Electroplated diamond grinding rod

Abstract

The utility model relates to the technical field of cover plate glass processing, and discloses an electroplated diamond grinding rod, a grinding head of the grinding rod comprises at least three grinding layers, each grinding layer is electroplated with diamond particles with different particle sizes to form a coarse grinding area, a fine grinding area and an accurate grinding area, at least one grinding layer is provided with a groove part, and the particle size range of the diamond particles is 200-3000 meshes. The grinding rod is provided with at least three diamond grinding layers with different granularities, so that coarse grinding, fine grinding and accurate grinding are better realized, and not only can the working efficiency of the grinding rod be improved, but also the service life of the diamond grinding rod is prolonged when brittle materials, particularly ultra-thin glass, are finely machined.

Description

Technical Field

[0001] The utility model relates to the technical field of cover glass processing, in particular to an electroplated diamond grinding rod. Background Art

[0002] In the process of cover glass processing, fine carving and polishing are the key to quality control. The tools used for fine carving generally use diamond-plated grinding heads, and with the high-speed rotation of the spindle of 24,000 to 40,000 revolutions or even higher, it can realize the opening, grooving, upper and lower one-time chamfering, precise cutting of special-shaped glass, shape processing, chamfering, etc. of ultra-thin glass. The actual processing is grinding rather than cutting. The error can be controlled within ±0.02 to ±0.05mm, and the edge of the glass is not easy to collapse or break. The next step is to grind and polish the fine carving parts. The workpiece is placed in the polishing machine, water and polishing powder are added, and the grinding tool is used to make complex relative movements with the processing surface under a certain pressure to grind the cutting part to the required curvature and polish it into a mirror effect on the surface. The application fields of sapphire, cover glass, and microcrystalline glass determine that the thinner the product thickness, the better. The current thickness is generally 0.5mm, and the thinnest reaches 0.3mm.

[0003] CN 212762963 U discloses a new type of grinding head for precision engraving machine with both precision engraving and sweeping functions, including a grinding head inner core, the front end of which is a hole trimming area and a rough sweeping area in sequence, a precision grinding resin layer is sleeved on the rear end of the rough sweeping area on the grinding head inner core, and the front end surface of the precision grinding resin layer is the precision sweeping area. However, the grinding head has problems such as edge collapse and chip falling when processing brittle materials such as glass using a precision engraving machine.

[0004] Therefore, there is a need for improved grinding rods in the prior art. Utility Model Content

[0005] In view of this, the technical problem solved by the utility model is to solve the problems of edge chipping and chip falling when finely processing brittle materials, especially ultra-thin glass.

[0006] Based on the above purpose, an embodiment of the utility model provides an electroplated diamond grinding rod, the grinding head of the grinding rod includes at least three grinding layers, each grinding layer is electroplated with diamond particles of different particle sizes to form a coarse grinding area, a fine grinding area and a fine grinding area, wherein at least one grinding layer is provided with a groove portion, and the particle size range of the diamond particles is 200 to 3000 mesh.

[0007] In some embodiments, the grinding head includes a first grinding layer, a second grinding layer and a third grinding layer, the diamond particle size range of the first grinding layer is 200-600 mesh, the diamond particle size range of the second grinding layer is 2000-3000 mesh, and the diamond particle size range of the third grinding layer is 800-1500 mesh.

[0008] In some embodiments, a heat dissipation hole and / or a heat dissipation groove is disposed on the top of the grinding rod.

[0009] In some embodiments, each grinding layer is an annular grinding layer.

[0010] In some embodiments, each grinding layer is arranged without a gap between them.

[0011] In some embodiments, at least one grinding layer is provided with an annular groove portion.

[0012] In some embodiments, the expansion angle of the annular groove portion is 50-60°.

[0013] In some embodiments, the diamond particles are single crystal diamond particles.

[0014] In some embodiments, in the axial direction, the total length of at least three grinding layers accounts for 1 / 4 to 1 / 2 of the length of the grinding rod.

[0015] In some embodiments, the central axis of the grinding rod is hollow.

[0016] The utility model has at least the following beneficial technical effects:

[0017] The utility model provides an electroplated diamond grinding rod, which makes innovative structural improvements to the grinding head part and is provided with at least three grinding layers, each of which is electroplated with diamond grinding layers of different particle sizes, so as to achieve fine processing of brittle materials such as ultra-thin glass. In combination with corresponding fine processing technology, it can effectively avoid defects such as edge collapse and chipping in the process of fine processing of ultra-thin glass, and is suitable for being widely used in the field of glass or semiconductor production and manufacturing. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the utility model. For ordinary technicians in this field, other embodiments can be obtained based on these drawings without paying creative work.

[0019] Figure 1 A schematic diagram of an embodiment of an electroplated diamond grinding rod provided by the utility model;

[0020] Description of reference numerals:

[0021] 10. Grinding head; 11. First grinding layer; 12. Second grinding layer; 13. Third grinding layer. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the embodiments of the present invention are further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field of the present invention; the terms used in this specification are only for the purpose of describing specific embodiments and are not intended to limit the present invention. For example, the directions or positions indicated by terms such as "length", "width", "up", "down", "left", "right", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", and "outside" are based on the directions or positions shown in the drawings, which are only for the convenience of description and cannot be understood as limitations on the present technical solution.

[0024] The terms "including" and "having" and any variations thereof in the specification and claims of the present utility model and the above-mentioned drawings are intended to cover non-exclusive inclusions; the terms "first", "second", etc. in the specification and claims of the present utility model or the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. "Multiple" means two or more, unless otherwise clearly and specifically defined.

[0025] In the specification and claims of the utility model and the above-mentioned drawings, when an element is referred to as being "fixed on" or "mounted on" or "disposed on" or "connected to" another element, it may be directly or indirectly located on the other element. For example, when an element is referred to as being "connected to" another element, it may be directly or indirectly connected to the other element.

[0026] In addition, the reference to "embodiment" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiment may be included in at least one embodiment of the present invention. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0027] like Figure 1 The figure shows a schematic diagram of an embodiment of the electroplated diamond grinding rod provided by the utility model. The grinding head 10 of the grinding rod includes at least three grinding layers, each of which is electroplated with diamond particles of different particle sizes to form a coarse grinding area, a fine grinding area and a fine grinding area. At least one of the grinding layers is provided with a groove portion, and the particle size range of the diamond particles is 200 to 3000 meshes.

[0028] Compared with the solutions in the prior art, the electroplated diamond grinding rod provided by the utility model is provided with at least three grinding layers, each grinding layer is electroplated with diamond grinding layers of different particle sizes, so as to achieve the fine processing of brittle materials such as ultra-thin glass. In combination with the corresponding fine processing technology, it can effectively avoid defects such as edge collapse and chipping during the fine processing of ultra-thin glass.

[0029] Further, the grinding head 10 may include three grinding layers, namely, a first grinding layer 11 as a rough grinding area, a second grinding layer 12 as a fine grinding area, and a third grinding layer 13 as a fine grinding area. The diamond particle size range of the first grinding layer 11 is 200-600 mesh, the diamond particle size range of the second grinding layer 12 is 2000-3000 mesh, and the diamond particle size range of the third grinding layer 13 is 800-1500 mesh. In some embodiments, the electroplated diamond grinding rod particles are respectively 200 mesh, preferably 300 mesh, for the first layer structure; 2000 mesh, preferably 2600 mesh, for the second layer structure; 800 mesh, preferably 1000 mesh, more preferably 1200 mesh, for the third layer structure. Different processing areas are formed on the grinding head by electroplating diamonds of different particle sizes, and the processing stage is adjusted at any time based on the processing conditions of the glass, thereby solving the problems of edge collapse and chipping during the processing of ultra-thin glass.

[0030] Furthermore, in some preferred embodiments, four grinding layers may be provided, wherein the second and third layers are fine grinding layers, so as to further reduce the problems of edge chipping and chip falling.

[0031] Furthermore, a heat dissipation hole and / or heat dissipation groove is provided at the top of the grinding rod. When the grinding rod rotates at high speed, friction with the glass generates heat, which affects the service life of the grinding rod. Therefore, the heat dissipation hole or heat dissipation groove provided at the top can dissipate the internal heat of the grinding rod into the air more quickly.

[0032] Furthermore, each grinding layer is an annular grinding layer, which is arranged around the circumference of the grinding rod, so as to facilitate engraving and polishing operations at multiple angles and positions.

[0033] In some embodiments, each grinding layer is arranged without a gap to ensure continuous engraving and polishing operations on the glass.

[0034] In some embodiments, at least one annular grinding layer is provided with an annular groove portion to enable processing of corners or irregular positions.

[0035] In some further embodiments, preferably, the expansion angle of the annular groove portion is 50-60° to better match corners or irregular positions. The expansion angle of the annular groove portion is greater than 50°, preferably, the expansion angle is 58°. In some examples, such as a four-layer structure, a layer is added between the second layer and the third layer, the diamond particle size of which is greater than the second layer, the diamond particle size is less than 3000 mesh, and the expansion angle is greater than the second layer.

[0036] Furthermore, the diamond particles are single crystal diamond particles. The characteristics of single crystal diamond are hardness and wear resistance. Therefore, the use of single crystal diamond can effectively improve the wear resistance of the grinding rod, thereby increasing the service life.

[0037] Furthermore, in the axial direction, the total length of the multiple grinding layers accounts for 1 / 4 to 1 / 2 of the length of the grinding rod. This ratio is designed based on the size of the ultra-thin glass to reasonably utilize the use area of ​​the grinding rod and better implement the finishing of the glass.

[0038] Furthermore, the central axis of the grinding rod is hollow, and the hollow axis can achieve better heat dissipation effect.

[0039] The grinding rod provided by the utility model is further equipped with a processing technology, wherein, for example Figure 1 The embodiment shown in the figure has three grinding layers, namely, rough grinding, fine grinding, and fine grinding. In the fine grinding stage, the ultra-thin glass is chamfered, and the angle expansion size is designed according to different types of ultra-thin glass. At the same time, a processing technology is combined, which corresponds to Figure 1 The electroplated diamond grinding rod shown adjusts the single-edge removal amount, spindle speed and feed speed according to the glass of different weight and thickness, effectively reducing the occurrence of edge chipping and chip falling. In some embodiments, the supporting process includes:

[0040] The speed of the engraving machine is 20,000 to 30,000 rpm, preferably 24,000 rpm. The maximum speed is set to avoid large edge collapse and chip drop.

[0041] The feed speed of the engraving machine is 100mm / min to 380mm / min, preferably 200mm / min. Too fast a speed will increase the risk of edge collapse and chip drop.

[0042] During the processing, the corresponding single-side removal amount of each grinding layer structure is greater than 2.0mm, 0.1mm, and 0.5mm respectively, and the better single-side removal amount is 1.5mm, 0.05mm, and 0.3mm respectively, to ensure that the edge chipping decreases from large to small during the processing until the edge chipping and chip falling defects are completely removed.

[0043] The utility model is explained in detail below in conjunction with specific embodiments. In the following embodiments and comparative examples, the equipment and other materials used are commercially available or homemade. Among them, the engraving machine is a high-speed machine for processing sapphire, glass, and ceramics, the group B550E; the processed ultra-thin glass is cover glass and microcrystalline glass, some of which are homemade; the program used in the processing technology is manually compiled, and can also be compiled using professional software; the edge processing quality is determined by the Olympus semiconductor and flat panel display inspection microscope MX63.

[0044] Example 1

[0045] The customized electroplated diamond grinding rod is divided into three layers, and the corresponding diamond particle sizes are 200 mesh, 2000 mesh, and 800 mesh, and the expansion angle is 50°, which is fixed to the spindle of the precision engraving machine. The manual programming program spindle speed is 20,000 rpm, the feed speed is 150mm / min, and the single-side removal amount of the three-layer structure of the electroplated diamond grinding rod is 2.0mm, 0.1mm, and 0.5mm respectively. The glass used is cover glass and microcrystalline glass with a thickness of 0.5mm.

[0046] The glass to be processed is placed on the workbench, and the engraving machine processes it according to the set program. After processing, it is taken out for cleaning and drying, and the edge processing is observed under a microscope. The microscope magnification is set to 100 times, and the judgment standard is: defects less than 3μm and less than 5 are considered qualified. After processing and observation, there are 2 3μm defects in this group.

[0047] Example 2

[0048] The customized electroplated diamond grinding rod is divided into three layers, and the corresponding diamond particle sizes are 400 mesh, 2500 mesh, and 1000 mesh, and the expansion angle is 60°, which is fixed to the spindle of the precision engraving machine. The manual programming program spindle speed is 23000 rpm, the feed speed is 200mm / min, and the single-side removal amount of the three-layer structure of the electroplated diamond grinding rod is 1.5mm, 0.05mm, and 0.3mm respectively. The glass used is cover glass and microcrystalline glass with a thickness of 0.4mm.

[0049] The glass to be processed is placed on the workbench, and the engraving machine processes it according to the set program. After processing, it is taken out for cleaning and drying, and the edge processing is observed under a microscope. The microscope magnification is set to 100 times, and the judgment standard is: defects less than 3μm and less than 5 are considered qualified. After processing and observation, there are 4 3μm defects in this group.

[0050] Example 3

[0051] The customized electroplated diamond grinding rod is divided into three layers, and the corresponding diamond particle sizes are 600 mesh, 3000 mesh, and 1500 mesh, and the expansion angle is 80°, which is fixed to the spindle of the precision engraving machine. The manual programming program spindle speed is 26000 rpm, the feed speed is 300mm / min, and the single-side removal amount of the three-layer structure of the electroplated diamond grinding rod is 1.5mm, 0.05mm, and 0.3mm respectively. The glass used is cover glass and microcrystalline glass with a thickness of 0.3mm.

[0052] The glass to be processed is placed on the workbench, and the engraving machine processes it according to the set program. After processing, it is taken out for cleaning and drying, and the edge processing is observed under a microscope. The microscope magnification is set to 100 times, and the judgment standard is: defects less than 3μm and less than 5 are considered qualified. After processing and observation, there are 4 3μm defects in this group.

[0053] Comparative Example 1

[0054] The electroplated diamond grinding rod is divided into two layers, and the corresponding diamond particle sizes are 600 mesh and 3000 mesh, respectively, and the expansion angle is 40°, which is fixed on the spindle of the precision engraving machine. The manual programming program spindle speed is 35000 rpm, the feed speed is 400mm / min, and the single-side removal amount of the two-layer structure of the electroplated diamond grinding rod is 3.0mm and 0.1mm respectively. The glass used is cover glass and microcrystalline glass with a thickness of 0.5mm.

[0055] The glass to be processed is placed on the workbench, and the engraving machine processes it according to the set program. After processing, it is taken out for cleaning and drying, and the edge processing is observed under a microscope. The microscope magnification is set to 100 times. The judgment standard is: no defects less than 3μm and the number is less than 5 are observed to be qualified. After processing and observation, this group has 18 defects of 3μm and 32 defects greater than 3μm.

[0056] Through the technical solution of the utility model, the utilization rate of the diamond grinding rod can be improved when processing ultra-thin glass by adopting professionally designed electroplated diamond grinding rods and processing technology, while avoiding the occurrence of defects such as edge collapse and chipping in the ultra-thin glass processing project, thereby improving the processing yield and efficiency.

[0057] The above are exemplary embodiments disclosed by the present utility model, but it should be noted that various changes and modifications may be made without departing from the scope of the present utility model embodiments disclosed by the claims. The functions, steps and / or actions of the method claims according to the disclosed embodiments described herein do not need to be performed in any particular order. In addition, although the elements disclosed by the present utility model embodiments may be described or required in individual form, they may also be understood as multiple unless explicitly limited to the singular.

[0058] It should be understood that, as used herein, the singular forms "a", "an" are intended to include the plural forms as well, unless the context clearly supports an exception. It should also be understood that, as used herein, "and / or" refers to any and all possible combinations including one or more of the associated listed items.

[0059] The serial numbers of the embodiments disclosed in the above-mentioned embodiments of the utility model are only for description and do not represent the advantages and disadvantages of the embodiments.

[0060] Those skilled in the art should understand that the discussion of any of the above embodiments is only exemplary and is not intended to imply that the scope of the disclosure of the embodiments of the present invention (including the claims) is limited to these examples; under the concept of the embodiments of the present invention, the technical features in the above embodiments or different embodiments can also be combined, and there are many other changes in different aspects of the above embodiments of the present invention, which are not provided in detail for the sake of simplicity. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present invention should be included in the protection scope of the embodiments of the present invention.

Claims

1. An electroplated diamond grinding rod, characterized in that: The grinding head (10) of the grinding rod comprises at least three grinding layers, each of which is electroplated with diamond particles of different particle sizes to form a coarse grinding area, a fine grinding area and a fine grinding area, wherein at least one of the grinding layers is provided with a groove portion, and the particle size of the diamond particles ranges from 200 to 3000 meshes.

2. The electroplated diamond grinding rod according to claim 1, characterized in that: The grinding head comprises a first grinding layer (11), a second grinding layer (12) and a third grinding layer (13); the diamond particle size range of the electroplated diamond on the first grinding layer (11) is 200-600 meshes, the diamond particle size range of the electroplated diamond on the second grinding layer (12) is 2000-3000 meshes, and the diamond particle size range of the electroplated diamond on the third grinding layer (13) is 800-1500 meshes.

3. The electroplated diamond grinding rod according to claim 2, characterized in that: The top of the grinding rod is provided with heat dissipation holes and / or heat dissipation grooves.

4. The electroplated diamond grinding rod according to claim 1, characterized in that: Each grinding layer is an annular grinding layer.

5. The electroplated diamond grinding rod according to claim 4, characterized in that: There is no interval between each grinding layer.

6. The electroplated diamond grinding rod according to claim 4, characterized in that: At least one annular grinding layer is provided with an annular groove portion.

7. The electroplated diamond grinding rod according to claim 6, characterized in that: The expansion angle of the annular groove portion is 50 to 60 degrees.

8. The electroplated diamond grinding rod according to claim 1, characterized in that: The diamond particles are single crystal diamond particles.

9. The electroplated diamond grinding rod according to claim 1, characterized in that: In the axial direction, the total length of the at least three grinding layers accounts for 1 / 4 to 1 / 2 of the length of the grinding rod.

10. The electroplated diamond grinding rod according to claim 1, characterized in that: The central axis of the grinding rod is hollow.

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