Photovoltaic cell packaging structure

Abstract

A photovoltaic cell packaging structure comprises a lower cover plate, a lower conductive layer, a photovoltaic layer, an upper conductive layer, an electrode wire, a packaging layer, an upper cover plate, a filling layer and a conductive assembly. The lower conductive layer is arranged on the side surface of the lower cover plate. The photovoltaic layer is arranged on the side surface of the lower conductive layer. The upper conductive layer is arranged on the side face of the photovoltaic layer. The electrode wires are electrically connected with the lower conductive layer or the upper conductive layer. The packaging layer is arranged on the periphery of the lower cover plate and the periphery of the wire end point of the electrode wire. The upper cover plate is arranged on the packaging layer and provided with an opening, and the opening is located in the packaging layer on the periphery of the line end point to form a packaging area and a through hole. The filling layer is arranged in the packaging area.

Description

[0001] This application claims priority to a patent application filed in Taiwan, China, with application number 113201267 and invention name “Photovoltaic Cell Packaging Structure”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to a photovoltaic cell, and in particular to a thin-film photovoltaic cell packaging structure. Background Art

[0003] Solar cells are devices that directly convert solar energy into electrical energy, and they have broad application prospects in environmental protection, energy conservation and renewable energy. Among them, thin-film photovoltaic modules are a relatively new solar cell technology, which has the advantages of light weight, thinness, shortness and low production cost, so they are widely used in building integration, portable power supplies, solar bicycles and other scenarios.

[0004] However, if it is a photovoltaic cell component in the form of a glass component, both sides of the component are glass substrates, and the electrode wires are mostly led out from the side of the component, which limits the product's appearance and structural design. If the electrode wires are too long, it will waste the space of the effective surface. Referring to known technologies such as Chinese patent publication No. CN102856413A, holes can be directly opened on the surface of the glass surface to lead out the electrode wires. The electrode wire openings of the glass panel openings are inside the glass surface and are directly led out from the panel, which can fully and effectively utilize the panel structure. However, the above-mentioned structures are only suitable for adhesive structures encapsulated with polymers or plastics, and the water and gas barrier effects are limited, and the component sealing performance is poor. Utility Model Content

[0005] Therefore, the main purpose of the present application is to provide a packaging structure for photovoltaic (solar) cells, which can be used to perform vacuum laser packaging on photovoltaic cells using laser technology.

[0006] To achieve the above-mentioned purpose, the present application provides a photovoltaic cell packaging structure, comprising: a lower cover plate, a lower conductive layer, a photovoltaic layer, an upper conductive layer, at least one electrode wire, a packaging layer, an upper cover plate, a filling layer and at least one conductive component. The lower conductive layer is arranged on the side of the lower cover plate, and the lower conductive layer is composed of a plurality of lower electrode lines. The photovoltaic layer is composed of a plurality of photovoltaic units, and the plurality of photovoltaic units are arranged on a plurality of lower electrode lines, so that a gap is formed between each photovoltaic unit. The upper conductive layer is composed of a plurality of upper electrode lines, and the plurality of upper electrode lines are arranged on the sides of the plurality of photovoltaic units and are electrically connected to the plurality of lower electrode lines. The electrode wire is electrically connected to the lower conductive layer or the upper conductive layer. The packaging layer is arranged around the periphery of the lower cover plate and around at least one end point of the electrode wire. The upper cover plate is arranged on the packaging layer, and has at least one opening thereon, and the opening is aligned with the packaging layer at the periphery of the end point to form a packaging area and a through hole. The filling layer is arranged in the packaging area.

[0007] In one embodiment of the present application, the photovoltaic cell packaging structure further includes at least one conductive component, which is arranged in the through hole, with one end of the conductive component electrically connected to the wire end point, and the other end of the conductive component is output from the side of the opening surface of the upper cover plate.

[0008] In one embodiment of the present application, the conductive component is a conductive column.

[0009] In one embodiment of the present application, the conductive pillar is a copper terminal.

[0010] In one embodiment of the present application, the conductive component is output from one side of the opening surface of the upper cover plate to be electrically connected to an external electronic device.

[0011] In one embodiment of the present application, the thickness of the photovoltaic layer is 0.1 μm to 500 μm.

[0012] In one embodiment of the present application, the photovoltaic layer has a thickness of 10 μm to 150 μm.

[0013] In one embodiment of the present application, the photovoltaic layer is an organic solar cell, a copper indium gallium selenide thin film solar cell, a cadmium tin oxide thin film solar cell, a silicon thin film solar cell, a perovskite thin film solar cell or a dye-sensitized solar cell.

[0014] In one embodiment of the present application, a plurality of photovoltaic units are stacked in sequence by an electron transport layer, an active layer, and a hole transport layer.

[0015] In one embodiment of the present application, a plurality of photovoltaic units are stacked in sequence by a hole transport layer, an active layer, and an electron transport layer.

[0016] In one embodiment of the present application, the electrode conductor is copper foil, copper wire or silver paste.

[0017] In one embodiment of the present application, the filling layer is a transparent filling material.

[0018] In one embodiment of the present application, the thickness of the encapsulation layer is 10 μm to 1000 μm. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 , is a side cross-sectional schematic diagram of a semi-finished photovoltaic cell packaging structure of the present application;

[0020] Figure 2 ,for Figure 1 A partial enlarged schematic diagram of a photovoltaic cell packaging structure;

[0021] Figure 3 ,for Figure 1 A schematic side cross-sectional view of a semi-finished product of a photovoltaic cell packaging structure having a packaging layer and an upper cover plate sealed thereon;

[0022] Figure 4 ,for Figure 3 Schematic diagram of top view;

[0023] Figure 5 ,for Figure 3 A schematic side view of a photovoltaic cell packaging structure in which a conductive component penetrates the upper cover;

[0024] Figure 6 ,for Figure 5 Schematic top view of .

[0025] Description of reference numerals:

[0026] 10: lower cover;

[0027] 20: lower conductive layer;

[0028] 21: lower electrode circuit;

[0029] 30: photovoltaic layer;

[0030] 31: Photovoltaic unit;

[0031] 31a: electron transport layer;

[0032] 31b: active layer;

[0033] 31c: hole transport layer;

[0034] 32: gap;

[0035] 40: upper conductive layer;

[0036] 41: upper electrode circuit;

[0037] 50: electrode wire;

[0038] 51: line endpoint;

[0039] 60: upper cover plate;

[0040] 61: opening;

[0041] 70: encapsulation layer;

[0042] 71: packaging area;

[0043] 72: through hole;

[0044] 80: filling layer;

[0045] 90: Conductive component. DETAILED DESCRIPTION

[0046] The technical content and detailed description of this application are described as follows with reference to the accompanying drawings:

[0047] See also Figure 1 , 2 , a side cross-sectional view of a semi-finished photovoltaic cell packaging structure of the present application and Figure 1 As shown in the figure: the photovoltaic cell packaging structure of the present application at least includes: a lower cover plate 10, a lower conductive layer 20, a photovoltaic layer 30, an upper conductive layer 40 and an electrode wire 50.

[0048] When the photovoltaic cell packaging structure is manufactured, a lower cover plate 10 is prepared first. The lower cover plate 10 is a glass substrate or plastic. The plastic is polyimide (PI), hybrid PI, polyethylene terephthalate (PET), polyethers ulfone (PES), polyethylene naphthalate (PEN) or cycloolefin polymer (COP). The present application selects the lower cover plate 10 as but not limited to a glass substrate.

[0049] Next, a lower conductive layer 20 is formed on the side of the lower cover plate 10. The lower conductive layer 20 can be formed into a transparent plurality of lower electrode lines 21 by etching technology containing inorganic conductive materials. In the present figure, the inorganic conductive material is indium tin oxide (ITO) or silver paste. This application selects but is not limited to indium tin oxide ITO.

[0050] Next, a photovoltaic layer 30 is fabricated on the side of the lower conductive layer 20. The photovoltaic layer 30 is composed of a plurality of photovoltaic units 31. The plurality of photovoltaic units 31 are arranged on the side of the plurality of lower electrode lines 21, so that there are gaps 32 between the plurality of photovoltaic units 31. The plurality of photovoltaic units 31 are sequentially composed of a stacked structure of an electron transfer layer 31a, an active layer 31b and a hole transfer layer 31c, or sequentially composed of a stacked structure of a hole transfer layer 31c, an active layer 31b and an electron transfer layer 31a. The photovoltaic layer 30 is an organic solar cell, a copper indium gallium selenide (CIGS) thin film solar cell, a cadmium tetroxide (CdTe) thin film solar cell, a silicon (α-Si) thin film solar cell, a perovskite thin film solar cell or a dye-sensitized solar cell (DSSC). In the present figure, the thickness of the photovoltaic layer 30 is 0.1 μm to 500 μm. The thickness of the photovoltaic layer 30 is 10 μm to 150 μm.

[0051] Next, an upper conductive layer 40 is formed on the side of the plurality of photovoltaic units 31 and electrically connected to the lower conductive layer 20. The upper conductive layer 40 may be formed by evaporation, sputtering or coating of an inorganic conductive material and then etching to form a plurality of transparent upper electrode lines 41. In this figure, the inorganic conductive material is aluminum or silver.

[0052] Finally, the electrode wire 50 is manufactured. The electrode wire 50 is a copper foil, copper wire or silver paste which is printed and arranged on the side of the lower cover plate 10 and is electrically connected to the lower conductive layer 20 or the upper conductive layer 40. In this way, a semi-finished photovoltaic cell packaging structure is completed. The semi-finished photovoltaic cell packaging structure is electrically connected to the electrode wire 50 to complete the manufacturing of the photovoltaic cell packaging structure.

[0053] See also Figure 3 , 4 ,for Figure 1 The semi-finished product of the photovoltaic cell packaging structure is sealed with a packaging layer and an upper cover plate. Figure 3 Schematic diagram of top view. As shown in the figure: Then, the above-mentioned photovoltaic cell encapsulation structure semi-finished component is coated with polyimide (PIB) of the encapsulation layer 70, and the encapsulation coating is applied to the periphery of the lower cover plate 10 and the periphery of the two wire end points 51 of the electrode wire 50 by a dispensing machine, and then the upper cover plate 60 with two openings 61 is placed on the encapsulation layer 70, and the two openings 61 are aligned with the encapsulation layer 70 outside the wire end points 51 to form an encapsulation area 71 and a through hole 72. In this figure, the thickness of the encapsulation layer 70 can be 10μm to 1000μm. In this figure, the encapsulation layer 70 is glass glue, polyurethane (Polyurethane, PU), ethylene-vinyl acetate (Ethylene Vinyl Acetate, EVA), polyvinyl butyral (Polyvinyl Butyral, PVB) or polyimide (Polyisobutylene, PIB).

[0054] Next, a filling layer 80 of transparent polyolefin elastomer (POE) is coated in the encapsulation area 71 in the encapsulation layer 70. The filling layer 80 maintains a hollow through hole 72 on the end point 51 of the electrode wire 50. Then, the upper cover plate 60 is fixed with a clamp after alignment and then placed in a vacuum heating encapsulation furnace for encapsulation. The encapsulation furnace is first evacuated to make the air pressure in the cavity lower than 10-3torr, and then heated. The heating temperature can be controlled at 100-150°C, which will not damage the material of the photovoltaic layer 30. The sealing lasts for about 30 minutes, and then the encapsulation furnace is returned to room temperature. After breaking the vacuum, the finished encapsulated photovoltaic cell is taken out. In this figure, the filling layer 80 is a transparent filling material, and the transparent filling material is polyolefin elastomer (POE), polymer (ionomer), ethylene vinyl acetate (EVA) or polyvinyl butyral (PVB).

[0055] Alternatively, the semi-finished components of the photovoltaic cell packaging structure are coated with glass glue of the packaging layer 70, and the packaging coating is applied to the periphery of the lower cover plate 10 and the periphery of the two end points 51 of the electrode wire 50 by a dispensing machine, and then the upper cover plate 60 with two openings 61 is placed on the packaging layer 70, and the two openings 61 are aligned with the packaging layer 70 outside the end points 51. The semi-finished product covered with the upper cover plate 60 is clamped and fixed with a clamp after alignment, and then packaged in a vacuum packaging furnace. The packaging furnace is first evacuated to make the air pressure in the cavity lower than 10-3torr, and then the packaging layer is laser-heated externally by laser, so that the packaging layer 70 is solidified and connected to the upper cover plate 60 and the lower cover plate 10, and the air is evacuated at the same time, which will not damage the material of the photovoltaic layer 30. After packaging, the finished photovoltaic cell is taken out after breaking the vacuum. In this figure, the upper cover plate 60 is a glass substrate or plastic. The plastic is polyimide (PI), hybrid PI, polyethylene terephthalate (PET), polyethers ulfone (PES), polyethylene naphthalate (PEN) or cycloolefin polymer (COP). The upper cover plate 60 is selected as but not limited to a glass substrate.

[0056] See also Figure 5 , 6 ,for Figure 3 Photovoltaic cell packaging structure manufacturing conductive components through the upper cover plate side view and Figure 5As shown in the figure: the photovoltaic cell packaging structure of the present application can further be provided with a conductive component (conductive column) 90 through the opening 61 of the upper cover plate 60, such as a copper terminal electrically connected and welded to the end point 51 of the electrode wire 50, and the other end of the copper terminal can be connected to an external power supply device (not shown in the figure).

[0057] In summary, the photovoltaic cell packaging structure of the present application sets the conductive component 90 in the through hole 72, and after one end of the conductive component 90 is electrically connected to the line end 51, the other end of the conductive component 90 is output from the surface side of the opening 61 of the upper cover plate 60, making full use of the space utilization of the non-photovoltaic area in the packaging area 71, which can be beneficial to the structural configuration application requirements of the corresponding matching circuit board (not shown in the figure). In addition, the filling layer 80 is set in the packaging area 71 to strengthen the structural stress in the packaging area 71, and it also has the effect of blocking water and gas, and the selection of materials for the packaging glue can be more diversified. The structure of the present application provides many effects such as structural safety, reliability, durability and good weather resistance.

[0058] However, the above description is only a preferred embodiment of the present application and is not intended to limit the patent protection scope of the present application. Therefore, all equivalent changes made using the contents of the present application specification or drawings are also included in the scope of protection of the present application and are hereby stated.

Claims

1. A photovoltaic cell packaging structure, characterized in that: Include: Lower cover; A lower conductive layer, disposed on the side of the lower cover plate, the lower conductive layer is composed of a plurality of lower electrode circuits; A photovoltaic layer, comprising a plurality of photovoltaic units, wherein the plurality of photovoltaic units are arranged on the plurality of lower electrode lines so that a gap is formed between each of the photovoltaic units; An upper conductive layer, composed of a plurality of upper electrode circuits, the plurality of upper electrode circuits being disposed on the sides of the plurality of photovoltaic units and being electrically connected to the plurality of lower electrode circuits; at least one electrode wire electrically connected to the lower conductive layer or the upper conductive layer; The packaging layer is arranged around the lower cover plate and around at least one end point of the electrode wire; An upper cover plate is disposed on the packaging layer and has at least one opening thereon, and the opening is aligned with the packaging layer at the periphery of the line end point to form a packaging area and a through hole; The filling layer is arranged in the packaging area.

2. The photovoltaic cell packaging structure according to claim 1, characterized in that: The photovoltaic cell packaging structure further includes at least one conductive component, which is arranged in the through hole, with one end of the conductive component electrically connected to the wire end point, and the other end of the conductive component is output from the side of the opening surface of the upper cover plate.

3. The photovoltaic cell packaging structure according to claim 2, characterized in that: The conductive component is a conductive column.

4. The photovoltaic cell packaging structure according to claim 3, characterized in that: The conductive pillar is a copper terminal.

5. The photovoltaic cell packaging structure according to claim 2, characterized in that: The conductive component is output from one side of the opening surface of the upper cover plate to be electrically connected to an external electronic device.

6. The photovoltaic cell packaging structure according to claim 1, characterized in that: The photovoltaic layer has a thickness of 0.1 μm to 500 μm.

7. The photovoltaic cell packaging structure according to claim 6, characterized in that: The photovoltaic layer has a thickness of 10 μm to 150 μm.

8. The photovoltaic cell packaging structure according to claim 1, characterized in that: The photovoltaic layer is an organic solar cell, a copper indium gallium selenide thin film solar cell, a cadmium tin oxide thin film solar cell, a silicon thin film solar cell, a perovskite thin film solar cell or a dye-sensitized solar cell.

9. The photovoltaic cell packaging structure according to claim 1, characterized in that: The plurality of photovoltaic units are stacked in sequence by an electron transfer layer, an active layer and a hole transfer layer.

10. The photovoltaic cell packaging structure according to claim 1, characterized in that: The plurality of photovoltaic units are stacked in sequence by a hole transfer layer, an active layer and an electron transfer layer.

11. The photovoltaic cell packaging structure according to claim 1, characterized in that: The filling layer is a transparent filling material.

12. The photovoltaic cell packaging structure according to claim 1, characterized in that: The packaging layer has a thickness of 10 μm to 1000 μm.

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