1 is a cross-sectional schematic diagram of another circuit structure in a circuit board provided by an embodiment of the present utility model. Figure 4 As shown, the cross-sectional shape of the protrusion-shaped structure 12 includes: a rectangle.

[0039] Specifically, the cross-sectional shape of the protruding structure 12 can be a rectangle, in which case the protruding structure 12 includes a top surface and a bottom surface, and the area of ​​the bottom surface is the same as the area of ​​the top surface. The rectangle includes a first long side and a second long side, and the cross-sectional shape of the top surface of the protruding structure 12 corresponds to the first long side of the rectangle, and the cross-sectional shape of the bottom surface of the protruding structure 12 corresponds to the second long side of the rectangle. The area of ​​the bottom surface of the protruding structure 12 is the same as the area of ​​the top surface, which also indicates that the length of the first long side of the rectangle is the same as the length of the second long side, and the length of the first long side of the rectangle and the length of the second long side are both W3.

[0040] The vertical distance between the farthest end of the protruding structure 12 and the interconnection line 11 is set to S1, that is, the vertical distance between the first long side of the rectangle and the interconnection line 11 is S1; the height of the protruding structure 12 is set to H, that is, the width of the rectangle is H; the vertical distance between adjacent protruding structures 12 between adjacent interconnections 11 is set to S2. S1, S2 and H are set to be the same. The length of the second long side of the rectangle corresponds to the lateral length of the bottom surface of the protruding structure 12, and the length of the first long side of the rectangle corresponds to the lateral length of the top surface of the protruding structure 12. The purpose of adjusting the impedance of the circuit structure 1 is achieved by adjusting the length of the first long side and the length of the second long side W3 of the rectangle. The larger the length of the first long side and the length of the second long side W3, the smaller the impedance value of the corresponding circuit structure 1.

[0041] Figure 5 FIG. 1 is a cross-sectional schematic diagram of another circuit structure in a circuit board provided by an embodiment of the present utility model. Figure 5 As shown, the cross-sectional shape of the protruding structure 12 includes: an isosceles triangle; the base of the isosceles triangle contacts the interconnection line.

[0042] Specifically, the cross-sectional shape of the protruding structure 12 can be an isosceles triangle, in which case the protruding structure 12 only includes the bottom surface. The isosceles triangle includes a bottom side, and the cross-sectional shape of the bottom surface of the protruding structure 12 corresponds to the bottom side of the isosceles triangle. The isosceles triangle also includes a vertex, and the length of the bottom side of the isosceles triangle is set to W4.

[0043] The vertical distance between the farthest end of the protruding structure 12 and the interconnection line 11 is set to S1, that is, the vertical distance between the vertex of the isosceles triangle and the interconnection line 11 is S1; the height of the protruding structure 12 is set to H, that is, the height of the isosceles triangle is H; the vertical distance between adjacent protruding structures 12 between adjacent interconnections 11 is set to S2. S1, S2 and H are set to be the same. The length of the base of the isosceles triangle corresponds to the lateral length of the bottom surface of the protruding structure 12. The purpose of adjusting the impedance of the line structure 1 is achieved by adjusting the length W4 of the base of the isosceles triangle. The larger the length W4 of the base, the smaller the impedance value of the corresponding line structure 1.

[0044] By designing three different cross-sectional shapes corresponding to the protruding structures 12 on the high-speed signal transmission line in a densely located position to match the impedance requirements, the corresponding impedance results of the protruding structures 12 corresponding to the three different cross-sectional shapes are different. The key dimension design of the protruding structure 12 is standardized according to the product characteristics to ensure the design standardization and consistency. The actual product production can select the protruding structures 12 corresponding to the above three different cross-sectional shapes to match the corresponding impedance according to the impedance requirements. Each protruding structure 12 can also obtain different impedance values ​​by adjusting the lateral side length h2 of the top surface and / or the lateral side length h1 of the bottom surface to ensure the actual product impedance requirements.

[0045] Optionally, S1, S2, and H are all set to 4 mil.

[0046] Specifically, the vertical distance between the farthest end of the protruding structure and the interconnection line is set to S1, the height of the protruding structure is set to H, the vertical distance between adjacent protruding structures between adjacent interconnections is set to S2, and the sizes of S1, S2 and H are set to be the same. S1, S2 and H can be set to 4mil, the line structure can be arranged between the main chip and the memory, and the line structure is set close to the main chip. S1, S2 and H are set to 4mil, which can meet the impedance matching between the line structure and the line 2 set close to the memory. The sizes of S1, S2 and H can also be set to be larger or smaller, and the specific design needs to be made according to the specific product.

[0047] Continue to refer Figure 2 , the width of the interconnection line 11 is W, and S1, S2, H and W are set to be equal.

[0048] Specifically, the vertical distance between the farthest end of the protruding structure 12 and the interconnection line 11 is set to S1, the height of the protruding structure 12 is set to H, the vertical distance between adjacent protruding structures 12 between adjacent interconnections 11 is set to S2, and the sizes of S1, S2 and H are set to be the same. The width of the interconnection line 11 is W, and the sizes of S1, S2, H and W can be set to be equal. When the sizes of S1, S2, H and W are the same, the impedance design effect of the line structure 1 is the best, and the purpose of adjusting the impedance of the line structure 1 can be achieved by continuing to adjust the lateral side length h2 of the top surface and / or the lateral side length h1 of the bottom surface.

[0049] The cross-sectional shapes of the protruding structure 12 may include a trapezoid, a rectangle, and an isosceles triangle. When the sizes of S1, S2, H, and W are equal, the impedance value of the circuit structure 1 corresponding to the trapezoid is the lowest, the impedance value of the circuit structure 1 corresponding to the rectangle is the highest, and the impedance value of the circuit structure 1 corresponding to the isosceles triangle is between the impedance value of the circuit structure 1 corresponding to the trapezoid and the impedance value of the corresponding circuit structure 1. When manufacturing actual products, the protruding structures 12 corresponding to the above three cross-sectional shapes may be selected to match the corresponding impedance according to specific impedance requirements.

[0050] Optionally, S1, S2, H, and W are all set to 4 mil.

[0051] Specifically, the vertical distance between the farthest end of the protruding structure and the interconnection line is set to S1, the height of the protruding structure is set to H, the vertical distance between adjacent protruding structures between adjacent interconnections is set to S2, and the sizes of S1, S2 and H are set to be the same. The width of the interconnection line 11 is W, and the sizes of S1, S2, H and W can be set to be equal. S1, S2, H and W can be set to 4mil. The line structure can be arranged between the main chip and the memory, and the line structure is set close to the main chip. S1, S2, H and W are set to 4mil. At this time, the impedance matching between the line structure and the line 2 set close to the memory can be satisfied. The sizes of S1, S2, H and W can also be set to be larger or smaller. At this time, it is necessary to design specifically according to the specific product.

[0052] Continue to refer Figure 2 , the interconnection line 11 includes a first side and a second side.

[0053] The protrusion-shaped structure 12 disposed on the first side and the adjacent protrusion-shaped structure 12 disposed on the second side are disposed at intervals.

[0054] Specifically, the interconnection line 11 includes a first side and a second side, and the first side and the second side are both provided with a protruding structure 12. The protruding structures 12 provided on the first side of the interconnection line 11 can be arranged at intervals of a first preset distance, and the first preset distance can be preset according to specific product requirements. Adjacent protruding structures 12 provided on different sides of the interconnection line 11 can be arranged at intervals of a second preset distance, and the second preset distance can be preset according to specific product requirements. Exemplarily, the second preset distance can be half of the first preset distance. Exemplarily, the second preset distance can also be set to 0, that is, adjacent protruding structures 12 provided on different sides of the interconnection line 11 can also be arranged relatively.

[0055] Continue to refer Figure 2 The cross-sectional shapes of the protruding structures 12 are the same in size.

[0056] Specifically, a protruding structure 12 is provided on both sides of each interconnection line 11, and the cross-sectional shape of the protruding structure 12 may include a trapezoid, a rectangle and a triangle. The circuit structure 1 may be provided between the main chip and the memory, and the circuit structure 1 may be provided close to the main chip to realize the electrical connection between the main chip and the memory. The circuit structure 1 may also be provided between other electronic components on the circuit board to realize the electrical connection between other different components. The cross-sectional shapes of the protruding structures 12 on both sides of the multiple interconnections 11 provided between the two electronic components may be provided to be the same. For example, the cross-sectional shapes of the protruding structures 12 on both sides of the multiple interconnections 11 provided between the two electronic components may all be provided to be trapezoidal. And the cross-sectional shapes of the protruding structures 12 on both sides of the multiple interconnections 11 provided between the two electronic components may be provided to be the same in size. Since the electronic components are generally provided on the surface layer of the circuit board, by providing the cross-sectional shapes of the protruding structures 12 to be the same and the same in size, the difficulty of the circuit board manufacturing process may be reduced while realizing the impedance design requirements, while ensuring that the circuit board signal transmission is more stable.

[0057] The cross-sectional shape and size of the protruding structures 12 in all the circuit structures 1 set on the same circuit board need to be set to be the same, and the protruding structures 12 corresponding to the cross-sectional shapes with different shapes and sizes can be set on different circuit boards according to the actual impedance requirements. No specific limitation is made here, and it needs to be designed according to the specific product.

[0058] Continue to refer Figure 2 The circuit board's circuit structure 1 connects the chip and the memory, and the protruding structure 12 is disposed close to the chip.

[0059] Specifically, the circuit structure 1 can be arranged between the main chip and the memory, and the circuit structure 1 is arranged close to the main chip to realize the electrical connection between the main chip and the memory. At present, with the upgrading of various products, the signal transmission rate is required to be faster and faster, and the circuits that need to be arranged per unit area are becoming more and more dense. At the same time, the package size of the main chip is getting smaller and smaller, and the spacing between the pins is getting smaller and smaller, resulting in the wiring space near the main chip position becoming smaller and smaller. By arranging the circuit structure 1 close to the main chip, and adjusting the lateral side length of the top surface and / or the lateral side length of the bottom surface of the protruding structure 12 to achieve the purpose of adjusting the impedance of the circuit structure 1, the impedance matching of the circuit structure 1 and the circuit 2 arranged close to the memory is achieved, thereby improving the signal transmission quality.

[0060] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be performed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0061] The above specific implementations do not constitute a limitation on the protection scope of the present utility model. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.

Claims

1. A circuit board, characterized in that: include: Line structure; The circuit structure includes interconnection lines between components and protrusion-shaped structures located on both sides of the interconnection lines; the interconnection lines are connected to the protrusion-shaped structures; The convex structure is connected to the corresponding interconnection line; the vertical distance between the farthest end of the convex structure and the interconnection line is S1, the vertical distance between adjacent convex structures between adjacent different interconnections is S2, the height of the convex structure is H, and S1, S2 and H are set to be equal.

2. The circuit board according to claim 1, characterized in that: The cross-sectional shape of the protruding structure includes: a trapezoid; the protruding structure includes a top surface and a bottom surface, the area of ​​the bottom surface is larger than the area of ​​the top surface, and the bottom surface is in contact with the interconnection line.

3. The circuit board according to claim 1, characterized in that: The cross-sectional shape of the protrusion-shaped structure includes: a rectangle.

4. The circuit board according to claim 1, characterized in that: The cross-sectional shape of the protruding structure includes an isosceles triangle; the base of the isosceles triangle contacts the interconnection line.

5. The circuit board according to claim 1, characterized in that: The S1, S2 and H are all set to 4 mil.

6. The circuit board according to claim 1, characterized in that: The width of the interconnection line is W, and S1, S2, H and W are set to be equal.

7. The circuit board according to claim 6, characterized in that: The S1, S2, H and W are all set to 4 mil.

8. The circuit board according to any one of claims 1 to 7, characterized in that: The interconnect comprises a first side and a second side; The protrusion-shaped structure disposed on the first side and the adjacent protrusion-shaped structure disposed on the second side are disposed at intervals.

9. The circuit board according to any one of claims 1 to 8, characterized in that: The cross-sectional shapes of the protrusion-shaped structures are the same in size.

10. The circuit board according to claim 1, characterized in that: The circuit board has a circuit structure that connects the chip and the memory, and the protruding structure is disposed close to the chip.

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