Heat dissipation module and projection device

Abstract

The utility model provides a heat dissipation module. The heat dissipation module comprises a fan and a damping sleeve. And the damping sleeve sleeves the fan. The damping sleeve is provided with an inner surface and an outer surface which are opposite, and the inner surface faces the fan. The damping sleeve comprises a plurality of damping protrusions. One of the inner surface and the outer surface is formed with a damping protrusion, and each side of the other of the inner surface and the outer surface is a plane. The utility model further provides a projection device comprising the heat dissipation module. The heat dissipation module and the projection device can buffer vibration generated during operation of the fan.

Description

Technical Field

[0001] The utility model relates to a heat dissipation module, in particular to a heat dissipation module for a projection device, and a projection device having the heat dissipation module. Background Art

[0002] The types of light sources used in projection devices have evolved from ultra-high pressure mercury lamps (UHP lamps), light emitting diodes (LEDs) to laser diodes (LDs) as the market demands for brightness, color saturation, service life, and non-toxicity and environmental protection of projection devices.

[0003] Since a projection device generates a lot of heat when in operation, a fan is usually installed in the projection device. However, the fan will continue to generate a lot of vibration when in operation, and the vibration will be transmitted to the light source, light valve or projection lens through the components in the projection device, resulting in poor image quality of the projection device.

[0004] The "background technology" section is only used to help understand the content of the present invention. Therefore, the content disclosed in the "background technology" section may contain some prior art that is not known to those skilled in the art. The content disclosed in the "background technology" section does not mean that the content or the problem to be solved by one or more embodiments of the present invention has been known or recognized by those skilled in the art before the application of the present invention. Summary of the invention

[0005] The utility model provides a heat dissipation module to buffer the vibration generated when a fan is running.

[0006] The utility model provides a projection device to improve image quality.

[0007] Other purposes and advantages of the utility model can be further understood from the technical features disclosed in the utility model.

[0008] To achieve one or part or all of the above purposes or other purposes, a heat dissipation module of an embodiment of the utility model includes a fan and a shock-absorbing sleeve. The shock-absorbing sleeve is arranged on the fan. The shock-absorbing sleeve has an inner surface and an outer surface opposite to each other, and the inner surface faces the fan. The shock-absorbing sleeve includes a plurality of shock-absorbing convex parts. A shock-absorbing convex part is formed on one of the inner surface and the outer surface, and each side of the other of the inner surface and the outer surface is a plane.

[0009] To achieve one, part, or all of the above objectives or other objectives, a projection device according to an embodiment of the present invention includes the above-mentioned heat dissipation module.

[0010] The heat dissipation module of the utility model adopts a shock-absorbing sleeve, wherein the inner surface or the outer surface of the shock-absorbing sleeve is formed with a shock-absorbing convex portion. Furthermore, the shock-absorbing convex portion can contact the fan or other mechanical components, so that the area where the shock-absorbing sleeve contacts the fan or the above-mentioned mechanical components can be reduced, so that the shock-absorbing sleeve can evenly absorb and buffer the vibration generated when the fan is running. Based on the above, the heat dissipation module of the utility model can effectively reduce the vibration amplitude transmitted from the fan. The projection device of the utility model adopts the above-mentioned heat dissipation module to improve the image quality.

[0011] In order to make the above and other purposes, features and advantages of the present invention more obvious and understandable, preferred embodiments are specifically cited below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of a heat dissipation module according to an embodiment of the present utility model.

[0013] Figure 2 yes Figure 1 A cross-sectional schematic diagram of a heat dissipation module.

[0014] Figure 3 It is a cross-sectional schematic diagram of a heat dissipation module according to another embodiment of the utility model.

[0015] Figure 4 It is a cross-sectional schematic diagram of a heat dissipation module according to another embodiment of the utility model.

[0016] Figure 5 yes Figure 4 Schematic diagram of the fan and shock-absorbing sleeve.

[0017] Figure 6 It is a cross-sectional schematic diagram of a heat dissipation module according to another embodiment of the utility model.

[0018] Figure 7 It is a block diagram of a projection device according to an embodiment of the utility model.

[0019] Reference numerals list

[0020] 100, 100a, 100b, 100c: heat dissipation module

[0021] 110: Fan

[0022] 120, 120b, 120c: shock-absorbing sleeve

[0023] 121, 121b: Inner surface

[0024] 122, 122b: outer surface

[0025] 123: shock absorbing convex part

[0026] 124: Frame

[0027] 125: Stopper

[0028] 126: threading hole

[0029] 127: Anti-slip part

[0030] 130: Bracket

[0031] 200: Projection device

[0032] 210: Light source

[0033] 220: Light valve

[0034] 230: Projection lens

[0035] 1230: End face

[0036] 1270: Anti-slip surface

[0037] A: Airflow generating part

[0038] B1, B2: Circuit board

[0039] E: Edge

[0040] F: Frame

[0041] H: Heating element

[0042] L1: illumination beam

[0043] L2: Image beam

[0044] S: Shell

[0045] S1, S2, S3, S4, S5, S6, S7, S8: side. DETAILED DESCRIPTION

[0046] The above and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the drawings. The directional terms (e.g., up, down, left, right, front or back, etc.) mentioned in the following embodiments are only the directions of the reference drawings. Therefore, the directional terms used are used to illustrate and not to limit the present invention.

[0047] Figure 1 It is a schematic diagram of a heat dissipation module according to an embodiment of the present utility model. Figure 2 yes Figure 1 Please refer to the cross-sectional diagram of the heat dissipation module. Figure 1 and Figure 2 The heat dissipation module 100 includes a fan 110 and a shock absorbing sleeve 120. The shock absorbing sleeve 120 is sleeved on the fan 110. The shock absorbing sleeve 120 has opposite inner surfaces 121 (shown in FIG. Figure 2 ) and an outer surface 122, and the inner surface 121 faces the fan 110. The shock absorbing sleeve 120 includes a plurality of shock absorbing protrusions 123 (shown in Figure 2 ). A plurality of shock absorbing protrusions 123 are formed on one of the inner surface 121 and the outer surface 122, and each side of the other of the inner surface 121 and the outer surface 122 is a plane. For example, in this embodiment, a plurality of shock absorbing protrusions 123 may be formed on the inner surface 121, and the four sides S1, S2, S3 and S4 of the outer surface 122 are all planes.

[0048] The fan 110 includes, for example, an airflow generating portion A and a frame portion F, wherein the frame portion F is connected to and surrounds the airflow generating portion A, and the shock absorbing sleeve 120 can be sleeved on the frame portion F. The airflow generating portion A can include a plurality of blades, and the airflow generating portion A is used to generate airflow. The shock absorbing sleeve 120 has an opening that can expose the airflow generating portion A, so that the airflow can flow out from the opening of the shock absorbing sleeve 120. The fan 110 of this embodiment is, for example, an axial flow fan. In one embodiment, the fan 110 can be a blower fan 110.

[0049] In this embodiment, the shock absorbing sleeve 120 includes, for example, a rubber shock absorbing sleeve or a silicone shock absorbing sleeve to absorb and buffer the vibration generated when the fan 110 is running. The shock absorbing sleeve 120 can be integrally formed. In one embodiment, the shock absorbing sleeve 120 can be made of rubber, silicone, a combination of the above or other suitable materials, and the hardness of the material of the shock absorbing sleeve 120 can be lower than the hardness of the material of the frame F.

[0050] Please continue to refer to Figure 2In this embodiment, at least part of the plurality of shock-absorbing protrusions 123 contacts the fan 110 to absorb and buffer the vibration generated when the fan 110 is running. For example, the plurality of shock-absorbing protrusions 123 of this embodiment may all contact the frame portion F of the fan 110, so that the shock-absorbing sleeve 120 can absorb and buffer more of the aforementioned vibrations, thereby further reducing the amplitude of the vibration transmitted from the fan 110. In one embodiment, a part of the plurality of shock-absorbing protrusions 123 contacts the fan 110, while another part of the plurality of shock-absorbing protrusions 123 may be separated from the fan 110, depending on the appearance of the shock-absorbing sleeve 120 and the fan 110. In another embodiment, at least one of the plurality of shock-absorbing protrusions 123 may partially or completely contact the fan 110. The multiple shock-absorbing protrusions 123 of the present embodiment may be evenly distributed on the inner surface 121, that is, the shock-absorbing protrusions 123 on each side of the inner surface 121 may be arranged equidistantly from each other; for example, the inner surface 121 includes a first side, a second side, a third side and a fourth side, and the multiple shock-absorbing protrusions 123 on the first side, the second side, the third side and the fourth side are all arranged equidistantly from each other. In other embodiments, the multiple shock-absorbing protrusions 123 on each side of the inner surface 121 may be arranged unequally from each other or approximately equidistantly from each other. In the present embodiment, the four sides S1, S2, S3 and S4 of the outer surface 122 are all planes, that is, the outer surface 122 is not formed with the shock-absorbing protrusions 123, and there is a thickness between the portion of the inner surface 121 without the shock-absorbing protrusions 123 and the outer surface 122, so the shock-absorbing sleeve 120 as a whole can maintain a sufficient thickness, thereby having the advantage of not being easily deformed.

[0051] The shape of the shock-absorbing protrusion 123 may be strip-shaped, block-shaped, dot-shaped, cone-shaped or pyramid-shaped. In one embodiment, the surface of the shock-absorbing protrusion 123 that contacts the fan 110 may be a convex arc surface, which can further reduce the area of ​​the shock-absorbing protrusion 123 that contacts the fan 110, so that the shock-absorbing sleeve 120 can better absorb and buffer the vibration generated when the fan 110 is running, thereby further reducing the amplitude of the vibration transmitted from the fan 110. In another embodiment, the surface of the shock-absorbing protrusion 123 that contacts the fan 110 may be a plane. The size of the shock-absorbing protrusion 123 can be changed according to actual needs, so the utility model does not impose more restrictions on this.

[0052] Compared with the prior art, the heat dissipation module 100 of the present embodiment adopts a shock-absorbing sleeve 120, wherein the inner surface 121 of the shock-absorbing sleeve 120 may be formed with a shock-absorbing protrusion 123. In other words, the shock-absorbing protrusion 123 may contact the fan 110, so that the area where the shock-absorbing sleeve 120 contacts the fan 110 can be reduced, so that the shock-absorbing sleeve 120 can evenly absorb and buffer the vibration generated when the fan 110 is running. Based on the above, the heat dissipation module 100 of the present embodiment can effectively reduce the amplitude of the vibration transmitted from the fan 110.

[0053] Please refer to Figure 1 and Figure 2 The shock absorbing sleeve 120 may further include a frame 124 and a stopper 125 (shown in FIG. Figure 1 ), the frame 124 is sleeved on the fan 110. The frame 124 has an inner surface 121, an outer surface 122 and an edge E, and the edge E is located between the inner surface 121 and the outer surface 122. The stopper 125 is connected to the edge E and partially covers the fan 110 to further fix or limit the fan 110 in the shock-absorbing sleeve 120. For example, the stopper 125 can cover the frame F of the fan 110 and expose the airflow generating portion A, so that the fan 110 can be fixed in the shock-absorbing sleeve 120, and the airflow generated by the airflow generating portion A can also flow out.

[0054] The shock-absorbing sleeve 120 may also have a threading hole 126, which passes through the inner surface 121 and the outer surface 122. Specifically, the threading hole 126 allows the wires connected to the fan 110 to pass through and extend out of the shock-absorbing sleeve 120. The number, position and shape of the threading holes 126 can be changed according to actual needs, and the present invention does not impose any restrictions on this.

[0055] Figure 3 is a cross-sectional schematic diagram of a heat dissipation module of another embodiment of the present invention. The structure and advantages of the heat dissipation module 100a of this embodiment are similar to Figure 1 The following is an example of an embodiment of the present invention, and only the differences are described below. Please refer to Figure 3 , the heat dissipation module 100a further includes a bracket 130, which is sleeved on the outer surface 122 of the shock-absorbing sleeve 120. Each side S1, S2, S3 and S4 of the outer surface 122 is a plane and contacts the bracket 130. Specifically, the shock-absorbing sleeve 120 is sandwiched between the bracket 130 and the fan 110, and the shock-absorbing protrusion 123 contacts the fan 110. As mentioned above, because the shock-absorbing sleeve 120 can uniformly absorb and buffer the vibration generated when the fan 110 is running, the shock-absorbing sleeve 120 can reduce the amplitude of the vibration transmitted from the fan 110 to the bracket 130. The material hardness of the shock-absorbing sleeve 120 can be less than the material hardness of the bracket 130.

[0056] Figure 4 It is a cross-sectional schematic diagram of a heat dissipation module according to another embodiment of the utility model. Figure 5 yes Figure 4 The structure and advantages of the heat dissipation module 100b of this embodiment are similar to those of Figure 1 The following is an example of an embodiment of the present invention, and only the differences are described below. Please refer to Figure 4 and Figure 5, the outer surface 122b of the shock-absorbing sleeve 120b is formed with a plurality of shock-absorbing protrusions 123, and at least a portion of the plurality of shock-absorbing protrusions 123 contacts the bracket 130. For example, in this embodiment, all the shock-absorbing protrusions 123 contact the bracket 130 as an example, but other embodiments are not limited thereto. In this embodiment, each side S5, S6, S7 and S8 of the inner surface 121b are planes and contact the fan 110. In this way, the area of ​​the shock-absorbing sleeve 120b contacting the bracket 130 can be reduced, thereby effectively reducing the amplitude of the vibration transmitted from the fan 110 to the bracket 130. Similar to the shock-absorbing sleeve 120, the plurality of shock-absorbing protrusions 123 of the shock-absorbing sleeve 120b are, for example, evenly distributed on the outer surface 122b, so that the vibration generated when the fan 110 is running can be prevented from being too concentratedly transmitted from a certain part of the shock-absorbing sleeve 120b to the bracket 130, thereby further reducing the amplitude of the vibration transmitted to the bracket 130. In one embodiment, the plurality of shock-absorbing protrusions 123 may be disposed at unequal distances or approximately equidistant distances from each other on the outer surface 122 b.

[0057] Figure 6 is a cross-sectional schematic diagram of a heat dissipation module of another embodiment of the present invention. The structure and advantages of the heat dissipation module 100c of this embodiment are similar to Figure 1 The following is an example of an embodiment of the present invention, and only the differences are described below. Please refer to Figure 6 , the shock absorbing sleeve 120c may further include an anti-slip portion 127. The anti-slip portion 127 is formed on the inner surface 121 and abuts against the fan 110 to further fix the fan 110 in the shock absorbing sleeve 120c. Specifically, the anti-slip portion 127, for example, abuts against the frame F of the fan 110. The anti-slip portion 127 may be formed between any two shock absorbing protrusions 123. The utility model does not impose many restrictions on the specific position of the anti-slip portion 127. For example, the anti-slip portion 127 of the present embodiment is formed on the side S6 of the inner surface 121, but in other embodiments, the anti-slip portion 127 may be formed on the side S5, S7 or S8. In the present embodiment, the anti-slip portion 127 may have an anti-slip surface 1270 facing away from the outer surface 122, and the anti-slip surface 1270, for example, is attached to the frame F of the fan 110, and the side facing away from the outer surface 122 (for example Figure 2 The side S2 of the shock-absorbing convex portion 123 is provided with a flat end surface 1230 facing away from the outer surface 122, and the area of ​​the anti-slip surface 1270 is, for example, larger than the area of ​​the end surface 1230. Further, the area of ​​the anti-slip surface 1270 contacting the fan 110 may be larger than the area of ​​the end surface 1230 contacting the fan 110, and therefore, the friction between the anti-slip surface 1270 and the fan 110 may be greater than the friction between the end surface 1230 and the fan 110, thereby further fixing the fan 110 in the shock-absorbing sleeve 120c. In one embodiment, the contour of the anti-slip portion 127 may be fixed to each other with the groove on the frame portion F. In another embodiment, a rough structure may be formed on the anti-slip surface 1270 to increase the friction between the anti-slip surface 1270 and the fan 110.

[0058] Figure 7 This is a block diagram of a projection device according to an embodiment of the present invention. Figure 7 , the projection device 200 includes a heat dissipation module 100, a heating element H and a projection lens 230. The heating element H generates heat energy when the projection device 200 is in operation, and the heat dissipation module 100 is used to dissipate heat from the heating element H. The heating element H may, for example, include at least one of a light source 210, a light valve 220, and circuit boards B1 and B2. The circuit board B1 may be electrically connected to the light source 210, and the circuit board B2 may be electrically connected to the light valve 220. The light source 210 is used to provide an illumination beam L1. The light valve 220 is disposed on the transmission path of the illumination beam L1, and the light valve 220 is used to convert the illumination beam L1 into an image beam L2. The projection lens 230 is disposed on the transmission path of the image beam L2, and the projection lens 230 is used to project the image beam L2 out of the projection device 200. In one embodiment, the heat dissipation module 100 may further include an air duct, and the air duct is used to guide the airflow generated by the fan 110 to pass through the heating element H, thereby improving the heat dissipation efficiency. In another embodiment, the heat dissipation module 100 may further include heat dissipation fins and heat pipes, the heat dissipation fins may be connected to the heating element H via the heat pipes, and the heat dissipation fins may be located on the airflow path generated by the fan 110 to improve the heat dissipation efficiency. The projection device 200 of this embodiment further includes a housing S, for example. The heat dissipation module 100 and the heating element H may be disposed in the housing S, and the housing S may have a vent corresponding to the heat dissipation module 100 (not shown in the figure).

[0059] The light source 210 includes, for example, a light emitting diode (LED), a laser diode (LD), or a combination thereof. Specifically, the number of light emitting diodes and / or laser diodes may be one or more, and when the number of light emitting diodes and / or laser diodes is multiple, the light emitting diodes and / or laser diodes may be arranged in a matrix. In addition, the light source 210 of the present embodiment may also be combined with optical elements such as a wavelength conversion element (fluorescent wheel), a filter element, and a light combining module as the source of the illumination beam L1. For example, the wavelength conversion element may be disposed on the transmission path of the excitation beam from the light source 210 to convert the excitation beam emitted by the light source 210 into a conversion beam, and the illumination beam L1 includes at least one of the excitation beam and the conversion beam. In one embodiment, the light source 210 may include a multi-color light source, and the light combining module may include light guiding elements such as a reflector and a spectroscopic element. The light combining module may be disposed on the beam transmission path of the multi-color light source, and the light beam is emitted by the light combining module to form the illumination beam L1.

[0060] In this embodiment, the light valve 220 is, for example, a digital micromirror device (DMD). In other embodiments, the light valve 220 may include liquid crystal on silicon (LCoS) or a liquid crystal display panel (LCD). In one embodiment, the projection device 200 may adopt a single-chip liquid crystal display panel or a three-chip liquid crystal display panel architecture, and the present invention does not impose further restrictions on this.

[0061] The projection lens 230 of this embodiment may include one or more optical lenses, and the refractive powers of the optical lenses may be the same or different from each other. The optical lenses may include various non-planar lenses such as biconcave lenses, biconvex lenses, concave-convex lenses, convex-concave lenses, plano-convex lenses, and plano-concave lenses, or any combination of the above non-planar lenses. On the other hand, the projection lens 230 may also include a planar optical lens. The utility model does not impose many restrictions on the specific structure of the projection lens 230.

[0062] The projection device 200 of this embodiment adopts the heat dissipation module 100, so the image quality can be improved. In other embodiments, the projection device 200 may include the heat dissipation module 100a, 100b or 100c.

[0063] In summary, the heat dissipation module of the embodiment of the utility model has at least one of the following advantages. The heat dissipation module of the utility model adopts a shock-absorbing sleeve, wherein the inner surface or outer surface of the shock-absorbing sleeve is formed with a shock-absorbing protrusion. Furthermore, the shock-absorbing protrusion can contact the fan or other mechanical components (such as a bracket), so that the area where the shock-absorbing sleeve contacts the fan or the aforementioned mechanical components can be reduced, so that the shock-absorbing sleeve can evenly absorb and buffer the vibration generated when the fan is running. Based on the above, the heat dissipation module of the utility model can effectively reduce the amplitude of the vibration transmitted from the fan. The projection device of the utility model adopts the above-mentioned heat dissipation module, so it can improve the image quality.

[0064] The above description is only the preferred embodiment of the utility model, and it cannot be used to limit the scope of implementation of the utility model. That is, all simple equivalent changes and modifications made in accordance with the claims of the utility model and the specification of the utility model are still within the scope of the utility model patent. In addition, any embodiment or claim of the utility model does not have to achieve all the purposes, advantages or features disclosed in the utility model. In addition, the abstract of the specification and the name of the utility model are only used to assist in the retrieval of patent documents, and are not used to limit the scope of rights of the utility model. In addition, the terms "first", "second", etc. mentioned in this specification or claims are only used to name the name of the element or distinguish different embodiments or scopes, and are not used to limit the upper or lower limit of the number of elements.

Claims

1. A heat dissipation module, characterized in that: The heat dissipation module includes a fan and a shock-absorbing sleeve, wherein: The shock-absorbing sleeve is arranged on the fan, and has opposite inner and outer surfaces, the inner surface faces the fan, and the shock-absorbing sleeve includes a plurality of shock-absorbing protrusions, one of the inner and outer surfaces is formed with the plurality of shock-absorbing protrusions, and each side of the other of the inner and outer surfaces is a plane.

2. The heat dissipation module according to claim 1, characterized in that: The inner surface is formed with the plurality of shock-absorbing protrusions, and at least a portion of the plurality of shock-absorbing protrusions contacts the fan, and each side of the outer surface is a plane.

3. The heat dissipation module according to claim 2, characterized in that: The heat dissipation module further comprises a bracket, wherein the bracket is sleeved on the outer surface of the shock-absorbing sleeve, and each side of the outer surface is a plane and contacts the bracket.

4. The heat dissipation module according to claim 1, characterized in that: The heat dissipation module also includes a bracket, wherein the bracket is sleeved on the outer surface of the shock-absorbing sleeve, the outer surface is formed with the multiple shock-absorbing protrusions, and at least a portion of the multiple shock-absorbing protrusions contacts the bracket, and each side of the inner surface is a plane and contacts the fan.

5. The heat dissipation module according to claim 1, characterized in that: The multiple shock-absorbing protrusions are in the shape of strips, blocks, dots, cones or pyramids.

6. The heat dissipation module according to claim 1, characterized in that: The plurality of shock-absorbing protrusions are evenly distributed on one of the inner surface and the outer surface.

7. The heat dissipation module according to claim 1, characterized in that: The shock-absorbing sleeve also has a threading hole, and the threading hole passes through the inner surface and the outer surface.

8. The heat dissipation module according to claim 1, characterized in that: The shock-absorbing sleeve further includes a non-slip portion, which is formed on the inner surface and abuts against the fan.

9. The heat dissipation module according to claim 8, characterized in that: The anti-slip portion has an anti-slip surface facing away from the outer surface, each of the plurality of shock-absorbing protrusions has an end surface facing away from the plane, and an area of ​​the anti-slip surface is greater than an area of ​​the end surface.

10. The heat dissipation module according to claim 1, characterized in that: The shock-absorbing sleeve also includes a frame and a stopper, the frame is sleeved on the fan, the frame has the inner surface, the outer surface and an edge, and the edge is located between the inner surface of the frame and the outer surface of the frame, and the stopper is connected to the edge and partially covers the fan.

11. The heat dissipation module according to claim 1, characterized in that: The shock-absorbing sleeve comprises a rubber shock-absorbing sleeve or a silicone shock-absorbing sleeve.

12. A projection device, characterized in that: The projection device comprises a heat dissipation module according to any one of claims 1-11.

13. The projection device according to claim 12, characterized in that: The projection device further comprises a heating element, and the heat dissipation module is used for dissipating heat from the heating element.

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