Wafer grabbing mechanism

Abstract

The utility model relates to the technical field of semiconductors, in particular to a wafer grabbing mechanism which comprises a base and a top plate, the top plate is hinged to the base through a connecting part, the base is provided with a supporting area used for placing materials, one end of the top plate is provided with a pressing part, the pressing part is located above the supporting area, and the top plate is provided with a clamping groove. The other end of the top plate is connected with a driving part, the driving part drives the top plate to move front and back to be close to or away from the base so that materials can be clamped or loosened in parallel, at least two supporting arms are symmetrically arranged at the end, away from the driving part, of the base, and adsorption areas are arranged on the supporting arms. The driving piece drives the top plate to move back and forth to be close to or far away from the base so as to clamp or loosen materials in parallel, the pressing part can move towards the supporting area so as to press the wafer, the wafer is prevented from being subjected to acting force in the horizontal direction, the wafer is prevented from deviating in the left-right relative position, the taking and placing position is prevented from deviating, and the equipment precision is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a wafer grabbing mechanism. Background Art

[0002] Wafer refers to the silicon chip used to make silicon semiconductor circuits, and its original material is silicon. High-purity polysilicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing, and slicing, the silicon crystal rod forms a silicon wafer. The back of the wafer will be covered with a thin film, which is supported by a wafer frame we call "Frame" to form an integral sheet material. Multiple sheets of sheet materials are usually loaded in a sheet material box (Framebox), which serves as a carrier for transportation.

[0003] At present, during the wafer transplanting process, the wafer is subjected to horizontal force, which causes the wafer to deviate from the left and right relative position, resulting in a deviation in the placement position, thereby causing equipment accuracy deviation. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model provides a wafer grasping mechanism, which drives a top plate to move forward and backward through a driving member to approach or move away from a base to achieve parallel clamping or loosening of materials, and can move a pressing portion toward a supporting area to press the wafer, thereby preventing the wafer from being subjected to horizontal forces, avoiding deviation of the wafer from the left and right relative position, preventing deviation of the pick-up and placement position, and improving the accuracy of the equipment.

[0005] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0006] The utility model provides a wafer grasping mechanism, comprising a base and a top plate, the top plate being hinged to the base by a connecting component, the base being provided with a supporting area for placing materials, one end of the top plate being provided with a clamping portion, the clamping portion being located above the supporting area, the other end of the top plate being connected with a driving member, the driving member driving the top plate to move forward and backward towards or away from the base to achieve parallel clamping or releasing of the materials, at least two supporting arms being symmetrically provided at one end of the base away from the driving member, and an adsorption area being provided on the base.

[0007] Wherein, at least two positioning members are installed in the supporting area.

[0008] Wherein, a suction cup is arranged in the adsorption area.

[0009] Wherein, the base includes a mounting plate and a support plate, the mounting plate and the support plate are connected, the connecting component is at least two parallel flip blocks, the top end of the flip block is hinged to the top plate through a top axis, and the bottom end of the flip block is hinged to the support plate through a bottom axis.

[0010] Among them, the mounting plate includes a supporting part and an adsorption part, one end of the supporting part is connected to the supporting plate, the adsorption part is the same in number as the supporting arm and is connected to the other end of the supporting part, the adsorption part is connected to the supporting arm one-to-one, the supporting area is arranged on the supporting part, and the adsorption area is arranged on the adsorption part.

[0011] Wherein, a ventilation channel is arranged on the back side of the adsorption part, and the ventilation channel is communicated with the adsorption area.

[0012] Among them, a first accommodating groove is arranged between the mounting plate and the supporting plate, the lower end and the bottom shaft of the flip block are both installed in the first accommodating groove, and the top plate is arranged with a second accommodating groove, the upper end and the top shaft of the flip block are both installed in the second accommodating groove.

[0013] Among them, the other end of the top plate is provided with a mounting part, the mounting part is connected to a moving block, the driving member is drivingly connected to the moving block, and the driving member enables the moving block to drive the top plate to move forward and backward so that the clamping part is close to or away from the supporting area.

[0014] Wherein, the mounting portion is installed with a bearing, the moving block is provided with a guide groove, and the bearing is arranged in the guide groove.

[0015] Wherein, the mounting portion is provided with a clearance opening, the bearing is installed in the clearance opening, and the front end wall of the guide groove is arranged in the clearance opening.

[0016] Beneficial effects of the utility model:

[0017] The utility model drives the top plate to move forward and backward to approach or move away from the base through a driving member to achieve parallel clamping or loosening of the material, and can move the pressing part toward the supporting area to press the wafer, prevent the wafer from being subjected to horizontal force, avoid deviation of the relative position of the wafer to the left and right, prevent deviation of the placement position, and improve the accuracy of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Schematic diagram of the exploded structure of the wafer grabbing mechanism.

[0019] Figure 2 A top view of the wafer grabbing mechanism.

[0020] Figure 3 Top view of the wafer after the wafer is accurately installed in the wafer gripper mechanism.

[0021] Figure 4 A schematic diagram of the partial structure of the base.

[0022] Figure 5 This is a partial structural cross-sectional view of the base.

[0023] Figure 6 A schematic diagram of the partial structure of the base.

[0024] Figure 7 This is a partial structural cross-sectional view of the base.

[0025] 1. Base; 011. Mounting plate; 0111. Support part; 0112. Adsorption part; 01121. Ventilation channel; 012. Support plate; 101. Support area; 1011. Positioning member; 102. Support arm; 1021. Adsorption area; 1022. Suction cup; 2. Top plate; 201. Pressing part; 202. Driving member; 203. Second accommodating groove; 204. Mounting part; 2041. Bearing; 2042. Make way; 205. Moving block; 2051. Guide groove; 100. Flipping block; 1001. Top shaft; 1002. Bottom shaft; 200. First accommodating groove. DETAILED DESCRIPTION

[0026] In order to facilitate the understanding of those skilled in the art, the present invention is further described below in conjunction with the examples and drawings. The specific implementation methods of the present invention will be described below. It should be noted that in the specific description of these implementation methods, in order to provide a concise description, this specification cannot provide a detailed description of all the features of the actual implementation methods. It should be understood that in the actual implementation of any one of the implementation methods, it should be understood that for those of ordinary skill in the art related to the content disclosed in the present invention, some changes such as design, manufacturing or production based on the technical content disclosed in the present invention are only conventional technical means, and should not be understood as the content of the present disclosure being insufficient. The present utility model is described in detail below in conjunction with the drawings.

[0027] refer to Figures 1 to 7 As shown, the utility model provides a wafer grabbing mechanism, including a base 1 and a top plate 2, the top plate 2 is hinged to the base 1 by a connecting component, the base 1 is provided with a supporting area 101 for placing materials, one end of the top plate 2 is provided with a clamping portion 201, the clamping portion 201 is located above the supporting area 101, the other end of the top plate 2 is connected with a driving member 202, the driving member 202 drives the top plate 2 to move back and forth close to or away from the base 1, so as to achieve parallel clamping or releasing of materials, the end of the base 1 away from the driving member 202 is symmetrically provided with two supporting arms 102, and the base 1 is provided with an adsorption area 1021; in actual application, the top plate 2 is firstly moved away from the base 1, and the wafer is placed in the supporting area 101 as a material. Specifically, the wafer can be placed on the supporting arm 102, refer to Figure 2 , 3As shown, the length of the support arm 102 is greater than the radius of the wafer, which is convenient for stably supporting the wafer and generating a negative pressure adsorption force in the adsorption area 1021. The wafer is stably adsorbed by the adsorption force, and then the top plate 2 is driven to move forward and backward by the driving member 202 to approach or move away from the base 1 to achieve parallel clamping or releasing of the wafer. Specifically, when the top plate 2 moves, it moves toward the support area 101 through the clamping portion 201, thereby clamping the wafer to prevent the wafer from being subjected to horizontal forces, avoiding deviation of the wafer from the relative position to the left and right, preventing deviation of the placement position, and improving the accuracy of the equipment. In order to improve the grasping quality, a fiber optic sensor can be configured on the base 1. The fiber optic sensor determines the presence or absence of the wafer and performs the next step. Then, the wafer is adsorbed by negative pressure to fix the position of the wafer, which is convenient for subsequent operations.

[0028] refer to Figure 2 , 3 As shown, in this embodiment, two positioning members 1011 are installed in the support area 101; in actual application, the number of the positioning members 1011 is two, and the positioning members 1011 are pins. The wafer has two positioning cavities in the circumference. In actual installation, the wafer is first positioned quickly by matching the positioning cavities with the pins. Therefore, in order to speed up the wafer installation efficiency, the wafer can be positioned first by the positioning member 1011, and then the negative pressure adsorption force can be used to stabilize the wafer to increase the installation speed.

[0029] refer to Figure 1 , 2 As shown, in this embodiment, a suction cup 1022 is provided in the adsorption area 1021; the suction cup 1022 is externally connected to a vacuum generator, and the vacuum generator is activated to generate negative pressure in the adsorption area 1021, thereby adsorbing the wafer through the negative pressure.

[0030] refer to Figure 1 , 4 As shown in Figure 5, in this embodiment, the base 1 includes a mounting plate 011 and a support plate 012, and the mounting plate 011 and the support plate 012 are connected. The connecting component is at least two parallel flip blocks 100, and the top end of the flip block 100 is hinged to the top plate 2 through a top shaft 1001, and the bottom end of the flip block 100 is hinged to the support plate 012 through a bottom shaft 1002; in actual application, the driving member 202 is power input, and the driving member 202 drives the top plate 2 to move back and forth. During this process, the flip block 100, the top plate 2 and the support plate 012 form a parallelogram structure, so that the top plate 2 moves smoothly, and the top plate 2 maintains a stable parallel state relative to the support plate 012. The structure is ingenious and easy to use.

[0031] refer to Figure 1 , 6As shown in Figures 7, in this embodiment, the mounting plate 011 includes a supporting portion 0111 and an adsorption portion 0112, one end of the supporting portion 0111 is connected to the supporting plate 012, the adsorption portions 0112 are the same in number as the supporting arms 102 and are connected to the other end of the supporting portion 0111, the adsorption portions 0112 are connected to the supporting arms 102 in a one-to-one correspondence, the supporting area 101 is arranged on the supporting portion 0111, and the adsorption area 1021 is arranged on the adsorption portion 0112.

[0032] refer to Figure 6 As shown, in this embodiment, a ventilation channel 01121 is provided on the back side of the adsorption portion 0112, and the ventilation channel 01121 is connected to the adsorption area 1021. In actual application, the end of the ventilation channel 01121 away from the adsorption portion 0112 is connected to negative pressure, and the lower end surface of the wafer is attached to the top opening of the ventilation channel 01121. The wafer is effectively adsorbed by the negative pressure, which is conducive to stabilizing the wafer.

[0033] refer to Figure 4 , 5 As shown, in this embodiment, a first receiving groove 200 is provided between the mounting plate 011 and the supporting plate 012, the lower end and the bottom shaft 1002 of the flip block 100 are both installed in the first receiving groove 200, and the top plate 2 is provided with a second receiving groove 203, the upper end and the top shaft 1001 of the flip block 100 are installed in the second receiving groove 203; the installation space of the lower end of the flip block 100 and the bottom shaft 1002 is hidden in the first receiving groove 200, and the installation space of the upper end of the flip block 100 and the top shaft 1001 is hidden in the second receiving groove 203, which reduces the space occupancy of the structure, saves space, and has a compact structure.

[0034] refer to Figure 1 , 2 As shown, in this embodiment, a mounting portion 204 is provided at the other end of the top plate 2, and the mounting portion 204 is connected to a moving block 205. The driving member 202 is drivingly connected to the moving block 205, and the driving member 202 enables the moving block 205 to drive the top plate 2 to move forward and backward, so that the clamping portion 201 is close to or away from the support area 101; in actual application, the driving member 202 drives the moving block 205 to move forward and backward, drives the mounting portion 204 and the top plate 2 to move synchronously, thereby driving the clamping portion 201 to move close to or away from the support area 101.

[0035] refer to Figure 1 , 2As shown, in this embodiment, the mounting portion 204 is installed with a bearing 2041, the moving block 205 is provided with a guide groove 2051, and the bearing 2041 is arranged in the guide groove 2051; when the moving block 205 moves back and forth, it drives the bearing 2041 to move in the guide groove 2051, and the bearing 2041 has a moving distance in the direction of the support area 101 and along the extension direction of the guide groove 2051 during the movement process. Therefore, the moving trajectory of the bearing 2041 and the mounting portion 204 is arc-shaped, and the top plate 2 maintains stable translation under the action of the connecting component.

[0036] refer to Figure 1 , 2 As shown, in this embodiment, the mounting portion 204 is provided with a clearance opening 2042, the bearing 2041 is installed in the clearance opening 2042, and the front end wall of the guide groove 2051 is arranged in the clearance opening 2042; when the moving block 205 moves back and forth, part of the structure is passed through the clearance opening 2042 to save space; specifically, the top end of the guide groove 2051 can be set through, and when disassembling the top plate 2, the top plate 2 is removed from the top shaft 1001 and the bottom shaft 1002 and detached from the top end of the guide groove 2051. The disassembly and assembly is fast, the structure is ingenious, and it is convenient to replace the top plate 2.

[0037] The above is only a preferred embodiment of the utility model, and does not limit the utility model in any form. Although the utility model is disclosed as a preferred embodiment as above, it is not used to limit the utility model. Any technician familiar with this profession can make some changes or modifications to equivalent embodiments of equivalent changes by using the technical content disclosed above without departing from the scope of the technical solution of the utility model. However, any simple modification, equivalent change and modification made to the above embodiments according to the technology of the utility model, which does not depart from the content of the technical solution of the utility model, belongs to the scope of the technical solution of the utility model.

Claims

1. A wafer grabbing mechanism, characterized in that: The invention comprises a base (1) and a top plate (2), wherein the top plate (2) is hingedly connected to the base (1) by a connecting component, the base (1) is provided with a supporting area (101) for placing materials, one end of the top plate (2) is provided with a pressing portion (201), the pressing portion (201) is located above the supporting area (101), the other end of the top plate (2) is connected with a driving member (202), the driving member (202) drives the top plate (2) to move forward and backward to approach or move away from the base (1) to achieve a parallel clamping or releasing action of the materials, at least two supporting arms (102) are symmetrically provided at one end of the base (1) away from the driving member (202), and an adsorption area (1021) is provided on the base (1).

2. The wafer grabbing mechanism according to claim 1, characterized in that: At least two positioning members (1011) are installed in the support area (101).

3. The wafer grabbing mechanism according to claim 1, characterized in that: A suction cup (1022) is provided in the adsorption area (1021).

4. The wafer grabbing mechanism according to claim 1, characterized in that: The base (1) comprises a mounting plate (011) and a support plate (012), wherein the mounting plate (011) and the support plate (012) are connected, and the connecting component is at least two parallel flip blocks (100), wherein the top end of the flip block (100) is hinged to the top plate (2) via a top shaft (1001), and the bottom end of the flip block (100) is hinged to the support plate (012) via a bottom shaft (1002).

5. The wafer grabbing mechanism according to claim 4, characterized in that: The mounting plate (011) comprises a supporting portion (0111) and an adsorption portion (0112), one end of the supporting portion (0111) is connected to the supporting plate (012), the number of the adsorption portions (0112) is the same as that of the supporting arms (102) and the adsorption portions (0112) are connected to the other end of the supporting portion (0111), the adsorption portions (0112) are connected to the supporting arms (102) in a one-to-one correspondence, the supporting area (101) is arranged on the supporting portion (0111), and the adsorption area (1021) is arranged on the adsorption portion (0112).

6. The wafer grabbing mechanism according to claim 5, characterized in that: A ventilation channel (01121) is provided on the back side of the adsorption portion (0112), and the ventilation channel (01121) is connected to the adsorption area (1021).

7. The wafer grabbing mechanism according to claim 4, characterized in that: A first receiving groove (200) is provided between the mounting plate (011) and the supporting plate (012), and the lower end and the bottom shaft (1002) of the flip block (100) are both installed in the first receiving groove (200); the top plate (2) is provided with a second receiving groove (203), and the upper end and the top shaft (1001) of the flip block (100) are both installed in the second receiving groove (203).

8. The wafer grabbing mechanism according to claim 1, characterized in that: The other end of the top plate (2) is provided with a mounting portion (204), the mounting portion (204) is connected to a moving block (205), the driving member (202) is drivingly connected to the moving block (205), and the driving member (202) enables the moving block (205) to drive the top plate (2) to move forward and backward, so that the pressing portion (201) is close to or away from the supporting area (101).

9. The wafer grabbing mechanism according to claim 8, characterized in that: The mounting portion (204) is mounted with a bearing (2041), the moving block (205) is provided with a guide groove (2051), and the bearing (2041) is arranged in the guide groove (2051).

10. The wafer grabbing mechanism according to claim 9, characterized in that: The mounting portion (204) is provided with a clearance opening (2042), the bearing (2041) is installed in the clearance opening (2042), and the front end wall of the guide groove (2051) is arranged in the clearance opening (2042).

Images