Temperature sensing assembly, busbar assembly and battery module

Abstract

The utility model provides a temperature sensing assembly, a busbar assembly and a battery module, the temperature sensing assembly comprises a circuit board, and the circuit board is used for being connected with a busbar; the conductive structure is arranged on the circuit board; the two temperature sensing modules are arranged on the circuit board in a spaced mode, the conductive structure is electrically connected with the two temperature sensing modules, the two temperature sensing modules are arranged in parallel through the conductive structure, and the two temperature sensing modules independently conduct temperature detection on the busbar. According to the temperature sensing assembly, the busbar assembly and the battery module provided by the utility model, the structure that the at least two temperature sensing modules for independently detecting the busbar are matched with the conductive structure is adopted, so that the problem of large detection error of a single temperature sensing module in the prior art is solved.

Description

Technical Field

[0001] The utility model relates to the technical field related to batteries, and in particular to a temperature sensing component, a bus bar component and a battery module. Background Art

[0002] The important feature of new energy is to replace fossil energy with electric energy. Secondary batteries are increasingly used as a medium for storing and releasing electric energy. In secondary battery modules, since the battery cells generate a lot of heat while providing power, it is necessary to monitor their temperature changes in real time through devices such as temperature sensing modules in order to control their safe operation.

[0003] However, due to reasons such as space and cost, generally only one temperature sensing module is installed on one bus. When one temperature sensing module is used to detect the bus temperature, there is a risk of large temperature sampling deviation or even failure due to failure of the temperature sensor. There is a large error in use and the risk of false alarms, which affects the overall performance of the battery. Utility Model Content

[0004] The main purpose of the utility model is to provide a temperature sensing component, a bus bar component and a battery module to solve the problem of large use error of a single temperature sensing module in the prior art.

[0005] In order to achieve the above-mentioned purpose, according to one aspect of the utility model, a temperature sensing component is provided, which includes a circuit board for connecting to a bus; a conductive structure, which is arranged on the circuit board; a plurality of temperature sensing modules, which are arranged on the circuit board at intervals, and the conductive structure is electrically connected to the plurality of temperature sensing modules respectively, and the plurality of temperature sensing modules are arranged in parallel through the conductive structure, and the plurality of temperature sensing modules independently perform temperature detection on the bus.

[0006] Furthermore, the conductive structure includes a first conductive sheet, which is electrically connected to the positive poles of multiple temperature sensing modules; and a second conductive sheet, which is electrically connected to the negative poles of multiple temperature sensing modules, wherein the number of first conductive sheets is less than or equal to the number of temperature sensing modules, and the number of second conductive sheets is less than or equal to the number of temperature sensing modules.

[0007] Furthermore, the temperature sensing component also includes a protective frame, which is arranged on the circuit board. The protective frame has a protective cavity, and the plurality of temperature sensing modules are arranged inside the protective cavity.

[0008] Furthermore, the temperature sensing component also includes a colloid, which is filled in the interior of the protective cavity and covers the plurality of temperature sensing modules.

[0009] Furthermore, the temperature sensing component also includes a connecting adhesive layer, which is arranged between the circuit board and the bus bar and is used to adhere the circuit board to the bus bar.

[0010] Furthermore, the adhesive layers are connected to form an adhesive region, and a plurality of adhesive injection holes for adhesive injection are provided on the circuit board, and projections of the plurality of adhesive injection holes on the circuit board do not overlap with the adhesive region.

[0011] Furthermore, the temperature sensing component also includes an insulating layer, and the insulating layer is arranged on the surface of the circuit board away from the bus bar.

[0012] Furthermore, at least a portion of the conductive structure is exposed outside the insulating layer to form a welding area, and the welding area is used to be electrically connected to the sampling line.

[0013] According to another aspect of the present invention, a busbar assembly is provided. The busbar assembly includes a busbar and the above-mentioned temperature sensing assembly. The temperature sensing assembly is located above the busbar and fixedly connected to the busbar.

[0014] According to another aspect of the present invention, a battery module is provided. The battery module includes a plurality of battery cells and the above-mentioned bus bar assembly, and two adjacent battery cells are electrically connected via a bus bar of the bus bar assembly.

[0015] Applying the technical solution of the utility model, the temperature sensing component includes a circuit board, a conductive structure and multiple temperature sensing modules. The circuit board is used to connect to the bus. The conductive structure is arranged on the circuit board. Multiple temperature sensing modules are arranged at intervals on the circuit board. The conductive structure is electrically connected to the multiple temperature sensing modules respectively. The multiple temperature sensing modules are arranged in parallel through the conductive structure. The multiple temperature sensing modules independently perform temperature detection on the bus.

[0016] The present application sets up multiple independent temperature sensing modules to perform temperature detection on the bus respectively, thereby avoiding the problem of large temperature sampling deviation or even failure caused by the failure of a single temperature sensing module, and improving the accuracy and reliability of temperature sensing module sampling.

[0017] The present application pre-fixes the bus and the circuit board by connecting the glue layer, and then fixes the circuit board by injecting glue through the glue injection holes, which can increase the stability of the installation of the bus and the circuit board.

[0018] The present application can protect the temperature sensing module and improve the installation stability of the temperature sensing module through the protective frame and the colloid. The protective frame and the colloid provide a stable working environment for the temperature sensing module. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings constituting part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0020] Figure 1 This is a front view of the temperature sensing component provided by the utility model;

[0021] Figure 2 This is a schematic diagram of the cross-sectional structure of the temperature sensing component provided by the utility model;

[0022] Figure 3 An exploded diagram of the temperature sensing component provided by the utility model;

[0023] Figure 4 This is a schematic diagram of the structure of the installation of the temperature sensing component and the bus provided by the utility model.

[0024] The above drawings include the following reference numerals:

[0025] 1. Circuit board; 11. Glue injection hole; 2. Conductive structure; 21. First conductive sheet; 22. Second conductive sheet; 3. Temperature sensing module; 4. Protection frame; 41. Protection cavity; 5. Colloid; 6. Connecting glue layer; 7. Sampling line; 8. Insulation layer; 9. Bus. DETAILED DESCRIPTION

[0026] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present utility model will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0027] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meanings as commonly understood by ordinary technicians in the technical field to which this application belongs.

[0028] In the present invention, unless otherwise specified, the directional words used, such as "up, down, top, bottom", usually refer to the directions shown in the drawings, or to the components themselves in the vertical, perpendicular or gravity directions; similarly, for ease of understanding and description, "inside and outside" refer to the inside and outside relative to the outline of each component itself, but the above-mentioned directional words are not used to limit the present invention.

[0029] In order to solve the problem of large detection error of a single temperature sensing module in the prior art, the utility model provides a temperature sensing component, which reduces the detection error by arranging multiple temperature sensing modules.

[0030] Embodiment 1

[0031] A temperature sensing component, see Figures 1 to 4 The temperature sensing component includes a circuit board 1, a conductive structure 2 and a plurality of temperature sensing modules 3. The circuit board 1 is used to connect with the bus 9. The conductive structure 2 is arranged on the circuit board 1. The plurality of temperature sensing modules 3 are arranged at intervals on the circuit board 1. The conductive structure 2 is electrically connected to the plurality of temperature sensing modules 3 respectively. The plurality of temperature sensing modules are arranged in parallel through the conductive structure 2. The plurality of temperature sensing modules 3 independently detect the temperature of the bus 9. The plurality includes two or more.

[0032] Specifically, the conductive structure 2 on the circuit board 1 is used to power the temperature sensing module 3 so that the temperature sensing module 3 can work, and because the multiple temperature sensing modules are connected in parallel, the multiple temperature sensing modules 3 can work independently of each other. By setting up multiple independent temperature sensing modules 3 and performing temperature detection on the bus 9 respectively, the problem of large temperature sampling deviation or even failure caused by failure of a single temperature sensing module 3 is avoided, and the accuracy and reliability of sampling of the temperature sensing module 3 are improved.

[0033] Furthermore, the conductive structure 2 includes a first conductive sheet 21 and a second conductive sheet 22, the first conductive sheet 21 is electrically connected to the positive poles of the plurality of temperature sensing modules 3; the second conductive sheet 22 is electrically connected to the negative poles of the plurality of temperature sensing modules 3, wherein the number of the first conductive sheets 21 is less than or equal to the number of the temperature sensing modules 3, and the number of the second conductive sheets 22 is less than or equal to the number of the temperature sensing modules 3.

[0034] Among them, the first conductive sheet 21 and the second conductive sheet 22 are respectively connected to the positive electrode and the negative electrode of the temperature sensing module 3, so that the first conductive sheet 21 and the second conductive sheet 22 can provide power for the normal operation of multiple temperature sensing modules 3. And the first conductive sheet 21 and the second conductive sheet 22 are used in conjunction to realize that multiple temperature sensing modules 3 can be set in parallel. When the number of first conductive sheets 21 is equal to the number of temperature sensing modules 3, the positive electrode of each temperature sensing module 3 is respectively connected to a first conductive sheet 21, and when the number of first conductive sheets 21 is less than the number of temperature sensing modules 3, there are at least two positive electrodes of temperature sensing modules 3 connected to one first conductive sheet 21 to improve the reusability of the circuit and save space and cost. Similarly, when the number of second conductive sheets 22 is equal to the number of temperature sensing modules 3, the negative electrode of each temperature sensing module 3 is respectively connected to a second conductive sheet 22, and when the number of second conductive sheets 22 is less than the number of temperature sensing modules 3, there are at least two negative electrodes of temperature sensing modules 3 connected to one second conductive sheet 22.

[0035] It should be noted that at least two temperature sensing modules 3 are provided, and preferably two temperature sensing modules 3 are provided. The temperature sensing module 3 is used to collect the temperature of the bus 9, and the temperature sensing module 3 may be an NTC thermistor.

[0036] In a specific implementation of this embodiment, there are two temperature sensing modules 3 , and two first conductive sheets 21 and two second conductive sheets 22 are provided.

[0037] By adopting the above solution, one of the first conductive sheets 21 is electrically connected to the positive pole of one of the temperature sensing modules 3, and the other first conductive sheet 21 is electrically connected to the positive pole of the other temperature sensing module 3; one of the second conductive sheets 22 is electrically connected to the negative pole of one of the temperature sensing modules 3, and the other second conductive sheet 22 is electrically connected to the negative pole of the other temperature sensing module 3. The two first conductive sheets 21 are electrically connected to the positive poles of the two temperature sensing modules 3, respectively, and the two second conductive sheets 22 are electrically connected to the negative poles of the two temperature sensing modules 3, respectively. The cooperation of the two first conductive sheets 21 and the two second conductive sheets 22 with the two temperature sensing modules 3 enables the two temperature sensing modules 3 to work independently.

[0038] In another implementation of this embodiment, there are two temperature sensing modules 3 , two first conductive sheets 21 are provided, and one second conductive sheet 22 is provided.

[0039] By adopting the above-mentioned scheme, the two first conductive sheets 21 are electrically connected to the positive electrodes of the two temperature sensing modules 3 respectively, and the negative electrodes of the two temperature sensing modules 3 are electrically connected to the second conductive sheet 22. By only providing one second conductive sheet 22, the area occupied by the conductive structure 2 can be reduced, thereby reducing the area of ​​the entire temperature sensing component.

[0040] In another implementation of this embodiment, there are two temperature sensing modules 3 , one first conductive sheet 21 is provided, and two second conductive sheets 22 are provided.

[0041] By adopting the above-mentioned scheme, the two second conductive sheets 22 are electrically connected to the negative electrodes of the two temperature sensing modules 3 respectively, and the positive electrodes of the two temperature sensing modules 3 are electrically connected to the first conductive sheet 21. By only providing one first conductive sheet 21, the area occupied by the conductive structure 2 can be reduced, thereby reducing the area of ​​the entire temperature sensing component.

[0042] See also Figures 1 to 4 The temperature sensing component further includes a protection frame 4 , which is disposed on the circuit board 1 . The protection frame 4 has a protection cavity 41 , and the two temperature sensing modules 3 are disposed inside the protection cavity 41 .

[0043] Specifically, by providing the protection frame 4 and disposing the temperature sensing module 3 in the protection cavity 41 of the protection frame 4, the temperature sensing module 3 can be protected and damage to the temperature sensing module 3 during installation or other processes can be reduced.

[0044] Furthermore, the temperature sensing component also includes a colloid 5, which is filled in the interior of the protective cavity 41 and covers the two temperature sensing modules 3. After the protective frame 4 and the temperature sensing module 3 are installed, the colloid 5 is injected into the protective frame 4, and the injected colloid 5 covers the temperature sensing module 3, which can further protect and fix the temperature sensing module 3.

[0045] In this embodiment, the temperature sensing component further includes a connecting adhesive layer 6 , which is disposed between the circuit board 1 and the bus bar 9 and is used to bond the circuit board 1 to the bus bar 9 .

[0046] The connecting adhesive layer 6 bonds the circuit board 1 to the bus bar 9, so as to facilitate the temperature detection of the bus bar 9. Usually, the connecting adhesive layer 6 is made of double-sided adhesive, which is low in cost and easy to use.

[0047] Furthermore, the connecting adhesive layer 6 forms a bonding area, and a plurality of glue injection holes 11 for glue injection are provided on the circuit board 1, and the projections of the plurality of glue injection holes 11 on the circuit board 1 do not overlap with the bonding area. After the connecting adhesive layer 6 pre-fixes the circuit board 1, glue is injected through the plurality of glue injection holes 11 provided on the circuit board 1, thereby further increasing the firmness of the connection between the circuit board 1 and the bus 9. At the same time, the glue injection holes 11 avoid the bonding area, thereby reducing the interference between the glue injection holes 11 and the bonding area of ​​the connecting adhesive layer 6.

[0048] In this embodiment, the temperature sensing component further includes an insulating layer 8, which is disposed on the surface of the circuit board 1 on the side away from the bus 9. The insulating layer 8 can provide leakage protection for the circuit board 1 and the conductive structure 2 disposed on the circuit board 1 to prevent them from short-circuiting due to contact with the outside.

[0049] Furthermore, at least a portion of the conductive structure 2 is exposed outside the insulating layer 8 to form a welding area, and the welding area is used to be electrically connected to the sampling line 7. Specifically, the sampling line 7 is welded and fixed to the welding area of ​​the conductive structure 2. By providing the sampling line 7, it is convenient to electrically connect the conductive structure 2 to an external power source, so that the temperature sensing module 3 is powered, so that the temperature sensing module 3 works normally.

[0050] Among them, the sampling line 7 can be a wire harness, FFC, FPC, etc.

[0051] Embodiment 2

[0052] This embodiment provides a bus assembly, which includes a bus 9 and the temperature sensing assembly in the first embodiment. The temperature sensing assembly is located above the bus 9 and is fixedly connected to the bus 9.

[0053] Embodiment 3

[0054] This embodiment provides a battery module, which includes multiple battery cells and the bus assembly in Embodiment 2. Two adjacent battery cells are electrically connected via a bus 9. A temperature sensing assembly is disposed on the bus 9 to detect the temperature of the bus 9 and thereby determine the battery cell temperature.

[0055] From the above description, it can be seen that the above embodiments of the utility model achieve the following technical effects:

[0056] 1. The present application sets at least two independent temperature sensing modules 3 to respectively detect the temperature of the bus 9, thereby avoiding the problem of large temperature sampling deviation or even failure caused by the failure of a single temperature sensing module, and improving the accuracy and reliability of the sampling of the temperature sensing module 3.

[0057] 2. The present application pre-fixes the circuit board 1 and the bus 9 by connecting the adhesive layer 6 and then connects the circuit board 1 by injecting adhesive through the adhesive injection holes 11, which can increase the installation stability of the circuit board 1.

[0058] 3. The present application can protect the temperature sensing module 3 through the structure in which the protection frame 4 and the colloid 5 cooperate, thereby providing a stable working environment for the temperature sensing module 3 .

[0059] Obviously, the embodiments described above are only some embodiments of the utility model, not all embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0060] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0061] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0062] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A temperature sensing component, characterized in that: include: A circuit board (1), the circuit board (1) being used to be connected to a bus bar (9); A conductive structure (2), the conductive structure (2) being arranged on the circuit board (1); A plurality of temperature sensing modules (3), wherein the plurality of temperature sensing modules (3) are arranged at intervals on the circuit board (1), the conductive structure (2) is electrically connected to the plurality of temperature sensing modules (3) respectively, the plurality of temperature sensing modules (3) are arranged in parallel via the conductive structure (2), and the plurality of temperature sensing modules (3) independently detect the temperature of the bus bar (9).

2. The temperature sensing component according to claim 1, characterized in that: The conductive structure (2) comprises: A first conductive sheet (21), the first conductive sheet (21) being electrically connected to the positive electrode of the temperature sensing module (3); a second conductive sheet (22), the second conductive sheet (22) being electrically connected to the negative electrode of the temperature sensing module (3), The number of the first conductive sheets (21) is less than or equal to the number of the temperature sensing modules (3), and the number of the second conductive sheets (22) is less than or equal to the number of the temperature sensing modules (3).

3. The temperature sensing component according to claim 1, characterized in that: The temperature sensing component further comprises a protective frame (4), wherein the protective frame (4) is arranged on the circuit board (1), the protective frame (4) has a protective cavity (41), and the plurality of temperature sensing modules (3) are arranged inside the protective cavity (41).

4. The temperature sensing component according to claim 3, characterized in that: The temperature sensing component further comprises a colloid (5), wherein the colloid (5) is filled in the interior of the protective cavity (41), and the colloid (5) covers the plurality of temperature sensing modules (3).

5. The temperature sensing component according to claim 1, characterized in that: The temperature sensing component further comprises a connecting adhesive layer (6), wherein the connecting adhesive layer (6) is arranged between the circuit board (1) and the bus bar (9) and is used for bonding the circuit board (1) to the bus bar (9).

6. The temperature sensing component according to claim 5, characterized in that: The connecting adhesive layer (6) forms a bonding area, and the circuit board (1) is provided with a plurality of glue injection holes (11) for injecting glue, and the projections of the plurality of glue injection holes (11) on the circuit board (1) do not overlap with the bonding area.

7. The temperature sensing component according to claim 1, characterized in that: The temperature sensing component further comprises an insulating layer (8), wherein the insulating layer (8) is arranged on a surface of the circuit board (1) on a side facing away from the bus bar (9).

8. The temperature sensing component according to claim 7, characterized in that: At least a portion of the conductive structure (2) is exposed outside the insulating layer (8) to form a welding area, and the welding area is used to be electrically connected to the sampling line (7).

9. A busbar assembly, characterized in that: The busbar assembly comprises: Busbar (9); The temperature sensing component according to any one of claims 1 to 8, wherein the temperature sensing component is located above the bus (9) and is fixedly connected to the bus (9).

10. A battery module, characterized in that: The battery module comprises a plurality of battery cells and the busbar assembly as claimed in claim 9, and two adjacent battery cells are electrically connected via a busbar (9) of the busbar assembly.

Images