LED workpiece surface machining device

Abstract

The utility model discloses an LED workpiece surface processing device, which comprises a surface component analyzer, a processing device and a control device, wherein the surface component analyzer is used for analyzing the surface of an LED workpiece and qualitatively determining the surface component; the laser device is used for generating laser required for cleaning glue and melting welding spot welding flux; the contour scanning camera is used for detecting a processing position and guiding the laser to clean a scanning path of glue; the control module is provided with cleaning data of the cleaning glue corresponding to the surface material; controlling the laser to clean according to the cleaning data corresponding to the surface material determined by the surface component analyzer and the scanning path determined by the contour scanning camera; and after the surface component analyzer qualitatively obtains the surface material, the laser is controlled according to the cleaning data corresponding to the surface material, so that the laser performs cleaning scanning on the surface of the LED workpiece according to the path planned by the contour scanning camera. Due to the fact that the LED workpiece surface machining device can achieve automatic cleaning of glue on the surface of the LED workpiece, the glue cleaning efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of LED workpiece processing, in particular to a device for processing the surface of an LED workpiece. Background Art

[0002] In the LED display packaging process, due to the small area of ​​each welding, vibration is inevitable during the installation process or use process. Therefore, when the electrical connection and fixation are performed through a single solder joint, it is easy to become loose. For LED display products, it causes local luminescence, affecting the display effect. For conductor chips, it causes malfunctions. Therefore, it is usually adopted to set a curable glue on the welding surface to share the stability of the fixation of the solder joint, thereby improving the stability of the solder joint. In addition, filling glue on the surface of the solder joint can also improve its waterproofness. However, when the product filled with glue on the surface of the solder joint has defects during the production process, such as the existence of cold solder joints, leaking solder joints, etc., it is difficult to repair or rework the cold solder joints, leaking solder joints, or aging devices. The glue needs to be cleaned before replacement or welding, resulting in low efficiency of repair or rework. Utility Model Content

[0003] The main technical problem solved by the utility model is to provide a device for processing the surface of an LED workpiece, which can automatically clean glue from problematic solder joints and improve the efficiency of cleaning glue.

[0004] In order to solve the above technical problems, the utility model provides an LED workpiece surface processing device, the LED workpiece surface processing device comprises:

[0005] Surface component analyzer, which analyzes the surface of LED workpieces and qualitatively determines the surface material of LED workpieces;

[0006] Lasers, which generate the laser light needed to clean glue and melt solder at solder joints;

[0007] A contour scanning camera detects in real time the scanning path of the laser to clean the glue;

[0008] The control module is provided with at least one set of cleaning data of the cleaning glue corresponding to the surface material.

[0009] Control the laser to perform cleaning according to the cleaning data corresponding to the surface material determined by the surface component analyzer and the scanning path determined by the profile scanning camera;

[0010] After the surface component analyzer qualitatively obtains the surface material, it controls the laser according to the cleaning data corresponding to the surface material, so that the laser cleans and scans the surface of the LED workpiece according to the path planned by the contour scanning camera.

[0011] Furthermore, the LED workpiece surface processing device also includes a positioning camera connected to the control module signal to determine the position of the LED workpiece.

[0012] Furthermore, the LED workpiece surface processing device also includes an optical path component for delivering the laser to the cleaning position, collecting the LED workpiece surface image and planning the scanning path.

[0013] Further, the optical path component includes a first total reflection mirror for totally reflecting the laser light emitted by the laser, a second total reflection mirror for totally transmitting the laser and totally reflecting the optical path of the contour scanning camera and the surface composition analyzer, a third total reflection mirror for totally reflecting the optical path of the laser, the contour scanning camera and the surface composition analyzer, and a galvanometer for guiding the laser, the contour scanning camera and the surface composition analyzer to the LED workpiece surface cleaning position and the laser scanning speed.

[0014] Furthermore, the LED workpiece surface processing device also includes a smoke extraction mechanism for exhausting smoke generated when laser cleaning glue.

[0015] Furthermore, the smoke extraction mechanism includes a smoke hood, an exhaust duct connected to the smoke hood, and an exhaust fan connected to the exhaust duct.

[0016] Furthermore, the LED workpiece surface processing device also includes a three-dimensional moving mechanism for moving the laser and the contour scanning camera within the X, Y, and Z coordinate systems.

[0017] Furthermore, the laser wavelength output by the laser is 335nm ultraviolet laser.

[0018] Furthermore, the cleaning data includes laser light emission frequency and scanning speed.

[0019] Furthermore, the three-dimensional moving mechanism includes an X-axis translation servo component and an X-axis translation servo component, and a Z-axis movement servo component.

[0020] The utility model also provides an LED workpiece surface cleaning system, which includes an operating table for placing the LED workpiece and a vacuum adsorption mechanism for fixing the LED workpiece, and an LED workpiece surface processing device, wherein the LED workpiece surface processing device includes:

[0021] Surface component analyzer, which analyzes the surface of LED workpieces and qualitatively determines the surface material of LED workpieces;

[0022] Lasers, which generate the laser light needed to clean glue and melt solder at solder joints;

[0023] A contour scanning camera detects in real time the scanning path of the laser to clean the glue;

[0024] The control module is provided with at least one set of cleaning data of the cleaning glue corresponding to the surface material.

[0025] Control the laser to perform cleaning according to the cleaning data corresponding to the surface material determined by the surface component analyzer and the scanning path determined by the profile scanning camera;

[0026] After the surface component analyzer qualitatively obtains the surface material, it controls the laser according to the cleaning data corresponding to the surface material, so that the laser cleans and scans the surface of the LED workpiece according to the path planned by the contour scanning camera.

[0027] The LED workpiece surface processing device also includes a positioning camera connected to the control module signal to determine the position of the LED workpiece.

[0028] Furthermore, the LED workpiece surface processing device also includes an optical path component for delivering the laser to the cleaning position, collecting the LED workpiece surface image and planning the scanning path.

[0029] Further, the optical path component includes a first total reflection mirror for totally reflecting the laser light emitted by the laser, a second total reflection mirror for totally transmitting the laser and totally reflecting the optical path of the contour scanning camera and the surface composition analyzer, a third total reflection mirror for totally reflecting the optical path of the laser, the contour scanning camera and the surface composition analyzer, and a galvanometer for guiding the laser, the contour scanning camera and the surface composition analyzer to the LED workpiece surface cleaning position and the laser scanning speed.

[0030] Furthermore, the LED workpiece surface processing device also includes a smoke extraction mechanism for exhausting smoke generated when laser cleaning glue.

[0031] Furthermore, the smoke extraction mechanism includes a smoke hood, an exhaust duct connected to the smoke hood, and an exhaust fan connected to the exhaust duct.

[0032] Furthermore, the LED workpiece surface processing device also includes a three-dimensional moving mechanism for moving the laser and the contour scanning camera within the X, Y, and Z coordinate systems.

[0033] Furthermore, the laser wavelength output by the laser is 335nm ultraviolet laser.

[0034] Furthermore, the cleaning data includes laser light emission frequency and scanning speed.

[0035] The utility model discloses an LED workpiece surface processing device, which includes a surface component analyzer for analyzing the surface of the LED workpiece and qualitatively determining the surface material of the LED workpiece; a laser for generating the laser required for cleaning glue and melting solder at the solder joint; a contour scanning camera for real-time detection and guidance of the scanning path of the laser for cleaning glue; a control module, which is provided with at least one set of cleaning data for cleaning glue corresponding to the surface material; the laser is controlled to clean according to the cleaning data corresponding to the surface material determined by the surface component analyzer and the scanning path determined by the contour scanning camera; after the surface component analyzer qualitatively obtains the surface material, the laser is controlled to control the laser according to the cleaning data corresponding to the surface material, so that the laser cleans and scans the surface of the LED workpiece according to the path planned by the contour scanning camera. When in use, the surface component analyzer qualitatively analyzes the surface component of the processing position to determine the material, and the control module controls the laser to scan according to the processing parameters corresponding to the determined material. At the same time, the processing position contour is scanned in real time, and the laser processing path is guided in real time. Since the LED workpiece surface processing device can realize automatic cleaning of the LED workpiece surface glue, the efficiency of cleaning glue is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the description only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0037] Figure 1 This is a schematic diagram of the principle of an embodiment of the LED workpiece surface processing device of the utility model.

[0038] Figure 2 It is a three-dimensional structural schematic diagram of an embodiment of the LED workpiece surface processing device of the utility model.

[0039] Figure 3 This is a structural schematic diagram of another viewing angle of an embodiment of the LED workpiece surface processing device of the utility model.

[0040] Figure 4 This is a structural schematic diagram of another viewing angle of an embodiment of the LED workpiece surface processing device of the utility model.

[0041] The purpose, features and advantages of the present invention will be further described in conjunction with the embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0042] The claims of the utility model are further described in detail below in conjunction with specific embodiments and drawings. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, all other embodiments proposed by ordinary technicians in this field before making creative work also fall within the scope of protection of the utility model.

[0043] It should be understood that in the description of the embodiments of the present invention, all directional indication terms, such as "up", "down", "left", "right", "front", "back", etc., indicate the orientation or position relationship based on the orientation, position relationship shown in the drawings or the orientation or position relationship in which the utility model product is usually placed when in use, which is only for the convenience of simplifying the description of the utility model, and does not expressly or imply that the device, element or component referred to must have a specific orientation and a specific orientation structure, and should not be understood as a limitation on the present invention. It is only used to explain the relative position relationship, movement, etc. between the components shown in the drawings. When the specific posture changes, the directional indication may also change accordingly.

[0044] In addition, ordinal numbers such as "first" and "second" in the present invention are only used for the purpose of distinction, and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. The features defined as "first" and "second" can explicitly or implicitly indicate at least one of the technical features. In the description of the present invention, "multiple" means at least two, that is, two or more, unless otherwise clearly defined; "at least one" means one or one and more.

[0045] In the present utility model, unless otherwise clearly stipulated and limited, the terms such as "installation", "setting", "connection", "fixation" and "screw-on" should be understood in a broad sense. For example, the positional relationship between components can be relatively fixed, or there can be a physically fixed connection between components. The connection can be detachable or integrated. It can be a mechanical connection or an electrical signal connection. It can be directly connected or indirectly connected through an intermediate medium or component. It can be the internal connection of two elements or the interaction relationship between two elements. Unless otherwise clearly defined in the specification, other interpretations may not achieve the corresponding functions or effects. For ordinary technicians in this field, the specific meanings of the above terms in the utility model can be understood according to specific circumstances.

[0046] The controller and control circuit involved in the utility model are conventional control technologies or units of the technicians in this field. For example, the control circuit of the controller can be realized by ordinary technicians in this field using existing technologies, such as simple programming. If the software or program involved in the control result is not described in detail, it belongs to the use of existing technologies or conventional technologies of ordinary technicians in this field. The power supply also uses the existing technologies in this field, and the main technical point of the utility model is to improve the mechanical device, so the utility model will no longer describe the specific circuit control relationship and circuit connection in detail.

[0047] The disclosure of the present invention provides many different embodiments or examples for realizing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and settings of specific examples are described in the present invention. Of course, they are merely examples, and the purpose is not to limit the present invention. In addition, the present invention may repeat reference numbers and / or reference letters in different examples, and such repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides various specific examples of processes and materials, but those of ordinary skill in the art may be aware of the application of other processes and / or the use of other materials.

[0048] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0049] like Figure 1 - Figure 4 As shown, the utility model provides an embodiment of an LED workpiece surface processing device.

[0050] The LED workpiece surface processing device comprises:

[0051] Surface component analyzer 5, analyzes the surface of LED workpiece and qualitatively determines the surface material of LED workpiece;

[0052] Laser 2, generating the laser light required for cleaning glue and melting solder at solder joints;

[0053] A contour scanning camera 6 detects in real time the scanning path of the laser to clean the glue;

[0054] The control module 9 is provided with at least one set of cleaning data of cleaning glue corresponding to the surface material.

[0055] Control the laser to perform cleaning according to the cleaning data corresponding to the surface material determined by the surface component analyzer and the scanning path determined by the profile scanning camera;

[0056] After the surface component analyzer qualitatively obtains the surface material, it controls the laser according to the cleaning data corresponding to the surface material, so that the laser cleans and scans the surface of the LED workpiece according to the path planned by the contour scanning camera.

[0057] Specifically, the laser 2 uses an ultraviolet laser with a wavelength of 355nm; the surface composition analyzer 5 uses existing technology and can obtain qualitative results and distribution status of the material in the area to be processed, as well as corresponding coordinate data, by analyzing the image features of the surface of the workpiece.

[0058] The control module 9 adopts existing technology, such as a single chip microcomputer, etc., and is preset with processing parameters adapted according to the characteristics of the material to be processed. For example, when the cleaning glue is A, the A1 processing parameter (cleaning data) is the best, and when the cleaning glue is B, the B1 processing parameter (cleaning data) is the best. The control module 9 contains processing parameters corresponding to such qualitative materials, and each processing parameter can be obtained through limited experiments or empirical data. The processing parameters include laser light frequency and scanning speed, etc.

[0059] The LED workpiece surface processing device also includes an optical path component 3 that transports the laser to the cleaning position, collects the LED workpiece surface image, and plans the scanning path. When the workpiece to be processed has different materials, when the laser scans the area, the control module 9 automatically calls the processing parameters that match the material in the area from the preset database, controls the laser to work, and thus obtains a better processing effect.

[0060] The optical path component 3 includes a first total reflection mirror 31 for total reflection of the laser light emitted by the laser 2; a second total reflection mirror 32 for total transmission of the laser light and total reflection of the optical path of the profile scanning camera 6 and the surface component analyzer 5; a third total reflection mirror 33 for total reflection of the optical path of the laser 2, the profile scanning camera 6 and the surface component analyzer 5; and a galvanometer 5 for guiding the laser, the profile scanning camera and the surface component analyzer 5 to the cleaning position (cleaning position) of the LED workpiece surface and the laser scanning speed. Due to such an optical path component, part of the optical path can be shared, saving the number of parts and components and the difficulty of assembly.

[0061] The LED workpiece surface processing device further includes a positioning camera 4 which is connected to the control module 9 by signals to determine the position of the LED workpiece.

[0062] When in use, the workpiece (such as an LED workpiece) can be placed on the operating table 10 and fixed by a vacuum adsorption mechanism (not shown in the figure); after the positioning camera 4 determines the position of the LED workpiece, the control module 9 controls the surface component analyzer 5 to collect the LED workpiece image on the operating table 10 through the optical path component 3, and determines the surface material of the LED workpiece and the distribution area of ​​different materials according to the image features. Then, the control module 9 controls the laser to perform processing according to the processing parameters matching the surface material of the corresponding position of the determined LED workpiece. At the same time, the image of the processing position is scanned in real time by the contour scanning camera 6, and the laser processing path is guided in real time, so that the image of the processing position matches the preset data, that is, the contour after processing matches the contour image that needs to be achieved in theory. When the material of another processing area is different from that of the previous processing area, the control module 9 controls the laser to process the area according to the processing parameters corresponding to the area, so that each processing area is processed with the best processing technology, which not only improves the processing accuracy, but also reduces the impact on the non-processing area. Automatic processing can be fully realized and processing efficiency can be improved.

[0063] In order to improve the environmental friendliness of processing and reduce waste gas emissions, the LED workpiece surface processing device also includes a smoke extraction mechanism 8 for exhausting the smoke generated when the laser cleans the glue. The smoke extraction mechanism 8 includes a smoke hood 81 and an exhaust duct 82 connected to the smoke hood 81, and an exhaust fan connected to the exhaust duct 82 (not shown in the drawings).

[0064] According to the needs, the LED workpiece surface processing device also includes a three-dimensional moving mechanism that enables the laser 2, the contour scanning camera 6, the positioning camera 4 and the optical path component 3 to move in the X, Y, and Z coordinate systems. The three-dimensional moving mechanism includes an X-axis translation servo component and an X-axis translation servo component, and a Z-axis movement servo component 7. The X-axis translation servo component and the X-axis translation servo component, and the Z-axis movement servo component 7 can be implemented using existing technologies and will not be described in detail. In this embodiment, the LED workpiece surface processing includes LED workpiece surface cleaning.

[0065] The utility model also provides an LED workpiece surface processing system, the LED workpiece surface cleaning system comprises an operating table 10 for placing the LED workpiece and a vacuum adsorption mechanism for fixing the LED workpiece, and an LED workpiece surface processing device, wherein the LED workpiece surface processing device comprises:

[0066] Surface component analyzer 5, analyzes the surface of LED workpiece and qualitatively determines the surface material of LED workpiece;

[0067] Laser 2, generating the laser required for cleaning glue and melting solder at solder joints;

[0068] A contour scanning camera 6 detects in real time the scanning path of the laser to clean the glue;

[0069] The control module 9 is provided with at least one set of cleaning data of cleaning glue corresponding to the surface material.

[0070] Control the laser to perform cleaning according to the cleaning data corresponding to the surface material determined by the surface component analyzer and the scanning path determined by the profile scanning camera;

[0071] After the surface component analyzer qualitatively obtains the surface material, it controls the laser according to the cleaning data corresponding to the surface material, so that the laser cleans and scans the surface of the LED workpiece according to the path planned by the contour scanning camera.

[0072] Specifically, the laser 2 uses an ultraviolet laser with a wavelength of 355nm; the surface composition analyzer 5 uses existing technology and can obtain qualitative results and distribution status of the material in the area to be processed, as well as corresponding coordinate data, by analyzing the image features of the surface of the workpiece.

[0073] The control module 9 adopts existing technology, such as a single chip microcomputer, etc., and is preset with processing parameters adapted according to the characteristics of the material to be processed. For example, when the cleaning glue is A, the A1 processing parameter (cleaning data) is the best, and when the cleaning glue is B, the B1 processing parameter (cleaning data) is the best. The control module 9 contains processing parameters corresponding to such qualitative materials, and each processing parameter can be obtained through limited experiments or empirical data. The processing parameters include laser light frequency and scanning speed, etc.

[0074] The LED workpiece surface processing device also includes an optical path component 3 that transports the laser to the cleaning position, collects the LED workpiece surface image, and plans the scanning path. When the workpiece to be processed has different materials, when the laser scans the area, the control module 9 automatically calls the processing parameters that match the material in the area from the preset database, controls the laser to work, and thus obtains a better processing effect.

[0075] The optical path component 3 includes a first total reflection mirror 31 for total reflection of the laser light emitted by the laser 2; a second total reflection mirror 32 for total transmission of the laser light and total reflection of the optical path of the profile scanning camera 6 and the surface component analyzer 5; a third total reflection mirror 33 for total reflection of the optical path of the laser 2, the profile scanning camera 6 and the surface component analyzer 5; and a galvanometer 5 for guiding the laser, the profile scanning camera and the surface component analyzer 5 to the cleaning position (cleaning position) of the LED workpiece surface and the laser scanning speed. Due to such an optical path component, part of the optical path can be shared, saving the number of parts and components and the difficulty of assembly.

[0076] The LED workpiece surface processing device further includes a positioning camera 4 which is connected to the control module 9 by signals to determine the position of the LED workpiece.

[0077] When in use, the workpiece (such as an LED workpiece) can be placed on the operating table 10 and fixed by a vacuum adsorption mechanism (not shown in the figure); after the positioning camera 4 determines the position of the LED workpiece, the control module 9 controls the surface component analyzer 5 to collect the LED workpiece image on the operating table 10 through the optical path component 3, and determines the surface material of the LED workpiece and the distribution area of ​​different materials according to the image features. Then, the control module 9 controls the laser to perform processing according to the processing parameters matching the surface material of the corresponding position of the determined LED workpiece. At the same time, the image of the processing position is scanned in real time by the contour scanning camera 6, and the laser processing path is guided in real time, so that the image of the processing position matches the preset data, that is, the contour after processing matches the contour image that needs to be achieved in theory. When the material of another processing area is different from that of the previous processing area, the control module 9 controls the laser to process the area according to the processing parameters corresponding to the area, so that each processing area is processed with the best processing technology, which not only improves the processing accuracy, but also reduces the impact on the non-processing area. Automatic processing can be fully realized and processing efficiency can be improved.

[0078] In order to improve the environmental friendliness of processing and reduce waste gas emissions, the LED workpiece surface processing device also includes a smoke extraction mechanism 8 for exhausting the smoke generated when the laser cleans the glue. The smoke extraction mechanism 8 includes a smoke hood 81 and an exhaust duct 82 connected to the smoke hood 81, and an exhaust fan connected to the exhaust duct 82 (not shown in the drawings).

[0079] As needed, the LED workpiece surface processing device also includes a three-dimensional moving mechanism that enables the laser 2 and the contour scanning camera 6 to move in the X, Y, and Z coordinate systems. The three-dimensional moving mechanism includes an X-axis translation servo component, an X-axis translation servo component, and a Z-axis movement servo component 7. The X-axis translation servo component, the X-axis translation servo component, and the Z-axis movement servo component 7 can be implemented using existing technologies and will not be described in detail.

[0080] The above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some structures (technical features) in one or more embodiments may be replaced or combined by equivalent means, and these modifications or replacements or combinations do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the utility model, unless the embodiments explicitly exclude the possibility of replacing or combining structures (technical features) in different embodiments, or such replacement or combination is contrary to the overall concept of the utility model.

Claims

1. A LED workpiece surface processing device, characterized in that: include, Surface component analyzer, which analyzes the surface of LED workpieces and qualitatively determines the surface material of LED workpieces; Lasers, which generate the laser light needed to clean glue and melt solder at solder joints; A contour scanning camera detects in real time the scanning path of the laser to clean the glue; The control module is provided with at least one set of cleaning data of the cleaning glue corresponding to the surface material. Control the laser to perform cleaning according to the cleaning data corresponding to the surface material determined by the surface component analyzer and the scanning path determined by the profile scanning camera; After the surface component analyzer qualitatively obtains the surface material, it controls the laser according to the cleaning data corresponding to the surface material, so that the laser cleans and scans the surface of the LED workpiece according to the path planned by the contour scanning camera.

2. The LED workpiece surface processing device according to claim 1, characterized in that: The LED workpiece surface processing device also includes a positioning camera connected to the control module signal to determine the position of the LED workpiece.

3. The LED workpiece surface processing device according to claim 1, characterized in that: The LED workpiece surface processing device also includes an optical path component for delivering the laser to a cleaning position, collecting an LED workpiece surface image, and planning a scanning path.

4. The LED workpiece surface processing device according to claim 3, characterized in that: The optical path component includes a first total reflection mirror for totally reflecting the laser light emitted by the laser, a second total reflection mirror for totally transmitting the laser light and totally reflecting the optical path of the profile scanning camera and the surface component analyzer, a third total reflection mirror for totally reflecting the optical path of the laser, the profile scanning camera and the surface component analyzer, and a galvanometer for guiding the laser, the profile scanning camera and the surface component analyzer to the cleaning position of the LED workpiece surface.

5. The LED workpiece surface processing device according to claim 1, characterized in that: The LED workpiece surface processing device also includes a smoke extraction mechanism for exhausting smoke generated when laser cleaning glue.

6. The LED workpiece surface processing device according to claim 5, characterized in that: The smoke extraction mechanism comprises a smoke hood, an exhaust duct connected to the smoke hood, and an exhaust fan connected to the exhaust duct.

7. The LED workpiece surface processing device according to claim 1, characterized in that: The LED workpiece surface processing device also includes a three-dimensional moving mechanism for moving the laser and the contour scanning camera within an X, Y, and Z coordinate system.

8. The LED workpiece surface processing device according to claim 7, characterized in that: The three-dimensional moving mechanism includes an X-axis translation servo component and an X-axis translation servo component, and a Z-axis movement servo component.

9. The LED workpiece surface processing device according to claim 1, characterized in that: The laser wavelength output by the laser is 335nm ultraviolet laser.

10. The LED workpiece surface processing device according to claim 1, characterized in that: The cleaning data includes a pair of laser light emission frequency and scanning speed.

Images