Liquid cooling plate and chip test pressure head

Abstract

The utility model discloses a liquid cooling plate and a chip testing pressure head, and relates to the technical field of chip testing. The liquid cooling plate comprises a liquid cooling plate body and at least two groups of turbulent flow assemblies; the liquid cooling plate body is internally provided with a flow channel for a liquid cooling working medium to flow, and the flow channel is provided with a width direction perpendicular to the flowing direction of the liquid cooling working medium; the at least two groups of turbulent flow assemblies are arranged in the flow channel at intervals in the width direction, each group of turbulent flow assemblies comprises a plurality of turbulent flow columns, and the turbulent flow columns in the two adjacent groups of turbulent flow assemblies are sequentially arranged in a staggered manner in the flowing direction of the liquid cooling working medium. The liquid cooling plate provided by the utility model can have relatively high heat dissipation efficiency.

Description

[0001] This application is required to be submitted to the China Patent Office on December 19, 2023, with application number

[0002] The present invention claims priority from Chinese patent application No. 2023234877711, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present application relates to the field of chip testing technology, and in particular to a liquid cooling plate and a chip testing pressure head. Background Art

[0004] With the continuous expansion of the semiconductor market and the continuous growth of demand for various electronic products, chips have been widely used in electronic products such as mobile phones, laptops, smart wearables, car electronics and desktop computers. Accordingly, chips will be widely used in various environments, such as low temperature environment, normal temperature environment and high temperature environment. Therefore, product design needs to ensure the effectiveness of chip operation at high and low temperatures.

[0005] However, there are currently few devices used for low-temperature testing of chips, and existing low-temperature testing equipment has problems such as low heat dissipation efficiency. Utility Model Content

[0006] The present application provides a liquid cooling plate and a chip test pressure head to improve heat dissipation efficiency.

[0007] The present application provides a liquid cooling plate, which is applied to a chip test pressure head, wherein the liquid cooling plate comprises a liquid cooling plate body and at least two groups of spoiler components;

[0008] A flow channel for the flow of liquid cooling medium is provided in the liquid cooling plate body, and the flow channel is configured with a width direction perpendicular to the flow direction of the liquid cooling medium;

[0009] The at least two groups of spoiler components are arranged in the flow channel at intervals in the width direction, each group of spoiler components includes a plurality of spoiler columns, and the spoiler columns in two adjacent groups of spoiler components are arranged alternately in sequence in the flow direction of the liquid-cooling medium.

[0010] Based on the above technical solution, the present application sets at least two groups of spoiler components in the flow channel of the liquid cooling plate body. On the one hand, the turbulent effect of the liquid cooling medium can be improved, and combined with the principle of convective heat transfer, the convective heat transfer coefficient between the liquid cooling medium and the liquid cooling plate can be improved, thereby improving the heat dissipation efficiency of the liquid cooling plate. On the other hand, by setting the at least two groups of spoiler components in the flow channel, the contact area between the liquid cooling plate and the liquid cooling medium can be increased, that is, the heat exchange area between the liquid cooling plate and the liquid cooling medium can be increased, thereby further improving the heat dissipation efficiency of the liquid cooling plate. Thus, when the liquid cooling plate 100 is applied to the chip test pressure head, the heat in the semiconductor refrigerator 220 can be quickly taken away by the liquid cooling plate 100, so that the semiconductor refrigerator 220 transfers the corresponding cold amount to the chip to be tested through the pressure head 240, thereby providing the required low temperature environment for the chip to be tested.

[0011] In some possible implementations, the liquid cooling plate includes two groups of spoiler components, and the two groups of spoiler components are arranged in the flow channel at intervals in the width direction;

[0012] Each group of the spoiler components includes a plurality of the spoiler columns, and the plurality of spoiler columns in the same group are sequentially spaced apart along the flow direction of the liquid-cooling medium.

[0013] In some possible implementations, along the width direction, a center distance M between two adjacent groups of spoiler components is 3 mm ≤ M ≤ 7 mm.

[0014] In some possible implementations, along the flow direction of the liquid-cooling medium, a center distance N between the spoiler column and adjacent spoiler columns in an adjacent spoiler assembly is 3 mm ≤ N ≤ 7 mm.

[0015] In some possible implementations, along the width direction, the center distance between two adjacent groups of spoiler components is M;

[0016] Along the flow direction of the liquid-cooling medium, the center distance between the spoiler column and the adjacent spoiler column in the adjacent spoiler assembly is N, wherein N=M.

[0017] In some possible implementations, the flow channel is an S-shaped flow channel.

[0018] In some possible implementations, the flow channel includes a first structural segment and a second structural segment which are alternately arranged in sequence, and the at least two groups of spoiler components are arranged in the first structural segment.

[0019] In some possible implementations, the flow channel is configured with an inlet structure and a flow channel body that are connected;

[0020] The cross-sectional area S1 of the inlet structure perpendicular to the flow direction of the liquid-cooling medium and the cross-sectional area S of the flow channel body perpendicular to the flow direction of the liquid-cooling medium satisfy:

[0021] In some possible implementations, the flow channel is configured with an outlet structure and a flow channel body that are connected;

[0022] The cross-sectional area S2 of the outlet structure perpendicular to the flow direction of the liquid-cooling medium and the cross-sectional area S of the flow channel body perpendicular to the flow direction of the liquid-cooling medium satisfy,

[0023] In addition, the present application also provides a chip test pressure head, including a pressure head, a semiconductor cooler and the liquid cooling plate provided in the above embodiments;

[0024] The liquid cooling plate is arranged between the pressure head and the semiconductor refrigerator. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 A schematic diagram of the side view structure of a liquid cooling plate in some embodiments is shown;

[0027] Figure 2 shows a schematic cross-sectional structure diagram of a liquid cooling plate in some embodiments;

[0028] Figure 3 A schematic diagram of the three-dimensional structure of a chip test indenter in some embodiments is shown;

[0029] Figure 4 A schematic cross-sectional structure diagram of a chip test indenter in some embodiments is shown;

[0030] Figure 5 Schematic diagrams of cross-sectional structures of chip test pressure heads in other embodiments are shown.

[0031] Description of main component symbols:

[0032] 100-Liquid cooling plate;

[0033] 110-liquid cooling plate body; 111-flow channel; 1111-flow channel body; 1111a-first structural section; 1111b-second structural section; 1112-inlet structure; 1113-outlet structure;

[0034] 120-spoiler assembly; 1201-first spoiler assembly; 1202-second spoiler assembly; 121-spoiler column;

[0035] 210 - first liquid cooling plate; 220 - semiconductor refrigerator; 230 - bracket; 240 - pressure head; 241 - contact plate; 242 - pressure block; 250 - second liquid cooling plate. DETAILED DESCRIPTION

[0036] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0037] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0038] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0039] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0040] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0041] like Figure 1 and Figure 2 As shown, a Cartesian coordinate system is established, and it is defined that the length direction of the liquid cooling plate 100 is parallel to the direction shown by the x-axis, the width direction of the liquid cooling plate 100 may be parallel to the direction shown by the y-axis, and the thickness direction of the liquid cooling plate 100 may be parallel to the direction shown by the z-axis. It can be understood that the above definition is only for the convenience of understanding the relative position relationship of the various parts of the liquid cooling plate 100, and should not be understood as a limitation to the present application.

[0042] In an embodiment, a liquid cooling plate 100 is provided, which can be applied to a chip test press head to provide a heat dissipation function.

[0043] like Figure 1 and Figure 2 As shown, the liquid cooling plate 100 may include a liquid cooling plate body 110 and at least two groups of spoiler components 120 .

[0044] Among them, a flow channel 111 is opened in the liquid cooling plate body 110 for the liquid cooling medium to flow. Among them, the liquid cooling medium can be deionized water at room temperature, which has efficient heat carrying capacity and thermal shock resistance. It can be understood that the liquid cooling medium can have a flow direction in the flow channel 111. In addition, the flow channel 111 is also configured with a width direction, and the width direction of the flow channel 111 can be perpendicular to the flow direction of the liquid cooling medium.

[0045] The at least two groups of spoiler components 120 are both arranged in the flow channel 111. And along the width direction of the flow channel 111, the at least two spoiler components 120 are arranged at intervals. In the embodiment, each group of spoiler components 120 includes a plurality of spoiler columns 121. The spoiler columns 121 of the same group can be arranged in sequence along the flow direction of the liquid-cooling medium. In addition, the spoiler columns 121 in two adjacent groups of spoiler components 120 are arranged in sequence in an interlaced manner in the flow direction of the liquid-cooling medium.

[0046] When the liquid cooling medium enters the flow channel 111, the at least two groups of spoiler components 120 can provide spoiler effect for the liquid cooling medium. On the one hand, the turbulent effect of the liquid cooling medium can be improved. Combined with the principle of convective heat transfer, the convective heat transfer coefficient between the liquid cooling medium and the liquid cooling plate 100 can be improved, and the heat dissipation efficiency of the liquid cooling plate 100 can be improved. On the other hand, by arranging the at least two groups of spoiler components 120 in the flow channel 111, the contact area between the liquid cooling plate 100 and the liquid cooling medium can be increased, that is, the heat exchange area between the liquid cooling plate 100 and the liquid cooling medium can be increased, and the heat dissipation efficiency of the liquid cooling plate 100 can be further improved. Therefore, when the liquid cooling plate 100 is applied to the chip test pressure head, the heat in the semiconductor refrigerator 220 can be quickly taken away by the liquid cooling plate 100, so that the semiconductor refrigerator 220 transfers the corresponding cold amount to the chip to be tested through the pressure head 240, providing the required low temperature environment for the chip to be tested.

[0047] like Figure 1 and Figure 2 As shown, further, the flow channel 111 may include a flow channel body 1111, an inlet structure 1112 and an outlet structure 1113. The inlet structure 1112 and the outlet structure 1113 are respectively arranged at two ends of the flow channel body 1111, and are both connected to the flow channel body 1111. It can be understood that the liquid cooling medium can enter the flow channel 111 from the inlet structure 1112, and after passing through the flow channel body 1111, it can be output from the flow channel 111 from the outlet structure 1113.

[0048] In the embodiment, the flow channel body 1111 may have a cross section perpendicular to the flow direction of the liquid-cooling medium, and the cross-sectional area may be recorded as S. In addition, the inlet structure 1112 may have a cross section perpendicular to the flow direction of the liquid-cooling medium, and its cross-sectional area may be recorded as S1. The outlet structure 1113 may have a cross section perpendicular to the flow direction of the liquid-cooling medium, and its cross-sectional area may be recorded as S2.

[0049] In some embodiments, the cross-sectional area S1 of the inlet structure 1112 perpendicular to the flow direction of the liquid-cooling medium and the cross-sectional area S of the flow channel body 1111 perpendicular to the flow direction of the liquid-cooling medium can satisfy, The cross-sectional area S2 of the outlet structure 1113 perpendicular to the flow direction of the liquid-cooling medium and the cross-sectional area S of the flow channel body 1111 perpendicular to the flow direction of the liquid-cooling medium can satisfy, When the flow rate of the liquid cooling medium is constant, the inlet structure 1112 and the outlet structure 1113 in the flow channel 111 both have relatively large areas, which can increase the flow rate of the liquid cooling medium, improve the heat carrying capacity of the liquid cooling medium, and further improve the heat dissipation efficiency of the liquid cooling plate 100.

[0050] For example, in some embodiments, the cross-sectional area S1 of the inlet structure 1112 perpendicular to the flow direction of the liquid cooling medium can be set to or to Any other value in the outlet structure 1113. The cross-sectional area S2 perpendicular to the flow direction of the liquid cooling medium in the outlet structure 1113 can be set to or to Any other value in .

[0051] like Figure 1 and Figure 2 As shown, in some embodiments, the flow channel 111 may be an S-shaped flow channel. Accordingly, the flow channel body 1111 may include a first structural segment 1111a and a second structural segment 1111b that are alternately arranged in sequence. The first structural segment 1111a may be parallel to the length direction of the liquid cooling plate 100, and the second structural segment 1111b may be parallel to the width direction of the liquid cooling plate 100.

[0052] It is understandable that the flow direction of the liquid cooling medium and the width direction of the flow channel 111 may change along the direction of the flow channel 111. Specifically, in the first structural section 1111a, the flow direction of the liquid cooling medium may be parallel to the length direction of the liquid cooling plate 100, and the width direction of the flow channel 111 may be parallel to the width direction of the liquid cooling plate 100. In the second structural section 1111b, the flow direction of the liquid cooling medium may be parallel to the width direction of the liquid cooling plate 100, and the width direction of the flow channel 111 may be parallel to the length direction of the liquid cooling plate 100.

[0053] In the embodiment, the flow channel 111 is set as an S-shaped flow channel, which can make the liquid cooling medium form a turbulent effect during the flow. Combined with the setting of the spoiler component 120, the turbulent effect of the liquid cooling medium can be improved, thereby improving the heat dissipation efficiency of the liquid cooling plate 100.

[0054] Of course, in other embodiments, it is not excluded to set the flow channel 111 to have a U-shaped or straight-line flow channel structure.

[0055] like Figure 1 and Figure 2 As shown, in some embodiments, the liquid cooling plate 100 may include two groups of spoiler components 120, namely a first spoiler component 1201 and a second spoiler component 1202. In the width direction of the flow channel 111, the first spoiler component 1201 and the second spoiler component 1202 are arranged at intervals.

[0056] In other embodiments, the liquid cooling plate 100 may also include three, four, or six groups of spoiler components 120. Along the width direction of the flow channel 111, multiple groups of spoiler components 120 may be arranged in sequence and spaced apart.

[0057] In the embodiment, the first spoiler assembly 1201 and the second spoiler assembly 1202 both include a plurality of spoiler columns 121. The plurality of spoiler columns 121 in the first spoiler assembly 1201 and the plurality of spoiler columns 121 in the second spoiler assembly 1202 can be sequentially arranged at intervals along the flow direction of the liquid-cooling medium, and can extend from the end of the flow channel body 1111 close to the inlet structure 1112 to the end of the flow channel body 1111 close to the outlet structure 1113. In some embodiments, the spoiler columns 121 in the first spoiler assembly 1201 and the spoiler columns 121 in the second spoiler assembly 1202 can be basically arranged in the first structural section 1111a of the flow channel 111.

[0058] In some other embodiments, the spoiler posts 121 in the first spoiler component 1201 and the spoiler posts 121 in the second spoiler component 1202 may be disposed in the first structural segment 1111 a and the second structural segment 1111 b of the flow channel 111 .

[0059] In some other embodiments, the first spoiler component 1201 does not exclude the inclusion of a spoiler column 121 . The second spoiler component 1202 does not exclude the inclusion of a spoiler column 121 .

[0060] like Figure 1 and Figure 2 As shown, in some embodiments, the spoiler columns 121 in the first spoiler assembly 1201 and the spoiler columns 121 in the second spoiler assembly 1202 may be alternately arranged in sequence along the flow direction of the liquid-cooling medium.

[0061] Along the width direction of the flow channel 111, the center distance M between the first spoiler component 1201 and the second spoiler component 1202 can be set to 3mm≤M≤7mm. Along the flow direction of the liquid-cooling medium, the center distance N between the spoiler column 121 in the first spoiler component 1201 and the adjacent spoiler column 121 in the second spoiler component 1202 can be set to 3mm≤N≤7mm. On the one hand, it can avoid increasing the flow resistance of the flow channel 111 due to the excessive density of the spoiler column 121. It can be understood that the increase in flow resistance will greatly reduce the convective heat transfer coefficient between the liquid-cooling medium and the liquid-cooling plate 100. On the other hand, the heat exchange area between the liquid-cooling plate 100 and the liquid-cooling medium can also be increased as much as possible to improve the heat dissipation efficiency of the liquid-cooling plate 100.

[0062] Exemplarily, in some embodiments, along the width direction of the flow channel 111, the center distance M between the first spoiler assembly 1201 and the second spoiler assembly 1202 can be set to 3mm, 3.4mm, 3.8mm, 4.2mm, 4.6mm, 4.7mm, 5mm, 5.4mm, 5.8mm, 6.2mm, 6.6mm, 7mm or any other value between 3mm and 7mm. Along the flow direction of the liquid-cooling medium, the center distance N between the spoiler column 121 in the first spoiler assembly 1201 and the adjacent spoiler column 121 in the second spoiler assembly 1202 can be set to 3mm, 3.4mm, 3.8mm, 4.2mm, 4.6mm, 4.7mm, 5mm, 5.4mm, 5.8mm, 6.2mm, 6.6mm, 7mm or any other value between 3mm and 7mm.

[0063] In some embodiments, the center distance M between the first spoiler component 1201 and the second spoiler component 1202 in the width direction of the flow channel 111 may be equal to the center distance N between the spoiler column 121 in the first spoiler component 1201 and the adjacent spoiler columns 121 in the second spoiler component 1202 in the flow direction of the liquid-cooling medium.

[0064] In some embodiments, the first spoiler assembly 1201, the second spoiler assembly 1202 and the liquid cooling plate body 110 are an integrated structure. In an embodiment, the liquid cooling plate 100 may be made of 6061-T6 aluminum alloy, which has a high thermal conductivity.

[0065] In other embodiments, the first spoiler assembly 1201 and the liquid cooling plate body 110 , and the second spoiler assembly 1202 and the liquid cooling plate body 110 may be fixedly connected by welding or interference fit.

[0066] like Figure 3 and Figure 4 As shown, a chip test pressure head is also provided in the embodiment, which can provide a required low temperature environment for the chip to be tested for testing. The chip test pressure head may include a first liquid cooling plate 210, a semiconductor cooler 220, a bracket 230 and a pressure head 240. Among them, the first liquid cooling plate 210 can be the liquid cooling plate 100 provided in the embodiment.

[0067] In an embodiment, the semiconductor refrigerator 220 may be disposed between the pressure head 240 and the first liquid cooling plate 210. The bracket 230 may be disposed around the periphery of the semiconductor refrigerator 220 and between the first liquid cooling plate 210 and the pressure head 240 to provide support. In some embodiments, the pressure head 240 may be made of copper, which not only has a high thermal conductivity, but also has strong rigidity and compressive resistance. The bracket 230 may be made of high temperature resistant polyetheretherketone (PEEK).

[0068] In some embodiments, thermal conductive silicone grease (not shown) is further provided between the semiconductor refrigerator 220 and the first liquid cooling plate 210, which can reduce the contact thermal resistance between the semiconductor refrigerator 220 and the first liquid cooling plate 210 and improve the heat conduction efficiency. Thermal conductive silicone grease (not shown) can also be provided between the semiconductor refrigerator 220 and the pressure head 240, which can reduce the contact thermal resistance between the semiconductor refrigerator 220 and the pressure head 240 and improve the heat conduction efficiency.

[0069] like Figure 5 As shown, in other embodiments, the chip test pressure head may further include a second liquid cooling plate 250. The pressure head 240 may include an integrated contact plate 241 and a pressure block 242 located on one side of the contact plate 241. The side of the contact plate 241 away from the pressure block 242 may be thermally connected to the semiconductor refrigerator 220 through thermal conductive silicone grease. The second liquid cooling plate 250 may be disposed on the side of the contact plate 241 away from the semiconductor refrigerator 220. The pressure block 242 may be penetrated in the second liquid cooling plate 250 and protrude relative to the side of the second liquid cooling plate 250 away from the contact plate 241 so as to contact the chip to be tested. In addition, the second liquid cooling plate 250 may also be made of 6061-T6 aluminum alloy.

[0070] During use, the side of the pressing block 242 away from the semiconductor refrigerator 220 can be in contact with the chip to be tested. When the chip to be tested is subjected to a low-temperature test, the cold surface of the semiconductor refrigerator 220 can be placed close to one side of the pressure head 240, and the cold energy can be transferred to the chip to be tested through the pressure head 240. Accordingly, the hot surface of the semiconductor refrigerator 220 can be arranged close to one side of the first liquid cooling plate 210. The first liquid cooling plate 210 and the semiconductor refrigerator 220 perform heat exchange, which can absorb the heat in the semiconductor refrigerator 220 and the heat generated by the chip to be tested, and take away the heat through the liquid cooling medium in the first liquid cooling plate 210 to achieve heat dissipation.

[0071] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0072] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A liquid cooling plate, characterized in that: Applied to a chip test pressure head, the liquid cooling plate comprises a liquid cooling plate body and at least two groups of spoiler components; A flow channel for the flow of liquid cooling medium is provided in the liquid cooling plate body, and the flow channel is configured with a width direction perpendicular to the flow direction of the liquid cooling medium; The at least two groups of spoiler components are arranged in the flow channel at intervals in the width direction, each group of spoiler components includes a plurality of spoiler columns, and the spoiler columns in two adjacent groups of spoiler components are arranged alternately in sequence in the flow direction of the liquid-cooling medium; Along the width direction, the center distance between two adjacent groups of spoiler components is M; Along the flow direction of the liquid-cooling medium, the center distance between the spoiler column and the adjacent spoiler column in the adjacent spoiler assembly is N, wherein N=M.

2. The liquid cooling plate according to claim 1, characterized in that: The liquid cooling plate comprises two groups of spoiler components, and the two groups of spoiler components are arranged in the flow channel at intervals in the width direction; Each group of the spoiler components includes a plurality of the spoiler columns, and the plurality of spoiler columns in the same group are sequentially spaced apart along the flow direction of the liquid-cooling medium.

3. The liquid cooling plate according to claim 1, characterized in that: Along the width direction, the center distance M between two adjacent groups of spoiler components is 3mm≤M≤7mm.

4. The liquid cooling plate according to claim 1, characterized in that: Along the flow direction of the liquid-cooling medium, the center distance N between the spoiler column and the adjacent spoiler columns in the adjacent spoiler assembly is 3mm≤N≤7mm.

5. The liquid cooling plate according to any one of claims 1 to 4, characterized in that: The flow channel is an S-shaped flow channel.

6. The liquid cooling plate according to claim 5, characterized in that: The flow channel comprises a first structural segment and a second structural segment which are alternately arranged in sequence, and the at least two groups of spoiler components are arranged in the first structural segment.

7. The liquid cooling plate according to claim 1, characterized in that: The flow channel is provided with an inlet structure and a flow channel body which are connected; The cross-sectional area S1 of the inlet structure perpendicular to the flow direction of the liquid-cooling medium and the cross-sectional area S of the flow channel body perpendicular to the flow direction of the liquid-cooling medium satisfy:

8. The liquid cooling plate according to claim 1 or 7, characterized in that: The flow channel is provided with an outlet structure and a flow channel body which are connected; The cross-sectional area S2 of the outlet structure perpendicular to the flow direction of the liquid-cooling medium and the cross-sectional area S of the flow channel body perpendicular to the flow direction of the liquid-cooling medium satisfy, 9. A chip testing indenter, characterized in that: It comprises a pressure head, a semiconductor refrigerator and a liquid cooling plate as claimed in any one of claims 1 to 8; The liquid cooling plate is arranged between the pressure head and the semiconductor refrigerator.

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