Chip packaging structure and electronic product
By setting a thermal conductive layer and wire tapping section in the chip package structure, the heat on the chip is transmitted to the plastic sealing body, which solves the problem of thermal failure caused by the rise in the chip working temperature and improves the heat dissipation performance and reliability of electronic devices.
Patent Information
- Application Number
- CN202323519699.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-22
- Publication Date
- 2024-12-24
- Estimated Expiration
- 2033-12-22
AI Technical Summary
As the number and density of chips increase, the chip operating temperature rises sharply, which may lead to thermal failure. The prior art is difficult to effectively ensure the good heat dissipation performance of electronic devices and prevent damage beyond the normal operating temperature range.
A chip packaging structure is designed, including a substrate, a chip, a thermally conductive layer and a plastic sealing body. The thermally conductive layer is arranged on the side of the chip away from the substrate, and a first wire tapping part with the plastic sealing body exposed on the thermally conductive layer is provided, and the thermally conductive layer and tapping body are used. The wire section conducts heat on the chip to the outside of the plastic seal body to improve heat dissipation performance.
It achieves good heat dissipation performance of the packaging structure, ensures that the chip operates within a reasonable temperature range, prevents thermal failure, and improves the operating reliability of the product.
Smart Images
Figure CN222233626U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a chip packaging structure and an electronic product. Background Art
[0002] With the promotion of artificial intelligence and autonomous driving technology, electronic devices require higher computing power, which are often designed to include flip chips and upright chips. As the number and density of chips continue to increase, the number of chip transistors is increasing and the density is increasing, the chip operating temperature rises sharply, and thermal failure, temporary failure or permanent damage may occur. Therefore, it is necessary to ensure that electronic devices have good heat dissipation performance to avoid thermal failure caused by exceeding the normal operating temperature range of the chip. Utility Model Content
[0003] The purpose of the utility model is to provide a chip packaging structure and an electronic product, which can improve the heat dissipation performance of the structure and enhance the reliability of product operation.
[0004] The embodiment of the utility model is achieved as follows:
[0005] In a first aspect, the utility model provides a chip packaging structure, comprising:
[0006] substrate;
[0007] A chip, wherein the chip is attached to the substrate;
[0008] A heat-conducting layer, the heat-conducting layer being arranged on a side of the chip away from the substrate;
[0009] A plastic package body, which is disposed on the substrate and covers the chip and the heat-conducting layer;
[0010] The first bonding portion is disposed on the heat conducting layer and is exposed from the plastic package body.
[0011] In an optional embodiment, heat dissipation glue is further included, and the heat dissipation glue is arranged between the chip and the heat conductive layer.
[0012] In an optional embodiment, the heat-conducting layer includes a first heat-conducting layer and a second heat-conducting layer;
[0013] The first heat-conducting layer is arranged on a side of the chip away from the substrate, and the second heat-conducting layer is arranged on the substrate and located at the periphery of the chip.
[0014] In an optional embodiment, a second bonding portion is further included, one end of the second bonding portion is connected to the first heat conducting layer, and the other end of the second heat conducting layer is connected to the second heat conducting layer.
[0015] In an optional embodiment, a third bonding portion is provided on a side of the second heat conducting layer away from the substrate.
[0016] In an optional embodiment, the heat conducting layer is made of metal.
[0017] In an optional embodiment, the chip is a flip chip and / or a face-up chip.
[0018] In an optional embodiment, the chip is a front-mounted chip, and a first solder pad and the heat-conducting layer are provided on a side of the front-mounted chip away from the substrate, and the first solder pad is located at the periphery of the heat-conducting layer.
[0019] In an optional embodiment, a connecting line is further included, a second pad is provided on the substrate, one end of the connecting line is connected to the first pad, and the other end is connected to the second pad.
[0020] In a second aspect, the utility model provides an electronic product, comprising a circuit board and a chip packaging structure as described in any one of the aforementioned embodiments, wherein the substrate and the circuit board are electrically connected.
[0021] The beneficial effects of the embodiments of the utility model include:
[0022] The chip packaging structure proposed in the embodiment of the utility model has a heat-conducting layer on the side of the chip away from the substrate, and a first bonding portion exposed to the plastic package body is also provided on the heat-conducting layer. The heat-conducting layer and the first bonding portion can better conduct the heat on the chip to the outside of the plastic package, thereby achieving good heat dissipation performance of the packaging structure and improving the reliability of product operation.
[0023] The electronic product proposed in the embodiment of the utility model includes a circuit board and the above-mentioned chip packaging structure, which can achieve good heat dissipation performance, improve the heat dissipation effect of the packaging structure, ensure that the chip works within a reasonable temperature range, prevent thermal failure, and improve the reliability of product operation. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.
[0025] Figure 1 A schematic diagram of a chip packaging structure provided by the first embodiment of the utility model;
[0026] Figure 2A schematic diagram of a chip packaging structure provided in accordance with the second embodiment of the present invention;
[0027] Figure 3 A schematic diagram of a process for manufacturing a chip packaging structure provided in an embodiment of the utility model.
[0028] Icons: 100-chip packaging structure; 110-substrate; 111-second pad; 113-third pad; 120-chip; 121-flip chip; 122-bump; 123-upright chip; 124-first pad; 130-thermal conductive layer; 131-first thermal conductive layer; 133-second thermal conductive layer; 140-plastic package; 151-first bonding part; 153-second bonding part; 155-third bonding part; 160-heat dissipation glue; 170-connecting wire. DETAILED DESCRIPTION
[0029] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.
[0030] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0031] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.
[0032] In the description of the present utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the accompanying drawings, or the orientation or position relationship in which the utility model product is usually placed when in use, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.
[0033] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0034] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0035] With the promotion of artificial intelligence and autonomous driving technology, electronic devices require higher computing power, which are often designed to include flip chips and upright chips. As the number and density of chips continue to increase, the number of chip transistors is increasing and the density is increasing, the chip operating temperature rises sharply, and thermal failure, temporary failure or permanent damage may occur. Therefore, it is necessary to ensure that electronic devices have good heat dissipation performance to avoid thermal failure caused by exceeding the normal operating temperature range of the chip.
[0036] The embodiment of the utility model proposes a chip packaging structure 100, which can achieve good heat dissipation of the packaging structure, improve the heat dissipation effect of the packaging structure, ensure that the chip 120 works within a reasonable temperature range, prevent thermal failure, and improve the reliability of product operation.
[0037] First embodiment
[0038] Please refer to Figure 1 and Figure 3 The present embodiment provides a chip packaging structure 100, including a substrate 110, a chip 120, a heat-conducting layer 130, a plastic package 140 and a first bonding portion 151, wherein the chip 120 is attached to the substrate 110. The heat-conducting layer 130 is disposed on a side of the chip 120 away from the substrate 110. The plastic package 140 is disposed on the substrate 110 and covers the chip 120 and the heat-conducting layer 130; the first bonding portion 151 is disposed on the heat-conducting layer 130, and the first bonding portion 151 is exposed from the plastic package 140. In the chip packaging structure 100, the heat generated by the chip 120 can be conducted to the outside of the plastic package 140 through the heat-conducting layer 130 and the first bonding portion 151, so as to have good heat dissipation performance, prevent problems such as thermal failure, and improve the reliability of product operation.
[0039] Optionally, the heat conducting layer 130 is made of metal, such as any one or more combinations of metals such as aluminum, copper, iron, gold, silver, magnesium, tungsten, titanium, etc., which are not specifically limited here. Of course, in some embodiments, the heat conducting layer 130 can also be made of other materials, such as plastic, mica, graphene, etc.
[0040] The chip 120 may be a flip chip 121 and / or a normal chip 123. According to actual conditions, a package structure may include one chip 120 or multiple chips 120. If there is one chip 120, the chip 120 may be a flip chip 121 or a normal chip 123. If multiple chips 120 are included, all of the multiple chips 120 may be flip chips 121, or all may be normal chips 123, or some may be flip chips 121 and some may be normal chips 123.
[0041] Combination Figure 1 , a flip chip 121 is used as an example for explanation. The front side of the flip chip 121 is provided with a bump 122, and the substrate 110 is provided with a second pad 111. The bump 122 is welded on the second pad 111 of the substrate 110 to realize the electrical connection between the flip chip 121 and the substrate 110. The back side of the flip chip 121, that is, the side away from the substrate 110, is used to carry the heat conducting layer 130. The heat conducting layer 130 is located on the back side of the flip chip 121, so as to conduct the heat generated by the flip chip 121 from the back side to the outside of the plastic package 140.
[0042] The chip packaging structure 100 further includes a heat dissipation adhesive 160, which is disposed between the flip chip 121 and the heat conductive layer 130. The heat dissipation adhesive 160 can fix the heat conductive layer 130, and the heat conductive layer 130 is bonded to the surface of the flip chip 121 through the heat dissipation adhesive 160. In addition, it can be understood that the heat dissipation adhesive 160 can also play a role in heat conduction, improve the heat transfer efficiency, and quickly transfer the heat of the flip chip 121 to the heat conductive layer 130 to prevent the temperature of the flip chip 121 from being too high.
[0043] Optionally, the heat-conducting layer 130 includes a first heat-conducting layer 131 and a second heat-conducting layer 133. The first heat-conducting layer 131 is disposed on a side of the flip chip 121 away from the substrate 110, and the second heat-conducting layer 133 is disposed on the substrate 110 and is located at the periphery of the flip chip 121. In this embodiment, the size of the first heat-conducting layer 131 is comparable to that of the flip chip 121, and the flip chip 121 and the first heat-conducting layer 131 are both rectangular parallelepipeds with equal lengths and widths, respectively, to ensure that the flip chip 121 and the first heat-conducting layer 131 have a sufficiently large effective contact area, thereby improving heat dissipation efficiency.
[0044] The first bonding portion 151 adopts a vertical bonding method, that is, the first bonding portion 151 is perpendicular to the first heat-conducting layer 131 and extends along the height direction of the first heat-conducting layer 131. The shape, quantity and position of the first bonding portion 151 can be flexibly set according to actual conditions, and are not specifically limited here. For example, the cross-sectional shape of the first bonding portion 151 is a triangle, a rhombus, a circle, an ellipse, a square, a rectangle, a polygon or any other shape. The first bonding portion 151 can be one, two, three, four, five or more. The first bonding portion 151 can be evenly arranged at equal intervals on the first heat-conducting layer 131, or can be arranged only in the middle, or arranged in a rectangular array, a ring array or other regular or irregular shapes, which are not specifically limited here.
[0045] Optionally, the chip packaging structure 100 further includes a second bonding portion 153, one end of the second bonding portion 153 is connected to the first heat conducting layer 131, and the other end is connected to the second heat conducting layer 133. The materials of the first heat conducting layer 131 and the second heat conducting layer 133 may be the same or different. In this embodiment, the materials of the first heat conducting layer 131 and the second heat conducting layer 133 are respectively made of metal, and the first bonding portion 151 and the second bonding portion 153 are also made of metal. The same material can facilitate bonding, and the bonding connection is more reliable. In addition, the metal has high heat dissipation efficiency, so that the heat dissipation effect of the entire packaging structure is better. The second bonding portion 153 can be a curve, an arc or a broken line, which is not specifically limited here.
[0046] Further, the second heat-conducting layer 133 is disposed on the substrate 110 through the heat-dissipating adhesive 160, and a third bonding portion 155 is disposed on a side of the second heat-conducting layer 133 away from the substrate 110. The third bonding portion 155 is extended in a direction perpendicular to the substrate 110 and away from the substrate 110, and is used to transfer the heat of the second heat-conducting layer 133 to the outside of the plastic package 140. It can be understood that the upper end of the third bonding portion 155, that is, the end away from the second heat-conducting layer 133, can be lower than the surface of the plastic package 140, can be flush with the surface of the plastic package 140, or can be higher than the surface of the plastic package 140, so as to achieve heat conduction and improve the heat dissipation performance of the entire structure.
[0047] The number of the second heat conducting layers 133 is not limited, and they can be designed along the chip 120 to dissipate the heat around the chip 120. Each second heat conducting layer 133 is provided with a third bonding portion 155, so that the third bonding portion 155 is also designed along the chip 120 to improve the heat dissipation efficiency.
[0048] Other configurations of the third bonding portion 155 , such as shape, quantity, distribution position, etc., may be consistent with or similar to the configuration of the first bonding portion 151 , or may be flexibly adjusted, and are not specifically limited here.
[0049] Second embodiment
[0050] Combination Figure 2 In this embodiment, the chip 120 is a front-mounted chip 123 . A first pad 124 and a heat-conducting layer 130 are provided on a side of the front-mounted chip 123 away from the substrate 110 . The first pad 124 is located at the periphery of the heat-conducting layer 130 .
[0051] It can be understood that the heat-conducting layer 130 includes a first heat-conducting layer 131 and a second heat-conducting layer 133. The first heat-conducting layer 131 is arranged on the side of the front-mounted chip 123 away from the substrate 110, and the second heat-conducting layer 133 is arranged on the substrate 110 and is located at the periphery of the front-mounted chip 123. In this embodiment, the first heat-conducting layer 131 and the front-mounted chip 123 are both rectangular parallelepipeds, and the cross-section of the first heat-conducting layer 131 is smaller than the cross-section of the front-mounted chip 123, that is, the length and width of the first heat-conducting layer 131 are respectively smaller than the length and width of the front-mounted chip 123. In this way, it is ensured that the first heat-conducting layer 131 does not interfere with the electrical connection of the first pad 124 of the front-mounted chip 123. The compact structure can also ensure that the front-mounted chip 123 and the first heat-conducting layer 131 have a sufficiently large effective contact area, thereby improving the heat dissipation efficiency.
[0052] The chip package structure 100 further includes a connection line 170. The substrate 110 is provided with a second pad 111. One end of the connection line 170 is connected to the first pad 124, and the other end is connected to the second pad 111. The connection line 170 is a metal wire to achieve electrical connection between the mounted chip 123 and the substrate 110.
[0053] In addition, the first heat conducting layer 131 is disposed on the front mounted chip 123 through the heat dissipation adhesive 160, and a vertically arranged first bonding portion 151 is disposed on the first heat conducting layer 131. The second heat conducting layer 133 is disposed on the substrate 110 through the heat dissipation adhesive 160, and the second heat conducting layer 133 is distributed around the periphery of the front mounted chip 123.
[0054] The chip packaging structure 100 further includes a second bonding portion 153. One end of the second bonding portion 153 is connected to the first heat conducting layer 131, and the other end is connected to the second heat conducting layer 133. The second bonding portion 153 can be in the shape of a curve, an arc or a broken line, which is not specifically limited here. A third bonding portion 155 arranged vertically is provided on the second heat conducting layer 133.
[0055] Other contents not mentioned in this embodiment are similar to those described in the first embodiment and will not be described in detail here.
[0056] Combination Figure 3 The manufacturing process of the chip packaging structure 100 is roughly as follows:
[0057] Step S1: providing a substrate 110 , wherein a first solder pad 124 is disposed on the front side of the substrate 110 , and a second solder pad 111 is disposed on the back side of the substrate 110 .
[0058] Step S2: Mount the chip 120 on the substrate 110 and realize electrical connection between the chip 120 and the substrate 110. If a flip chip 121 is used, the chip 120 and the substrate 110 are electrically connected by welding. If a face-up chip 123 is used, the chip 120 and the substrate 110 are electrically connected by wire bonding.
[0059] Step S3: attaching the first heat-conducting layer 131 on the chip 120. The first heat-conducting layer 131 is bonded to the chip 120 via the heat-dissipating adhesive 160. Attaching the second heat-conducting layer 133 on the substrate 110, the second heat-conducting layer 133 is bonded to the substrate 110 via the heat-dissipating adhesive 160.
[0060] Step S4: vertical bonding wires, i.e., first bonding wire portions 151, are provided on the first heat conducting layer 131. Second bonding wire portions 153 for connecting the first heat conducting layer 131 and the second heat conducting layer 133 are provided between the first heat conducting layer 131 and the second heat conducting layer 133. Vertical bonding wires, i.e., third bonding wire portions 155, are provided on the second heat conducting layer 133.
[0061] Step S5: Plastic encapsulation. The entire structure on the substrate 110 is plastic encapsulated for protection. The plastic encapsulation body 140 is ground so that the first wire bonding portion 151 is exposed from the surface of the plastic encapsulation body 140, that is, the upper end surface of the first wire bonding portion 151 is flush with the surface of the plastic encapsulation body 140. The plastic encapsulated and ground structure is cut into individual products using a diamond cutting knife to complete the process.
[0062] The embodiment of the utility model also provides an electronic product, including a circuit board and a chip packaging structure 100 as in any of the above embodiments, wherein a substrate 110 is electrically connected to the circuit board. A third pad 113 is provided on the side of the substrate 110 away from the chip 120, and the third pad 113 can be welded to the circuit board to achieve electrical connection between the chip packaging structure 100 and the circuit board. The electronic product has a compact structure, good heat dissipation effect, and high heat dissipation performance, which is conducive to improving the reliability of the product and preventing thermal failure.
[0063] In summary, the chip packaging structure 100 and the electronic product provided by the embodiment of the present invention have the following beneficial effects, including:
[0064] The chip packaging structure 100 proposed in the embodiment of the utility model is provided with a heat-conducting layer 130 on the side of the chip 120 away from the substrate 110, and a first bonding portion 151 exposed from the plastic package 140 is also provided on the heat-conducting layer 130. The heat-conducting layer 130 and the first bonding portion 151 can better conduct the heat on the chip 120 to the outside of the plastic package 140, thereby achieving good heat dissipation performance of the packaging structure and improving the reliability of product operation.
[0065] The electronic product proposed in the embodiment of the utility model includes a circuit board and the above-mentioned chip packaging structure 100, which can achieve good heat dissipation performance, improve the heat dissipation effect of the packaging structure, ensure that the chip 120 operates within a reasonable temperature range, prevent thermal failure, and improve the reliability of product operation.
[0066] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may be subject to various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.
Claims
1. A chip packaging structure, characterized in that: include: substrate; A chip, wherein the chip is attached to the substrate; A heat-conducting layer, the heat-conducting layer being arranged on a side of the chip away from the substrate; A plastic package body, which is disposed on the substrate and covers the chip and the heat-conducting layer; The first bonding portion is disposed on the heat conducting layer and is exposed from the plastic package body.
2. The chip packaging structure according to claim 1, characterized in that: It also includes heat dissipation glue, which is arranged between the chip and the heat conducting layer.
3. The chip packaging structure according to claim 1, characterized in that: The heat-conducting layer comprises a first heat-conducting layer and a second heat-conducting layer; The first heat-conducting layer is arranged on a side of the chip away from the substrate, and the second heat-conducting layer is arranged on the substrate and located at the periphery of the chip.
4. The chip packaging structure according to claim 3, characterized in that: It also includes a second bonding part, one end of which is connected to the first heat conducting layer, and the other end of which is connected to the second heat conducting layer.
5. The chip packaging structure according to claim 3, characterized in that: A third wiring portion is disposed on a side of the second heat conducting layer away from the substrate.
6. The chip packaging structure according to claim 1, characterized in that: The heat conducting layer is made of metal.
7. The chip packaging structure according to any one of claims 1 to 6, characterized in that: The chip is a flip chip and / or a face-up chip.
8. The chip packaging structure according to claim 1, characterized in that: The chip is a front-mounted chip, and a first pad and the heat-conducting layer are arranged on a side of the front-mounted chip away from the substrate, wherein the first pad is located at the periphery of the heat-conducting layer.
9. The chip packaging structure according to claim 8, characterized in that: It also includes a connecting line. A second pad is provided on the substrate. One end of the connecting line is connected to the first pad, and the other end is connected to the second pad.
10. An electronic product, characterized in that: The invention comprises a circuit board and a chip packaging structure as claimed in any one of claims 1 to 9, wherein the substrate and the circuit board are electrically connected.