Electroplating equipment with alternately used conductive wheels
By using swing mechanism and reverse electrolysis in the electroplating equipment, the conductive wheel is used alternately without shutdown, which solves the problem of copper plating affecting the electroplating effect and shutdown cleaning of the conductive wheel, and achieves efficient removal of copper plating and production continuity.
Patent Information
- Application Number
- CN202421055003.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-14
- Publication Date
- 2024-12-24
- Estimated Expiration
- 2034-05-14
AI Technical Summary
After conventional electroplating equipment forms copper plating on the surface of the conductive wheel, it affects the electroplating effect, and the existing cleaning methods require shutdown of the machine to discharge the electroplating solution, affecting production continuity.
Design an electroplating equipment for alternately used conductive wheels, using swing mechanism and reverse electrolysis method, switches its electrode properties during electroplating and de-washing by the second conductor, and uses the de-washing liquid to cover and reverse electrolysis to remove the copper plating layer to achieve No shutdown cleaning.
The continuous cleaning of the conductive wheel without shutdown is realized, the copper plating removal efficiency is improved, and the continuous and efficiency of production is ensured.
Smart Images
Figure CN222226617U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of electroplating, in particular to an electroplating device with alternating conductive wheels. Background Art
[0002] Conventional circuit board electroplating equipment electroplates the circuit board in a chamber filled with electroplating liquid. In this chamber, the cathode used for electroplating is a conductive wheel. During electroplating, a layer of copper plating is deposited on the conductive wheel. After about a week of operation, the copper plating formed on the surface of the conductive wheel will affect the electroplating effect.
[0003] The conventional cleaning method is to add nitric acid solution into the chamber for de-laundering. However, this method requires the original plating solution to be discharged, and the operation process is quite cumbersome. In addition, stopping the machine for cleaning will affect the continuity of production operations. Utility Model Content
[0004] In order to solve the above problems, the utility model provides an electroplating device with alternately used conductive wheels, which will not stop during cleaning.
[0005] To achieve the above-mentioned purpose, the technical solution adopted by the utility model is: an electroplating device with alternating conductive wheels, characterized in that the electroplating area contains a second conductor as a cathode, which is connected to a swing mechanism outside the electroplating area, and at least two second conductors are provided. After a single swing, at least one second conductor reaches a height that is separated from electroplating, and the position of at least one second conductor is maintained on the conveying path of the circuit board. The stripping mechanism serving as the cathode is flipped to the bottom of the second conductor that is separated from electroplating, so that the stripping liquid in the stripping mechanism is soaked into the second conductor, and the second conductor is connected to the positive electrode to form an anode, so that the second conductor is reversely electrolyzed on the inside of the stripping mechanism. The copper plated on the conductive wheel is achieved.
[0006] Furthermore, the swing mechanism has a pivot point for swinging, and at least two second conductors are provided at equal intervals from the pivot point, and the second conductors do not overlap.
[0007] Furthermore, the washing-off mechanism includes a flipping mechanism, a water receiving box and a first liquid outlet mechanism. The driving part of the flipping mechanism is connected to the water receiving box, driving the water receiving box to flip under the second conductor. The liquid outlet mechanism is arranged above the second conductor, and continuously delivers washing-off liquid to the water receiving box and the second conductor, so that the washing-off liquid covers the second conductor.
[0008] Furthermore, the first end of the second conductor is covered by a gear set, so that the second conductors rotate synchronously.
[0009] Furthermore, it also includes a first driving part with a toothed surface at the output end, and a gear is provided on the second end of the second conductor. After the swing mechanism completes a cycle of swinging motion, the second end of at least one second conductor meshes with the output end of the first driving part.
[0010] Furthermore, a plurality of second conductors are distributed above and below the circuit board, and the swing mechanism controls the positions of the second conductors above and below the circuit board simultaneously.
[0011] Furthermore, the swing mechanism includes a conductive wheel connecting plate, a toothed part and a second driving part. The conductive wheel connecting plate is the first end of the second conductor that is simultaneously sleeved on the top and bottom of the circuit board. The toothed part is fixed on the conductive wheel connecting plate. The toothed parts are meshed with each other. The transmission shaft included in the second driving part is connected to any one of the toothed parts. After the toothed part is dragged and swung, the two conductive wheel connecting plates will have corresponding swinging trajectories.
[0012] Furthermore, the electroplating area also includes an upper cover, which is suspended above the water box. The distance between the upper cover and the water box forms a passage space reserved for the entry and exit of the circuit board. The water box has a storage space for storing the electroplating liquid. The circuit board is in the electroplating space and is immersed in the electroplating liquid.
[0013] Furthermore, a second liquid outlet mechanism is provided in the electroplating area. The second liquid outlet mechanism is arranged in the accommodating space and below the passing space. The liquid outlet mechanism includes a liquid pump, and the copper sulfate solution is filled in the entire passing space and the accommodating space through the liquid pump; the filling means that the liquid inlet amount provided by the liquid pump is greater than the liquid outlet amount of the copper sulfate solution flowing out of the passing space, so the copper sulfate solution can completely cover the entire circuit board and the second liquid outlet mechanism.
[0014] Furthermore, the liquid outlet mechanism includes a diverter and a liquid outlet pipe, the surface of the diverter is provided with a plurality of first diverter holes, the liquid outlet pipe is arranged below the diverter and is connected with the diverter, and the extracted copper sulfate solution passes through the first diverter holes, so that the entire circuit board can be evenly soaked.
[0015] Beneficial effects of the utility model:
[0016] The utility model comprises at least two second conductors, combined with a swinging mechanism, after a single swing, there is a second conductor for performing an electroplating process and another second conductor separated from the electroplating process, cooperates with the flipping movement of the stripping and washing bin body, so that the stripping liquid can cover the second conductor separated from the electroplating process, the second conductor separated from the electroplating process is connected to the positive electrode, the stripping and washing bin body is connected to the negative electrode, and the copper is reversely stripped inside the stripping and washing bin body in the form of electroplating, so as to achieve the purpose of cleaning. From the process point of view, the second conductor can be used alternately to simultaneously perform conductive copper plating as a cathode and copper stripping cleaning as an anode, without the need for equipment shutdown processing. In addition, this cleaning is performed in the form of reverse electrolytic stripping, so that the efficiency of copper stripping is improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a stereogram of the utility model.
[0018] Figure 2 It is a cross-sectional view of the utility model.
[0019] Figure 3 It is the internal structure diagram of the utility model.
[0020] Figure 4 yes Figure 3 Enlarged schematic diagram of point C.
[0021] Figure 5 Schematic diagram of the connection between the second conductor and the flip structure.
[0022] Figure 6 It is a stereoscopic diagram of the liquid outlet mechanism in the embodiment.
[0023] Figure 7 yes Figure 6 Enlarged schematic diagram of point D. DETAILED DESCRIPTION
[0024] In the specification, references to "one embodiment", "an embodiment" or "some embodiments" mean that a particular feature, structure or element described with reference to the embodiment is included in at least one embodiment of the subject matter being described. Thus, sentences in the specification saying "in one embodiment" or "in an embodiment" or "in some embodiments" do not necessarily refer to the same embodiment or embodiments. The particular features, structures or elements may be further combined in any embodiment in a suitable manner.
[0025] like Figure 1-7 As shown, the electroplating equipment of the utility model is mainly used to solve the problem of stopping the equipment to clean the copper on the second conductor. Generally speaking, stopping the equipment for cleaning will consume a lot of time. In addition, the electroplating equipment is one of the important links in the production of the circuit board 1. When the electroplating equipment is stopped, the production capacity of other production lines will also be affected.
[0026] The electroplating equipment includes an anode and a cathode forming a circuit. In the utility model, at least two second conductors (A / B) serving as cathodes are provided, and the cathode property of the second conductor (A / B) is not fixed. Depending on whether the positive electrode or the negative electrode is connected, the second conductor (A / B) serves as an anode during stripping and serves as a cathode during electroplating.
[0027] In order to fully illustrate the utility model, the electroplating equipment of the utility model takes copper plating as an example, and is specifically described as follows:
[0028] The second conductor (A / B) is arranged on a swing mechanism that can make reciprocating motion, and the two are at the same distance from the pivot point on the swing mechanism. In one period of swing (single swing), there is always a second conductor (A / B) that contacts the circuit board 1, and the other second conductor (A / B) is suspended on the circuit board 1. The second conductor (A / B) that contacts the circuit board 1 is connected to the negative electrode to form a cathode. In this way, the two second conductors (A / B) can be distinguished in the electroplating stage, and it is ensured that one second conductor (A / B) does not participate in the electroplating process each time. When there is a need, it can switch to using another second conductor (A / B) to be determined.
[0029] The electroplating solution is a copper sulfate solution. During the electroplating process, the first conductor 100 as the anode and the circuit board 1 are immersed in the electroplating solution. When the second conductor (A / B) serves as the cathode, after contacting the circuit board 1, copper ions adhere to the circuit board 1 to achieve copper plating.
[0030] The above immersion should be understood as relying on the sprayed electroplating solution to act on the circuit board 1. The electroplating solution is copper ions with positive electrodes, and the circuit board is negative. Therefore, the positive copper ions will be evenly attached to the circuit board 1 through the sprayed electroplating solution, forming electroplated copper on the circuit board 1 (thickening the copper on the circuit board 1 or plating copper in the hole).
[0031] Specifically, the second conductor (A / B) and the first conductor 100 are both conductive steel pressure rollers. The second conductor (A / B), the first conductor 100 and the water box 4 form an electroplating area. The swing mechanism is located outside the electroplating area and is connected to the first end of the second conductor (A / B).
[0032] The main purpose of setting at least two second conductors (A / B) is to clean the vacated second conductor A. A water receiving box 2 is provided around the second conductor A, which is turned around the central axis of the second conductor A. The water receiving box 2 is an arc-shaped body adapted to the second conductor A. The end of the water receiving box 2 extending along the length direction is connected to the rotating end of the turning mechanism (not shown in the figure). When cleaning is required, the water receiving box 2 is rotated to the bottom of the second conductor A, and cooperates with the spray pipe 3 above the second conductor A. The copper sulfate solution with ferric chloride as the washing liquid is sprayed from the spray pipe 3 (the bottom surface of the spray pipe 3) The stripping liquid in the water receiving box 2 is sprayed out by spraying on the second conductor A and the water receiving box 2. The stripping liquid in the water receiving box 2 will gradually increase and cover the local area of the second conductor A. At this time, the water receiving box 2 is connected to the cathode, the second conductor A is connected to the anode, and the copper attached to the surface of the second conductor A is reversely plated on the inner surface of the water receiving box 2. In this way, the second conductor A completes the stripping step and all the copper is stripped away. It can be seen that the utility model uses the method of electro-stripping to strip the copper on the second conductor A, combined with the use of the flipping mechanism, to achieve the purpose of continuous electroplating without stopping.
[0033] Corresponding to another second conductor B, a flipping mechanism, a water receiving box 2, and a spray pipe 3 with the same positional relationship, role, function, and connection relationship are also provided. When the second conductor B needs to be cleaned, the swing mechanism swings in the opposite direction so that the second conductor A overlaps with the conveying path of the circuit board 1, and the second conductor B is separated from the conveying path of the circuit board 1; after the swing mechanism stops swinging, the gap formed between the second conductor B and the path of the circuit board 1 allows the water receiving box 2 to flip to between the second conductor B and the path of the circuit board 1;
[0034] It is not difficult to conclude that the utility model achieves the purpose of synchronous cleaning and electroplating through a swing mechanism and at least two second conductors (A / B) that can be connected to the positive electrode and the negative electrode. Alternating use of the second conductors (A / B) can ensure that at least one second conductor (A / B) remains in a washed state. When the second conductor (A / B) needs to be replaced, the positions of the two second conductors (A / B) are switched by the swing mechanism, so that a new round of electroplating can be timely involved. Thus, continuous electroplating can be carried out without stopping, and production efficiency is effectively guaranteed.
[0035] The above explanation and cleaning of copper plating are mainly aimed at the electroplating on the surface of the circuit board 1 and the second conductor (A / B) on the surface of the corresponding circuit board 1.
[0036] In practice, there are other second conductors (A / B), a water receiving box 2, etc. located below the circuit board 1, which is also for the purpose of cleaning and electroplating the bottom of the circuit board 1. The specific mechanisms involved can be referred to as described above.
[0037] It should be noted that, at the bottom, the component providing the washing liquid is a pipe directly connected to the water box 4, the washing liquid directly fills the entire water box 2, the second conductor (A / B) is immersed in the washing liquid in the water box 2, and the water box 2 is provided with a water outlet 2' at the other end away from the pipe, and the amount of washing liquid in the water box 2 is greater than the amount of washing liquid outflowing;
[0038] The same is true for the water receiving box 2 above, where the water outlet 2' falls into the main tank below through a pipe or directly.
[0039] It should also be noted that the gears 5 on the second ends of the two second conductors (A / B) are meshed with each other. When the second conductor A is electroplated, the lateral movement of the circuit board 1 will also guide the second conductor A to rotate. After the second conductor B is meshed with the second conductor A through the gear 5, the second conductor B in the water receiving box 2 will also rotate and fully contact with the washing liquid.
[0040] Furthermore, after each swinging motion of the swing mechanism is completed, the first end of at least one second conductor (A / B) is connected to the first driving part. Such connection may be that two independent bevel gears 6 mesh with each other after contact.
[0041] The above-mentioned swing mechanism controls the position of the second conductor (A / B) above and below the circuit board 1 at the same time. The swing mechanism includes a pair of conductive wheel connecting plates 71, a pair of toothed parts 72 and a second driving part 73. The conductive wheel connecting plate 71 is simultaneously sleeved on the first end of the second conductor (A / B) above or below the circuit board 1. The toothed parts 72 are fixed on the conductive wheel connecting plate 71. The toothed parts 72 are meshed with each other. The transmission shaft 73′ included in the second driving part is connected to any one of the toothed parts 72. After the toothed parts 72 are dragged and swung, the two conductive wheel connecting plates 71 will have corresponding swinging trajectories.
[0042] The pivot point is where the toothed member 72 is fixed to the conductive wheel connecting plate 71 .
[0043] It should be noted that the second conductor (A / B), as one of the copper-plated components, is also close to the circuit board 1 during stripping.
[0044] In fact, the electroplating equipment also includes a housing 8 surrounding the above components.
[0045] The electroplating area also includes an upper cover 9, which is fixed to the inner side of the outer shell 8 through the side and suspended above the water box 4. The distance between the upper cover 9 and the water box 4 forms a passage space 1a reserved for the entry and exit of the circuit board 1. The water box 4 has a storage space 41 for storing the electroplating liquid. The circuit board 1 is in the electroplating space and is immersed in the electroplating liquid.
[0046] The electroplating area also includes a liquid discharge mechanism for continuously delivering copper sulfate solution. The liquid discharge mechanism is arranged in the accommodating space 41 and is located below the through space 1a. The liquid discharge mechanism includes a liquid pump (not shown in the figure), and the copper sulfate solution is filled in the entire through space 1a and the accommodating space 41 through the liquid pump; the filling means that the liquid inlet amount provided by the liquid pump is greater than the liquid outlet amount of the copper sulfate solution flowing out of the through space, so the copper sulfate solution can completely cover the entire circuit board 1.
[0047] The liquid outlet mechanism includes a diverter 10, a surface of which is provided with a plurality of first diverter holes 11, a liquid outlet pipe 12 is provided below the diverter 10, and the drawn copper sulfate solution passes through the first diverter holes 11, so that the entire circuit board 1 can be evenly soaked.
[0048] For another example, in order to further enhance the diversion effect, a diversion plate 13 is further provided in the diversion member 10, and the diversion plate 13 has a second diversion hole 13' whose diameter is larger than that of the first diversion hole 11. In this way, the copper sulfate solution flowing out of the second diversion hole 13' flows out of the first diversion hole 11 again, and the liquid outputs of each are uniform.
[0049] In the embodiment, a liquid outlet mechanism is further provided above the passage space 1a. The two liquid outlet mechanisms have the same structure and the same operating principle.
[0050] The above implementation modes are merely descriptions of the preferred implementation modes of the present invention, and are not intended to limit the scope of the present invention. Without departing from the design spirit of the present invention, various modifications and improvements made to the technical solutions of the present invention by ordinary engineering and technical personnel in the field shall fall within the protection scope determined by the claims of the present invention.
Claims
1. An electroplating device with alternating conductive wheels, characterized in that: The electroplating area includes a second conductor serving as a cathode, which is connected to a swing mechanism outside the electroplating area. At least two second conductors are provided. After a single swing, at least one second conductor reaches a height to be separated from electroplating. The position of at least one second conductor is maintained on the conveying path of the circuit board. The stripping mechanism serving as the cathode is flipped to the bottom of the second conductor separated from electroplating, so that the stripping liquid in the stripping mechanism is soaked into the second conductor. The second conductor is connected to the positive electrode to form an anode, so that the second conductor is reversely copper-plated on the inside of the stripping mechanism.
2. The electroplating equipment for alternating conductive wheels according to claim 1, characterized in that: The swing mechanism is provided with a pivot point for swinging, and at least two second conductors are provided with equal spacings from the pivot point, and the second conductors do not overlap.
3. The electroplating equipment for alternately using conductive wheels according to claim 1, characterized in that: The washing-off mechanism includes a flipping mechanism, a water receiving box and a first liquid outlet mechanism. The driving part of the flipping mechanism is connected to the water receiving box, driving the water receiving box to flip under the second conductor. The liquid outlet mechanism is arranged above the second conductor, and continuously delivers washing-off liquid to the water receiving box and the second conductor, so that the washing-off liquid covers the second conductor.
4. The electroplating equipment for alternately using conductive wheels according to claim 1, characterized in that: The first end of the second conductor is covered by the gear set, so that the second conductors rotate synchronously.
5. The electroplating equipment for alternately using conductive wheels according to claim 1, characterized in that: It also includes a first driving part with a toothed surface at the output end, a second end of the second conductor is provided with a gear, and after the swing mechanism completes the swinging motion, the second end of at least one second conductor is meshed with the output end of the first driving part.
6. The electroplating equipment for alternately using conductive wheels according to claim 1, characterized in that: A plurality of second conductors are distributed above and below the circuit board, and the swing mechanism is used to simultaneously control the positions of the second conductors above and below the circuit board.
7. The electroplating equipment for alternately using conductive wheels according to any one of claims 1 to 6, characterized in that: The swing mechanism includes a conductive wheel connecting plate, a toothed part and a second driving part. The conductive wheel connecting plate is the first end of the second conductor that is simultaneously sleeved on the upper and lower sides of the circuit board. The toothed part is fixed on the conductive wheel connecting plate. The toothed parts are meshed with each other. The transmission shaft included in the second driving part is connected to any one of the toothed parts. After the toothed part is dragged and swung, the two conductive wheel connecting plates will have corresponding swinging trajectories.
8. The electroplating equipment for alternately using conductive wheels according to claim 1, characterized in that: The electroplating area also includes an upper cover, which is suspended above the water box. The distance between the upper cover and the water box forms a passage space reserved for the entry and exit of the circuit board. The water box has a storage space for storing the electroplating liquid. The circuit board is in the electroplating space and is immersed in the electroplating liquid.
9. The electroplating equipment for alternately using conductive wheels according to claim 8, characterized in that: A second liquid outlet mechanism is also provided in the electroplating area. The second liquid outlet mechanism is arranged in the accommodating space and below the through space. The liquid outlet mechanism includes a liquid pump, and the copper sulfate solution is filled in the entire through space and the accommodating space through the liquid pump; the filling means that the liquid inlet amount provided by the liquid pump is greater than the liquid outlet amount of the copper sulfate solution flowing out of the through space, so the copper sulfate solution can completely cover the entire circuit board.
10. The electroplating equipment for alternately using conductive wheels according to claim 9, characterized in that: The liquid outlet mechanism includes a diverter and a liquid outlet pipe. The surface of the diverter is provided with a plurality of first diverter holes. The liquid outlet pipe is arranged below the diverter and is connected with the diverter. The extracted copper sulfate solution passes through the first diverter holes, so that the entire circuit board can be evenly soaked.