Communication chip and communication system

Abstract

The utility model discloses a communication chip and a communication system, the communication chip comprises a transmitting channel, a transmitting port, a receiving channel, a receiving port, a first switch and an antenna interface, the transmitting channel is connected with the transmitting port; the receiving channel is separated from the transmitting channel, and the receiving channel is connected with the receiving port; the first switch is connected with the transmitting channel, the receiving channel and the antenna interface, and is configured to communicate the transmitting channel and the antenna interface and / or communicate the receiving channel and the antenna interface. According to the chip, a transmitting channel and a receiving channel can be separated, and the transmitting and receiving isolation degree can be improved, so that the difference of the sensitivity of the communication chip caused by different signal power can be avoided, the isolation degree problem can be solved from the inside, the integration degree can be improved, and the PCB layout area can be saved.

Description

Technical Field

[0001] The utility model relates to the technical field of communication, and in particular to a communication chip and a communication system. Background Art

[0002] In the related technology, in the RF circuit system, each frequency band requires a corresponding filter, but discrete devices are often used in current designs, requiring independently packaged duplexers and switches. Independently packaged duplexers and switches, considering the transmit and receive isolation of the duplexer, often require a larger PCB (Printed Circuit Board) layout area to achieve the ideal effect.

[0003] However, due to poor duplex isolation design, the sensitivity of the communication chip may be different when receiving signals of different powers, thus affecting the receiving performance. In addition, independent duplex devices occupy a large area and are not highly integrated. Utility Model Content

[0004] The utility model aims to solve at least one of the technical problems in the related art to a certain extent. To this end, the first purpose of the utility model is to propose a communication chip that can separate the transmission and reception channels, improve the isolation between transmission and reception, thereby avoiding the difference in sensitivity of the communication chip caused by different signal power, solving the isolation problem from the inside, and improving the integration, thereby saving PCB layout area.

[0005] The second objective of the present invention is to provide a communication system.

[0006] To achieve the above-mentioned purpose, the first aspect of the utility model proposes a communication chip, including: a transmitting channel, a transmitting port, a receiving channel, a receiving port, a first switch and an antenna interface, wherein the transmitting channel is connected to the transmitting port; the receiving channel is separated from the transmitting channel, and the receiving channel is connected to the receiving port; the first switch is respectively connected to the transmitting channel, the receiving channel and the antenna interface, and is configured to connect the transmitting channel and the antenna interface and / or connect the receiving channel and the antenna interface.

[0007] According to the communication chip of the embodiment of the utility model, the receiving channel is separated from the transmitting channel, and the first switch can configure the connected components according to the type of signal frequency band: when the frequency band of the signal is the TDD (Time Division Duplexing) frequency band, the first switch connects the transmitting channel and the antenna interface when transmitting the signal, and connects the receiving channel and the antenna interface when receiving the signal; when the frequency band of the signal is the FDD (Frequency Division Duplexing) frequency band, the first switch connects the transmitting channel and the antenna interface, and connects the receiving channel and the antenna interface. As a result, the chip can separate the transmitting and receiving channels, improve the isolation between transmitting and receiving, thereby avoiding the difference in the sensitivity of the communication chip caused by different signal power sizes, solving the isolation problem from the inside, and improving the integration, thereby saving the PCB layout area.

[0008] In addition, the communication chip according to the above embodiment of the utility model may also have the following additional technical features:

[0009] Specifically, the first switch is a single-pole double-throw switch, and is configured to connect the transmitting channel and the antenna interface, or to connect the receiving channel and the antenna interface.

[0010] Specifically, the first switch is a double-pole double-throw switch, which is configured to connect the transmitting channel and the antenna interface, and connect the receiving channel and the antenna interface.

[0011] Specifically, the transmitting port includes multiple transmitting sub-ports, and the transmitting channel includes multiple transmitting sub-channels and a second switch, wherein the multiple transmitting sub-ports are correspondingly connected to the multiple transmitting sub-channels; the second switch is respectively connected to the multiple transmitting sub-channels and the first switch, and is configured to connect one of the multiple transmitting sub-channels to the first switch.

[0012] Specifically, each of the transmitting sub-channels includes a first matching circuit, a first filter, and a second matching circuit connected in sequence, and the first matching circuit is connected to the corresponding transmitting sub-port, and the second matching circuit is connected to the second switch.

[0013] Specifically, the multiple transmitting sub-channels include multiple low-frequency transmitting sub-channels, multiple intermediate frequency transmitting sub-channels and multiple high-frequency transmitting sub-channels, and the multiple low-frequency transmitting sub-channels are adjacent to each other, the multiple intermediate frequency transmitting sub-channels are adjacent to each other, and the multiple high-frequency transmitting sub-channels are adjacent to each other.

[0014] Specifically, the receiving port includes multiple receiving sub-ports, and the receiving channel includes multiple receiving sub-channels and a third switch, wherein the multiple receiving sub-ports are correspondingly connected to the multiple receiving sub-channels; the third switch is respectively connected to the multiple receiving sub-channels and the first switch, and is configured to connect one of the multiple receiving sub-channels to the first switch.

[0015] Specifically, each of the receiving sub-channels includes a third matching circuit and a second filter connected to each other, wherein the third matching circuit is connected to the third switch, and the second filter is connected to the corresponding receiving sub-port.

[0016] Specifically, the multiple receiving sub-channels include multiple low-frequency receiving sub-channels, multiple intermediate frequency receiving sub-channels and multiple high-frequency receiving sub-channels, and the multiple low-frequency receiving sub-channels are adjacent to each other, the multiple intermediate frequency receiving sub-channels are adjacent to each other, and the multiple high-frequency receiving sub-channels are adjacent to each other.

[0017] To achieve the above-mentioned purpose, the second aspect of the utility model proposes a communication system, comprising: the above-mentioned communication chip; an antenna, the antenna is connected to the antenna interface of the communication chip; a modem, the receiving port of the modem is connected to the receiving port of the communication chip; an amplifier, the amplifier is respectively connected to the transmitting port of the modem and the transmitting port of the communication chip; wherein the modem is configured to receive external signals through the antenna and the communication chip, and to transmit signals outward through the amplifier, the communication chip and the antenna.

[0018] According to the communication system of the embodiment of the utility model, the transmission and reception channels can be separated through the above-mentioned communication chip, which can improve the transmission and reception isolation, thereby avoiding the difference in the sensitivity of the communication chip caused by different signal power sizes, and solving the isolation problem from the inside.

[0019] Additional aspects and advantages of the present invention will be given in part in the following description and in part will become apparent from the following description or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a block diagram of a communication chip according to an embodiment of the utility model;

[0021] Figure 2 is a block diagram of a communication chip according to an embodiment of the utility model;

[0022] Figure 3 It is a block diagram of a communication system according to an embodiment of the utility model. DETAILED DESCRIPTION

[0023] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0024] The communication chip and the communication system proposed in the embodiments of the present invention are described below with reference to the accompanying drawings.

[0025] Figure 1 It is a block diagram of a communication chip according to an embodiment of the utility model.

[0026] like Figure 1 As shown, the communication chip 100 of the embodiment of the utility model includes: a transmitting channel 110, a transmitting port TX, a receiving channel 120, a receiving port RX, a first switch K1 and an antenna interface ANT, wherein the transmitting channel 110 is connected to the transmitting port TX; the receiving channel 120 is separated from the transmitting channel 110, and the receiving channel 120 is connected to the receiving port RX; the first switch K1 is respectively connected to the transmitting channel 110, the receiving channel 120 and the antenna interface ANT, and is configured to connect the transmitting channel 110 and the antenna interface ANT and / or connect the receiving channel 120 and the antenna interface ANT.

[0027] Specifically, during the communication process, the frequency band of the signal generally includes the FDD frequency band and the TDD frequency band, wherein the signal of the FDD frequency band is transmitted and received simultaneously, and the signal of the TDD frequency band is transmitted and received separately. When the frequency band of the signal is the TDD frequency band, and the communication chip 100 is used to transmit the signal, the first switch K1 connects the transmission channel 110 and the antenna interface ANT, and the modem sends the transmission signal to the amplifier for amplification, wherein the amplifier can be a multi-band power amplifier, which can perform power amplification on signals of multiple frequency bands. The transmission signal amplified by the amplifier enters the transmission port TX of the communication chip 100, and is selected to be transmitted to the transmission channel 110 and the antenna interface ANT through the first switch K1, so as to transmit the signal through the antenna; when the communication chip 100 is used to receive the signal, the first switch K1 connects the receiving channel 120 and the antenna interface ANT, and the antenna receives the signal and transmits it to the antenna interface ANT to enter the communication chip 100, and enters the receiving channel 120 through the first switch K1 to be transmitted to the modem.

[0028] When the frequency band of the signal is the FDD frequency band, and the communication chip 100 is used to transmit and receive the signal, the first switch K1 connects the transmitting channel 110 and the antenna interface ANT, and connects the receiving channel 120 and the antenna interface ANT, wherein the signal transmission process is: the modem sends the transmission signal to the amplifier for amplification, the amplified signal enters the transmitting port TX of the communication chip 100, and is selected to be transmitted to the transmitting channel 110 and the antenna interface ANT through the first switch K1, so as to transmit the signal through the antenna; the signal receiving process is: the antenna receives the signal and transmits it to the antenna interface ANT to enter the communication chip 100, and enters the receiving channel 120 through the first switch K1 to be transmitted to the modem.

[0029] According to an embodiment of the present invention, the first switch K1 is a single-pole double-throw switch, which is configured to connect the transmitting channel 110 and the antenna interface ANT, or to connect the receiving channel 120 and the antenna interface ANT.

[0030] Specifically, when the frequency band of the signal is the TDD frequency band, the first switch K1 is a single-pole double-throw switch. When the communication chip 100 is used to transmit a signal, the first switch K1 connects the transmission channel 110 and the antenna interface ANT, and the modem sends the transmission signal to the amplifier for amplification. The amplified signal enters the transmission port TX of the communication chip 100, and is selected to be transmitted to the transmission channel 110 and the antenna interface ANT through the first switch K1, so as to transmit the signal through the antenna; when the communication chip 100 is used to receive a signal, the first switch K1 connects the receiving channel 120 and the antenna interface ANT, and the antenna receives the signal and transmits the signal to the antenna interface ANT to enter the communication chip 100, and enters the receiving channel 120 through the first switch K1 to be transmitted to the modem.

[0031] According to another embodiment of the present invention, the first switch K1 is a double-pole double-throw switch, which is configured to connect the transmitting channel 110 and the antenna interface ANT, and to connect the receiving channel 120 and the antenna interface ANT.

[0032] Specifically, when the frequency band of the signal is the FDD frequency band, the first switch K1 is a double-pole double-throw switch. When the communication chip 100 is used to transmit and receive signals, the first switch K1 connects the transmission channel 110 and the antenna interface ANT, and connects the receiving channel 120 and the antenna interface ANT, wherein the signal transmission process is: the modem sends the transmission signal to the amplifier for amplification, the amplified signal enters the transmission port TX of the communication chip 100, and is selected to be transmitted to the transmission channel 110 and the antenna interface ANT through the first switch K1, so as to transmit the signal through the antenna; the signal reception process is: the antenna receives the signal and transmits it to the antenna interface ANT to enter the communication chip 100, and enters the receiving channel 120 through the first switch K1 to be transmitted to the modem.

[0033] According to one embodiment of the utility model, Figure 2 As shown, the transmitting port TX includes multiple transmitting sub-ports TX1, and the transmitting channel 110 includes multiple transmitting sub-channels 111 and a second switch K2, wherein the multiple transmitting sub-ports TX1 are correspondingly connected to the multiple transmitting sub-channels 111; the second switch K2 is respectively connected to the multiple transmitting sub-channels 111 and the first switch K1, and is configured to connect one of the multiple transmitting sub-channels 111 to the first switch K1. The second switch K2 may be a single-pole multi-throw switch.

[0034] Specifically, when the communication chip 100 is used to transmit a signal, the first switch K1 is connected to the second switch K2, and the second switch K2 is connected to one of the plurality of transmitting sub-channels 111 to send the signal to the corresponding transmitting sub-port TX1.

[0035] Further, according to an embodiment of the present invention, Figure 2 As shown, each transmitting sub-channel 111 includes a first matching circuit 1111, a first filter 1112, and a second matching circuit 1113 connected in sequence, and the first matching circuit 1111 is connected to the corresponding transmitting sub-port TX1, and the second matching circuit 1113 is connected to the second switch K2. Among them, the first filter 1112 can be an acoustic surface filter, and the first matching circuit 1111 and the second matching circuit 1113 can be one of an L-type matching circuit, a Π-type matching circuit, and a T-type matching circuit, which can be selected according to actual conditions. It should be noted that the L-type matching circuit is composed of an inductor and a capacitor connected in series or in parallel, the Π-type matching circuit is composed of an inductor and two capacitors, and the T-type matching circuit is composed of a capacitor and two inductors. The size of the capacitor and the inductor can be selected according to actual conditions, and is not limited here.

[0036] Specifically, when the communication chip 100 is used to transmit a signal, the first switch K1 is connected to the second switch K2, and the second switch K2 is connected to one of the multiple transmission sub-channels 111. The signal enters the first matching circuit 1111 in the transmission sub-channel 111 through the transmission sub-port TX1 for impedance matching, and then the signal is filtered by the first filter 1112 to suppress noise outside the transmission signal. After impedance matching is performed by the second matching circuit 1113, the signal is sent to the antenna interface ANT to transmit the signal through the antenna. Impedance matching through the first matching circuit 1111 and the second matching circuit 1113 can enable the transmission signal to be transmitted with maximum power and minimum reflection loss, and can avoid echo phenomenon.

[0037] According to an embodiment of the present invention, the multiple transmitting sub-channels 111 include multiple low-frequency transmitting sub-channels 111, multiple intermediate-frequency transmitting sub-channels 111, and multiple high-frequency transmitting sub-channels 111, and the multiple low-frequency transmitting sub-channels 111 are arranged adjacent to each other, the multiple intermediate-frequency transmitting sub-channels 111 are arranged adjacent to each other, and the multiple high-frequency transmitting sub-channels 111 are arranged adjacent to each other. Thus, when the communication chip 100 transmits a signal, signals of different frequency bands can be transmitted through the low-frequency transmitting sub-channels 111, the multiple intermediate-frequency transmitting sub-channels 111, and the multiple high-frequency transmitting sub-channels 111, and the transmitting sub-channels 111 of the same frequency band are arranged adjacent to each other, which can facilitate the designers to perform wiring when designing the circuit.

[0038] According to one embodiment of the utility model, Figure 2 As shown, the receiving port RX includes a plurality of receiving sub-ports RX1, and the receiving channel 120 includes a plurality of receiving sub-channels 121 and a third switch K3, wherein the plurality of receiving sub-ports RX1 are correspondingly connected to the plurality of receiving sub-channels 121; the third switch K3 is respectively connected to the plurality of receiving sub-channels 121 and the first switch K1, and is configured to connect one of the plurality of receiving sub-channels 121 to the first switch K1. The third switch K3 may be a single-pole multi-throw switch.

[0039] Specifically, when the communication chip 100 is used to receive a signal, the first switch K1 is connected to the third switch K3 , and the third switch K3 is connected to one of the multiple receiving sub-channels 121 to send the signal to the corresponding receiving sub-port RX1 .

[0040] Further, according to an embodiment of the present invention, Figure 2 As shown, each receiving sub-channel 121 includes a third matching circuit 1211 and a second filter 1212 connected to each other, and the third matching circuit 1211 is connected to the third switch K3, and the second filter 1212 is connected to the corresponding receiving sub-port RX1. The second filter 1212 may be a surface acoustic wave filter, and the third matching circuit 1211 may be one of an L-type matching circuit, a Π-type matching circuit, and a T-type matching circuit, which may be selected according to actual conditions.

[0041] Specifically, when the communication chip 100 is used to receive a signal, the first switch K1 is connected to the third switch K3, and the third switch K3 is connected to one of the multiple receiving sub-channels 121. The signal enters the communication chip 100 through the antenna interface ANT, and enters the third matching circuit 1211 in the receiving sub-channel 121 through the third switch K3 for impedance matching, and then the signal is filtered by the second filter 1212 to suppress noise outside the transmission signal, and then the signal is sent to the corresponding receiving sub-port RX1 to transmit the signal to the modem. Impedance matching through the third matching circuit 1211 can enable the received signal to be transmitted with maximum power and minimum reflection loss, and can avoid echo phenomenon.

[0042] According to an embodiment of the present invention, the multiple receiving sub-channels 121 include multiple low-frequency receiving sub-channels 121, multiple intermediate-frequency receiving sub-channels 121, and multiple high-frequency receiving sub-channels 121, and the multiple low-frequency receiving sub-channels 121 are arranged adjacent to each other, the multiple intermediate-frequency receiving sub-channels 121 are arranged adjacent to each other, and the multiple high-frequency receiving sub-channels 121 are arranged adjacent to each other. Thus, when the communication chip 100 receives a signal, signals of different frequency bands can be received through the low-frequency receiving sub-channels 121, the multiple intermediate-frequency receiving sub-channels 121, and the multiple high-frequency receiving sub-channels 121, and the adjacent arrangement of the receiving sub-channels 121 of the same frequency band can facilitate the designers to perform wiring when designing the circuit.

[0043] In summary, according to the communication chip of the embodiment of the utility model, the receiving channel is separated from the transmitting channel, and the first switch can configure the connected components according to the type of signal frequency band: when the frequency band of the signal is the TDD frequency band, the first switch connects the transmitting channel and the antenna interface when transmitting the signal, and connects the receiving channel and the antenna interface when receiving the signal; when the frequency band of the signal is the FDD frequency band, the first switch connects the transmitting channel and the antenna interface, and connects the receiving channel and the antenna interface. As a result, the chip can separate the transmitting and receiving channels, improve the isolation between sending and receiving, thereby avoiding the difference in the sensitivity of the communication chip caused by different signal powers, solving the isolation problem from the inside, and improving the integration, thereby saving the PCB layout area.

[0044] Corresponding to the above embodiments, the utility model also proposes a communication system.

[0045] Figure 3 It is a block diagram of a communication system according to an embodiment of the utility model.

[0046] like Figure 3 As shown, the communication system 200 of the embodiment of the present invention includes: the above-mentioned communication chip 100 , an antenna 210 , a modem 220 and an amplifier 230 .

[0047] The antenna 210 is connected to the antenna interface ANT of the communication chip 100; the receiving port of the modem 220 is connected to the receiving port RX of the communication chip 100; and the amplifier 230 is respectively connected to the transmitting port of the modem 220 and the transmitting port TX of the communication chip 100. The modem 220 is configured to receive external signals through the antenna 210 and the communication chip 100, and transmit signals to the outside through the amplifier 230, the communication chip 100 and the antenna 210.

[0048] Specifically, if Figure 3 As shown, when the communication system 100 transmits a signal to the outside, the modem 220 first transmits the signal to the amplifier 230 for amplification, and the amplified signal enters the transmitting port TX of the communication chip 100 and is transmitted to the antenna interface ANT to transmit the signal through the antenna 210; when the communication system 200 receives an external signal, the antenna 210 receives the signal and transmits it to the antenna interface ANT to enter the communication chip 100, and the communication chip 100 transmits the signal to the modem 220.

[0049] According to the communication system of the embodiment of the utility model, the transmission and reception channels can be separated through the above-mentioned communication chip, which can improve the isolation between transmission and reception, thereby avoiding the difference in sensitivity of the communication chip caused by the signal power size and solving the isolation problem from the inside.

[0050] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0051] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0052] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0053] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A communication chip, characterized in that: include: A transmitting channel, a transmitting port, a receiving channel, a receiving port, a first switch and an antenna interface, wherein: The transmitting channel is connected to the transmitting port; The receiving channel is separated from the transmitting channel, and the receiving channel is connected to the receiving port; The first switch is connected to the transmitting channel, the receiving channel and the antenna interface respectively, and is configured to connect the transmitting channel and the antenna interface and / or connect the receiving channel and the antenna interface.

2. The communication chip according to claim 1, characterized in that: The first switch is a single-pole double-throw switch, and is configured to connect the transmitting channel and the antenna interface, or to connect the receiving channel and the antenna interface.

3. The communication chip according to claim 1, characterized in that: The first switch is a double-pole double-throw switch, and is configured to connect the transmitting channel and the antenna interface, and to connect the receiving channel and the antenna interface.

4. The communication chip according to claim 1, characterized in that: The transmitting port includes a plurality of transmitting sub-ports, the transmitting channel includes a plurality of transmitting sub-channels and a second switch, wherein: The plurality of transmitting sub-ports are correspondingly connected to the plurality of transmitting sub-channels; The second switch is connected to the plurality of transmitting sub-channels and the first switch respectively, and is configured to connect one of the plurality of transmitting sub-channels to the first switch.

5. The communication chip according to claim 4, characterized in that: Each of the transmitting sub-channels includes a first matching circuit, a first filter, and a second matching circuit which are connected in sequence, and the first matching circuit is connected to a corresponding transmitting sub-port, and the second matching circuit is connected to the second switch.

6. The communication chip according to claim 4, characterized in that: The multiple transmitting sub-channels include multiple low-frequency transmitting sub-channels, multiple intermediate-frequency transmitting sub-channels and multiple high-frequency transmitting sub-channels, and the multiple low-frequency transmitting sub-channels are arranged adjacent to each other, the multiple intermediate-frequency transmitting sub-channels are arranged adjacent to each other, and the multiple high-frequency transmitting sub-channels are arranged adjacent to each other.

7. The communication chip according to claim 1, characterized in that: The receiving port includes a plurality of receiving sub-ports, the receiving channel includes a plurality of receiving sub-channels and a third switch, wherein: The plurality of receiving sub-ports are correspondingly connected to the plurality of receiving sub-channels; The third switch is connected to the plurality of receiving sub-channels and the first switch respectively, and is configured to connect one of the plurality of receiving sub-channels to the first switch.

8. The communication chip according to claim 7, characterized in that: Each of the receiving sub-channels includes a third matching circuit and a second filter connected to each other, wherein the third matching circuit is connected to the third switch, and the second filter is connected to the corresponding receiving sub-port.

9. The communication chip according to claim 7, characterized in that: The multiple receiving sub-channels include multiple low-frequency receiving sub-channels, multiple intermediate-frequency receiving sub-channels and multiple high-frequency receiving sub-channels, and the multiple low-frequency receiving sub-channels are adjacently arranged, the multiple intermediate-frequency receiving sub-channels are adjacently arranged, and the multiple high-frequency receiving sub-channels are adjacently arranged.

10. A communication system, characterized in that: include: The communication chip according to any one of claims 1 to 9; An antenna connected to an antenna interface of the communication chip; A modem, a receiving port of the modem being connected to a receiving port of the communication chip; An amplifier, wherein the amplifier is connected to the transmitting port of the modem and the transmitting port of the communication chip respectively; wherein, The modem is configured to receive an external signal through the antenna and the communication chip, and to transmit a signal to the outside through the amplifier, the communication chip, and the antenna.

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