Stacked etching and shaping ultrathin glass, manufacturing method therefor and use thereof

Abstract

Disclosed are stacked etching and shaping ultrathin glass, a manufacturing method therefor and a use thereof. The manufacturing method for the stacked etching and shaping ultrathin glass comprises: immersing a first side of an ultrathin glass body having undergone single-sided protection into a first etching solution; performing first etching on the first side in a manner of rising the liquid level of the first etching solution or moving the position of the ultrathin glass body having undergone single-sided protection relative to the first etching solution, to form an intermediate product containing a first transition area; and performing second etching on a second side, opposite to the first side, of the intermediate product in a manner of rising the liquid level of a second etching solution or moving the position of the intermediate product relative to the second etching solution.

Description

Superimposed etching shaping ultra-thin glass and its manufacturing method and application

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application is based on the Chinese patent application with application number 202311330486.0 and application date October 13, 2023, and claims the priority of the Chinese patent application. The entire content of the Chinese patent application is hereby introduced into this application as a reference. Technical Field

[0003] The present disclosure relates to the technical field of glass processing and molding, and in particular to a superimposed etching and molding ultra-thin glass and a manufacturing method and application thereof. Background Art

[0004] Folding screen mobile phones use UTG as the main material for their main cover. As terminals gradually launch folding screen mobile phones, UTG can replace CPI in terms of functionality. However, since the main raw material of UTG is glass, the commonly used thickness is 0.03mm, and its impact resistance is relatively poor. The market urgently needs an ultra-thin glass product that can achieve bending performance and high strength.

[0005] Therefore, the applicant disclosed a CFG ultra-thin glass in the Chinese patent application with application number 202111588204.8. As shown in Figure 1, the CFG ultra-thin glass (Center Folded Glass) includes a shaping area (i.e., a shaping surface) and a non-shaping area (i.e., a non-shaping surface). The shaping area includes a flat area (i.e., a large surface area), a bending area, and symmetrically distributed slope areas (i.e., transition areas) located on both sides of the bending area. The slope area smoothly transitions with the flat area and the bending area. However, the preparation method of the CFG ultra-thin glass still has the following defects: the dimensional accuracy of the bending area and the transition area is low, and the shaping area of ​​the CFG ultra-thin glass has a single shape.

[0006] Summary of the Invention

[0007] The embodiments of the present disclosure aim to solve one of the technical problems in the related art at least to a certain extent.

[0008] In view of this, one purpose of the embodiments of the present disclosure is to provide a method for manufacturing ultra-thin glass by superimposed etching and shaping, in which the ultra-thin glass body is directly grooved by immersion etching. After shaping, the gradient transition zone presents a smooth transition with good smooth transition properties, and the middle of the shaping zone presents an arc groove or a trapezoidal groove shape. Compared with the machining method, it has high efficiency, low cost, and high mass production, and can effectively improve the competitiveness of the product after practical application.

[0009] Another object of the embodiments of the present disclosure is to provide a superimposed etching and shaping ultra-thin glass.

[0010] Another object of the embodiments of the present disclosure is to provide a folding screen.

[0011] Yet another object of an embodiment of the present disclosure is to provide an electronic device.

[0012] In a first aspect, an embodiment of the present disclosure provides a method for manufacturing ultra-thin glass by stacking etching and shaping, the method comprising:

[0013] Immersing the first side of the single-sided protected ultra-thin glass body in a first etching solution;

[0014] Performing a first etching on the first side by increasing the liquid level of the first etching solution or moving the position of the single-side protected ultra-thin glass body relative to the first etching solution to form an intermediate product containing a first transition zone;

[0015] immersing a second side of the intermediate product opposite to the first side in a second etching solution;

[0016] The second side is subjected to a second etching by increasing the liquid level of the second etching solution or moving the position of the intermediate product relative to the second etching solution to form an arc-shaped or trapezoidal groove containing a second transition zone and the first transition zone.

[0017] In some embodiments, etching the first side by increasing the liquid level of the first etching solution includes:

[0018] adding new first etching liquid to the first etching liquid so that the liquid level of the first etching liquid rises from a first position to a second position at a first preset speed;

[0019] The first position and the second position are both above the center line of the single-sided protected ultra-thin glass body.

[0020] In some embodiments, etching the second side by increasing the liquid level of the second etching solution includes:

[0021] adding new second etching liquid to the second etching liquid so that the liquid level of the second etching liquid rises from the third position to the fourth position at a second preset speed;

[0022] The third position and the fourth position are both above the center line of the intermediate product.

[0023] In some embodiments, the first preset speed and the second preset speed are both 0.01-0.05 mm / s.

[0024] In some embodiments, the first preset speed and the second preset speed are the same.

[0025] In some embodiments, performing the first etching on the first side by moving the single-sided protected ultra-thin glass body relative to the first etching liquid includes:

[0026] immersing the portion from the first position to the second position of the first side into the first etching liquid at a third preset speed; or,

[0027] Alternately immersing the portion from the first position to the second position of the first side in and out of the first etching solution at a fourth preset speed;

[0028] Both the first position and the second position are above the center line of the ultra-thin glass body protected on one side, and the distance between the second position and the center line of the ultra-thin glass body protected on one side is greater than the distance between the first position and the center line of the ultra-thin glass body protected on one side.

[0029] In some embodiments, performing a second etching on the second side by moving the position of the intermediate product relative to the second etching liquid includes:

[0030] immersing the portion from the third position to the fourth position of the second side into the second etching liquid at a fifth preset speed; or,

[0031] Alternately immersing and removing the portion from the third position to the fourth position of the second side in the second etching solution at a sixth preset speed;

[0032] The third position and the fourth position are both above the center line of the intermediate product, and the distance between the fourth position and the center line of the intermediate product is greater than the distance between the third position and the center line of the intermediate product.

[0033] In some embodiments, the third preset speed and the fifth preset speed are both 0.01-0.05 mm / s.

[0034] In some embodiments, the third preset speed and the fifth preset speed are the same.

[0035] In some embodiments, the fourth preset speed and the sixth preset speed are both 0.1-3 mm / S.

[0036] In some embodiments, the fourth preset speed and the sixth preset speed are the same.

[0037] In some embodiments, the number of times of alternately immersing in and removing from the first etching solution and the number of times of alternately immersing in and removing from the second etching solution are both 2-10 times.

[0038] In some embodiments, the number of times the first etching solution is alternately immersed in and removed from the first etching solution is the same as the number of times the second etching solution is alternately immersed in and removed from the first etching solution.

[0039] In some embodiments, the method for manufacturing the superimposed etching and shaping ultra-thin glass further includes a step of reducing the texture of the first transition zone and the texture of the second transition zone.

[0040] In some embodiments, the method for manufacturing superimposed etching and shaping ultra-thin glass further includes the step of fixing the protected side of the single-sided protected ultra-thin glass body on an acid-resistant liner before immersing the first side of the single-sided protected ultra-thin glass body in the first etching solution.

[0041] As a non-limiting example, the material of the acid-resistant liner includes but is not limited to one of polypropylene (PP), polyvinyl chloride (PVC), carbon fiber, etc.

[0042] It should be noted that, when the method for manufacturing the superimposed etching and shaping ultra-thin glass in the embodiment of the present application includes the step of fixing the protected side of the single-sided protected ultra-thin glass body on an acid-resistant lining before immersing the first side of the single-sided protected ultra-thin glass body in the first etching solution, the first etching, the second etching, the steps of reducing the first transition zone texture and the second transition zone texture, etc., are all performed based on the single-sided protected ultra-thin glass body with an acid-resistant lining.

[0043] In some embodiments, the single-sided protection method for the ultra-thin glass body includes but is not limited to at least one of single-sided UV acid-proof film, single-sided silk-screen ink, and single-sided spray photoresist.

[0044] In some embodiments, when etching the first side by increasing the liquid level of the first etching solution, the method of reducing the texture of the first transition region includes:

[0045] adding new first etching liquid to increase the liquid level of the first etching liquid from the first position to the second position at a seventh preset speed, and then discharging the first etching liquid to decrease the liquid level of the first etching liquid from the second position to the first position at an eighth preset speed;

[0046] Alternating the steps of adding the first etching solution and discharging the first etching solution;

[0047] The first position and the second position are both above the center line of the single-sided protected ultra-thin glass body.

[0048] In some embodiments, when etching the second side by increasing the liquid level of the second etching solution, the method of reducing the texture of the second transition region includes:

[0049] adding new second etching liquid so that the liquid level of the second etching liquid rises from the third position to the fourth position at a ninth preset speed, and then discharging the second etching liquid so that the liquid level of the second etching liquid drops from the fourth position to the third position at a tenth preset speed;

[0050] Alternating the steps of adding the second etching solution and discharging the second etching solution;

[0051] The third position and the fourth position are both above the center line of the intermediate product.

[0052] In some embodiments, the seventh speed and the ninth speed are both 0.1-0.5 mm / S.

[0053] In some embodiments, the eighth speed and the tenth speed are both 0.1-0.5 mm / S.

[0054] In some embodiments, the number of times the action of adding the first etching liquid and draining the first etching liquid is performed alternately, and the number of times the action of adding the second etching liquid and draining the second etching liquid is performed alternately are both 2-10 times.

[0055] In some embodiments, the seventh speed is the same as the ninth speed, and the eighth speed is the same as the tenth speed.

[0056] In some embodiments, the method of reducing the texture of the first transition region and the texture of the second transition region includes:

[0057] During the entire process of the first etching or the second etching, the single-sided protected ultra-thin glass body or the intermediate product is sprayed above the first etching solution level or the second etching solution level.

[0058] In some embodiments, the spraying is performed in a continuous spraying or intermittent spraying manner.

[0059] In some embodiments, when the spraying method is intermittent spraying, spraying is performed every 30-300 seconds, and the amount of spray liquid used each time is 100-500 ml.

[0060] In some embodiments, the first etching solution and the second etching solution both include a first acid solution and a second acid solution, the first acid solution includes hydrofluoric acid, and the second acid solution includes at least one of nitric acid, sulfuric acid, and hydrochloric acid.

[0061] In some embodiments, the first etching solution and the second etching solution are the same.

[0062] In some embodiments, the distance between the first position and the center line of the single-sided protected ultra-thin glass body is a mm, the distance between the third position and the center line of the intermediate product is b mm, and both a and b are 0-30 mm.

[0063] In some embodiments, said a is equal to said b.

[0064] In some embodiments, the distance between the second position and the center line of the single-sided protected ultra-thin glass body is d mm, the distance between the fourth position and the center line of the intermediate product is f mm, and both d and f are 3-33 mm.

[0065] In some embodiments, said d and said f are equal.

[0066] In some embodiments, the method for manufacturing the superimposed etching and shaping ultra-thin glass further includes: before protecting the ultra-thin glass to obtain the protected ultra-thin glass body, thinning the thicker raw material glass to a target thickness, and then cutting it to obtain the ultra-thin glass body.

[0067] In some embodiments, the cutting method includes but is not limited to laser cutting, glass knife cutting, etc.

[0068] In some embodiments, the method for manufacturing the superimposed etching-shaped ultra-thin glass further includes the steps of removing the protective layer, performing a forming process, and performing a strengthening process in sequence after forming the arc-shaped or trapezoidal groove.

[0069] In a second aspect, an embodiment of the present disclosure proposes a superimposed etching and shaping ultra-thin glass, which is prepared using the manufacturing method of the superimposed etching and shaping ultra-thin glass of the embodiment of the present disclosure.

[0070] On the third aspect, an embodiment of the present disclosure proposes a folding screen, including the superimposed etched and shaped ultra-thin glass prepared by the manufacturing method of the superimposed etched and shaped ultra-thin glass of the embodiment of the present disclosure, or the superimposed etched and shaped ultra-thin glass of the embodiment of the present disclosure.

[0071] In a fourth aspect, an embodiment of the present disclosure proposes an electronic device, comprising the superimposed etched and shaped ultra-thin glass prepared by the method for manufacturing the superimposed etched and shaped ultra-thin glass according to the embodiment of the present disclosure, or the superimposed etched and shaped ultra-thin glass according to the embodiment of the present disclosure, or the folding screen according to the embodiment of the present disclosure.

[0072] The method for manufacturing ultra-thin glass by stacked etching and shaping according to the embodiment of the present disclosure can at least bring the following beneficial effects:

[0073] The ultra-thin glass body is grooved directly by immersion etching. After forming, the gradient transition zone presents a smooth transition with good smooth transition. The middle of the shaping zone presents an arc groove or a trapezoidal groove. Compared with the machining method, it has high efficiency, low cost and high mass production. After practical application, it can effectively improve the competitiveness of the product.

[0074] Additional aspects and advantages of the present disclosure will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0075] The above and / or additional aspects and advantages of the present disclosure will become apparent and readily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0076] FIG1 is a schematic structural diagram of existing CFG ultra-thin glass.

[0077] FIG2 is an ultra-thin glass body that has been protected on one side in a method for manufacturing ultra-thin glass by stacked etching and shaping according to an exemplary embodiment of the present disclosure.

[0078] FIG3 shows an ultra-thin glass body protected on one side and fixed with an acid-resistant liner in a method for manufacturing ultra-thin glass by stacked etching and shaping according to an exemplary embodiment of the present disclosure.

[0079] FIG4 shows an ultra-thin glass body (protective layer not shown) protected on one side and containing a trapezoidal groove in a method for manufacturing ultra-thin glass by stacked etching according to an exemplary embodiment of the present disclosure.

[0080] FIG5 is a state diagram showing a method for manufacturing superimposed etching-shaped ultra-thin glass according to an exemplary embodiment of the present disclosure, in which the first side is first etched by increasing the liquid level of the first etching solution.

[0081] FIG6 is a state diagram showing a method for manufacturing ultra-thin glass by stacked etching according to an exemplary embodiment of the present disclosure, in which a first etching is performed on the first side by moving the position of the ultra-thin glass body protected on one side relative to the first etching liquid.

[0082] FIG7 is a state diagram showing how the texture of the first transition zone is reduced by spraying in a method for manufacturing superimposed etching and shaping ultra-thin glass according to an exemplary embodiment of the present disclosure.

[0083] FIG8 is a schematic diagram of etching the first side in a method for manufacturing superimposed etching shaped ultra-thin glass according to an exemplary embodiment of the present disclosure, wherein A represents the first side and B represents the second side.

[0084] FIG9 is a schematic diagram of etching the second side in a method for manufacturing superimposed etching-shaped ultra-thin glass according to an exemplary embodiment of the present invention, wherein A represents the first side and B represents the second side.

[0085] FIG10 is a diagram showing the final effect of etching both the first side and the second side of a method for manufacturing superimposed etching-shaped ultra-thin glass according to an exemplary embodiment of the present disclosure, wherein A represents the first side and B represents the second side.

[0086] FIG11 is a diagram of an ultra-thin glass body (protective layer not shown) protected on one side and containing an arc-shaped groove in a method for manufacturing ultra-thin glass by stacked etching according to another exemplary embodiment of the present disclosure.

[0087] Reference numerals:

[0088] 1-Shaping surface; 101-Large surface area; 102-Transition zone; 103-Bending zone; 2-Non-shaping surface; 3-Protective layer; 4-Ultra-thin glass body; 401-First surface; 402-Second surface; 403-First side; 404-Second side; 405-Center line; 5-Groove; 501-First transition zone; 502-Second transition zone; 503-Bending zone; 6-Acid-resistant lining; 7-Spraying device. DETAILED DESCRIPTION

[0089] The embodiments of the present disclosure are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to be used to explain the present disclosure, but should not be understood as limiting the present disclosure.

[0090] In the disclosure, the disclosure of numerical ranges includes disclosure of all values ​​within the entire range and further subdivided ranges, including the endpoints and subranges given for such ranges.

[0091] In the disclosure, the raw materials, equipment, etc. involved, unless otherwise specified, are all raw materials and equipment that can be produced through commercial channels or known methods; the methods involved, unless otherwise specified, are all conventional methods.

[0092] The following describes a method for manufacturing superimposed etching and shaping ultra-thin glass according to an embodiment of the present disclosure with reference to the accompanying drawings.

[0093] The method for manufacturing the superimposed etching and shaping ultra-thin glass according to the embodiment of the present disclosure includes the following steps:

[0094] S101 , immersing a first side (side A in FIG8 ) of the single-sided protected ultra-thin glass body (as shown in FIG2 ) into a first etching solution.

[0095] In some embodiments, the method for manufacturing the superimposed etching and shaping ultra-thin glass of the embodiment of the present disclosure further includes: before protecting the ultra-thin glass body to obtain the protected ultra-thin glass body, thinning the thicker raw material glass to the target thickness, and then cutting it to obtain the ultra-thin glass body.

[0096] As a non-limiting example, the length of the raw glass is 300-700 mm, including but not limited to 300 mm, 350 mm, 400 mm, 450 mm, 500 mm, 550 mm, 600 mm, 650 mm or 700 mm, etc.; the width of the raw glass is 300-650 mm, including but not limited to 300 mm, 350 mm, 400 mm, 450 mm, 500 mm, 550 mm or 600 mm, etc.

[0097] As non-limiting examples, the target thickness is 100-300 μm, including but not limited to 100 μm, 150 μm, 200 μm, 250 μm, or 300 μm.

[0098] In some embodiments, the cutting method includes but is not limited to laser cutting, glass knife cutting, etc.

[0099] In some embodiments, the single-sided protection method for the ultra-thin glass body includes but is not limited to at least one of single-sided UV acid-proof film, single-sided silk-screen ink, and single-sided spray photoresist.

[0100] In some embodiments, the method for manufacturing the superimposed etching and shaping ultra-thin glass of the embodiment of the present disclosure further includes the step of fixing the protected side of the ultra-thin glass body that has been protected on one side on an acid-resistant lining plate before immersing the first side of the ultra-thin glass body that has been protected on one side in the first etching solution.

[0101] As a non-limiting example, the material of the acid-resistant liner includes but is not limited to one of polypropylene (PP), polyvinyl chloride (PVC), carbon fiber, etc.

[0102] It should be noted that when the method for manufacturing the superimposed etching and shaping ultra-thin glass of the embodiment of the present disclosure includes the step of fixing the protected side of the ultra-thin glass body that has been protected on one side on an acid-resistant lining before immersing the first side of the ultra-thin glass body that has been protected on one side in the first etching solution, the first etching, the second etching, the steps of reducing the texture of the first transition zone and the texture of the second transition zone, etc., can all be performed based on the ultra-thin glass body that has been protected on one side with an acid-resistant lining (as shown in Figure 3).

[0103] In some embodiments, the first etching solution includes a first acid solution and a second acid solution. The first acid solution includes but is not limited to hydrofluoric acid, and the second acid solution includes but is not limited to at least one of nitric acid, sulfuric acid, and hydrochloric acid.

[0104] S102, performing a first etching on the first side by increasing the liquid level of the first etching solution or moving the position of the single-sided protected ultra-thin glass body relative to the first etching solution to form an intermediate product containing a first transition zone (as shown in FIG8).

[0105] In the embodiments of the present disclosure, the first etching is performed on the first side by increasing the liquid level of the first etching solution or moving the position of the single-sided protected ultra-thin glass body relative to the first etching solution, thereby forming a first transition zone. However, since the first side of the single-sided protected ultra-thin glass body is entirely etched and thinned during the first etching process, an intermediate product containing the first transition zone is formed, rather than the original single-sided protected ultra-thin glass body having only the first transition zone formed.

[0106] In some embodiments, performing a first etching on the first side by increasing the liquid level of the first etching solution includes: adding new first etching solution to the first etching solution, causing the liquid level of the first etching solution to rise from a first position to a second position at a first preset speed; the first position and the second position are both above the center line of the single-sided protected ultra-thin glass body (i.e., the product center line in FIG8 ).

[0107] It should be noted that the first position, i.e., the starting level of the first etching solution after the first side of the single-sided protected ultra-thin glass body is immersed in the first etching solution in step S101, is also the initial level line of the first etching in FIG8 . The second position, i.e., the final level of the first etching solution after the first side of the single-sided protected ultra-thin glass body is immersed in the first etching solution, is also the final level line of the first etching in FIG8 . The portion between the first and second positions forms a first transition zone after the first etching.

[0108] In some embodiments, the first preset speed is 0.01-0.05 mm / s, including but not limited to 0.01 mm / s, 0.02 mm / s, 0.03 mm / s, 0.04 mm / s, or 0.05 mm / s. Within the above range, the first preset speed can cause the first etching liquid level in the container to continuously rise, and the time the ultra-thin glass body is immersed in the first etching liquid gradually decreases from bottom to top (from the first position to the second position), thereby forming a smooth first transition zone.

[0109] As an optional example, a metering pump can be used to add new first etching solution to the first etching solution, thereby achieving a rise in the first etching solution level at a first predetermined speed. As a non-limiting example, the pump speed is 1-20 L / min, including but not limited to 1 L / min, 5 L / min, 10 L / min, 15 L / min, or 20 L / min.

[0110] It should be noted that, in the embodiment of the present disclosure, as shown in FIG5 , the distance between the starting liquid level of the first etching solution (i.e., the first position) and the end liquid level of the first etching solution (i.e., the second position) (i.e., the width of the first transition zone) can be arbitrarily adjusted by adding a new amount of the first etching solution. The specific methods of adjustment include but are not limited to: adding using a metering pump, adding by gravity, etc.

[0111] Furthermore, in the embodiment of the present disclosure, during the entire etching cycle of performing the first etching on the first side by increasing the liquid level of the first etching solution, the liquid level of the first etching solution rises from the lower limit first position to the upper limit second position only once.

[0112] In some embodiments, the distance between the first position and the center line of the single-sided protected ultra-thin glass body is a mm, where a is 0-30 mm, including but not limited to 0 mm, 1 mm, 5 mm, 10 mm, 15 mm, 20 mm, 25 mm or 30 mm.

[0113] It should be noted that when the values ​​of a and b are both 0, the groove 5 is an arc-shaped groove (as shown in FIG11 ); when the values ​​of a and b are both greater than 0, the groove 5 is a trapezoidal groove (as shown in FIG1 and FIG4 ). When the groove 5 is a trapezoidal groove, the values ​​of a and b are preferably 1-30 mm.

[0114] In some embodiments, the distance between the second position and the center line of the single-sided protected ultra-thin glass body is d mm, where d is 3-33 mm, including but not limited to 3 mm, 10 mm, 20 mm, 25 mm, or 33 mm.

[0115] In some embodiments, the width of the first transition zone is (da) mm, including but not limited to 2 mm, 3 mm, 5 mm, 10 mm, 15 mm, 20 mm, 25 mm, 30 mm or 32 mm, etc.

[0116] In other embodiments, the first side is first etched by moving the single-sided protected ultra-thin glass body relative to the first etching liquid, including one of the following two methods:

[0117] The first method is to immerse the portion from the first position to the second position of the first side of the single-sided protected ultra-thin glass body into the first etching solution at a third preset speed.

[0118] The second method is to alternately immerse the portion from the first position to the second position of the first side of the single-sided protected ultra-thin glass body in and out of the first etching solution at a fourth preset speed.

[0119] It should be noted that in the above two cases, the definitions of the first position and the second position are consistent with those in the aforementioned process of performing the first etching on the first side by increasing the liquid level of the first etching solution: the first position and the second position are both above the centerline of the single-sided protected ultra-thin glass body, and the distance between the second position and the centerline of the single-sided protected ultra-thin glass body is greater than the distance between the first position and the centerline of the single-sided protected ultra-thin glass body. However, in these two cases, no new first etching solution is added; the single-sided protected ultra-thin glass body is simply moved to achieve immersion etching of the portion between the first and second positions in the original first etching solution. The first position represents the initial liquid level of the first etching solution and also represents the starting position of the descent of the single-sided protected ultra-thin glass body.

[0120] It should also be noted that during the first etching process of the first form described above, the ultra-thin glass body, which has been protected on one side, slowly moves downward at a third preset speed, so that the portion of the upper side of the first side of the ultra-thin glass body, which has been protected on one side, located between the first position and the second position, gradually immerses in the first etching solution, forming a first transition zone. During the entire first etching cycle, the ultra-thin glass body, which has been protected on one side, moves from bottom to bottom only once. During the first etching process of the second form described above, the portion of the upper side of the first side of the ultra-thin glass body, which has been protected on one side, located between the first position and the second position, is rapidly immersed in and removed from the first etching solution back and forth at a fourth preset speed, forming a first transition zone. Both the first and second forms of the first etching process described above can be understood with the help of Figure 6.

[0121] In some embodiments, the third preset speed is 0.01-0.05 mm / S, including but not limited to 0.01 mm / S, 0.02 mm / S, 0.03 mm / S, 0.04 mm / S or 0.05 mm / S, etc.

[0122] In some embodiments, the fourth preset speed is 0.1-3 mm / S, including but not limited to 0.1 mm / S, 0.5 mm / S, 1 mm / S, 1.5 mm / S, 2 mm / S, 2.5 mm / S or 3 mm / S.

[0123] In some embodiments, during the first etching process of the second form described above, the portion of the first side (e.g., the upper side) of the single-sided protected ultra-thin glass body located between the first position and the second position is alternately immersed in and removed from the first etching solution at a fourth preset speed 2-10 times, including but not limited to 2 times, 3 times, 4 times, 5 times, 6 times, 7 times, 8 times, 9 times, or 10 times.

[0124] S103 , immersing a second side (side B in FIG. 9 ) of the intermediate product opposite to the first side into a second etching solution.

[0125] In some embodiments, the second etching solution includes a first acid solution and a second acid solution. The first acid solution includes but is not limited to hydrofluoric acid, and the second acid solution includes but is not limited to at least one of nitric acid, sulfuric acid, and hydrochloric acid.

[0126] It should be noted that the initial liquid level of the second etching solution needs to be controlled at the subsequent third position.

[0127] S104: Perform a second etching on the second side by increasing the level of the second etching solution or moving the intermediate product relative to the second etching solution to form an arc-shaped or trapezoidal groove (as shown in FIG9 ) containing the second transition zone and the first transition zone. The final product is shown in FIG10 .

[0128] In the embodiments of the present disclosure, the second side is subjected to a second etching by increasing the liquid level of the second etching solution or moving the position of the intermediate product relative to the second etching solution, thereby forming a second transition zone. However, since the entire second side of the intermediate product participates in the etching and thinning during the second etching process, an arc-shaped or trapezoidal groove containing the second transition zone and the first transition zone is formed (as shown in FIG. 4 ), rather than the original intermediate product with only the second transition zone formed.

[0129] In some embodiments, performing a second etching on the second side by increasing the liquid level of the second etching solution includes: adding new second etching solution to the second etching solution, causing the liquid level of the second etching solution to increase from a third position to a fourth position at a second preset speed; the third position and the fourth position are both above the center line of the intermediate product (i.e., the product center line in FIG. 9 ).

[0130] It should be noted that the third position, i.e., the starting level of the second etching solution after the second side of the intermediate product, opposite the first side, is immersed in the second etching solution in step S103, is also the secondary etching initial level line in FIG9 . The fourth position, i.e., the final level of the second etching solution after it rises, is also the secondary etching final level line in FIG9 . The portion between the third and fourth positions forms a second transition zone after the second etching.

[0131] In some embodiments, the second preset speed is 0.01-0.05 mm / s, including but not limited to 0.01 mm / s, 0.02 mm / s, 0.03 mm / s, 0.04 mm / s, or 0.05 mm / s. Within the above range, the second preset speed can cause the second etching liquid level in the container to continuously rise, and the time the intermediate product is immersed in the second etching liquid gradually decreases from bottom to top (from the third position to the fourth position), thereby forming a smooth second transition zone.

[0132] As an optional example, a metering pump can be used to add new second etching solution to the second etching solution, thereby achieving an increase in the second etching solution level at a second preset speed. As a non-limiting example, the pump speed is 1-20 L / min, including but not limited to 1 L / min, 5 L / min, 10 L / min, 15 L / min or 20 L / min.

[0133] It should be noted that, in the embodiments of the present disclosure, the distance between the starting liquid level of the second etching solution (i.e., the third position) and the end liquid level of the second etching solution (i.e., the fourth position) (i.e., the width of the second transition zone) can be arbitrarily adjusted by adding a new amount of the second etching solution. The specific methods of adjustment include but are not limited to: adding using a metering pump, adding by gravity, etc.

[0134] Furthermore, in the embodiment of the present disclosure, during the entire etching cycle of performing the second etching on the second side by increasing the liquid level of the second etching solution, the liquid level of the second etching solution rises from the lower limit third position to the upper limit fourth position only once.

[0135] In some embodiments, the distance between the third position and the center line of the intermediate product is b mm, where b is 0-30 mm, including but not limited to 0 mm, 1 mm, 5 mm, 10 mm, 15 mm, 20 mm, 25 mm or 30 mm.

[0136] In some embodiments, the distance between the fourth position and the center line of the intermediate product is f mm, and f is 3-33 mm, including but not limited to 3 mm, 10 mm, 20 mm, 25 mm or 33 mm.

[0137] In some embodiments, the width of the second transition zone is (fb) mm, including but not limited to 2 mm, 3 mm, 5 mm, 10 mm, 15 mm, 20 mm, 25 mm, 30 mm or 32 mm, etc.

[0138] In other embodiments, performing the second etching on the second side by moving the intermediate product relative to the second etching solution includes one of the following two methods:

[0139] Method 1: Immersing the portion from the third position to the fourth position on the second side of the intermediate product opposite to the first side into the second etching solution at a fifth preset speed.

[0140] Mode 2: Alternately immersing and removing the portion of the intermediate product from the third position to the fourth position on the second side opposite to the first side into and out of the second etching solution at a sixth preset speed.

[0141] It should be noted that in both of the above cases, the definitions of the third and fourth positions are consistent with those in the aforementioned process of performing the second etching of the second side by increasing the second etching solution level: both the third and fourth positions are above the centerline of the intermediate product, and the fourth position is farther from the centerline of the intermediate product than the third position. However, in both cases, no new second etching solution is added; instead, the intermediate product is moved to immerse and etch the portion between the third and fourth positions in the original second etching solution. The third position represents the initial level of the second etching solution and also marks the starting point of the intermediate product's descent.

[0142] It should also be noted that during the first etching process of the above-mentioned method 1, the intermediate product is slowly moved downward at a fifth preset speed, so that the portion of the second side (for example, the upper side) of the intermediate product opposite to the first side, located between the third position and the fourth position, is gradually immersed in the second etching solution, forming a second transition zone. During the entire second etching cycle, the intermediate product is moved from top to bottom only once. During the second etching process of the above-mentioned method 2, the portion of the upper side of the second side of the intermediate product opposite to the first side, located between the third position and the fourth position, is quickly immersed in and removed from the second etching solution at a sixth preset speed, forming a second transition zone. The second etching processes of the above-mentioned methods 1 and 2 can also be understood with the help of Figure 6.

[0143] In some embodiments, the fifth preset speed is 0.01-0.05 mm / S, including but not limited to 0.01 mm / S, 0.02 mm / S, 0.03 mm / S, 0.04 mm / S or 0.05 mm / S, etc.

[0144] In some embodiments, the sixth preset speed is 0.1-3 mm / S, including but not limited to 0.1 mm / S, 0.5 mm / S, 1 mm / S, 1.5 mm / S, 2 mm / S, 2.5 mm / S or 3 mm / S.

[0145] In some embodiments, during the second etching process in the above-described method 2, a portion of an upper side of the second side of the intermediate product opposite to the first side located between the third position and the fourth position is alternately immersed in and removed from the second etching solution at a sixth preset speed 2-10 times, including but not limited to 2 times, 3 times, 4 times, 5 times, 6 times, 7 times, 8 times, 9 times, or 10 times.

[0146] It should be noted that in the method for making the superimposed etching shaping ultra-thin glass of the embodiment of the present disclosure, the first etching solution and the second etching solution may be the same or different; the aforementioned a and b may be equal or unequal; the aforementioned d and f may be equal or unequal; the first preset speed and the second preset speed may be the same or different; the third preset speed and the fifth preset speed may be the same or different; the fourth preset speed and the sixth preset speed may be the same or different; the number of times of alternately immersing in and removing the first etching solution and the number of times of alternately immersing in and removing the second etching solution may be the same or different. When each of the above groups of parameters are the same or equal, the ultra-thin glass after etching using steps S101-S104 has a structure as shown in Figure 1 or Figure 4 (the groove is trapezoidal), or has a structure when the groove 5 in Figure 1 or Figure 4 is an arc-shaped groove (as shown in Figure 11). When the groove is an arc-shaped groove (as shown in Figure 11), the above-mentioned a and b values ​​need to be adjusted to 0, and water spraying is required during the etching process on both sides (to reduce the texture of the transition zone) so that the final product can achieve an arc shape in the bending zone 503.

[0147] When at least part of each of the above groups of parameters is different or equal, the structure of the ultra-thin glass after etching using steps S101-S104 may be similar to the structure shown in Figure 1 or Figure 4 (the groove is trapezoidal) or the case where the groove is arc-shaped (as shown in Figure 11), but there may also be some minor differences, such as different angles between the inclined parts on both sides of the trapezoidal groove and the bottom, different widths of the inclined parts (different widths of the first transition zone and the second transition zone), etc.

[0148] In the method for manufacturing superimposed etching-shaped ultra-thin glass in the embodiment of the present disclosure, the first transition zone and the second transition zone are formed after etching in steps S101-S104. Within the transition range, due to the factor of liquid tension, the product will produce lines due to etching. This line will affect the light and shadow refraction effect of the finished product after coating, so this line needs to be removed or reduced.

[0149] Therefore, in some embodiments, the method for manufacturing the superimposed etching shaped ultra-thin glass according to the embodiment of the present disclosure further includes the step of reducing the texture of the first transition zone and the texture of the second transition zone.

[0150] In some embodiments, when etching the first side by increasing the level of the first etching solution, a method for reducing the texture of the first transition region includes:

[0151] adding new first etching liquid so that the liquid level of the first etching liquid rises from the first position to the second position at a seventh preset speed, and then discharging the first etching liquid so that the liquid level of the first etching liquid drops from the second position to the first position at an eighth preset speed;

[0152] Alternating between adding new first etching solution and draining the first etching solution;

[0153] The first position and the second position are both above the center line of the single-sided protected ultra-thin glass body.

[0154] The description of the first etching solution, the first position, and the second position is substantially the same as that of step S102 and will not be repeated here.

[0155] In some embodiments, when etching the second side by increasing the liquid level of the second etching solution, a method for reducing the lines in the second transition region includes:

[0156] adding new second etching liquid so that the liquid level of the second etching liquid rises from the third position to the fourth position at a ninth preset speed, and then discharging the second etching liquid so that the liquid level of the second etching liquid drops from the fourth position to the third position at a tenth preset speed;

[0157] Alternating between adding new second etching solution and draining the second etching solution;

[0158] The third position and the fourth position are both above the center line of the intermediate product.

[0159] The descriptions of the second etching solution, the third position, and the fourth position are substantially the same as those of step S104 and are not repeated here.

[0160] In some embodiments, the seventh speed and the ninth speed are both 0.1-0.5 mm / S, including but not limited to 0.1 mm / S, 0.2 mm / S, 0.3 mm / S, 0.4 mm / S or 0.5 mm / S, etc.

[0161] In some embodiments, the eighth speed and the tenth speed are both 0.1-0.5 mm / S, including but not limited to 0.1 mm / S, 0.2 mm / S, 0.3 mm / S, 0.4 mm / S or 0.5 mm / S, etc.

[0162] In some embodiments, the number of times the first etching solution is added and the number of times the first etching solution is drained are alternately performed, and the number of times the second etching solution is added and the number of times the second etching solution is drained are alternately performed are both 2-10 times, including but not limited to 2 times, 3 times, 4 times, 5 times, 6 times, 7 times, 8 times, 9 times or 10 times.

[0163] As an optional example, the seventh speed is the same as the ninth speed, the eighth speed is the same as the tenth speed, and the number of times of alternately adding new first etching liquid and discharging the first etching liquid and the number of times of alternately adding new second etching liquid and discharging the second etching liquid are the same.

[0164] In the method for manufacturing ultra-thin glass by stacked etching and shaping in the embodiment of the present disclosure, by the above-mentioned liquid level rising method, liquid is continuously added and discharged during the entire first etching or second etching time period, so that the etching liquid level moves up and down quickly, shortening the time that the acid solution stays at the same position during the etching process, thereby reducing the transition zone texture.

[0165] In other embodiments, a method for reducing the texture of the first transition region and the texture of the second transition region includes: spraying the single-sided protected ultra-thin glass body or intermediate product above the first etching solution level or the second etching solution level during the entire first etching process or the second etching process (as shown in FIG. 7 ).

[0166] It should be noted that the above-mentioned method of reducing the texture of the first transition zone and the second transition zone by spraying is applicable to all the above-mentioned formation methods of the first transition zone and the second transition zone. During the entire etching process, the transition zone position can be cleaned and flushed by spraying to reduce the texture of the transition zone.

[0167] In some embodiments, the spraying method is continuous spraying or intermittent spraying.

[0168] In some embodiments, when the spraying method is intermittent spraying, spraying is performed every 30-300 seconds, and the amount of spray liquid used each time is 100-500 ml.

[0169] As non-limiting examples, the spraying interval includes but is not limited to 30s, 50s, 100s, 150s, 200s, 250s or 300s, etc.; the amount of spray liquid used each time includes but is not limited to 100ml, 200ml, 300ml, 400ml or 500ml, etc.

[0170] In some embodiments, the spraying is performed by pure water spraying, including but not limited to water jets or mists.

[0171] In some embodiments, the method for manufacturing the superimposed etching-shaped ultra-thin glass of the embodiment of the present disclosure further includes the steps of removing the protective layer, forming and strengthening the glass in sequence after forming the arc-shaped or trapezoidal groove.

[0172] In some embodiments, the method of removing the protective layer includes: removing the protective layer on the product containing the arc-shaped or trapezoidal grooves of the second transition zone and the first transition zone by ultraviolet light irradiation or strong alkaline solution cleaning to obtain a product without the protective layer.

[0173] In some embodiments, the molding method includes: removing the edge portion of the product without the protective layer by laser cutting to form the required shape and size, and passivating the edge of the product by acid (for example, hydrofluoric acid, etc.) to avoid damage during strengthening.

[0174] In some embodiments, the strengthening treatment method includes: placing the product after the above-mentioned molding treatment into a potassium nitrate solution for particle exchange, so that a stress layer is formed on the surface of the product to improve the strength of the product.

[0175] The method for manufacturing the superimposed etching-shaped ultra-thin glass of the disclosed embodiment directly adopts the immersion etching method to groove the ultra-thin glass body. After molding, the gradient transition zone (for example, the large surface area and the transition zone in Figure 1) has a smooth transition with good smooth transition. The middle of the molding zone presents an arc groove or a trapezoidal groove shape. Compared with the machining method, it is more efficient, low-cost, and has higher mass production. After practical application, it can effectively improve the competitiveness of the product.

[0176] The superimposed etching and shaping ultra-thin glass of the embodiment of the present disclosure is prepared using the manufacturing method of the superimposed etching and shaping ultra-thin glass of the embodiment of the present disclosure.

[0177] The folding screen of the embodiment of the present disclosure includes the superimposed etched and shaped ultra-thin glass prepared by the manufacturing method of the superimposed etched and shaped ultra-thin glass of the embodiment of the present disclosure, or the superimposed etched and shaped ultra-thin glass of the embodiment of the present disclosure.

[0178] In some embodiments, the superimposed etching and shaping ultra-thin glass of the embodiment of the present disclosure is as shown in FIG. 1 , but the transition area 102 and the bending area 103 are partially replaced by arc-shaped grooves.

[0179] The electronic device of the embodiment of the present disclosure includes the superimposed etched and shaped ultra-thin glass prepared by the method for manufacturing the superimposed etched and shaped ultra-thin glass of the embodiment of the present disclosure, or the superimposed etched and shaped ultra-thin glass of the embodiment of the present disclosure, or the folding screen of the embodiment of the present application.

[0180] In some embodiments, electronic devices include but are not limited to foldable screen mobile phones, tablet computers, etc.

[0181] As an optional example, the superimposed etching and shaping ultra-thin glass is the ultra-thin glass shown in FIG1 (that is, the CFG ultra-thin glass disclosed in the Chinese patent application No. 202111588204.8), and its manufacturing method includes the following steps:

[0182] (1) Large-sheet thinning: Thinning thicker raw glass (length 300-700 mm, e.g. 500 mm; width 300-650 mm, e.g. 400 mm) to the required target thickness (100-300 μm, e.g. 200 μm).

[0183] (2) Cutting: Use laser cutting, glass knife cutting or other methods to cut the thinned raw material into smaller set sizes to obtain an ultra-thin glass body (length of 100-500 mm, for example, 400 mm).

[0184] (3) Product protection: The ultra-thin glass body is protected on one side by at least one of a single-sided UV acid-proof film, a single-sided silk-screen ink, and a single-sided spray photoresist, and a protective layer 3 is formed on one side surface of the ultra-thin glass body 4 (i.e., the second surface 402) to obtain an ultra-thin glass body with single-sided protection, as shown in FIG2 .

[0185] (4) Product backing board: The side of the protective layer of the single-sided protected ultra-thin glass body is fixed on an acid-resistant backing board 6 (for example, PP acid-resistant backing board) made of polypropylene (PP), polyvinyl chloride (PVC), carbon fiber, etc. using adhesive tape. The single-sided protected ultra-thin glass body is placed horizontally or vertically and centered on the acid-resistant backing board 6 to obtain a single-sided protected ultra-thin glass body with an acid-resistant backing board (as shown in FIG3 ).

[0186] (5) Etching of the first side (side A): The ultra-thin glass body with single-sided protection and an acid-resistant liner is placed in a first etching solution (which must contain hydrofluoric acid, nitric acid, sulfuric acid, or hydrochloric acid, including 1-3 of them, for example, a mixture of hydrofluoric acid and hydrochloric acid in a mass ratio of 1:1), and the initial liquid level of the first etching solution is controlled to be at a first position above the center line of the ultra-thin glass body with single-sided protection and a liner (1-30 mm from the center line, for example, 10 mm), and the first side of the first surface 401 of the ultra-thin glass body is etched.

[0187] A. The transition zone is formed in one of the following three ways:

[0188] a. Forming a transition zone by controlling the rise of the first etching liquid level: After the single-sided protected ultra-thin glass body with an acid-resistant liner is placed in the first etching liquid, new first etching liquid is immediately added to the container storing the first etching liquid through a metering pump (pump speed: 1-20L / min, for example, 10L / min) to continuously increase the first etching liquid level in the container (the liquid level rise rate is 0.01-0.05mm / S, for example, 0.03mm / S). From bottom to top, the time the glass is immersed in the first etching liquid gradually decreases. 5 , the width of the transition zone can be adjusted arbitrarily (by adjusting the amount of the first etching solution added to the tank body, the width of the transition zone can be controlled). During the entire etching cycle, the liquid level of the first etching solution rises from the lower limit of the transition zone (the first position, i.e., the initial liquid level line of one etching in FIG8 ) to the upper limit of the transition zone (the second position, i.e., the end point liquid level line of one etching in FIG8 ) only once (after rising to the upper limit, the product is taken out and reversed, and the liquid level in the tank body is discharged to the initial liquid level in preparation for the second side etching).

[0189] b. Forming a transition zone by controlling the movement of the product: During the etching process, the product moves slowly downward (at a speed of 0.01-0.05 mm / s, for example, 0.03 mm / s), so that the upper part of the product located from the lower limit of the transition zone (the first position, i.e., the initial liquid level line of an etching in FIG8 ) to the upper limit (the second position, i.e., the liquid level line to the end point of an etching in FIG8 ) is gradually immersed in the acid solution to form a transition zone. During the entire etching cycle, the product moves from bottom to bottom only once, as shown in FIG6 .

[0190] c. Form a transition zone by controlling product movement: Rapidly move the product back and forth (at a speed of 0.1-3 mm / s, e.g., 1.5 mm / s) between the upper and lower limits of the transition zone (the lower limit is the first position, the upper limit is the second position) to form the transition zone. Typically, the product moves up and down 2-10 times (e.g., 6 times) per minute, as shown in Figure 6.

[0191] B. Methods for reducing the texture in the transition zone include one of the following two methods:

[0192] Method 1 (the above-mentioned liquid level rising method a is applicable): by rapidly adding the first etching solution (the liquid addition rate is 0.1-0.5 mm / s, for example, 0.3 mm / s) to the upper limit position of the transition zone (the second position, i.e., the liquid level line at the end of one etching in FIG8 ), and then rapidly draining the liquid (the rapid drainage rate is 0.1-0.5 mm / s, for example, 0.3 mm / s) to the lower limit position of the transition zone (the first position, i.e., the initial liquid level line of one etching in FIG8 ). During the entire etching time period, the first etching solution is continuously added and drained, so that the liquid level of the first etching solution moves up and down rapidly, shortening the residence time of the first etching solution at the same position during the etching process, thereby reducing the lines in the transition zone. Generally, the liquid level is rapidly drained 2-10 times (for example, 5 times) every 10 minutes.

[0193] Method 2 (all three transition zone formation methods a, b, and c mentioned above are applicable): During the entire etching process, the transition zone is cleaned and flushed by a pure water spray method (water column or spray) to reduce the lines generated in the transition zone, as shown in Figure 7; the spray method can be divided into continuous spraying and intermittent spraying. Intermittent spraying is usually set to spray once every 30-300S, and about 100-500ml of pure water is used for each spray.

[0194] (6) Second Side (Side B) Etching: After the first side etching is completed, the liner and the product after the first etching are turned 180° and placed in the first etching solution again (the initial liquid level is the initial liquid level during the first side etching in step (5)) for etching in the same manner as the first side etching. After the etching is completed, the product with the grooves formed on the first surface 401 is formed, as shown in Figure 4. The A / B side shaping diagrams are shown in Figures 8-10.

[0195] (7) Removal of product protective layer: After the groove is completed, the protective layer on the non-shaped surface of the product is removed by ultraviolet light irradiation or strong alkaline solution cleaning.

[0196] (8) Molding: The edge of the product after slotting is cut off by laser cutting to form the required shape and size, and the edge of the product is passivated with acid to avoid damage during strengthening.

[0197] (9) Strengthening: By placing the product in a potassium nitrate solution for particle exchange, a stress layer is formed on the surface of the product to improve the strength of the product.

[0198] The following further illustrates the method for manufacturing the superimposed etching-shaped ultra-thin glass as shown in FIG1 of the present application, which comprises the following steps:

[0199] 1) Large-scale thinning: Thinning the thicker raw glass to the required target thickness (such as 170um)

[0200] 2) Cutting: Use laser cutting, glass knife cutting or other methods to cut the thinned raw material into smaller set sizes (such as 200 mm in length and 180 mm in width) to obtain the ultra-thin glass body.

[0201] 3) Product Protection: The ultra-thin glass body is protected on one side. Specifically, a protective layer 3 is formed on the second surface 402 of the ultra-thin glass body 4. The protective layer 3 is a UV acid-proof film. The length and width of the acid-proof film are greater than the length and width of the ultra-thin glass body by at least 5 mm, resulting in a single-sided protected ultra-thin glass body, as shown in FIG2 .

[0202] 4) Product lining board: Use tape to fix the side of the protective layer 3 of the single-sided protected ultra-thin glass body on the acid-resistant lining board made of polypropylene (PP). The single-sided protected ultra-thin glass body is centered on the upper and lower center positions of the acid-resistant lining board to obtain a single-sided protected ultra-thin glass body with an acid-resistant lining board (as shown in Figure 3).

[0203] 5) First Side (Side A) Etching: The ultra-thin glass body with single-sided protection and an acid-resistant liner is placed in a first etching solution (a mixture of 20 wt% hydrofluoric acid and 2.5 wt% hydrochloric acid in a mass ratio of 1:1). The initial liquid level of the first etching solution is controlled at a first position above the centerline of the ultra-thin glass body with single-sided protection and an liner (10 mm from the centerline). The first side of the first surface 401 of the ultra-thin glass body is etched at an etching rate of 3 μm / min. During the etching process, a pure water spray is turned on. The spray position can be set to spray on the ultra-thin glass body with single-sided protection and an acid-resistant liner, near the surface of the first etching solution on the ultra-thin glass body with single-sided protection and an acid-resistant liner, so that the pure water flows evenly to the surface of the first etching solution to dilute the surface first etching solution. The spraying method is intermittent spraying, with spraying every 100 seconds during the intermittent spraying process, and the spray flow rate is 200 ml / min. The total thinning amount on the A side was set to 70 μm.

[0204] 6) Etching of the second side (side B): After completing the etching of side A, rinse the product (i.e., the product after etching the first side of the first surface 401 of the ultra-thin glass body), turn the liner together with the product 180°, and place it in the first etching solution again (the initial liquid level is the initial liquid level when etching the first side in step (5)) for etching. The total thinning amount of side B is set to 70μm, and other methods are the same as those for etching side A. Clean the product after etching. After etching, the product with the grooves on the first surface 401 is formed, as shown in Figure 4, and the A / B side shaping diagram is shown in Figures 8-10.

[0205] 7) Remove the product protective layer: After the product is grooved and cleaned, it can be irradiated with ultraviolet light to remove the stickiness of the UV acid-proof film. The ultraviolet light energy is ≥500mj / cm2 to remove the protective film on the non-shaped surface of the product. Finally, the product is cleaned to obtain a product with a thickness of 100um in the non-folding area (large area 101 in Figure 1) and a thickness of 30μm in the folding area (bending area 103 in Figure 1).

[0206] 8) Forming: Laser cutting is used to remove the edge of the product after slotting (i.e., the product of unequal thickness obtained in step 7) to form the required shape and size.

[0207] 9) Edge treatment: Place the cut product obtained in step 8) in an acid solution (must contain hydrofluoric acid, for example, 20 wt% hydrofluoric acid as the acid solution) to passivate the edge of the product with the acid solution to avoid damage during strengthening. The treatment time is 200 seconds.

[0208] 10) Strengthening: The product after the passivation treatment in step 9) is subjected to a particle exchange treatment in a 99wt% potassium nitrate solution at 380°C for 35 minutes to form a stress layer on the surface of the product, thereby improving the product strength. After strengthening, the product is immersed in water to remove surface residues and then cleaned to obtain the final product (as shown in Figure 1).

[0209] The final product was tested for performance, and the results are shown in Table 1.

[0210] Table 1 Note: The input number in Table 1 refers to folding 100 final products prepared according to the above method according to the folding conditions in Table 1, and then inspecting the folding OK number and folding pass rate.

[0211] In summary, in the embodiments of the present disclosure:

[0212] Preparation method of trapezoidal groove: It can be achieved by adding liquid (that is, forming a transition zone by controlling the liquid level of the first etching liquid to rise) or by swinging the product up and down (that is, forming a transition zone by controlling the movement of the product), and both a value a and b value (as shown above, a is the distance between the first position and the center line of the ultra-thin glass body protected on one side, b is the distance between the third position and the center line of the intermediate product) are required to be greater than 1 mm, and the optimal setting value can also be above 3 mm (that is, a≧3 mm and b≧3 mm). The upper and lower limits of the transition zone of adding liquid (that is, forming a transition zone by controlling the liquid level of the first etching liquid to rise) or swinging (that is, forming a transition zone by controlling the movement of the product) are generally set to more than 3 mm. During the etching process, the water spraying action to reduce the etching lines is not started, and a standard trapezoidal groove can be formed. If the water spraying action is turned on (ie, the above-mentioned method 2), the water spraying interval and flow rate are set the same as above), the trapezoidal shape will change after the groove is opened, and the transition edges will be smoother, as shown in Figure 1, forming a smoother trapezoidal groove.

[0213] Arc groove preparation method: It can be achieved by adding liquid (that is, by controlling the liquid level of the first etching liquid to rise to form a transition zone) or by swinging the product up and down (that is, by controlling the movement of the product to form a transition zone), and the a value and b value (as shown above, a is the distance between the first position and the center line of the ultra-thin glass body protected on one side, and b is the distance between the third position and the center line of the intermediate product) are both set in the range of 0 to 5 mm. The setting distance between the upper limit and the lower limit of the transition zone of adding liquid (that is, by controlling the liquid level of the first etching liquid to rise to form a transition zone) or swinging (that is, by controlling the movement of the product to form a transition zone) is generally more than 3 mm. The water spraying action needs to be turned on during the etching process (that is, the above-mentioned method 2). The spraying position can be set to spray on the product, on the acid liquid surface close to the product, or on the lining. The ultimate goal is to allow pure water to flow evenly to the surface of the acid solution to dilute the surface acid solution. The spray interval is set to 30-300 seconds, and the spray flow rate is set to 100-300 ml / min. The actual setting value needs to be set according to the size of the a value, b value, and the radius of the arc. The larger the a value and b value, the larger the arc radius, the spray interval needs to be reduced accordingly, and the spray flow rate needs to be increased accordingly. The smaller the a value and b value, the smaller the arc radius, and the opposite is true.

[0214] Glass grooving by etching can be mass-produced, with the CT output of a single piece of grooving being less than 15S, and the processing time is much lower than that of CNC machining and polishing. Etching grooving is a non-hard contact process, which can be used to groove thicker cover glass and flexible glass with a thickness of less than 0.2mm, effectively reducing breakage during the grooving process. Compared with machining grooving, etching grooving has great advantages in terms of processing efficiency, processing consumables, and processing yield. Flexible folding products processed by etching grooving have no microcracks in the folding area (i.e., bending area 103 in Figure 1, bending area 503 in Figure 4, or bending area 503 in Figure 5) due to the non-contact processing. Compared with the folding area with a thickness of 30μm, the product folding pass rate is more than 50% higher than other processing methods (folding radius R0.6mm).

[0215] In the present disclosure, the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In the specification of the present disclosure, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in the specification of the present disclosure and the features of different embodiments or examples, unless they are contradictory.

[0216] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. Throughout the present disclosure, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0217] Although the embodiments of the present disclosure have been shown and described above, it is understood that the above embodiments are illustrative and are not to be construed as limitations on the present application. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present disclosure.

[0218] All embodiments of the present disclosure may be implemented individually or in combination with other embodiments, and are all considered to be within the scope of protection claimed by the present disclosure.

Claims

1. A method for manufacturing superimposed etching and shaping ultra-thin glass, comprising: Immersing the first side of the single-sided protected ultra-thin glass body into a first etching solution; Performing a first etching on the first side by increasing the level of the first etching solution or moving the position of the single-sided protected ultra-thin glass body relative to the first etching solution to form an intermediate product containing a first transition zone; immersing a second side of the intermediate product opposite to the first side in a second etching solution; The second side is subjected to a second etching by increasing the liquid level of the second etching solution or moving the position of the intermediate product relative to the second etching solution to form an arc-shaped or trapezoidal groove containing the second transition zone and the first transition zone.

2. The method for manufacturing superimposed etching shaped ultra-thin glass according to claim 1, wherein: The etching the first side by increasing the liquid level of the first etching solution comprises: Adding new first etching liquid to the first etching liquid, so that the liquid level of the first etching liquid rises from a first position to a second position at a first preset speed; The first position and the second position are both above the center line of the single-sided protected ultra-thin glass body; And / or, etching the second side by increasing the liquid level of the second etching solution comprises: adding new second etching liquid to the second etching liquid, so that the liquid level of the second etching liquid rises from the third position to the fourth position at a second preset speed; The third position and the fourth position are both above the center line of the intermediate product.

3. The method for manufacturing superimposed etching and shaping ultra-thin glass according to claim 2, wherein: The first preset speed and the second preset speed are both 0.01-0.05 mm / S.

4. The method for manufacturing superimposed etching and shaping ultra-thin glass according to claim 2, wherein: The first preset speed and the second preset speed are the same.

5. The method for manufacturing superimposed etching and shaping ultra-thin glass according to any one of claims 1 to 4, wherein: The first side is first etched by moving the single-sided protected ultra-thin glass body relative to the first etching liquid, comprising: immersing the portion from the first position to the second position of the first side into the first etching liquid at a third preset speed; or, Alternately immersing and removing the portion from the first position to the second position of the first side into and out of the first etching solution at a fourth preset speed; The first position and the second position are both above the center line of the single-sided protected ultra-thin glass body, and the distance between the second position and the center line of the single-sided protected ultra-thin glass body is greater than the distance between the first position and the center line of the single-sided protected ultra-thin glass body; And / or, performing a second etching on the second side by moving the position of the intermediate product relative to the second etching liquid comprises: immersing the portion from the third position to the fourth position of the second side into the second etching liquid at a fifth preset speed; or, Alternately immersing and removing the portion from the third position to the fourth position of the second side into and out of the second etching solution at a sixth preset speed; The third position and the fourth position are both above the center line of the intermediate product, and the distance between the fourth position and the center line of the intermediate product is greater than the distance between the third position and the center line of the intermediate product.

6. The method for manufacturing superimposed etching and shaping ultra-thin glass according to claim 5, wherein: The third preset speed and the fifth preset speed are both 0.01-0.05 mm / S. And / or, the fourth preset speed and the sixth preset speed are both 0.1-3 mm / S; And / or, the number of times of alternately immersing in and removing from the first etching solution and the number of times of alternately immersing in and removing from the second etching solution are both 2-10 times.

7. The method for manufacturing superimposed etching and shaping ultra-thin glass according to claim 6, wherein: The third preset speed is the same as the fifth preset speed; and / or, the fourth preset speed is the same as the sixth preset speed; And / or, the number of times of alternately immersing in and removing from the first etching solution and the number of times of alternately immersing in and removing from the second etching solution are the same.

8. The method for manufacturing superimposed etching shaped ultra-thin glass according to any one of claims 1 to 7, wherein: The method for manufacturing superimposed etching shaping ultra-thin glass further includes the step of reducing the texture of the first transition zone and the texture of the second transition zone; And / or, the method for manufacturing superimposed etching and shaping ultra-thin glass further comprises the step of fixing the protected side of the ultra-thin glass body protected on one side on an acid-resistant liner before immersing the first side of the ultra-thin glass body protected on one side into the first etching solution; And / or, the single-sided protection method for the ultra-thin glass body includes but is not limited to at least one of single-sided UV acid-proof film, single-sided silk-screen ink, and single-sided spray photoresist.

9. The method for manufacturing superimposed etching and shaping ultra-thin glass according to claim 8, wherein: When etching the first side by increasing the liquid level of the first etching solution, the method for reducing the texture of the first transition area includes: Adding new first etching liquid to make the liquid level of the first etching liquid rise from the first position to the second position at a seventh preset speed, and then discharging the first etching liquid to make the liquid level of the first etching liquid drop from the second position to the first position at a preset eighth speed; Alternatingly performing the actions of adding new first etching solution and discharging the first etching solution; The first position and the second position are both above the center line of the single-sided protected ultra-thin glass body; And / or, when etching the second side by increasing the liquid level of the second etching solution, the method for reducing the texture of the second transition zone includes: Adding new second etching liquid so that the liquid level of the second etching liquid rises from the third position to the fourth position at a ninth preset speed, and then discharging the second etching liquid so that the liquid level of the second etching liquid drops from the fourth position to the third position at a tenth preset speed; Alternatingly performing the actions of adding new second etching liquid and discharging the second etching liquid; The third position and the fourth position are both above the center line of the intermediate product.

10. The method for manufacturing superimposed etching and shaping ultra-thin glass according to claim 9, wherein: The seventh speed and the ninth speed are both 0.1-0.5 mm / s; And / or, the eighth speed and the tenth speed are both 0.1-0.5 mm / s; And / or, the number of times of alternately adding the first etching liquid and discharging the first etching liquid, and the number of times of alternately adding the second etching liquid and discharging the second etching liquid are both 2-10 times.

11. The method for manufacturing superimposed etching and shaping ultra-thin glass according to claim 10, wherein: The seventh speed is the same as the ninth speed, and the eighth speed is the same as the tenth speed.

12. The method for manufacturing superimposed etching and shaping ultra-thin glass according to claim 8, wherein: The method for reducing the first transition zone texture and the second transition zone texture comprises: During the entire process of the first etching or the second etching, the single-sided protected ultra-thin glass body or the intermediate product is sprayed above the first etching solution level or the second etching solution level.

13. The method for manufacturing superimposed etching and shaping ultra-thin glass according to claim 12, wherein: The spraying method is continuous spraying or intermittent spraying.

14. The method for manufacturing superimposed etching and shaping ultra-thin glass according to claim 13, wherein: When the spraying method is intermittent spraying, spraying is performed every 30-300 seconds, and the amount of spraying liquid used each time is 100-500 ml.

15. The method for manufacturing superimposed etching shaped ultra-thin glass according to any one of claims 2 to 7 or any one of claims 9 to 11, wherein: The first etching solution and the second etching solution both include a first acid solution and a second acid solution, the first acid solution includes hydrofluoric acid, and the second acid solution includes at least one of nitric acid, sulfuric acid, and hydrochloric acid; And / or, the distance between the first position and the center line of the single-sided protected ultra-thin glass body is a mm, the distance between the third position and the center line of the intermediate product is b mm, and both a and b are 0-30 mm; And / or, the distance between the second position and the center line of the single-sided protected ultra-thin glass body is d mm, the distance between the fourth position and the center line of the intermediate product is f mm, and both d and f are 3-33 mm.

16. The method for manufacturing superimposed etching and shaping ultra-thin glass according to claim 15, wherein: The first etching solution and the second etching solution are the same; and / or, said a is equal to said b; And / or, said d and said f are equal.

17. The method for manufacturing superimposed etching and shaping ultra-thin glass according to any one of claims 1 to 16, wherein: The method for manufacturing the superimposed etching and shaping ultra-thin glass also includes the steps of removing the protective layer, forming and strengthening the glass in sequence after forming the arc-shaped or trapezoidal groove.

18. A superimposed etching shaping ultra-thin glass, wherein: The ultra-thin glass is prepared by the method for manufacturing the superimposed etching and shaping ultra-thin glass as described in any one of claims 1 to 17.

19. A folding screen, wherein: It comprises the superimposed etching and shaping ultra-thin glass prepared by the method for preparing superimposed etching and shaping ultra-thin glass as described in any one of claims 1 to 17, or the superimposed etching and shaping ultra-thin glass as described in claim 18.

20. An electronic device, wherein: It includes the superimposed etched shaped ultra-thin glass prepared by the method for making superimposed etched shaped ultra-thin glass as described in any one of claims 1 to 17, or the superimposed etched shaped ultra-thin glass as described in claim 18, or the folding screen as described in claim 19.

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