Electroplating liquid circulating device

Abstract

The utility model discloses an electroplating liquid circulating device which comprises an accommodating tank, the accommodating tank is divided into a treatment area and a standing area by the isolation plate, and a filtering unit is arranged in the treatment area; the first pump body is connected with the containing tank, and the first pump body is connected with a first pipeline extending into the side of the filtering unit; the two ends of the second pipeline are connected with the standing area and the first pump body respectively; according to the electroplating liquid treatment device, the containing pool is divided into different areas, the electroplating liquid is pumped from the standing area to the treatment area through the first pump body, solid particles in the electroplating liquid are filtered out under the action of the filtering unit, and the electroplating liquid is discharged out of the treatment area through the second pump body. And burrs caused by the fact that solid particles adhere to a plating piece are effectively prevented.

Description

Technical Field

[0001] The utility model belongs to the technical field of metal electroplating, and in particular relates to an electroplating liquid circulation device. Background Art

[0002] The electroplating process is a method of applying a layer of metal to a conductor using the principle of electrolysis. Electroplating refers to a surface processing method in which the cations of the pre-plated metal in the plating solution are deposited on the surface of the base metal through electrolysis in a salt solution containing metals such as potassium gold cyanide and potassium gold citrate, with the base metal to be plated as the cathode, to form a coating.

[0003] During the electroplating process, the purity of the electroplating solution directly affects the effect of electroplating and the quality of the coating formed on the surface of the workpiece. If the suspended solid particles in the electroplating solution are attached to the surface of the coating formed on the surface of the workpiece, it may cause problems such as reduced flatness of the coating, loss of gloss, slow glossing, etc., or cause pinholes and pitting in the coating, which reduces the corrosion resistance of the coating. In addition, during the long electroplating process, it is inevitable that a lot of impurities will precipitate in the electroplating solution. If the impurity concentration exceeds the standard, it will also cause the workpiece to be reworked or even scrapped.

[0004] A Chinese patent application with application number CN201621020838.8 discloses a plating liquid filtering circulation device, in which a water pump, a filter and a water outlet pump are placed in a moving device, and the moving device includes a lifting device and a horizontal moving device. The lifting device drives the water pump, the filter and the water outlet pump to perform lifting and lowering movements, and the horizontal moving device drives the water pump, the filter and the water outlet pump to perform horizontal movement. In this way, when extracting the plating liquid in the plating tank, the extraction angle can be adjusted, so that the plating liquid filtering circulation device can completely extract the plating liquid in the plating tank, thereby improving the filtering and purification effect of the plating liquid.

[0005] With further research by the applicant, it was found that since the technical solution provided inspiration for extracting the plating solution into a filter purifier for filtration and purification from multiple angles, it failed to make structural improvements to the filtration process of the plating solution. The filtration and purification effect failed to achieve the ideal effect, the purity of the plating solution could not be guaranteed, affecting the performance of the coating. Utility Model Content

[0006] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0007] A plating liquid circulation device, comprising:

[0008] Capacity pool;

[0009] An isolation plate separates the tank into a treatment area and a static area, wherein a filtering unit is disposed in the treatment area;

[0010] A first pump body connected to the container tank, wherein the first pump body is connected to a first pipeline extending into a side of the filter unit;

[0011] A second pipeline, wherein both ends of the second pipeline are respectively connected to the static area and the first pump body;

[0012] The upper end of the isolation plate is provided with a groove for supplying the plating solution to flow from the processing area into the static area.

[0013] Furthermore, it also includes a second pump body, the second pump body is connected to a third pipeline extending into the static area, and the second pipeline is connected to the third pipeline and the second pump body through a three-way connector.

[0014] Furthermore, a fourth pipe is connected to the side of the static area near the bottom, and the other end of the fourth pipe is connected to the second pump body.

[0015] Furthermore, a liquid level window is provided on the side of the container.

[0016] Furthermore, a control panel is connected to the container, and the control panel is electrically connected to the first pump body and the second pump body.

[0017] Furthermore, a valve body is connected to the three-way connector.

[0018] Compared with the prior art, the utility model has the following beneficial effects:

[0019] The containing pool is divided into different areas, and the plating liquid is pumped from the static area to the processing area through the first pump body. The solid particles in the plating liquid are filtered out by the filtering unit. The plating liquid after preliminary treatment overflows to the static area through the grooves opened in the partition plate. After continuous and multiple cycles of treatment, the plating liquid meets the process requirements and effectively prevents the solid particles from adhering to the plated parts to cause burrs. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a three-dimensional structural schematic diagram of an embodiment of an electroplating liquid circulation device of the utility model (viewing angle 1);

[0021] Figure 2 A schematic diagram of the three-dimensional structure of an embodiment of an electroplating liquid circulation device of the utility model (viewing angle 2);

[0022] Figure 3 This is a schematic diagram of the main structure of an embodiment of an electroplating liquid circulation device of the utility model;

[0023] Figure 4 It is a schematic diagram of the three-dimensional structure of a container in an embodiment of an electroplating liquid circulation device of the utility model;

[0024] The reference numerals in the drawings of the specification include:

[0025] The container 1, the isolation plate 10, the groove 100, the liquid level window 11, the control panel 12, the processing area 2, the filtering unit 20, the static area 3, the first pump body 4, the first pipeline 41, the second pipeline 42, the three-way connector 43, the valve body 430, the second pump body 5, the third pipeline 50, and the fourth pipeline 51. DETAILED DESCRIPTION

[0026] In order to enable those skilled in the art to better understand the present invention, the technical solution of the present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0027] Among them, the drawings are only used for exemplary explanations, and they only show schematic diagrams rather than actual drawings, and cannot be understood as limitations on this patent; in order to better illustrate the embodiments of the utility model, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of the actual product; for those skilled in the art, it is understandable that some well-known structures and their descriptions in the drawings may be omitted, and the same or similar reference numerals in the drawings of the embodiments of the utility model correspond to the same or similar parts; in the description of the utility model, it should be understood that if the terms "upper", "lower", "left", "right", "inner", "outer" and the like appear, the directions or positional relationships indicated are based on the directions or positional relationships shown in the drawings, which are only for the convenience of describing the utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, so the terms describing the positional relationship in the drawings are only used for exemplary explanations, and cannot be understood as limitations on this patent. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to specific circumstances.

[0028] like Figure 1 - Figure 4 As shown, a plating liquid circulation device of the utility model includes a container 1, a first pump body 4, a first pipeline 41 and a second pipeline 42;

[0029] The containment tank 1 is provided with an isolation plate 10, which separates the containment tank 1 into a treatment area 2 and a static area 3, and the treatment area 2 is provided with a filtering unit 20;

[0030] The first pump body 4 is located at the upper part of the tank 1, and is connected to a first pipe 41 extending into the side of the filter unit 20;

[0031] Wherein, both ends of the second pipeline 42 are connected to the static area 3 and the first pump body 4 respectively;

[0032] A groove 100 for allowing the plating solution to flow from the processing area 2 to the static area 3 is formed at the upper end of the isolation plate 10 . The groove 100 may be in a dovetail shape.

[0033] The container 1 is divided into different areas, and the plating liquid is pumped from the static area 3 to the processing area 2 by the first pump body 4. Under the action of the filtering unit 20, the solid particles in the plating liquid are filtered out, and the plating liquid after preliminary treatment overflows to the static area 3 through the groove 100 opened on the partition plate. After continuous and multiple cycles of treatment, the plating liquid meets the process requirements and effectively prevents the solid particles from adhering to the plated parts to cause burrs.

[0034] Specifically, it also includes a second pump body 5 , which is connected to a third pipeline 50 extending into the static area 3 , and the second pipeline 42 is connected to the third pipeline 50 and the second pump body 5 through a three-way connector 43 .

[0035] The three-way connector 43 is connected to a valve body 430 .

[0036] A fourth pipe 51 is connected to the side of the static area 3 near the bottom, and the other end of the fourth pipe 51 is connected to the second pump body 5 .

[0037] After the second pump body 5 is added, the circulation efficiency of the electroplating solution is improved, the electroplating solution in the static area 3 is continuously pumped into the processing area 2, and the electroplating solution in the processing area 2 flows into the static area 3. The electroplating solution in the processing area 2 is always in a flowing state, which is beneficial to the movement speed of ions in the electroplating solution, thereby reducing the concentration gradient of the electroplating solution in the container 1, reducing the polarization of the electroplating solution, and accelerating the current efficiency and electroplating efficiency.

[0038] The groove 100 formed on the partition plate is the standard liquid level for the electroplating solution to overflow to the static area 3 after each filtration. The electroplating solution exceeding the standard liquid level flows out of the groove 100 to ensure that the electroplating solution in the processing area 2 can always be maintained at the standard liquid level.

[0039] A liquid level window 11 is provided on the side of the container 1 , and an operator can know the liquid state and flow condition of the electroplating solution in the container 1 by observing the liquid level window 11 .

[0040] In addition, a control panel 12 is connected to the container 1, and the control panel 12 is electrically connected to the first pump body 4 and the second pump body 5. By operating the control panel 12, the gear positions of the first pump body 4 and the second pump body 5 are adjusted to control the speed of the circulation filtration.

[0041] The filtering unit 20 may be provided with multiple layers, preferably two layers, so as to improve the purity of the electroplating solution by filtering twice, thereby ensuring the quality of the coating.

[0042] The above are only embodiments of the utility model. The common sense such as the known specific structures and characteristics in the scheme is not described in detail here. The ordinary technicians in the relevant field are aware of all the common technical knowledge in the technical field to which the utility model belongs before the application date or priority date, can obtain all the existing technologies in the field, and have the ability to apply the conventional experimental means before that date. The ordinary technicians in the relevant field can improve and implement the scheme in combination with their own abilities under the enlightenment given by this application. Some typical known structures or known methods should not become obstacles for the ordinary technicians in the relevant field to implement this application. It should be pointed out that for the technicians in this field, without departing from the structure of the utility model, several deformations and improvements can be made, which should also be regarded as the protection scope of the utility model, and these will not affect the effect of the implementation of the utility model and the practicality of the patent.

Claims

1. A plating solution circulation device, characterized in that: include: Capacity pool (1); An isolation plate (10) is used to separate the container (1) into a processing area (2) and a static area (3); a filtering unit (20) is provided in the processing area (2); A first pump body (4) connected to the container (1), wherein the first pump body (4) is connected to a first pipe (41) extending into the side of the filter unit (20); A second pipeline (42), the two ends of which are respectively connected to the static area (3) and the first pump body (4); The upper end of the isolation plate (10) is provided with a groove (100) for allowing the electroplating solution to flow from the processing area (2) into the static area (3).

2. A plating solution circulation device as claimed in claim 1, characterized in that: The invention also comprises a second pump body (5), the second pump body (5) being connected with a third pipeline (50) extending into the static area (3), and the second pipeline (42) being connected with the third pipeline (50) and the second pump body (5) via a three-way connector (43).

3. A plating solution circulation device as claimed in claim 2, characterized in that: A fourth pipe (51) is connected to the side of the static zone (3) near the bottom, and the other end of the fourth pipe (51) is connected to the second pump body (5).

4. A plating solution circulation device as claimed in claim 1, 2 or 3, characterized in that: A liquid level window (11) is provided on the side of the container (1).

5. A plating solution circulation device as claimed in claim 2 or 3, characterized in that: The container (1) is connected to a control panel (12), and the control panel (12) is electrically connected to the first pump body (4) and the second pump body (5).

6. A plating solution circulation device as claimed in claim 2 or 3, characterized in that: The three-way connector (43) is connected to a valve body (430).

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