Probe detection mechanism of wafer testing device

Abstract

The utility model discloses a probe detection mechanism of a wafer testing device, which relates to the technical field of wafer testing devices and comprises a mounting seat, a plurality of probes used for wafer detection are arranged on the mounting seat, a position adjusting unit used for adjusting the positions of the plurality of probes is arranged on the mounting seat, and the probe detection mechanism is arranged on the mounting seat. The position adjusting unit comprises a plurality of inserting shafts inserted into the mounting base, one end of each inserting shaft is fixedly connected with a connecting rod, the probe is fixedly connected to the connecting rod, and the other end of each inserting shaft is provided with a driving unit used for driving the corresponding inserting shaft to move. According to the utility model, through the arrangement of the insertion shaft, the connecting rod, the pulley, the guide block, the first guide groove and the spring, a plurality of probes are driven to adjust positions synchronously by driving the guide block to lift, so that wafer detection is facilitated, the detection efficiency is improved, an existing detection mechanism is improved, and the practicability is high.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer testing devices, in particular to a probe detection mechanism of a wafer testing device. Background Art

[0002] A wafer generally contains multiple grains. Different types of wafers have different grain spacings. During the manufacturing process, the grains of the wafer need to be inspected. Generally, probes are used to perform performance inspection on the grains of the wafer. However, current wafer testing devices have the problem of low inspection efficiency because they need to inspect the grains of the wafer one by one. Existing multi-probe wafer inspection devices still have some problems during use.

[0003] For example, a Chinese patent with publication number CN219350151U discloses a probe detection mechanism for a wafer testing device, including a base; the base is provided with an upper test frame and a lower test frame; the upper test frame is provided with an upper fixed block and an upper movable block; the upper test frame is provided with an upper micro-motion platform; the upper fixed block and the upper movable block are both provided with an upper probe; the lower test frame is provided with a lower fixed block and a lower movable block; the lower test frame is provided with a lower micro-motion platform; the lower fixed block and the lower movable block are both provided with a lower probe; the upper probe and the lower probe are arranged opposite each other. The utility model can test two grains of a wafer at the same time by arranging an upper probe and a lower probe, and the number of upper probes and the number of lower probes are both two, thereby effectively improving the test efficiency; in addition, by arranging an upper micro-motion platform and a lower micro-motion platform, the spacing between the two upper probes and the spacing between the two lower probes can be adjusted, so that different types of wafers can be adapted.

[0004] Although the above-mentioned two probe structures with adjustable spacing are used for detection, the detection efficiency still cannot meet the requirements and the working efficiency is low. Therefore, the present application provides a probe detection mechanism of a wafer testing device to meet the needs. Utility Model Content

[0005] The main purpose of the utility model is to provide a probe detection mechanism for a wafer testing device, which can effectively solve the problem of low detection efficiency of existing wafer testing probes mentioned in the background technology, and achieve the purpose of improving the detection efficiency.

[0006] To achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a probe detection mechanism of a wafer testing device, including a mounting seat, on which are arranged a plurality of probes for wafer detection, and on which is arranged a position adjustment unit for adjusting the positions of the plurality of probes, the position adjustment unit including a plurality of plug-in shafts plugged into the mounting seat, one end of the plug-in shaft being fixedly connected to a connecting rod, the probe being fixedly connected to the connecting rod, and the other end of the plug-in shaft being provided with a driving unit for driving the plug-in shaft to move.

[0007] Preferably, the driving unit comprises a guide block slidably connected to the mounting seat, a plurality of first guide grooves are provided on the guide block, the end of the plug shaft is rotatably connected to a pulley, and the pulley is slidably connected to the guide block.

[0008] Preferably, a spring is sleeved on the insertion shaft, one end of the spring is fixedly connected to the connecting rod, and the other end of the spring is fixedly connected to the mounting seat.

[0009] Preferably, a lifting control unit for driving the guide block to lift and slide is provided on the mounting seat, and the lifting control unit includes a screw fixedly connected to the top of the guide block, a cover plate is fixedly connected to the mounting seat, a through hole is provided on the cover plate, and the screw is inserted into the through hole, a worm gear is rotatably connected to the cover plate, and the worm gear is threadedly connected to the screw, a worm is rotatably connected to the cover plate, and the worm is meshed with the worm wheel, a motor is installed on the cover plate, and the output end of the motor is fixedly connected to the worm.

[0010] Preferably, second guide grooves are provided on both sides of the screw rod, a protrusion is fixedly connected in the through hole, and the protrusion is slidably connected to the second guide groove.

[0011] Preferably, a pair of bearing seats are fixedly connected to the cover plate, and two ends of the worm are rotatably connected to the pair of bearing seats respectively.

[0012] Preferably, the top end of the screw is threadedly connected with an anti-drop cap, and the outer diameter of the anti-drop cap is greater than the diameter of the through hole.

[0013] Compared with the prior art, the utility model has the following beneficial effects:

[0014] 1. By setting the plug shaft, connecting rod, pulley, guide block, first guide groove and spring, and driving the guide block to rise and fall, multiple probes are driven to adjust their positions synchronously, which is convenient for wafer detection, improves detection efficiency, improves the existing detection mechanism, and has high practicality.

[0015] 2. By setting a screw, a second guide groove, a worm gear, a worm, and a motor, the purpose of driving the guide block to rise and fall is achieved, the lifting speed can be reduced, and the positions of multiple probes can be adjusted more accurately, which is highly practical. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic diagram of the three-dimensional structure of a probe detection mechanism of a wafer testing device;

[0017] Figure 2 It is a partially cutaway three-dimensional structural schematic diagram of a probe detection mechanism of a wafer testing device;

[0018] Figure 3 It is a schematic diagram of the three-dimensional enlarged structure of the connecting rod.

[0019] In the figure: 1. mounting base; 2. probe; 3. position adjustment unit; 4. plug shaft; 5. connecting rod; 6. pulley; 7. guide block; 8. first guide groove; 9. spring; 10. cover plate; 11. screw; 12. second guide groove; 13. worm gear; 14. worm; 15. motor; 16. anti-drop cap. DETAILED DESCRIPTION

[0020] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0021] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0022] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0023] Example 1: Reference Figure 1-3A probe detection mechanism of a wafer testing device shown in the figure includes a mounting base 1, on which are arranged a plurality of probes 2 for wafer detection, and on which is arranged a position adjustment unit 3 for adjusting the positions of the plurality of probes 2, the position adjustment unit 3 includes a plurality of plug shafts 4 plugged into the mounting base 1, one end of the plug shaft 4 is fixedly connected with a connecting rod 5, the probe 2 is fixedly connected to the connecting rod 5, and the other end of the plug shaft 4 is provided with a driving unit for driving the plug shaft 4 to move, when in use, the plug shaft 4 is pushed to move by the driving unit, thereby driving the probe 2 on the connecting rod 5 to move, thereby realizing synchronous pushing of the plurality of probes 2 to move at the same time, achieving the purpose of multi-probe 2 detection, improving detection efficiency, and having high practicality.

[0024] like Figure 1 and Figure 3 As shown, the driving unit includes a guide block 7 slidably connected to the mounting seat 1, and a plurality of first guide grooves 8 are opened on the guide block 7. The end of the plug shaft 4 is rotatably connected to the pulley 6, and the pulley 6 is slidably connected to the guide block 7. A spring 9 is sleeved on the plug shaft 4, one end of the spring 9 is fixedly connected to the connecting rod 5, and the other end of the spring 9 is fixedly connected to the mounting seat 1. When in use, the pulley 6 slides in the first guide groove 8 by driving the guide block 7 to rise and fall. The guide block 7 is an inverted conical structure, and then as the guide block 7 descends, the plug shaft 4 is pushed to move, and then the probe 2 on the connecting rod 5 is pushed to move, so that the multiple probes 2 are synchronously moved away. At this time, the spring 9 is stretched by force, and when the guide block 7 rises, the probes 2 are pulled closer to each other by the spring 9. In this way, the purpose of synchronously driving the multiple probes 2 to adjust their positions is achieved, which is convenient for detecting multiple grains on the wafer, improves the detection efficiency, and has high practicality.

[0025] like Figure 1-2 As shown, a lifting control unit for driving the guide block 7 to lift and slide is provided on the mounting seat 1, and the lifting control unit includes a screw 11 fixedly connected to the top of the guide block 7, a cover plate 10 is fixedly connected to the mounting seat 1, a through hole is opened on the cover plate 10, and the screw 11 is inserted into the through hole, a worm gear 13 is rotatably connected to the cover plate 10, and the worm gear 13 is threadedly connected to the screw 11, a worm 14 is rotatably connected to the cover plate 10, and the worm 14 is meshed with the worm gear 13, a pair of bearing seats are fixedly connected to the cover plate 10, and the two ends of the worm 14 are rotatably connected to a pair of bearing seats, respectively, a motor 15 is installed on the cover plate 10, and the output end of the motor 15 is fixedly connected to the worm 14, second guide grooves 12 are opened on both sides of the screw 11, a protrusion is fixedly connected in the through hole, and the protrusion is slidably connected to the second guide groove 12.

[0026] When it is necessary to drive the guide block 7 to rise or fall, first start the motor 15 to drive the worm 14 to rotate, and then drive the worm wheel 13 to rotate through the worm 14. Under the guidance of the protrusion and the second guide groove 12, the screw 11 is driven to rise or fall, and then the guide block 7 is driven to rise or fall. Similarly, multiple probes 2 are driven to adjust their positions synchronously. By setting the structure of the worm wheel 13 and the worm 14, the adjustment speed is reduced, and then the position of the probe 2 can be adjusted more accurately, which is highly practical.

[0027] like Figure 1 As shown, the top end of the screw rod 11 is threadedly connected with an anti-drop cap 16, and the outer diameter of the anti-drop cap 16 is larger than the diameter of the through hole. By setting the anti-drop cap 16, the screw rod 11 is prevented from falling off during the lifting and lowering process of the screw rod 11. At the same time, the anti-drop cap 16 is detachable, which is convenient for disassembly and maintenance, and is highly practical.

[0028] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A probe detection mechanism of a wafer testing device, comprising a mounting seat (1), characterized in that: The mounting seat (1) is provided with a plurality of probes (2) for wafer detection, and the mounting seat (1) is provided with a position adjustment unit (3) for adjusting the positions of the plurality of probes (2). The position adjustment unit (3) comprises a plurality of plug-in shafts (4) plugged into the mounting seat (1), one end of the plug-in shaft (4) is fixedly connected to a connecting rod (5), the probe (2) is fixedly connected to the connecting rod (5), and the other end of the plug-in shaft (4) is provided with a driving unit for driving the plug-in shaft (4) to move.

2. The probe detection mechanism of a wafer testing device according to claim 1, characterized in that: The driving unit comprises a guide block (7) slidably connected to the mounting seat (1), a plurality of first guide grooves (8) being provided on the guide block (7), and the end of the plug shaft (4) is rotatably connected to a pulley (6), and the pulley (6) is slidably connected to the guide block (7).

3. The probe detection mechanism of a wafer testing device according to claim 2, characterized in that: A spring (9) is sleeved on the insertion shaft (4), one end of the spring (9) is fixedly connected to the connecting rod (5), and the other end of the spring (9) is fixedly connected to the mounting seat (1).

4. The probe detection mechanism of a wafer testing device according to claim 2, characterized in that: The mounting seat (1) is provided with a lifting control unit for driving the guide block (7) to lift and slide, the lifting control unit comprising a screw (11) fixedly connected to the top of the guide block (7), the mounting seat (1) is fixedly connected to a cover plate (10), the cover plate (10) is provided with a through hole, and the screw (11) is inserted into the through hole, the cover plate (10) is rotatably connected to a worm wheel (13), the worm wheel (13) is threadedly connected to the screw (11), the cover plate (10) is rotatably connected to a worm (14), and the worm (14) is meshed with the worm wheel (13), the cover plate (10) is installed with a motor (15), and the output end of the motor (15) is fixedly connected to the worm (14).

5. The probe detection mechanism of a wafer testing device according to claim 4, characterized in that: Second guide grooves (12) are provided on both sides of the screw rod (11), a protrusion is fixedly connected in the through hole, and the protrusion is slidably connected to the second guide groove (12).

6. The probe detection mechanism of a wafer testing device according to claim 4, characterized in that: A pair of bearing seats are fixedly connected to the cover plate (10), and the two ends of the worm (14) are rotatably connected to the pair of bearing seats respectively.

7. The probe detection mechanism of a wafer testing device according to claim 4, characterized in that: The top end of the screw rod (11) is threadedly connected with an anti-drop cap (16), and the outer diameter of the anti-drop cap (16) is greater than the diameter of the through hole.

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