Cross-medium application optical module based on COB packaging

Abstract

The utility model relates to a cross-medium application optical module based on COB packaging, which comprises a shell and a signal receiving part, and is characterized in that the signal receiving part comprises a light receiving chip and a receiving end optical device connected with an optical fiber, an assembly space is arranged in the shell, and the light receiving chip and the receiving end optical device are arranged in the assembly space. The receiving end optical device and the light receiving chip are respectively arranged in the assembly space, the output end of the receiving end optical device directly faces the light receiving chip, and the area between the output end of the receiving end optical device and the light receiving chip is filled with refractive index matching glue; according to the optical module, the sealing performance between the receiving end optical device and the light receiving chip can be effectively improved, so that other media cannot permeate between the receiving end optical device and the light receiving chip when the optical module is in a cross-medium application scene, the interference and influence of other media on signal transmission can be effectively reduced, and the signal transmission efficiency is improved. Therefore, the signal receiving part of the high-speed optical module can operate normally and stably, and the COB optical module can meet the cross-medium application requirement.

Description

Technical Field

[0001] The utility model relates to the technical field of optical communication equipment, and in particular to a cross-medium application optical module based on COB packaging. Background Art

[0002] With the development of optoelectronic devices and the improvement of integration, the demand for high-bandwidth, high-speed and small-size optical modules is also increasing. At the same time, the continuous upgrading of optical modules in data centers and the rapid growth of traffic data are also constantly promoting the upgrading and innovation of data center architecture. With the deployment of large-scale 400G high-speed ports, 800G interconnection in data centers will also become a new demand. With the continuous expansion of data centers and the continuous improvement of computing power, the power density of cabinets will also increase accordingly, and the temperature control field of data centers will also change. It will be a general trend for traditional air cooling to be replaced by immersion liquid cooling.

[0003] The development trend of immersion liquid cooling will also drive the development of packaging technology. COB packaging devices are cheaper in terms of cost. Although they can be partially airtightly packaged, their optical devices and optical chips are directly exposed to the environment. In order to isolate the influence of other media (such as liquid cooling media) on optical devices and perfectly adapt to future packaging trends, some good solutions need to be proposed. For example, existing high-speed optical modules usually consist of two parts: the receiving part (RX) and the transmitting part (TX), in which the RX part realizes optical-electrical conversion and the TX part realizes electrical-optical conversion. The packaging process used in optical modules is COB (chip on board), the main purpose of which is to optically couple related materials (AWG, FA, Lens, Lens Array, etc.) and PCB, and finally realize the function of optical-electrical / electrical-optical conversion of optical signals. However, in the existing RX-COB high-speed optical module, the receiving optical device is usually arranged on the supporting component, which can be a PCB board or a substrate (Base), and the receiving light chip is arranged on the supporting component or on the TIA chip, and the TIA chip is arranged on the supporting component. A gap is usually reserved between the receiving optical device (such as a fiber array module (FA), an optical engine, AWG, etc.) and the receiving light chip (such as a photodetector (PD)), such as Figure 1 and Figure 2 As shown, the signal is transmitted between the receiving optical device and the receiving chip with air as the medium. In the use scenario of cross-medium application (such as immersion liquid cooling, etc.) of traditional COB packaging, other media will penetrate between the receiving optical device and the receiving chip, interfere with signal transmission, and cause the Rx part of the optical module to fail, which needs to be solved urgently. Utility Model Content

[0004] The first aspect of the utility model is to solve the problem that in the existing high-speed optical module using COB packaging, a gap is reserved between the receiving optical device and the receiving light chip, resulting in other media penetrating between the receiving optical device and the receiving light chip and interfering with signal transmission in the cross-medium application scenario. A high-speed optical module that can effectively solve this technical problem is provided, and the main concept is:

[0005] A cross-medium application optical module based on COB packaging, comprising a shell and a signal receiving part, wherein the signal receiving part comprises a light receiving chip and a receiving optical device connected to an optical fiber, wherein the shell has an assembly space, wherein the receiving optical device and the light receiving chip are respectively arranged in the assembly space, wherein the output end of the receiving optical device faces the light receiving chip, and the area between the output end of the receiving optical device and the light receiving chip is filled with a refractive index matching glue. In this scheme, a signal receiving part is configured in the optical module so that the signal receiving part can be used to convert an optical signal into an electrical signal, wherein the receiving optical device mainly transmits and / or processes optical signals and transmits optical signals to the light receiving chip, and the light receiving chip is mainly used to receive optical signals and convert optical signals into corresponding electrical signals; by configuring the output end of the receiving optical device to face the light receiving chip, the signal output by the receiving optical device can enter the light receiving chip and be received by the light receiving chip, and by filling the area between the output end of the receiving optical device and the light receiving chip with a refractive index matching glue, the receiving optical device and the light receiving chip can pass through the filled refractive index matching glue. For signal transmission, such a design can, on the one hand, utilize the filled refractive index matching glue to exhaust the air between the optical device at the receiving end and the receiving chip, thereby effectively reducing the influence of the air interface on the optical path in cross-media applications and reducing signal loss; on the other hand, it can effectively improve the sealing between the optical device at the receiving end and the receiving chip, so that in the cross-media application scenario of the optical module, other media will not penetrate between the optical device at the receiving end and the receiving chip, which can effectively reduce the interference and influence of other media on signal transmission, so that the signal receiving part of the high-speed optical module can operate normally and stably, and the optical module can also meet the application requirements of cross-media.

[0006] Furthermore, a supporting component is included, the receiving optical device is arranged on the supporting component, and the supporting component includes a PCB board or a substrate, so that there is a gap between the output end of the receiving optical device and the light receiving chip, so that the refractive index matching glue is filled in the gap area, and the thickness of the filled refractive index matching glue can be controlled by the thickness of the supporting component to meet the needs of different occasions.

[0007] Preferably, the light receiving chip adopts a photodetector to collect light signals.

[0008] Furthermore, the signal receiving part further includes a TIA chip, and the light receiving chip is connected to the TIA chip. Since the TIA chip is arranged on the supporting component, and the light receiving chip is eutectic arranged on the TIA chip, or the light receiving chip is connected to the TIA chip by wire bonding, the position of the light receiving chip is relatively fixed, so that the relative position of the receiving end optical device and the light receiving chip is determined and can correspond to each other, so that it is more convenient to stably fill the refractive index matching glue between the two.

[0009] Preferably, the receiving end optical device is a fiber array module or a light engine or an AWG to meet the use requirements of different occasions.

[0010] Furthermore, the optical fiber array module includes a first clamping portion, a second clamping portion, and at least one optical fiber, the optical fiber is clamped between the first clamping portion and the second clamping portion, at least one end of the first clamping portion is constructed as an inclined surface, the inclined surface is provided with a reflective layer, the ends of each optical fiber correspond to the reflective layer, and the light receiving chip corresponds to the reflective layer. By arranging multiple optical fibers in an array and clamping them between the first clamping portion and the second clamping portion, the optical fibers can be kept arranged in an array; by constructing an inclined surface at the end of the optical fiber array module and configuring a reflective layer on the inclined surface, so as to use the reflective layer to vertically change the transmission direction of the optical signal, and by corresponding the ends of each optical fiber to the reflective layer respectively, and the light receiving chip also corresponds to the reflective layer, the optical signal transmitted by the optical fiber can be completely shot into the light receiving chip after being reflected by the reflective layer, thereby realizing the transmission of the optical signal.

[0011] To facilitate the fixing and assembly of the optical fiber array module, further, the first clamping part is constructed with at least two grooves for constraining the optical fiber, and each groove is arranged in an array, each optical fiber is respectively arranged in each groove, and the second clamping part is connected to the first clamping part, and constrains the optical fiber in the groove. In this solution, by configuring the grooves arranged in an array, during assembly, it is only necessary to respectively arrange each optical fiber in each groove to ensure that each optical fiber is arranged in an array, which is not only convenient for assembly, but also can ensure assembly accuracy.

[0012] Preferably, the optical fiber array module includes four optical fibers, and the four optical fibers are arranged in an array.

[0013] Preferably, the first clamping part is made of a glass block, and the second clamping part is made of a glass plate.

[0014] Preferably, the second clamping portion is fixed to the cushion block, thereby achieving fixation of the optical fiber array module.

[0015] Preferably, the shell includes a base and a cover plate, the cover plate is detachably arranged on the base, and the assembly space is formed between the cover plate and the base.

[0016] The second aspect of the utility model aims to solve the problem that the layout of the existing 800G high-speed optical module is not reasonable, resulting in low space utilization and poor heat dissipation. Further, it includes two groups of signal receiving parts, and the receiving end optical devices of each group of signal receiving parts are respectively configured with four optical fibers, and one end of the housing is configured with an optical fiber interface.

[0017] The support component is constructed with a first notch, and two groups of signal receiving parts are respectively arranged on the upper and lower sides of the support component, wherein the four optical fibers of one group of signal receiving parts are respectively connected to the optical fiber interface, and the four optical fibers of the other group of signal receiving parts are respectively connected to the optical fiber interface via the first notch. In this scheme, by respectively arranging the two groups of signal receiving parts on the upper and lower sides of the support component, the space in the height direction of the shell can be fully utilized, not only will the width of the shell not increase due to the increase in the number of signal receiving parts and the number of optical fibers, making the layout in the 800G high-speed optical module more reasonable, but also making the two groups of signal receiving parts more dispersed, not interfering with each other, and more conducive to heat dissipation. By constructing the first notch in the support component, the four optical fibers of one group of signal receiving parts can be connected to the optical fiber interface via the first notch, which not only makes wiring more convenient, but also makes the layout in the 800G high-speed optical module more regular.

[0018] Preferably, the first notch is configured at the edge of the supporting component, which is convenient for molding, and can reserve space required for assembly for inserting into the housing, and is more convenient for disassembly.

[0019] Furthermore, it also includes a signal transmitting part, which is connected to the optical fiber interface through eight optical fibers, so that the signal transmitting part can convert the electrical signal into an optical signal and transmit it through the optical fiber interface.

[0020] In order to further improve the space utilization rate in the housing, the support component is further configured with a second notch, and the signal transmitting part is arranged in the second notch. In this solution, by configuring the second notch on the support component and arranging the signal transmitting part in the second notch, the requirement for the installation height of the signal transmitting part is effectively reduced, so that the space in the housing along the height direction can be fully utilized, making the layout in the optical module more compact and reasonable, and further improving the space utilization rate in the housing.

[0021] Compared with the prior art, the cross-media application optical module based on COB packaging provided by the utility model can effectively improve the sealing between the receiving optical device and the receiving chip, so that in the cross-media application scenario of the optical module, other media will not penetrate between the receiving optical device and the receiving chip, which can effectively reduce the interference and influence of other media on signal transmission, so that the signal receiving part of the high-speed optical module can operate normally and stably, and also enable the COB optical module to meet the application requirements of cross-media. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 This is a schematic diagram of the local structure of a signal receiving part in a conventional optical module.

[0024] Figure 2 for Figure 1 main view.

[0025] Figure 3 This is a schematic structural diagram of a receiving-end optical device in an optical module provided in Example 1 of the utility model.

[0026] Figure 4 This is a schematic diagram of the local structure of the signal receiving part of an optical module provided in Example 1 of the utility model.

[0027] Figure 5 for Figure 4 main view.

[0028] Figure 6 This is a partial side view of an optical module provided in Example 2 of the utility model, without showing the housing.

[0029] Figure 7 It is a partial side view of an optical module provided in Example 2 of the utility model.

[0030] Markings in the figure are as follows: housing 1; PCB board 2; signal receiving part 3, receiving end optical device 31, receiving chip 32, TIA chip 33, pad 34, shield 35; signal transmitting part 4, electromagnetic shielding cover 41, heat sink 42, thermal conductive gel 43; optical fiber 51 optical fiber interface; first clamping part 61, groove 611, second clamping part 62, reflecting layer 63; refractive index matching glue 7; gap 8. DETAILED DESCRIPTION

[0031] The technical scheme in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, rather than all the embodiments. The components of the embodiment of the utility model generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiment of the utility model provided in the drawings is not intended to limit the scope of the utility model claimed for protection, but merely represents the selected embodiment of the utility model. Based on the embodiment of the utility model, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the utility model.

[0032] Example 1

[0033] This embodiment provides a cross-medium application optical module based on COB packaging, including a housing 1, a supporting component 2, a signal receiving part 3 and a signal transmitting part 4, wherein:

[0034] In this embodiment, the housing 1 generally includes a base and a cover plate, and the cover plate is detachably arranged on the base by fasteners such as bolts or screws, so that an assembly space for accommodating other devices can be formed between the cover plate and the base, and the signal receiving part 3 and the signal transmitting part 4 can be arranged in the assembly space. Figure 7 shown.

[0035] like Figure 6-Figure 7 As shown, one end of the housing 1 is usually provided with an optical fiber interface, and the support component 2 can be arranged at a position lower than the optical fiber interface and can be horizontally fixed to the base of the housing 1. During implementation, the support component can be a PCB board 2 or a base. For ease of description, in this embodiment, the support component 2 can include a PCB board 2.

[0036] In this embodiment, the signal receiving part 3 is mainly used to convert the optical signal into an electrical signal. During implementation, the signal receiving part 3 may include a light receiving chip 32 and a receiving optical device 31 connected to the optical fiber 51. The receiving optical device 31 mainly transmits and / or processes the optical signal, and transmits the optical signal to the light receiving chip 32. The light receiving chip 32 is mainly used to receive the optical signal and convert the optical signal into a corresponding electrical signal. The receiving optical device 31 and the light receiving chip 32 are respectively arranged in the assembly space, and the receiving optical device 3 can be arranged on the supporting component 2, wherein the light receiving chip 32 can be directly or indirectly arranged on the PCB board 2. For example, in this embodiment, the light receiving chip 32 adopts a photodetector to collect the optical signal using the photodetector. At the same time, the signal receiving part 3 also includes a TIA chip 33. The light receiving chip 32 is connected to the TIA chip 33. The TIA chip 33 is arranged on the PCB board 2. Figure 4 and Figure 5 As shown, since the TIA chip 33 is arranged on the PCB board 2, and the light receiving chip 32 can be eutectic arranged on the TIA chip 33, or the light receiving chip 32 can be connected to the TIA chip 33 by wire bonding, at this time, the light receiving chip 32 can be directly fixed to the PCB board 2, so that the relative position of the receiving end optical device 31 and the light receiving chip 32 is determined and can correspond to each other.

[0037] In this embodiment, the support component may further include a pad 34, the receiving end optical device 31 may be disposed on a pad 34, and the pad 34 may be disposed on the PCB board 2 in the support component, such as Figure 4 and Figure 5 As shown, the output end of the receiving optical device 31 is directly opposite to the light receiving chip 32, and there is a gap 8 between the output end of the receiving optical device 31 and the light receiving chip 32 (that is, there is a spacing between the two). By configuring the pad 34, not only can the receiving optical device 31 be fixed, but in practice, the spacing between the output end of the receiving optical device 31 and the light receiving chip 32 can be changed by replacing pads 34 of different heights to meet the needs of different occasions. In specific implementation, the receiving optical device 31 can be fixed to the pad 34 by UV glue, and the pad 34 can also be fixed to the PCB board 2 by UV glue.

[0038] In this embodiment, the area between the output end of the receiving optical device 31 and the light receiving chip 32 is filled with a refractive index matching glue 7, such as Figure 4 and Figure 5As shown, the receiving optical device 31 and the receiving light chip 32 can transmit signals through the filled refractive index matching glue 7. With such a design, on the one hand, the filled refractive index matching glue 7 can be used to evacuate the air between the receiving optical device 31 and the receiving light chip 32, thereby effectively reducing the influence of the air interface on the optical path in cross-medium applications and reducing signal loss; on the other hand, the sealing between the receiving optical device 31 and the receiving light chip 32 can be effectively improved, so that when the optical module based on COB packaging is used across media, other media (such as liquid cooling media) will not penetrate between the receiving optical device 31 and the receiving light chip 32, which can effectively reduce the interference and influence of other media on signal transmission, so that the signal receiving part 3 of the high-speed optical module can operate normally and stably, and the COB optical module can also meet the application requirements of cross-medium.

[0039] In this embodiment, the signal transmitting part 4 can be arranged on the PCB board 2, such as Figure 6 As shown, the signal transmitting part 4 can be connected to the optical fiber interface via an optical fiber 51, so that the signal transmitting part 4 can convert the electrical signal into an optical signal and transmit it through the optical fiber interface.

[0040] In implementation, the receiving optical device 31 may be an optical fiber 51 array module, an optical engine, or an AWG, etc. For example, in this embodiment, the receiving optical device 31 is an optical fiber 51 array module, such as Figure 3 As shown, the optical fiber 51 array module includes a first clamping portion 61, a second clamping portion 62 and at least one optical fiber 51, and the optical fiber 51 is clamped between the first clamping portion 61 and the second clamping portion 62. When at least two optical fibers 51 are configured, one end of each optical fiber 51 is arranged in an array, so that the optical fibers 51 can maintain the state of being arranged in an array. At the same time, at least one end of the first clamping portion 61 is configured as an inclined surface, such as Figure 3 As shown, the inclined surface is provided with a reflective layer 63, and the ends of each optical fiber 51 correspond to the reflective layer 63 respectively. Correspondingly, the light receiving chip 32 also corresponds to the reflective layer 63. Figure 3 In this embodiment, an inclined surface is constructed at the end of the optical fiber 51 array module, and a reflective layer 63 is arranged on the inclined surface, so that the transmission direction of the optical signal can be vertically changed by using the reflective layer 63. By making the ends of each optical fiber 51 correspond to the reflective layer 63, and the light receiving chip 32 also corresponds to the reflective layer 63, the optical signal transmitted by the optical fiber 51 can be completely emitted into the light receiving chip 32 after being reflected by the reflective layer 63, thereby realizing the transmission of the optical signal.

[0041] In order to facilitate the fixing and assembly of the optical fiber 51 array module, during implementation, the first clamping portion 61 is constructed with at least two grooves 611 for constraining the optical fiber 51, and each groove 611 is arranged in an array, and each optical fiber 51 is respectively arranged in each groove 611. The second clamping portion 62 is connected to the first clamping portion 61 and constrains the optical fiber 51 in the groove 611. During assembly, it is only necessary to respectively arrange each optical fiber 51 in each groove 611 to ensure that each optical fiber 51 is arranged in an array, which is not only convenient for assembly, but also can ensure assembly accuracy. In specific implementation, the groove 611 can preferably adopt a V-shaped groove, such as Figure 3 As shown, the groove 611 can be used to place the optical fiber 51 (including the shell and the core), or the core of the optical fiber 51, as shown in FIG. Figure 3 As shown. In implementation, the first clamping portion 61 and the second clamping portion 62 can be connected together by fasteners or glued together. In implementation, the first clamping portion 61 and the second clamping portion 62 can preferably be made of glass. For example, in this embodiment, the first clamping portion 61 is made of a glass block and the second clamping portion 62 is made of a glass plate. During assembly, the second clamping portion 62 can be fixed to the cushion block 34, thereby fixing the optical fiber 51 array module.

[0042] In implementation, the number of optical fibers 51 configured for the receiving optical device 31 can be determined according to actual needs, and four or eight optical fibers 51 can be configured preferentially. For example, Figure 3-Figure 5 As shown, the optical fiber 51 array module includes four optical fibers 51, and the four optical fibers 51 are arranged in an array.

[0043] Example 2

[0044] In order to solve the problem that the layout in the existing 800G high-speed optical module is not reasonable, resulting in low space utilization and poor heat dissipation, the main difference between this embodiment 2 and the above-mentioned embodiment 1 is that the optical module based on COB packaging provided in this embodiment includes two groups of signal receiving parts 3, and the receiving end optical device 31 of each group of signal receiving parts 3 is respectively configured with four optical fibers 51, such as Figure 6-Figure 7 As shown, at the same time, one end of the housing 1 is provided with an optical fiber interface, and the optical fibers 51 are respectively connected to the optical fiber interfaces.

[0045] As an example, in this embodiment, the support component 2 is configured with a first notch, the support component 2 can be configured at the edge of the support component, the support component 2 can be a PCB board 2, the first notch can be configured on the PCB board 2, and the two groups of signal receiving parts 3 are respectively arranged on the upper side and the lower side of the PCB board 2, such as Figure 6-Figure 7As shown, in order to make full use of the space in the height direction of the housing 1, the width of the housing 1 will not increase due to the increase in the number of signal receiving parts 3 and the number of optical fibers 51, making the layout in the 800G high-speed optical module more reasonable, and making the two groups of signal receiving parts 3 more dispersed, not interfering with each other, and more conducive to heat dissipation. At the same time, the four optical fibers 51 of one group of signal receiving parts 3 are respectively connected to the optical fiber interface, and the four optical fibers 51 of the other group of signal receiving parts 3 are respectively connected to the optical fiber interface via the first notch, which not only makes wiring more convenient, but also makes the layout in the 800G high-speed optical module more regular.

[0046] In the optical module, the signal transmitting part 4 can be connected to the optical fiber interface through eight optical fibers 51. In order to further improve the space utilization rate in the housing 1, in a further embodiment, the PCB board 2 is also configured with a second notch, and the signal transmitting part 4 can be arranged in the second notch, so as to effectively reduce the requirement of the signal transmitting part 4 for the installation height, so that the space in the housing 1 along the height direction can be fully utilized, making the layout in the optical module more compact and reasonable, and further improving the space utilization rate in the housing 1.

[0047] In a more perfect solution, the optical module further includes an electromagnetic shielding cover 41 covering one side of the signal transmitting part 4 and one of the signal receiving parts 3, such as Figure 6-Figure 7 As shown, the electromagnetic shielding cover 41 can be set on the PCB board 2, so as to achieve better anti-electromagnetic interference performance by using the electromagnetic shielding cover 41. In order to achieve a better heat dissipation effect, it further includes a heat sink 42 covering the other side of the signal transmitting part 4, and a thermal conductive gel 43 is arranged between the heat sink 42 and the inner surface of the shell 1, so that when the optical module is working, the heat generated by the signal receiving part 3 can be transferred to the shell 1 through the heat sink 42 and the thermal conductive gel 43 at one time, and released through the shell 1 to achieve the purpose of heat dissipation. During implementation, the heat sink 42 can correspond to the base of the shell 1, so that the thermal conductive gel 43 is arranged between the heat sink 42 and the base, and the outer surface of the base is provided with heat dissipation fins, which is conducive to achieving a better heat dissipation effect.

[0048] like Figure 6 As shown, in a more complete solution, a protective cover 35 is also included, and the protective cover 35 at least covers the light receiving chip 32 of another signal receiving part 3 to play a role of protection and isolation.

[0049] The above description is only a specific implementation of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention.

Claims

1. A cross-media application optical module based on COB packaging, comprising a housing and a signal receiving part, characterized in that: The signal receiving part includes a light receiving chip and an optical receiving device connected to the optical fiber. The shell has an assembly space. The optical receiving device and the light receiving chip are respectively arranged in the assembly space. The output end of the optical receiving device faces the light receiving chip, and the area between the output end of the optical receiving device and the light receiving chip is filled with refractive index matching glue.

2. The cross-medium application optical module based on COB packaging according to claim 1, characterized in that: It also includes a supporting component, the receiving end optical device is arranged on the supporting component, and the supporting component includes a PCB board or a substrate.

3. The cross-medium application optical module based on COB packaging according to claim 2 is characterized in that: The signal receiving part also includes a TIA chip, and the light receiving chip is connected to the TIA chip.

4. The cross-medium application optical module based on COB packaging according to claim 1, characterized in that: The receiving end optical device adopts a fiber array module or a light engine or an AWG; and / or the light receiving chip adopts a photodetector.

5. The cross-medium application optical module based on COB packaging according to claim 1, characterized in that: The terminal optical device adopts a fiber array module, which includes a first clamping part, a second clamping part and at least one optical fiber. The optical fiber is clamped between the first clamping part and the second clamping part. At least one end of the first clamping part is constructed as a slope, and the slope is provided with a reflective layer. The ends of each optical fiber correspond to the reflective layer respectively.

6. The cross-medium application optical module based on COB packaging according to claim 5, characterized in that: The first clamping part is configured with at least two grooves for constraining the optical fiber, and the grooves are arranged in an array, and the optical fibers are respectively disposed in the grooves. The second clamping part is connected to the first clamping part and constrains the optical fiber in the grooves. And / or, the optical fiber array module includes four optical fibers, and the four optical fibers are arranged in an array; And / or, the first clamping part is made of a glass block, and the second clamping part is made of a glass plate; And / or, the second clamping portion is fixed to the cushion block.

7. The cross-medium application optical module based on COB packaging according to claim 2, characterized in that: It includes two groups of signal receiving parts, and the receiving end optical devices of each group of signal receiving parts are respectively configured with four optical fibers, and one end of the housing is configured with an optical fiber interface. The supporting component is constructed with a first notch, and two groups of signal receiving parts are respectively arranged on the upper and lower sides of the supporting component, wherein the four optical fibers of one group of signal receiving parts are respectively connected to the optical fiber interface, and the four optical fibers of the other group of signal receiving parts are respectively connected to the optical fiber interface via the first notch.

8. The cross-medium application optical module based on COB packaging according to claim 7, characterized in that: The first notch is configured at the edge of the supporting component; And / or, the supporting component is a PCB board.

9. The cross-medium application optical module based on COB packaging according to claim 7, characterized in that: It also includes a signal transmitting part, which is connected to the optical fiber interface through eight optical fibers.

10. The cross-medium application optical module based on COB packaging according to claim 2, characterized in that: The supporting component is also configured with a second notch, and the signal transmitting part is arranged in the second notch.

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