Semiconductor bare chip pushing device and bare chip picking device

Abstract

The embodiment of the utility model provides a semiconductor bare chip pushing device and a bare chip picking device. The semiconductor bare chip pushing device comprises a supporting table which comprises a supporting surface for supporting a scribing film carrying a plurality of bare chips, and the supporting surface comprises an opening; the pushing part is located in the opening of the supporting table and can move relative to the supporting table, the pushing part comprises a center pushing block and an edge pushing block arranged around the center pushing block, the center pushing block is used for ejecting a target bare chip on the scribing film to a first position, and the edge pushing block is used for ejecting the target bare chip on the scribing film to a second position. The edge pushing block is used for ejecting a bare chip adjacent to the target bare chip on the scribing film to a second position; the height of the first position relative to the surface of the supporting table is larger than the height of the second position relative to the surface of the supporting table.

Description

Technical Field

[0001] The disclosed embodiments relate to the field of semiconductor technology, and more particularly to a semiconductor die pushing device and a die picking device. Background Art

[0002] Die attach (DA) is a very important process in chip assembly production. The die is usually attached to the dicing tape through the die attach film (DAF). During the die attach process, a special pick-up tool is required to pick up the die from the dicing tape.

[0003] With the development of semiconductor technology, the thickness of bare chips continues to decrease, and the difficulty of picking up bare chips also increases, which puts higher requirements on the tools for picking up bare chips. Utility Model Content

[0004] In view of this, the embodiments of the present disclosure provide a semiconductor die pushing device and a die picking device.

[0005] To achieve the above objectives, the technical solution of the present disclosure is implemented as follows:

[0006] In a first aspect, an embodiment of the present disclosure provides a semiconductor die pushing device, which includes: a support table, including a support surface supporting a dicing film carrying a plurality of dies, the support surface including an opening; a pushing component, located in the opening of the support table and capable of moving relative to the support table, the pushing component including a central pushing block and an edge pushing block arranged around the central pushing block, the central pushing block being used to eject a target die on the dicing film to a first position, and the edge pushing block being used to eject a die on the dicing film adjacent to the target die to a second position; wherein the height of the first position relative to the surface of the support table is greater than the height of the second position relative to the surface of the support table.

[0007] In some embodiments, when the edge pushing block pushes out the die adjacent to the target die on the dicing film to the second position, the height of the edge pushing block relative to the surface of the support platform is fixed.

[0008] In some embodiments, when the edge pushing block pushes out the die adjacent to the target die on the dicing film to the second position, the height of the edge pushing block relative to the surface of the support platform gradually decreases in a direction from the center to the outside.

[0009] In some embodiments, the edge pushing block is an annular edge pushing block; or, the edge pushing block includes a plurality of rectangular edge sub-blocks.

[0010] In some embodiments, the central pushing block includes a plurality of central sub-blocks arranged sequentially from the center outward; when the central pushing block pushes the target bare chip on the dicing film to the first position, the heights of the plurality of central sub-blocks relative to the surface of the support platform are sequentially decreased from the center outward.

[0011] In some embodiments, when the central pushing block ejects the target die on the scribe film to a first position, and the edge pushing block ejects the die adjacent to the target die on the scribe film to a second position, the height of the edge pushing block relative to the surface of the support table is less than the minimum height of the multiple central sub-blocks relative to the surface of the support table.

[0012] In some embodiments, the central push block includes a rectangular central sub-block and a plurality of annular central sub-blocks surrounding the rectangular central sub-block, and the plurality of annular central sub-blocks are nested and arranged in sequence from the center outward.

[0013] In some embodiments, the height range from the second position to the support table is 25% to 100% of the smallest height among the heights of the plurality of central sub-blocks relative to the surface of the support table.

[0014] In some embodiments, when the center push block ejects the target die on the scribe film to a first position, and the edge push block ejects the die adjacent to the target die on the scribe film to a second position, the height difference between any two adjacent center sub-blocks in the center push block is greater than the height of the edge push block relative to the surface of the support platform.

[0015] In a second aspect, an embodiment of the present disclosure provides a bare die picking device, comprising: the semiconductor bare die pushing device as described in the first aspect; and a picking component, wherein the picking component is used to pick up the target bare die pushed out to the first position by the central pushing block.

[0016] The embodiment of the present disclosure provides a semiconductor die pushing device and a die picking device. The semiconductor die pushing device includes: a support table, including a support surface supporting a dicing film carrying a plurality of dies, the support surface including an opening; a pushing component, located in the opening of the support table and capable of moving relative to the support table, the pushing component including a central pushing block and an edge pushing block arranged around the central pushing block, the central pushing block is used to eject the target die on the dicing film to a first position, and the edge pushing block is used to eject the die adjacent to the target die on the dicing film to a second position; wherein the height of the first position relative to the surface of the support table is greater than the height of the second position relative to the surface of the support table. In the embodiment of the present disclosure, the semiconductor die pushing device includes a central pushing block and an edge pushing block, when picking up the target die, the central pushing block and the edge pushing block eject the target die and the die adjacent to the target die to the first position and the second position respectively, so that when the target die is ejected, the stress on the die adjacent to the target die is reduced, thereby reducing the risk of die breakage. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A top view and a cross-sectional view of a semiconductor die pushing device in an example of an embodiment of the present disclosure;

[0018] Figure 2A and Figure 2B A diagram showing the steps of a semiconductor die pushing device pushing a target die to a preset position in an example of an embodiment of the present disclosure;

[0019] Figure 3 A cross-sectional view and a top view of a semiconductor die pushing device provided in an embodiment of the present disclosure;

[0020] Figure 4 A partially enlarged cross-sectional view of a semiconductor die pushing device provided in an embodiment of the present disclosure;

[0021] FIG. 5A to FIG. 5B for Figure 4 A step diagram of a semiconductor die pushing device pushing a target die to a first position;

[0022] Figure 6 A partially enlarged cross-sectional view of another semiconductor die pushing device provided by an embodiment of the present disclosure;

[0023] FIG. 7A to FIG. 7B for Figure 6 A step diagram of a semiconductor die pushing device pushing a target die to a first position;

[0024] Figure 8 A top view of another semiconductor die pushing device provided by an embodiment of the present disclosure;

[0025] Fig. 9 It is a schematic diagram of five semiconductor die pushing devices provided in the embodiments of the present disclosure pushing a target die to a first position;

[0026] FIG. 10A to FIG. 10C A detailed step diagram of a semiconductor die pushing device according to an embodiment of the present disclosure pushing a target die to a first position. DETAILED DESCRIPTION

[0027] The following will be combined with the embodiments of the present disclosure and the accompanying drawings to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0028] In the following description, a large number of specific details are given to provide a more thorough understanding of the present disclosure. However, it is obvious to those skilled in the art that the present disclosure can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present disclosure, some technical features known in the art are not described; that is, all features of actual embodiments are not described here, and well-known functions and structures are not described in detail.

[0029] In the drawings, the sizes of layers, regions, elements and their relative sizes may be exaggerated for clarity. Like reference numerals denote like elements throughout.

[0030] It should be understood that when an element or layer is referred to as "on ...", "adjacent to ...", "connected to" or "coupled to" other elements or layers, it can be directly on, adjacent to, connected to or coupled to other elements or layers, or there can be intervening elements or layers. On the contrary, when an element is referred to as "directly on ...", "directly adjacent to ...", "directly connected to" or "directly coupled to" other elements or layers, there is no intervening element or layer. It should be understood that although the terms first, second, third, etc. can be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the present disclosure, the first element, component, region, layer or part discussed below can be represented as the second element, component, region, layer or part. And when the second element, component, region, layer or part is discussed, it does not indicate that the present disclosure necessarily has the first element, component, region, layer or part.

[0031] Spatially relative terms such as "under", "beneath", "below", "under", "above", "above", etc., may be used here for convenience of description to describe the relationship between an element or feature shown in the figure and other elements or features. It should be understood that in addition to the orientation shown in the figure, the spatial relationship terms are intended to also include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is turned over, then the elements or features described as "under other elements" or "under it" or "under it" will be oriented as "on" other elements or features. Therefore, the exemplary terms "under" and "under" may include both upper and lower orientations. The device can be oriented otherwise (rotated 90 degrees or other orientations) and the spatial descriptors used herein are interpreted accordingly.

[0032] The purpose of the terms used herein is only to describe specific embodiments and is not intended to be a limitation of the present disclosure. When used herein, the singular forms "one", "an" and "said / the" are also intended to include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "consisting of" and / or "comprising", when used in this specification, determine the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0033] In order to thoroughly understand the present disclosure, detailed steps and detailed structures will be presented in the following description to illustrate the technical solution of the present disclosure. The preferred embodiments of the present disclosure are described in detail below, but in addition to these detailed descriptions, the present disclosure may also have other implementations.

[0034] When preparing a bare chip, a grid-shaped predetermined division line can be formed on the surface of a circular wafer to divide the wafer into a plurality of bare chip areas, and then each area is divided along the predetermined division line to prepare a plurality of bare chips. Specifically, the wafer can be attached to a dicing film through a bare chip attachment film, and then the wafer is divided to form a plurality of bare chips arranged at intervals. At this time, the plurality of bare chips formed by division are attached to the dicing film through a bare chip attachment film.

[0035] In one example of the embodiment of the present disclosure, a target die attached to a dicing film through a die attaching film can be picked up by a die picking device. Specifically, the die picking device includes a semiconductor die pushing device and a picking arm, wherein the semiconductor die pushing device includes a support table, the support table includes a support surface for supporting a dicing film carrying multiple dies, and the support surface includes an opening. The opening includes a pushing component that can move relative to the support table, and the projection of the pushing component on the support table is located at the center of the projection of the opening on the support table. The dicing film can be moved to drive multiple dies on the dicing film to move simultaneously, so that one of the multiple dies on the dicing film is located directly above the opening. At this time, the die located directly above the opening is defined as the target die, that is, the target die is located directly above the pushing component. The pushing component is made to pass through the opening and push upward. Since the area of ​​the projection of the opening on the support surface is close to the area of ​​the projection of the die on the support surface, the pushing component can drive the target die above it to move to a preset position with a preset height, but will not drive the die adjacent to the target die to move to the preset height. In this way, the pick-up arm can be manipulated to pick up the target die from the preset position, thereby cooperating with the semiconductor die pushing device to complete the picking of the die.

[0036] refer to Figure 1 , Figure 1 1 is a top view and a cross-sectional view of a semiconductor die pushing device in an example of an embodiment of the present disclosure.

[0037] like Figure 1 As shown, the semiconductor die pushing device 100 includes a support platform 101, and the support platform 101 includes a support surface 102 for supporting a dicing film carrying a plurality of die. The support surface 102 is provided with an opening 103, and a pushing component 104 is provided in the opening 103, and the pushing component 104 can move relative to the support platform 101. The pushing component 104 includes three pushing sub-components arranged in sequence from the center to the outside, namely a first pushing sub-component 105, a second pushing sub-component 106 and a third pushing sub-component 107. Specifically, as shown in FIG. Figure 1As shown in the top view of the semiconductor die pushing device, the projection of the pushing component 104 on the supporting surface 102 is located at the center of the supporting surface 102. The projection of the first pushing sub-component 105 on the supporting surface 102 is a rectangle, and the projection of the first pushing sub-component 105 on the supporting surface 102 is located at the center of the supporting surface 102. The projection of the second pushing sub-component 106 on the supporting surface is a rectangular ring, and the second pushing sub-component 106 surrounds the four side walls of the first pushing sub-component 105. The projection of the third pushing sub-component 107 on the supporting surface 102 is a rectangular ring, and the third pushing sub-component 107 surrounds the four outer side walls of the second pushing sub-component 106. The pushing component 104 can push out the target die on the dicing film to a preset position for the pickup arm to pick up. At this time, the heights of the tops of the first pushing sub-component 105, the second pushing sub-component 106 and the third pushing sub-component 107 relative to the surface of the support platform 101 are successively reduced.

[0038] refer to Figure 2A and Figure 2B , Figure 2A and Figure 2B This is a diagram showing the steps of a semiconductor die pushing device pushing a target die to a preset position in an example of an embodiment of the present disclosure.

[0039] like Figure 2A As shown, a dicing film 202 carrying a plurality of bare chips 201 is placed on a support surface 204 of a support table 203, and the plurality of bare chips 201 are adhered to the dicing film 202 through a bare chip attaching film 205. The support surface 204 is provided with an opening ( Figure 2A 204 ), the opening is located at the center of the support surface 204. The die located above the opening is the target die 206, and the target die is usually one die. The target die can be picked up by the pick-up arm in the subsequent die placement process, while the non-target die cannot be picked up by the pick-up arm.

[0040] like Figure 2BAs shown, the pushing component 210 includes three pushing sub-components arranged in sequence from the center to the outside, namely, the first pushing sub-component 211, the second pushing sub-component 212 and the third pushing sub-component 213. In the die mounting process, the pushing component 210 can push the target die 206 on the dicing film 202 to a preset position (having a preset height H compared to the surface of the support table 203) for the pick-up arm to pick up. Among them, the process of the pushing component 210 pushing the target die 206 to the preset position can be carried out in multiple steps. In a specific embodiment, the process of the pushing component 210 pushing the target die 206 to the preset position can be carried out in three steps, that is, firstly pushing up the third pushing sub-component 213 to the third height relative to the surface of the support table 203, then pushing up the second pushing sub-component 212 to the second height relative to the surface of the support table 203, and finally pushing up the first pushing sub-component 211 to the first height relative to the surface of the support table 203. Here, the first height is higher than the second height, the second height is higher than the third height, and the first height is the preset height H, so that the portion of the scribe film 202 located at the target die 206 is positively bent, and the positive bending causes partial peeling between the target die 206 and the scribe film 202, which is conducive to the complete peeling between the target die 206 and the scribe film 202. Exemplarily, the first height can be 800μm; the second height can be 500μm; and the third height can be 200μm. However, in the process of the pushing component 210 pushing the target die 206 to the preset position, the portion of the scribe film 202 located at the die adjacent to the target die 206 will be reversely bent (compared to the positive bending), and the reverse bending will cause great stress on the die adjacent to the target die 206, and may even cause the die adjacent to the target die 206 to bend (such as Figure 2B The risk of breakage may occur.

[0041] An embodiment of the present disclosure provides a semiconductor bare die pushing device, which includes: a support table, including a supporting surface supporting a dicing film carrying a plurality of bare die, the supporting surface including an opening; a pushing component, which is located in the opening of the support table and can move relative to the support table, the pushing component including a central pushing block and an edge pushing block arranged around the central pushing block, the central pushing block is used to eject a target bare die on the dicing film to a first position, and the edge pushing block is used to eject a bare die adjacent to the target bare die on the dicing film to a second position; wherein the height of the first position relative to the surface of the support table is greater than the height of the second position relative to the surface of the support table.

[0042] refer to Figure 3 , Figure 3 A top view and a cross-sectional view of a semiconductor die pushing device provided in an embodiment of the present disclosure.

[0043] like Figure 3As shown, the semiconductor die pushing device includes a support platform 301, the support platform 301 includes a support surface 302 for supporting a dicing film carrying a plurality of dies, the support surface 302 includes an opening 303, and the opening 303 is located at the center of the support surface 302. The semiconductor die pushing device also includes a pushing component, which is located in the opening 303 of the support platform 301 and can move relative to the support platform 301. Figure 3 As shown in the top view of the semiconductor die pushing device, the pushing component includes a central pushing block 305 and an edge pushing block 306 arranged around the central pushing block 305. In one embodiment of the present disclosure, the opening 303 of the support surface 302 can be one, such as Figure 3 As shown. In another embodiment of the present disclosure, the support surface may have multiple openings, and the multiple openings correspond to the positions of the central push blocks and the edge push blocks, that is, the central push blocks and the edge push blocks are respectively located in different corresponding openings. In the die mounting process, the central push block 305 can push out the target die on the dicing film to the first position, and the edge push block 306 can push out the die adjacent to the target die on the dicing film to the second position, and the height of the first position relative to the surface of the support platform 301 is greater than the height of the second position relative to the surface of the support platform 301.

[0044] In the disclosed embodiment, the semiconductor die pushing device further comprises a driving component, which is located in the support platform and connected to the pushing component. In the operation of picking up the die, the driving component can drive the pushing component to push upward, so that the pushing component passes through the opening of the support surface, thereby driving the target die to the first position, and driving the die adjacent to the target die to the second position.

[0045] In a specific embodiment of the present disclosure, the edge pushing block includes a plurality of rectangular edge sub-blocks.

[0046] refer to Figure 3 The projection of the central push block 305 on the support surface 302 is rectangular, and the edge push block 306 includes four rectangular edge sub-blocks 3061 of the same structure, and the projection of the rectangular edge sub-blocks 3061 on the support surface 302 is rectangular. The four rectangular edge sub-blocks 3061 are respectively arranged on four sides of the central push block 305, so that the four rectangular edge sub-blocks 3061 surround the central push block 305 together.

[0047] In one embodiment of the present disclosure, the projection area of ​​the edge push block on the support surface and the projection area of ​​the center push block on the support surface can be greater than or equal to the projection area of ​​the die on the support surface, so as to reduce the stress on the die located on the edge push block and adjacent to the target die when picking up the target die.

[0048] In the disclosed embodiment, the central push block includes a plurality of central sub-blocks arranged sequentially from the center outward; when the central push block pushes the target bare chip on the dicing film to the first position, the heights of the plurality of central sub-blocks relative to the surface of the support platform are sequentially reduced from the center outward.

[0049] In the disclosed embodiment, the central push block includes a rectangular central sub-block and a plurality of annular central sub-blocks surrounding the rectangular central sub-block, and the plurality of annular central sub-blocks are nested and arranged in sequence from the center outward.

[0050] Continue to refer Figure 3 , the projection of the central push block 305 on the support surface 302 is located at the center of the support surface 302, and the central push block 305 includes three central sub-blocks nested and arranged in sequence from the center to the outside, namely, the first central sub-block 3051, the second central sub-block 3052 and the third central sub-block 3053. Among them, the projection of the first central sub-block 3051 on the support surface 302 is a rectangle, and the projection of the first central sub-block 3051 on the support surface 302 is located at the center of the support surface 302. The projection of the second central sub-block 3052 on the support surface 302 is a rectangular ring, and the second central sub-block 3052 surrounds the four side walls of the first central sub-block 3051. The projection of the third central sub-block 3053 on the support surface is a rectangular ring, and the third central sub-block 3053 surrounds the four outer side walls of the second central sub-block 3052. In the die mounting process, when the central push block 305 pushes the target die on the dicing film to the first position, the heights of the first central sub-block 3051 , the second central sub-block 3052 and the third central sub-block 3053 relative to the support table surface are successively reduced.

[0051] In the embodiment of the present disclosure, the central push block is used to push the target die on the dicing film to the first position in the die mounting process. Therefore, any central push block that meets this condition falls within the protection scope of the embodiment of the present disclosure, and the embodiment of the present disclosure does not limit the shape of the central push block and the number of central sub-blocks included.

[0052] In the disclosed embodiment, when the center push block ejects the target die on the dicing film to the first position, and the edge push block ejects the die adjacent to the target die on the dicing film to the second position, the height of the edge push block relative to the surface of the support table is less than the minimum height of the heights of the multiple center sub-blocks relative to the surface of the support table.

[0053] refer to Figure 3, the center push block includes a first center sub-block 3051, a second center sub-block 3052 and a third center sub-block 3053. In the die mounting process, the center push block 305 pushes out the target die on the dicing film to the first position, and the edge push block 306 pushes out the die adjacent to the target die on the dicing film to the second position. At this time, the heights of the first center sub-block 3051, the second center sub-block 3052 and the third center sub-block 3053 relative to the surface of the support table 301 are successively reduced, and the height of the edge push block 306 relative to the surface of the support table 301 is less than the height of the third center sub-block 3053 relative to the surface of the support table 301.

[0054] In the disclosed embodiment, when the edge pushing block pushes out the die adjacent to the target die on the dicing film to the second position, the height of the edge pushing block relative to the surface of the support platform gradually decreases in the direction from the center to the outside.

[0055] refer to Figure 4 , Figure 4 A partially enlarged view of a cross-sectional view of a semiconductor die pushing device provided in an embodiment of the present disclosure.

[0056] like Figure 4 As shown, in one embodiment of the present disclosure, when the edge push block 401 pushes the die adjacent to the target die on the dicing film to the second position, the edge push block 401 is completely exposed above the support surface, and the bottom of the edge push block 401 is flush with the top of the support surface. At this time, the height of the edge push block 401 relative to the surface of the support table gradually decreases in the direction from the center to the outside, that is, the thickness of the edge push block 401 gradually decreases in the direction from the center to the outside.

[0057] In another embodiment of the present disclosure, when the edge push block pushes out the die adjacent to the target die on the dicing film to the second position, a portion of the edge push block is exposed above the support surface, and the remaining portion of the edge push block is located in the opening of the support surface. At this time, the height of the edge push block relative to the surface of the support table gradually decreases in the direction from the center to the outside, that is, the height of the upper surface of the exposed portion of the edge push block relative to the surface of the support table gradually decreases in the direction from the center to the outside.

[0058] refer to Figure 5A and Figure 5B , FIG. 5A to FIG. 5B for Figure 4 FIG. 1 is a step diagram of a semiconductor die pushing device pushing a target die to a first position.

[0059] like Figure 5A As shown, a dicing film 404 carrying a plurality of bare chips 403 is placed on a support surface 406 of a support table 405, and the plurality of bare chips 403 are adhered to the dicing film 404 through a bare chip attaching film 407. The support surface 406 is provided with an opening ( Figure 5A(not shown), the opening is located at the center of the support surface 406.

[0060] like Figure 5B As shown, the pushing component 408 includes a central pushing block 402 and an edge pushing block 401 arranged around the central pushing block 402. In the die mounting process, the central pushing block 402 can push out the target die 409 on the dicing film 404 to a first position for picking up by a matching picking component, wherein the first position has a first distance Z1 compared to the surface of the support platform, and at the same time, the edge pushing block 401 pushes out the die adjacent to the target die 409 on the dicing film 404 to a second position, wherein the highest point of the second position has a second distance Z2 compared to the surface of the support platform. At this time, since the height of the edge pushing block 401 relative to the surface of the support platform 405 gradually decreases in the direction from the center to the outside, there is an inclination angle between the die adjacent to the target die 409 located on the edge pushing block 401 and the support surface. It should be noted that when the central push block 402 pushes the target die 409 on the dicing film 404 to the first position, the target die 409 and the dicing film 404 are gradually peeled off, but the die attaching film 407 is always adhered to the bottom of the target die 409 .

[0061] In the disclosed embodiment, when the edge pushing block pushes out the die adjacent to the target die on the dicing film to the second position, the height of the edge pushing block relative to the surface of the support platform is fixed.

[0062] refer to Figure 6 , Figure 6 A partially enlarged view of a cross-sectional view of another semiconductor die pushing device provided in an embodiment of the present disclosure.

[0063] like Figure 6 As shown, in one embodiment of the present disclosure, when the edge push block 601 pushes the die adjacent to the target die on the dicing film to the second position, the edge push block 601 is completely exposed above the support surface, and the bottom of the edge push block 601 is flush with the support surface. At this time, the height Z of the edge push block 601 relative to the surface of the support table is fixed, that is, the thickness of the edge push block 601 is fixed.

[0064] In another embodiment of the present disclosure, when the edge push block pushes out the die adjacent to the target die on the dicing film to the second position, a portion of the edge push block is exposed above the support surface, and the remaining portion of the edge push block is located in the opening of the support surface. At this time, the height of the edge push block relative to the surface of the support table is fixed, that is, the height of the upper surface of the exposed portion of the edge push block relative to the surface of the support table is fixed.

[0065] refer to Fig. 7A and Figure 7B , FIG. 7A to FIG. 7B for Figure 6FIG. 1 is a step diagram of a semiconductor die pushing device pushing a target die to a first position.

[0066] like Fig. 7A As shown, a dicing film 604 carrying a plurality of bare chips 603 is placed on a support surface 606 of a support table 605, and the plurality of bare chips 603 are adhered to the dicing film 604 through a bare chip attaching film 607. The support surface 606 is provided with an opening ( Fig. 7A (not shown), the opening is located at the center of the support surface 606.

[0067] like Figure 7B As shown, the pushing component 608 includes a central pushing block 602 and an edge pushing block 601 arranged around the central pushing block 602. In the die mounting process, the central pushing block 602 can push out the target die 609 on the dicing film 604 to a first position for picking up by the matching picking component, wherein the first position has a first distance Z1 compared to the surface of the support table 605. At the same time, the edge pushing block 601 pushes out the die adjacent to the target die 609 on the dicing film 604 to a second position, and the second position has a second distance Z2 compared to the surface of the support table. At this time, the surface of the edge pushing block 601 is fixed in height relative to the surface of the support table 605.

[0068] In the embodiment of the present disclosure, the edge push block is used to push the die adjacent to the target die on the dicing film to the second position during the die mounting process. Therefore, any edge push block that meets this condition falls within the protection scope of the embodiment of the present disclosure, and the embodiment of the present disclosure does not limit the shape of the edge push block and the number of edge sub-blocks included.

[0069] In a specific embodiment of the present disclosure, the edge pushing block is an annular edge pushing block.

[0070] refer to Figure 8 , Figure 8 A top view of another semiconductor die pushing device provided in an embodiment of the present disclosure.

[0071] like Figure 8As shown, the projection of the central push block 801 on the support surface 802 is located at the center of the support surface 802, and the central push block 801 includes three central sub-blocks nested and arranged in sequence from the center to the outside, namely, the first central sub-block 8011, the second central sub-block 8012 and the third central sub-block 8013. Among them, the projection of the first central sub-block 8011 on the support surface 802 is a rectangle, and the projection of the first central sub-block 8011 on the support surface 802 is located at the center of the support surface 802. The projection of the second central sub-block 8012 on the support surface 802 is a rectangular ring, and the second central sub-block 8012 surrounds the four side walls of the first central sub-block 8011. The projection of the third central sub-block 8013 on the support surface is a rectangular ring, and the third central sub-block 8013 surrounds the four outer side walls of the second central sub-block 8012. The projection of the annular edge push block 803 on the support surface 802 is a rectangular ring. The annular edge pushing block 803 is disposed around the central pushing block 801 , and the four inner walls of the annular edge pushing block 803 are respectively parallel to the four side surfaces of the central pushing block 801 .

[0072] In one embodiment of the present disclosure, the height range from the second position to the support table is 25% to 100% of the minimum height of the plurality of central sub-blocks relative to the surface of the support table.

[0073] refer to Figure 4 or Figure 6 When the center push block 402 (or 602) pushes out the target die on the dicing film to the first position, and the edge push block 401 (or 601) pushes out the die adjacent to the target die on the dicing film to the second position, the height of the edge push block 401 (or 601) relative to the surface of the support table can be 25% to 100% of the height h3 of the third center sub-block 4023 (or 6023) relative to the surface of the support table.

[0074] In another embodiment of the present disclosure, the height range from the second position to the support table is 25% to 75% of the minimum height of the plurality of central sub-blocks relative to the surface of the support table.

[0075] refer to Figure 4 or Figure 6 When the center push block 402 (or 602) pushes out the target die on the dicing film to the first position, and the edge push block 401 (or 601) pushes out the die adjacent to the target die on the dicing film to the second position, the height of the edge push block 401 (or 601) relative to the surface of the support table can be 25% to 75% of the height h3 of the third center sub-block 4023 (or 6023) relative to the surface of the support table.

[0076] In the embodiment of the present disclosure, within the height range of the second position, the higher the second position is, the better the effect of reducing the stress applied to the die adjacent to the target die is.

[0077] In the disclosed embodiment, when the center push block ejects the target die on the dicing film to the first position, and the edge push block ejects the die adjacent to the target die on the dicing film to the second position, the height difference between any two adjacent center sub-blocks in the center push block is greater than the height of the edge push block relative to the surface of the support platform.

[0078] refer to Figure 4 or Figure 6 In the embodiment of the present disclosure, the process of the center push block 402 (or 602) pushing the target die out to the first position can be performed in three steps. Specifically, the third center sub-block 4023 (or 6023) is lifted to the third height, and the distance between the third height and the surface of the support platform is h3; the second center sub-block 4022 (or 6022) is lifted to the second height, and the distance between the second height and the surface of the support platform is h2; the first center sub-block 4021 (or 6021) is lifted to the first height, and the distance between the first height and the surface of the support platform is h1. Among them, the steps of lifting the third center sub-block 4023 (or 6023) and lifting the edge push block 401 (or 601) can be performed simultaneously. When the center push block 402 (or 602) pushes the target die on the dicing film to the first position, the heights of the first center sub-block 4021 (or 6021), the second center sub-block 4022 (or 6022) and the third center sub-block 4023 (or 6023) relative to the surface of the support table are successively reduced, and the height difference between the first center sub-block 4021 (or 6021) and the second center sub-block 4022 (or 6022) and the height difference between the second center sub-block 4022 (or 6022) and the third center sub-block 4023 (or 6023) are both greater than the height of the edge push block 401 (or 601) relative to the surface of the support table. In this way, the separation area between the target die and the dicing film can be increased, thereby improving the stripping ability of the target die.

[0079] refer to Fig. 9 , Fig. 9 It is a schematic diagram of five semiconductor die pushing devices provided in the embodiments of the present disclosure pushing a target die to a first position.

[0080] like Fig. 9 As shown, Fig. 9, from top to bottom, are schematic diagrams of the first pusher 901, the second pusher 902, the third pusher 903, the fourth pusher 904 and the fifth pusher 905 pushing the target die to the first position. Among them, the pushing component of the first pusher 901 only includes the central pusher block, while the pushing components of the other four pushers include the central pusher block and the edge pusher block at the same time. Further, for the second pusher 902 and the third pusher 903, when the edge pusher block pushes the die adjacent to the target die on the dicing film to the second position, the height of the edge pusher block relative to the surface of the support table gradually decreases in the direction from the center to the outside. Here, the second pusher 902 and the third pusher 903 can be two pushers with the same structure but different operation control modules. The difference between the two is that the second position of the edge pusher block controlled by the operation control module to be lifted is different when the die mounting process is performed. Specifically, the height of the second position of the edge pusher block controlled by the operation control module of the second pusher 902 relative to the surface of the support table is less than the height of the second position of the edge pusher block controlled by the operation control module of the third pusher 903 relative to the surface of the support table. Here, the height of the second position of the edge push block of the second push device 902 relative to the surface of the support platform is 0.1mm, and the height of the second position of the edge push block of the third push device 903 relative to the surface of the support platform is 0.2mm. It should be noted that the second position is defined only to reflect that the position where the edge push block pushes out the die adjacent to the target die in the die mounting process is different from the position where the center push block pushes out the target die on the dicing film, that is, the second position is a relative position different from the first position, so the height of the second position of the edge push block can be controlled according to actual needs. For the fourth push device 904 and the fifth push device 905, when the edge push block pushes out the die adjacent to the target die on the dicing film to the second position, the height of the edge push block relative to the surface of the support platform is fixed. Here, the fourth push device 904 and the fifth push device 905 can be two push devices with the same structure but different operation control modules. The difference between the two is that the second position of the edge push block is different when the die mounting process is performed by their respective operation control modules. Specifically, the height of the second position of the edge push block raised by the operation control module of the fourth push device 904 relative to the support table surface is less than the height of the second position of the edge push block raised by the operation control module of the fifth push device 905 relative to the support table surface. Here, the height of the second position of the edge push block raised by the fourth push device 904 relative to the support table surface is 0.1 mm, and the height of the second position of the edge push block raised by the fifth push device 905 relative to the support table surface is 0.2 mm. In the die mounting process, compared with the first push device 901, the other four push devices can effectively reduce the stress applied to the die adjacent to the target die.Moreover, compared with the fourth pushing device 904 and the fifth pushing device 905, the second pushing device 902 and the third pushing device 903 can better reduce the stress applied to the die adjacent to the target die. In addition, for the pushing device with the edge pushing block, within a certain range (i.e., when the height of the edge pushing block relative to the surface of the support platform is less than the minimum height of the heights of the plurality of central sub-blocks relative to the surface of the support platform), the higher the height of the second position of the edge pushing block raised by the pushing device relative to the surface of the support platform, the better the effect of reducing the stress applied to the die adjacent to the target die.

[0081] refer to FIG. 10A to FIG. 10C , FIG. 10A to FIG. 10C A detailed step diagram of a pushing device according to an embodiment of the present disclosure pushing a target die to a first position.

[0082] like Fig. 10A As shown, the pushing device includes a pushing component 1001, and the pushing component 1001 includes a central pushing block 1002 and an edge pushing block 1003. The central pushing block 1002 includes three central sub-blocks ( Fig. 10A Only the third central sub-block 1023 is shown in the figure. In the die mounting process, the third central sub-block 1023 and the edge push block 1003 can be lifted up at the same time. At this time, the height of the third central sub-block 1023 is greater than the height of the edge push block 1003. The edge push block 1003 pushes the die adjacent to the target die 1004 to the second position, and the target die 1004 is partially separated from the dicing film 1005. Fig. 10A and Fig. 10B , the operation control module can control the edge push block 1003 to descend until the edge push block 1003 is completely retracted into the opening of the die push device. In one embodiment, the push component 1001 further includes a vacuum adsorption device for stabilizing the dicing film below the support surface 1006. In this way, during the descent of the edge push block 1003, the vacuum adsorption device can make the dicing film 1005 close to the upper surface of the edge push block 1003, so that the die adjacent to the target die 1004 is always subjected to less stress. Fig. 10AIn the embodiment, the target die 1004 and the scribe film 1005 have been partially separated. Therefore, by controlling the edge push block 1003 to descend, the separation area between the target die 1004 and the scribe film 1005 can be further increased, thereby improving the stripping ability of the target die 1004, thereby increasing the process window of the die mounting process. In other words, if the height of the third central sub-block 1023 is equal to the height of the edge push block 1003, it is equivalent to having no edge push block 1003. If there is no edge push block 1003, when the third central sub-block 1023 is lifted, the target die 1004 and the scribe film 1005 directly change from a tightly fitted state to a state of large-area separation, which will cause the scribe film 1005 located below the die adjacent to the target die 1004 to be deformed to a large extent, so that the stress applied to the die adjacent to the target die 1004 is relatively large. Fig. 10C As shown, after the edge push block is lowered into the push device, the second central sub-block 1022 and the first central sub-block 1021 are lifted up in sequence to push the target die 1004 out to the first position. The height of the second central sub-block 1022 being lifted up is less than the height of the first central sub-block 1021 being lifted up.

[0083] The disclosed embodiment further provides a bare die picking device, which includes: a semiconductor bare die pushing device as in the above technical solution; and a picking component, the picking component is used to pick up a target bare die pushed out to a first position by a central pushing block.

[0084] In the embodiment of the present disclosure, the picking component may be a picking arm. Fig. 10C After the die pushing device pushes the target die 1004 to the first position, the picking component is used to pick up the target die 1004 located at the first position, and then the die pushing device controls the three central sub-blocks of the central pushing block to descend simultaneously until the three central sub-blocks are completely retracted into the opening of the pushing device.

[0085] The embodiment of the present disclosure provides a semiconductor die pushing device, comprising: a support platform and a pushing component, the support platform comprising a supporting surface for supporting a dicing film carrying a plurality of dices, the supporting surface comprising an opening; the pushing component is located in the opening of the support platform and the pushing component can move relative to the support platform, the pushing component comprises a central pushing block and an edge pushing block arranged around the central pushing block, the central pushing block is used to eject a target die on the dicing film to a first position, and the edge pushing block is used to eject a die adjacent to the target die on the dicing film to a second position; wherein the height of the first position relative to the surface of the support platform is greater than the height of the second position relative to the surface of the support platform. In the embodiment of the present disclosure, the semiconductor pushing device comprises a central pushing block and an edge pushing block, when picking up a target die, the central pushing block and the edge pushing block eject the target die and the die adjacent to the target die to the first position and the second position respectively, so that when the target die is ejected, the stress on the die adjacent to the target die is reduced, thereby reducing the risk of die breakage.

[0086] It should be understood that "one embodiment" or "an embodiment" mentioned throughout the specification means that specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present disclosure. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that in the various embodiments of the present disclosure, the size of the serial number of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present disclosure. The serial numbers of the embodiments of the present disclosure are for description only and do not represent the advantages and disadvantages of the embodiments.

[0087] The above description is only a preferred embodiment of the present disclosure, and does not limit the patent scope of the present disclosure. All equivalent structural changes made by using the contents of the present disclosure and the drawings under the concept of the present disclosure, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present disclosure.

Claims

1. A semiconductor bare chip pushing device, characterized in that: include: A support platform, comprising a support surface for supporting a dicing film carrying a plurality of bare chips, wherein the support surface comprises an opening; A pushing component is located in the opening of the support platform and can move relative to the support platform, the pushing component includes a central pushing block and an edge pushing block arranged around the central pushing block, the central pushing block is used to eject the target die on the dicing film to a first position, and the edge pushing block is used to eject the die adjacent to the target die on the dicing film to a second position; wherein the height of the first position relative to the surface of the support platform is greater than the height of the second position relative to the surface of the support platform.

2. The semiconductor die pushing device according to claim 1, wherein: When the edge pushing block pushes out the die adjacent to the target die on the dicing film to the second position, the height of the edge pushing block relative to the surface of the support platform is fixed.

3. The semiconductor die pushing device according to claim 1, wherein: When the edge pushing block pushes out the die adjacent to the target die on the dicing film to the second position, the height of the edge pushing block relative to the surface of the support platform gradually decreases in the direction from the center to the outside.

4. The semiconductor die pushing device according to claim 1, wherein: The edge pushing block is an annular edge pushing block; or, the edge pushing block includes a plurality of rectangular edge sub-blocks.

5. The semiconductor die pushing device according to claim 1, wherein: The central push block includes a plurality of central sub-blocks arranged sequentially from the center outward; when the central push block pushes the target bare chip on the dicing film to the first position, the heights of the plurality of central sub-blocks relative to the surface of the support platform are sequentially reduced from the center outward.

6. The semiconductor die pushing device according to claim 5, wherein: When the central pushing block ejects the target die on the scribe film to a first position, and the edge pushing block ejects the die adjacent to the target die on the scribe film to a second position, the height of the edge pushing block relative to the surface of the support table is less than the minimum height of the heights of the plurality of central sub-blocks relative to the surface of the support table.

7. The semiconductor die pushing device according to claim 5, wherein: The central push block includes a rectangular central sub-block and a plurality of annular central sub-blocks surrounding the rectangular central sub-block, and the plurality of annular central sub-blocks are nested and arranged in sequence from the center outward.

8. The semiconductor die pushing device according to claim 5, wherein: The height range from the second position to the support table is 25% to 100% of the smallest height among the heights of the plurality of central sub-blocks relative to the surface of the support table.

9. The semiconductor die pushing device as described in claim 5, wherein when the center pushing block pushes out the target die on the scribe film to a first position, and the edge pushing block pushes out the die adjacent to the target die on the scribe film to a second position, a height difference between any two adjacent center sub-blocks in the center pushing block is greater than a height of the edge pushing block relative to the surface of the support platform.

10. A bare die picking device, characterized in that: include: The semiconductor die pushing device according to any one of claims 1 to 9; and A picking component is used to pick up the target bare die that is ejected to the first position by the central pushing block.

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