Carrier heat dissipation device

Abstract

The utility model discloses a carrier heat dissipation device which comprises a frame body, a plurality of fans, a carrier containing disc and a fan containing disc. The placing tray is latticed and is connected with the rack body; the fan placing disc is connected with the frame body and arranged below the carrier placing disc, and the multiple fans are arranged on the fan placing disc. According to the utility model, the carrier can be erected, so that the heat dissipation area is increased; the fan can be independently controlled, and energy is saved; the structure is simple and movement is convenient; and the device is suitable for small-batch carrier heat dissipation.

Description

Technical Field

[0001] The utility model relates to the technical field of vehicle heat dissipation equipment, and in particular to a vehicle heat dissipation device. Background Art

[0002] Existing mobile phone and computer accessory circuit boards are flexible, so they usually need to be laid flat on the carrier to complete solder paste printing, patching, reflow and other production processes. This carrier is usually made of aluminum plate. When passing through the high-temperature reflow furnace, the aluminum will absorb the high temperature of about 250°C in the furnace. After leaving the furnace, the next production action cannot be carried out quickly due to the residual high temperature. It must be cooled to room temperature after heat dissipation before the next action can be carried out.

[0003] In the prior art, some use natural cooling to cool the carrier, which takes a long time and has low cooling efficiency. Some use a large fan to cool the carrier after passing through the furnace to reduce the surface temperature of the aluminum carrier. However, aluminum carrier jigs are usually stacked together, which makes it difficult for the fan to convect evenly, making it difficult to solve the problem of complete cooling of the aluminum carrier jigs. In addition, the large fan will also blow up some dust, making the air turbid. In addition, when only a small number of carriers need to be cooled, using a large fan will waste electricity. Summary of the invention

[0004] According to an embodiment of the utility model, a carrier heat dissipation device is provided, comprising:

[0005] Frame;

[0006] Several fans;

[0007] The carrier placement plate is in a grid shape and connected to the frame;

[0008] The fan placement plate is connected to the frame and is arranged below the carrier placement plate. A plurality of fans are arranged on the fan placement plate.

[0009] Furthermore, a plurality of V-shaped raised grilles are provided on the carrier placement plate, and the carrier can be placed upright by utilizing adjacent V-shaped raised grilles.

[0010] Furthermore, the carrier placement plate is made of stainless steel.

[0011] Furthermore, the fan placement plate is provided with a plurality of mounting grooves for mounting fans.

[0012] Furthermore, it also includes: four self-locking universal wheels, which are arranged under the frame and fixedly connected to the frame.

[0013] Furthermore, the frame is made of stainless steel.

[0014] Furthermore, several fans can be controlled to be turned on and off individually.

[0015] According to the carrier heat dissipation device of the embodiment of the utility model, the carrier can be erected to increase the heat dissipation area; the fan can be controlled individually to save energy; the structure is simple and easy to move; and it is suitable for heat dissipation of small batches of carriers.

[0016] It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the technology as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of a stereogram according to an embodiment of the utility model;

[0018] Figure 2 for Figure 1 Bottom view of . DETAILED DESCRIPTION

[0019] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings to further illustrate the present invention.

[0020] First, combine Figure 1~2 The carrier heat dissipation device according to the embodiment of the utility model is described, which is used in the technical field of carrier heat dissipation equipment and has a wide range of application scenarios.

[0021] like Figure 1~2 As shown, the carrier heat dissipation device of the embodiment of the utility model comprises:

[0022] Frame 1;

[0023] A number of fans 2;

[0024] The carrier placement plate 3 is in a grid shape for heat dissipation and is connected to the frame 1;

[0025] The fan placement tray 4 is connected to the frame 1 and is arranged below the carrier placement tray 3. A plurality of fans 2 are arranged on the fan placement tray 4. The fans 2 blow air upward to accelerate the heat dissipation of the carrier on the carrier placement tray 3.

[0026] Further, if Figure 1 As shown, in this embodiment, a plurality of V-shaped raised grilles 31 are provided on the carrier placement plate 3. The carrier can be placed upright by using adjacent V-shaped raised grilles 31, thereby greatly increasing the heat dissipation area.

[0027] Furthermore, in this embodiment, the carrier placement plate 3 is made of stainless steel and is not prone to rust.

[0028] Further, if Figure 1~2As shown, in this embodiment, a plurality of mounting grooves 41 are provided on the fan placement plate 4 for mounting fans 2, and the number of fans 2 can be installed according to demand.

[0029] Further, if Figure 1~2 As shown, in this embodiment, it also includes: four self-locking universal wheels 5, which are arranged under the frame 1 and fixedly connected to the frame 1 to facilitate the movement and locking of the frame 1.

[0030] Furthermore, in this embodiment, the frame 1 is made of stainless steel and is not prone to rust.

[0031] Furthermore, in this embodiment, a plurality of fans 2 can be controlled to be turned on and off individually, and the number of fans 2 to be turned on is determined according to demand.

[0032] When cooling, the frame 1 is pushed to a designated position, the universal wheels 5 are locked, and then the high-temperature carrier is placed upright between adjacent V-shaped raised grilles 31 , and the fan 2 below is turned on for cooling.

[0033] Above, refer to Figure 1~2 The vehicle heat dissipation device according to the embodiment of the utility model is described, which can make the vehicle stand up and increase the heat dissipation area; the fan can be controlled individually to save energy; the structure is simple and easy to move; and it is suitable for heat dissipation of small batches of vehicles.

[0034] It should be noted that, in this specification, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprises..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0035] Although the content of the utility model has been described in detail through the above preferred embodiments, it should be recognized that the above description should not be considered as a limitation of the utility model. After reading the above content, various modifications and substitutions of the utility model will be obvious to those skilled in the art. Therefore, the protection scope of the utility model should be limited by the attached claims.

Claims

1. A carrier heat dissipation device, characterized in that: Include: Frame; Several fans; A carrier placement plate, the placement plate is in a grid shape and connected to the frame; A fan placement plate is connected to the frame and is arranged below the carrier placement plate. The plurality of fans are arranged on the fan placement plate.

2. The carrier heat dissipation device according to claim 1, characterized in that: A plurality of V-shaped raised grids are arranged on the carrier placement plate.

3. The carrier heat dissipation device according to claim 1 or 2, characterized in that: The carrier placement plate is made of stainless steel.

4. The carrier heat dissipation device according to claim 1, wherein: The fan placement plate is provided with a plurality of installation slots for installing the fan.

5. The carrier heat dissipation device according to claim 1, wherein: It also comprises: four self-locking universal wheels, which are arranged below the frame and fixedly connected to the frame.

6. The carrier heat dissipation device according to claim 1, wherein: The frame is made of stainless steel.

7. The carrier heat dissipation device according to claim 1, wherein: The fans can be controlled to be turned on and off individually.

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