Flow channel transportation device
By introducing linear modules, transportation mechanisms, hoisting mechanisms and limiting mechanisms into the flow channel transportation device, the precise transportation and positioning of the chips is achieved, and the damage problem during the chip separation process in the prior art is solved, and the separation is improved Safety and reliability of the process.
Patent Information
- Application Number
- CN202420954122.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-06
- Publication Date
- 2024-12-24
- Estimated Expiration
- 2034-05-06
AI Technical Summary
The existing flow channel transport devices cannot provide sufficient support and protection during chip separation, which can easily cause chip damage.
A flow channel transportation device including a linear module, a transport mechanism, a hoisting mechanism and a limiting mechanism is designed. The precise transportation and positioning of the chip is achieved through the transmission belt and the transmission wheel, and the limiting mechanism specifies the position of the substrate and the cover plate. Position to ensure that the next device can be removed safely.
The safety and reliability of the base plate separation stage are improved, and chip damage caused by traditional transportation methods is significantly reduced.
Smart Images

Figure CN222233599U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a flow channel transportation device, belonging to the technical field of automation equipment. Background Art
[0002] In the semiconductor industry, a chip usually includes a base plate, a substrate placed on the base plate, and a cover plate that fixes the substrate to the base plate. In this way, the substrate can be protected during transportation and handling to avoid damage during handling or mechanical processing. In order to ensure that the cover plate can effectively fix and protect the substrate, the size of the cover plate and the substrate is usually designed to be smaller than the base plate, so that space can be left at the edge of the base plate to facilitate subsequent mechanical operations or positioning.
[0003] During the chip processing, the three layers need to be separated separately. The operator first removes the cover plate and the substrate together with a suction cup or a robotic arm to separate the bottom plate from the assembly. When the bottom plate is successfully separated, the cover plate is separated from the substrate by other clamps to complete the three-layer separation.
[0004] During the base plate separation stage, the flow channel transport device is required to transport the chip to the designated location and cooperate with the next device to complete the base plate separation operation. However, the existing flow channel transport device is not specially designed for this process, so it may not provide sufficient support and protection, which may easily cause damage to the chip. Utility Model Content
[0005] The utility model aims to provide a flow channel transport device, which can improve the separation accuracy of chips with a three-layer structure and avoid chip damage.
[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a flow channel transport device for transporting chips, the flow channel transport device comprising a linear module, a base arranged on the linear module, and a transport mechanism, a lifting mechanism and a limiting mechanism arranged on the base; the base comprises a first bracket and a second bracket arranged relatively to each other, the transport mechanism comprises a transmission belt arranged relatively to each other on the first bracket and the second bracket, the lifting mechanism is located between the first bracket and the second bracket, the lifting mechanism switches between a first position and a second position in a height direction, the transport mechanism receives the chip and transports the chip to above the lifting mechanism when it is in the first position; the limiting mechanism is located in the circumferential direction of the lifting mechanism, and the limiting mechanism abuts the chip located on the lifting mechanism in the circumferential direction.
[0007] Furthermore, the base further comprises:
[0008] A base is arranged on the linear module, and the first bracket and the second bracket are arranged on the base;
[0009] An adjusting cylinder is arranged on the base, an output shaft of the adjusting cylinder is connected to the second bracket, and the second bracket can move relative to the first bracket under the driving of the adjusting cylinder.
[0010] Furthermore, the transportation mechanism also includes:
[0011] A transmission motor, arranged on the base;
[0012] A transmission shaft, mounted on the first bracket and the second bracket through bearings, and connected to the output shaft of the transmission motor through a synchronous wheel;
[0013] The transmission wheels are relatively arranged on adjacent sides of the first bracket and the second bracket, and each side includes at least two transmission wheels arranged along the axial direction of the linear module. The transmission belt is tensioned on the bearing and the transmission wheel.
[0014] Furthermore, the lifting mechanism comprises:
[0015] A lifting cylinder is arranged on the base and located between the first bracket and the second bracket;
[0016] The jacking platform is connected with the output shaft of the jacking cylinder. The jacking cylinder drives the jacking platform to move in a vertical direction, and a positioning pin is arranged on the jacking platform.
[0017] Furthermore, the limiting mechanism comprises:
[0018] The first limiting part includes a first abutting block and a second abutting block respectively arranged adjacent to two ends of the jacking platform along the axial direction of the linear module, and the first abutting block and the second abutting block can move in a vertical direction to protrude from the horizontal plane where the chip is located;
[0019] The second limiting portion includes a limiting piece relatively arranged on the first bracket and the second bracket.
[0020] Furthermore, the limiting mechanism comprises:
[0021] The first limiting part includes a first abutting block and a second abutting block respectively arranged adjacent to two ends of the jacking platform along the axial direction of the linear module, and the first abutting block and the second abutting block can move in a vertical direction to protrude from the horizontal plane where the chip is located;
[0022] The second limiting portion includes a limiting piece arranged on one of the first bracket and the second bracket, and a supporting wall formed on the other bracket and having the same height as the limiting piece.
[0023] Furthermore, the second supporting block is slidably disposed on the base and can move along the axial direction of the linear module.
[0024] Furthermore, a discharging sensor is disposed at one end of the first bracket and the second bracket close to the first supporting block, and a feeding sensor is disposed at one end of the first bracket and the second bracket close to the second supporting block.
[0025] Furthermore, limit sensors are provided at both ends of the linear module.
[0026] The beneficial effect of the utility model is that the present application receives the chip from the starting position through the transport mechanism, places the chip on the base, and then uses the linear module to move the chip to the end position, and then the lifting mechanism rises to support the lower surface of the chip, and then the limit mechanism moves to position the substrate and the cover plate, so that the substrate and the cover plate are located at the specified position, and finally waits for the next device to take away the cover plate and the substrate, thereby completing the separation of the bottom plate. In this way, the safety and reliability of the bottom plate separation stage are improved, and the chip damage caused by traditional transportation methods can be significantly reduced.
[0027] The above description is only an overview of the technical solution of the utility model. In order to more clearly understand the technical means of the utility model and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the utility model in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] Figure 1 It is a structural schematic diagram of a flow channel transport device shown in an embodiment of the utility model;
[0029] Figure 2 for Figure 1 A schematic structural diagram of the flow channel transport device from another perspective is shown. DETAILED DESCRIPTION
[0030] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0031] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.
[0032] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0033] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.
[0034] First, it should be noted that the flow channel transport device shown in the present application is used to transport the chip from the starting position to the end position, and to limit the chip at the end position for the next device to process. The chip includes a bottom plate, a substrate placed on the bottom plate, and a cover plate fixing the substrate on the bottom plate.
[0035] See also Figure 1 and Figure 2 A flow channel transport device 100 shown in a preferred embodiment of the present application includes a linear module 1, a base 2 arranged on the linear module 1, and a transport mechanism 3, a lifting mechanism 4 and a limiting mechanism 5 arranged on the base 2.
[0036] The linear module 1 serves as the basis of the mobile transport device 100, and is used to provide power so that the base 2 can move along the axial direction of the linear module 1, wherein, for the convenience of description, the axial direction of the linear module 1 is defined as the first direction. In this embodiment, the linear module 1 is a linear motor, and the base 2 is arranged on the linear motor. Under the drive of the linear motor, the base 2 can move along the first direction. In other embodiments, the linear module 1 can also be a linear guide and a cylinder, and the base 2 is slidably arranged on the linear guide, and the cylinder provides the base 2 with power to move along the first direction.
[0037] Furthermore, in order to limit the limit position of the base 2 moving at both ends of the linear module 1, limit sensors 11 are provided at both ends of the linear module.
[0038] The base 2 includes a base 21, a first bracket 22, an adjusting cylinder 23 and a second bracket 24. The base 21 is arranged on the linear module 1 to support the first bracket 22, the adjusting cylinder 23 and the second bracket 24. The first bracket 22 and the second bracket 24 are arranged relatively on the base 21, the adjusting cylinder is arranged on the base 21, and the output shaft of the adjusting cylinder 23 is connected to the second bracket 24. Under the drive of the adjusting cylinder 23, the second bracket 24 can move relative to the first bracket 22 along the second direction, wherein the second direction is perpendicular to the first direction on the horizontal plane. By moving the second bracket 24 along the second direction, the distance between the first bracket 22 and the second bracket 24 can be adjusted to adapt to chips of different widths.
[0039] The transport mechanism 3 is disposed on the base 2 to drive the chip to move along the first direction. The transport mechanism 3 includes a transport motor 31 , a transport shaft 32 , a transmission belt 33 and a transport wheel 34 .
[0040] The transmission motor 31 is arranged on the base 21. In this embodiment, the transmission motor 31 is arranged adjacent to the second bracket 24. The transmission shaft 32 is installed on the first bracket 22 and the second bracket 24 through the bearing 321, and one end of the transmission shaft 32 is connected to the output shaft of the transmission motor 31 through the synchronous wheel 322. As for the specific structure of the bearing 321 and the synchronous wheel 322, it is relatively common in the prior art and is not described here. The transmission wheels 34 are relatively arranged on the adjacent sides of the first bracket 22 and the second bracket 24, and each side includes at least two transmission wheels 34 arranged along the first direction. The transmission belt 33 is relatively arranged on the first bracket 22 and the second bracket 24, and is tensioned on the bearing 321 and the transmission wheel 34. The cooperation of the transmission motor 31, the output shaft 32, the transmission belt 33 and the transmission wheel 35 can enable the chip to move along the first direction on the transmission belt 33.
[0041] The lifting mechanism 4 is arranged on the base 2 and can move in a vertical direction relative to the base 2. The lifting mechanism 4 includes a lifting cylinder 41 and a lifting platform 42.
[0042] The lifting cylinder 41 is arranged on the base 21, and is located between the first bracket 22 and the second bracket 24. The lifting platform 42 is connected to the output shaft of the lifting cylinder 41, and the lifting cylinder 41 drives the lifting platform 42 to move in the vertical direction, and the lifting platform 42 is provided with a positioning pin 421, and the bottom plate of the chip is provided with positioning holes around it. When the lifting platform 42 moves up to hold the bottom surface of the chip, the positioning pin 421 can be inserted into the positioning hole.
[0043] The limiting mechanism 5 is disposed on the base 2 and located in the circumferential direction of the lifting mechanism 4 to support the outer edge of the chip, thereby limiting the cover plate and the substrate in the chip. The limiting mechanism 5 includes a first limiting portion 51 and a second limiting portion 52.
[0044] In one embodiment, the first limiting portion 51 includes a first abutting block 511 and a second abutting block 512 respectively disposed adjacent to both ends of the jacking platform 42 along the first direction, and the first abutting block 511 and the second abutting block 512 can move in the vertical direction to protrude from the horizontal plane where the chip is located, thereby limiting the chip in the first direction. In this embodiment, the first abutting block 511 and the second abutting block 512 are moved in the vertical direction by a cylinder or a motor.
[0045] Further, the second abutting block 512 is slidably disposed on the base 2 and can move along the first direction. In this embodiment, the second abutting block 512 is fixed to the base 21 by a linear motor, so that it can move along the first direction to accommodate chips of different lengths.
[0046] The second limiting part 52 includes a limiting member 521 relatively arranged on the first bracket 22 and the second bracket 24. The limiting member 521 moves in the second direction through a cylinder or a motor, and limits the cover plate and the base plate from both sides along the second direction. Further, there are four limiting members 521, which are relatively arranged on the first bracket 22 and the second bracket 24, so as to disperse the force and improve the limiting accuracy.
[0047] In another embodiment, the structure of the first limiting portion 51 is similar to that of the previous embodiment, and will not be described in detail here. The second limiting portion 52 includes a limiting member 521 disposed on one of the first bracket 22 and the second bracket 24, and a supporting wall 522 formed on the other and having the same height as the limiting member. The limiting member 521 on one side provides thrust, and the supporting wall 522 on the other side supports the chip to prevent the chip from leaving the lifting platform 42.
[0048] Furthermore, a discharge sensor 25 is provided at one end of the first bracket 22 and the second bracket 24 close to the first abutting block 511, and a feed sensor 26 is provided at one end of the first bracket 22 and the second bracket 24 close to the second abutting block 512. By providing the discharge sensor 25 and the feed sensor 26, it is possible to detect whether the chip reaches the specified position, thereby forming a signal connection with the previous device and the next device, and automatically completing the separation of the chip. This technology is relatively common and will not be described in detail here.
[0049] The workflow of the flow channel transport device 100 in the present application is as follows: First, in the preparation stage, the width between the first bracket 22 and the second bracket 24 is adjusted to adapt to the width of the chip, and the first abutment block 511 rises upward to form a limit. Then, the previous device transports the chip to the transmission belt 33, and the transmission motor 31 is started to move the chip along the first direction until it abuts against the first abutment block 511. Subsequently, the linear module 1 is started to drive the base 2 to move from one side of the linear module 1 to the other side. Then, the lifting platform 42 rises to abut the lower surface of the chip, the positioning pin 421 is inserted into the positioning hole of the bottom plate, the second abutment block 512 rises upward and moves toward the chip along the first direction to abut the cover plate and the substrate, and the limiter 521 moves toward the chip along the second direction to abut the cover plate and the substrate. Finally, after waiting for the positioning to be completed, the second abutment block 512 and the limiter 521 return to their original positions, and the next device takes away the cover plate and the substrate.
[0050] The present application receives the chip from the starting position through the transport mechanism 3, places the chip on the base 2, and then moves the chip to the end position through the linear module 1, and then the lifting mechanism 4 rises to support the lower surface of the chip, and then the limit mechanism 5 moves to position the substrate and the cover plate, so that the substrate and the cover plate are located at the specified position, and finally waits for the next device to take away the cover plate and the substrate, thereby completing the separation of the bottom plate. In this way, the safety and reliability of the bottom plate separation stage are improved, and the chip damage caused by traditional transportation methods can be significantly reduced.
[0051] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0052] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.
Claims
1. A flow channel transport device, characterized in that: Used to transport chips, the flow channel transport device includes a linear module, a base arranged on the linear module, and a transport mechanism, a lifting mechanism and a limiting mechanism arranged on the base; the base includes a first bracket and a second bracket arranged relatively, the transport mechanism includes a transmission belt arranged relatively on the first bracket and the second bracket, the lifting mechanism is located between the first bracket and the second bracket, the lifting mechanism switches between a first position and a second position in the height direction, the transport mechanism receives the chip and transports the chip to the top of the lifting mechanism when it is in the first position; the limiting mechanism is located in the circumferential direction of the lifting mechanism, and the limiting mechanism abuts the chip located on the lifting mechanism in the circumferential direction.
2. The flow channel transport device according to claim 1, characterized in that: The base also includes: A base is arranged on the linear module, and the first bracket and the second bracket are arranged on the base; An adjusting cylinder is arranged on the base, an output shaft of the adjusting cylinder is connected to the second bracket, and the second bracket can move relative to the first bracket under the driving of the adjusting cylinder.
3. The flow channel transport device according to claim 2, characterized in that: The transport mechanism also includes: A transmission motor, arranged on the base; A transmission shaft, mounted on the first bracket and the second bracket through bearings, and connected to the output shaft of the transmission motor through a synchronous wheel; The transmission wheels are relatively arranged on adjacent sides of the first bracket and the second bracket, and each side includes at least two transmission wheels arranged along the axial direction of the linear module. The transmission belt is tensioned on the bearing and the transmission wheel.
4. The flow channel transport device according to claim 2, characterized in that: The lifting mechanism comprises: A lifting cylinder is arranged on the base and located between the first bracket and the second bracket; The jacking platform is connected with the output shaft of the jacking cylinder. The jacking cylinder drives the jacking platform to move in a vertical direction, and a positioning pin is arranged on the jacking platform.
5. The flow channel transport device according to claim 4, characterized in that: The limiting mechanism comprises: The first limiting part includes a first abutting block and a second abutting block respectively arranged adjacent to two ends of the jacking platform along the axial direction of the linear module, and the first abutting block and the second abutting block can move in a vertical direction to protrude from the horizontal plane where the chip is located; The second limiting portion includes a limiting piece relatively arranged on the first bracket and the second bracket.
6. The flow channel transport device according to claim 4, characterized in that: The limiting mechanism comprises: The first limiting part includes a first abutting block and a second abutting block respectively arranged adjacent to two ends of the jacking platform along the axial direction of the linear module, and the first abutting block and the second abutting block can move in a vertical direction to protrude from the horizontal plane where the chip is located; The second limiting portion includes a limiting piece arranged on one of the first bracket and the second bracket, and a supporting wall formed on the other bracket and having the same height as the limiting piece.
7. The flow channel transport device according to claim 5 or 6, characterized in that: The second supporting block is slidably disposed on the base and can move along the axis direction of the linear module.
8. The flow channel transport device according to claim 5 or 6, characterized in that: A discharging sensor is disposed at one end of the first bracket and the second bracket close to the first supporting block, and a feeding sensor is disposed at one end of the first bracket and the second bracket close to the second supporting block.
9. The flow channel transport device according to claim 1, characterized in that: Limit sensors are arranged at both ends of the linear module.
