Gigabit bandwidth MDU device

Abstract

The utility model relates to gigabit bandwidth MDU equipment, which comprises an XPON module, a data exchange module, an SOC module, a first network port module and a second network port module, and is characterized in that the SOC module is electrically connected with the XPON module, the SOC module is electrically connected with the data exchange module through an HSGMII interface, the SOC module is electrically connected with the first network port module through an MDI interface, and the second network port module is electrically connected with the data exchange module. The SOC module is electrically connected with the first network port module through the MDI interface, so that the system can be connected with an external network efficiently at a high speed, and the network bandwidth capacity is effectively ensured. The second network port module is led out through the data exchange module, the data exchange module is connected with the SOC through the HSGMII interface, and the rate of the HSGMII interface is 2.5 g, so that the device can process higher data rate, and the bandwidth bottleneck problem of the MDU device in the prior art is solved. And the data transmission rate of the MDU equipment is improved.

Description

Technical Field

[0001] The present application relates to the field of network communication technology, and in particular to a gigabit bandwidth MDU device. Background Art

[0002] MDU (Multiple Dwelling Unit) refers to a multi-dwelling unit, usually a building shared by multiple residents or businesses such as an apartment building, residential community or commercial complex. In a fiber-optic communication network, MDU is a higher-level device used to connect multiple users and provide fiber-optic access. MDU equipment usually includes equipment functions such as fiber access systems, switches and routers, which are used to manage and distribute fiber-optic signals to various user units. The functions of MDU cover fiber access and network distribution to meet the communication needs of multiple residents or businesses. Through the PON (passive optical network) network, a point-to-multipoint network topology is adopted to effectively collect and aggregate the scattered Ethernet services of users, and provide a standard RJ45 fast Ethernet interface on the user side for smooth interconnection with the existing network.

[0003] At present, with the development of PON technology, 10G GPON and 10G EPON are gradually being implemented. MDU equipment needs to have greater bandwidth expansion capabilities and no internal bandwidth bottleneck. Broadband bottleneck is also called network bottleneck, which refers to some related factors that affect network transmission performance and stability. With the increase of network bandwidth (gigabit bandwidth), existing MDU equipment has bandwidth bottleneck problem. Utility Model Content

[0004] The embodiment of the present application provides a gigabit bandwidth MDU device to at least solve the bandwidth bottleneck problem of the MDU device in the related art.

[0005] The embodiment of the present application provides a gigabit bandwidth MDU device, including: an XPON module, a data exchange module, a SOC module, a first network port module and a second network port module;

[0006] The SOC module is electrically connected to the XPON module;

[0007] The SOC module is electrically connected to the data exchange module via a HSGMII interface;

[0008] The SOC module is electrically connected to the first network port module via an MDI interface;

[0009] The second network port module is electrically connected to the data exchange module.

[0010] In one embodiment, the XPON module is movably mounted on the device;

[0011] The XPON module includes a PON optical fiber interface, and the PON optical fiber interface is used to receive / send optical fiber signals;

[0012] The XPON module is used to convert optical signals into electrical signals or convert electrical signals into optical signals.

[0013] In one embodiment, the data exchange module includes:

[0014] A HSGMII interface, the HSGMII interface being electrically connected to the HSGMII interface of the SOC module;

[0015] MDI interface, the MDI interface is electrically connected to the second network port module.

[0016] In one embodiment, the number of HSGMII interfaces in the data exchange module is 1-2, and the number of MDI interfaces in the data exchange module is at least 4.

[0017] In one embodiment, the SOC module includes:

[0018] A CPU controller, used to execute related operations of the MDU device;

[0019] XPON interface, used to connect to the XPON module;

[0020] HSGMII interface, used to connect to the data exchange module;

[0021] An MDI interface is used to connect to the first network port module, wherein the MDI interface includes a MAC interface and a PHY interface, the MAC interface is used to implement control and management of media devices, and the PHY interface is used to implement data transmission and signal processing at the physical layer.

[0022] In one embodiment, the number of HSGMII interfaces in the SOC module is 1-2, and the number of MDI interfaces in the SOC module is at least 4.

[0023] In one embodiment, the first network port module and the second network port module both include a network transformer and an RJ45 interface;

[0024] The network transformer is used to isolate the MDI signal output by the SOC module or the data exchange module, and convert the MDI signal into a format for twisted pair transmission;

[0025] The RJ45 interface is used to connect the twisted pair transmission format with the network equipment.

[0026] In one embodiment, both the first network port module and the second network port module are Gigabit network ports.

[0027] In one embodiment, the number of network ports of the first network port module and the number of network ports of the second network port module are 2 to 4.

[0028] In one embodiment, the number of HSGMII interfaces in the SOC module corresponds to the number of HSGMII interfaces in the data exchange module.

[0029] A gigabit bandwidth MDU device provided in an embodiment of the present application has at least the following technical effects.

[0030] The SOC module is electrically connected to the first network port module through the MDI interface, and can be connected to the external network at high speed and high efficiency, effectively ensuring the network bandwidth capacity. The second network port module is led out through the data exchange module, and the data exchange module is connected to the SOC through the HSGMII interface. The HSGMII interface rate is 2.5g, which enables the device to handle higher data rates and solve the bandwidth bottleneck problem of the MDU device in the prior art. The data transmission rate of the MDU device is improved.

[0031] Details of one or more embodiments of the present application are set forth in the following drawings and description to make other features, objects, and advantages of the present application more readily apparent. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0033] Figure 1 It is a structural diagram of a gigabit bandwidth MDU device;

[0034] Figure 2 is a structural schematic diagram of a SOC module according to an exemplary embodiment;

[0035] Figure 3 The figure is a schematic diagram of the structure of a switching chip module according to an exemplary embodiment. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application is described and illustrated below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application. Based on the embodiments provided in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0037] Obviously, the drawings described below are only some examples or embodiments of the present application. For ordinary technicians in this field, the present application can also be applied to other similar scenarios based on these drawings without creative work. In addition, it can also be understood that although the efforts made in this development process may be complicated and lengthy, for ordinary technicians in this field related to the content disclosed in this application, some changes in design, manufacturing or production based on the technical content disclosed in this application are just conventional technical means, and should not be understood as insufficient content disclosed in this application.

[0038] Reference to "embodiments" in this application means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those of ordinary skill in the art that the embodiments described in this application may be combined with other embodiments without conflict.

[0039] Unless otherwise defined, the technical terms or scientific terms involved in this application should be understood by people with ordinary skills in the technical field to which this application belongs. The words "one", "a", "a", "the" and the like involved in this application do not indicate a quantitative limitation, and may represent the singular or plural. The terms "include", "comprise", "have" and any of their variations involved in this application are intended to cover non-exclusive inclusions; for example, a process, method, system, product or device that includes a series of steps or modules (units) is not limited to the listed steps or units, but may also include steps or units that are not listed, or may also include other steps or units inherent to these processes, methods, products or devices. The words "connect", "connected", "coupled" and the like involved in this application are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The "multiple" involved in this application refers to two or more. "And / or" describes the association relationship of associated objects, indicating that there may be three relationships, for example, "A and / or B" can represent: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the objects before and after are in an "or" relationship. The terms "first", "second", "third", etc. involved in this application are only used to distinguish similar objects and do not represent a specific ordering of the objects.

[0040] The present application embodiment provides a gigabit bandwidth MDU device, Figure 1 It is a schematic diagram of the structure of a gigabit bandwidth MDU device, such as Figure 1 As shown, a gigabit bandwidth MDU device includes:

[0041] It includes: XPON module, data exchange module, SOC module, first network port module and second network port module;

[0042] The SOC module is electrically connected to the XPON module;

[0043] The SOC module is electrically connected to the data exchange module via the HSGMII interface;

[0044] The SOC module is electrically connected to the first network port module via the MDI interface;

[0045] The second network port module is electrically connected to the data exchange module.

[0046] In summary, the embodiment of the present application provides a gigabit bandwidth MDU device, in which the SOC module is electrically connected to the first network port module through the MDI interface, and can be connected to the external network at high speed and efficiency, effectively ensuring the network bandwidth capacity. The second network port module is led out through the data exchange module, and the data exchange module is connected to the SOC through the HSGMII interface. The HSGMII interface rate is 2.5g, so that the device can handle a higher data rate, solving the bandwidth bottleneck problem of the MDU device in the prior art. The data transmission rate of the MDU device is improved.

[0047] In one embodiment, the XPON module is movably installed on the device, and the XPON module includes a PON optical fiber interface, the PON optical fiber interface is used to receive / send optical fiber signals, and the XPON module is used to convert optical signals into electrical signals or convert electrical wire signals into optical signals.

[0048] Optionally, the XPON module is movably or fixedly installed on the MDU device to realize an on-board optical module or a pluggable optical module. The XPON module includes a PON optical fiber interface, which is used to receive / send optical fiber signals, provide a PON optical fiber access interface, support 10G EPON or 10G GPON, and have a maximum network bandwidth of 10Gbit / s. The XPON module is used to convert optical signals into electrical signals or convert electrical wire signals into optical signals. The XPON module is connected to the XPON interface of the SOC module through electrical signals to realize communication with the PON network.

[0049] In one embodiment, the SOC module includes:

[0050] CPU controller, used to execute relevant operations of MDU equipment;

[0051] XPON interface, used to connect to the XPON module;

[0052] HSGMII interface, used to connect to the data exchange module;

[0053] The MDI interface is used to connect to the first network port module, wherein the MDI interface includes a MAC interface and a PHY interface, the MAC interface is used to implement control and management of media devices, and the PHY interface is used to implement data transmission and signal processing at the physical layer.

[0054] Optionally, Figure 2 is a schematic diagram of the structure of a SOC module according to an exemplary embodiment. Figure 2 As shown, the SOC module includes a CPU controller and provides a RAM interface, a ROM interface, an XPON interface, a HSGMII interface, an MDI interface and other auxiliary interfaces. Among them, the number of HSGMII interfaces in the SOC module is 1-2, and the number of MDI interfaces in the SOC module is at least 4. In this embodiment, the number of HSGMII interfaces is 2 and the number of MDI interfaces is 4. All interfaces are integrated on a chip to form a SOC (system on chip), which has a network switching core inside and has the required functions of MDU such as network switching, routing, and bandwidth allocation through ROM and RAM. Among them, 4 MDIs (including MAC+PHY) directly expand 4 Gigabit electrical ports, the MAC interface is used to realize the control and management of media devices, and the PHY interface is used to realize data transmission and signal processing at the physical layer. The SOC module is electrically connected to the first network port module through the MDI interface, and can be connected to the external network at high speed and efficiency, effectively ensuring the network bandwidth capacity. The 2 HSGMII interfaces can provide a maximum bandwidth of 2.5G respectively, and each interface can meet 2 Gigabit bandwidths at the same time, which can meet the expansion requirements of 4 Gigabit bandwidths. The network data of the four MDI interfaces and two HSGMII interfaces can be exchanged or routed with the XPON interface data at full bandwidth through the switching core inside the chip. In addition, the SOC chip solution with the above functional interfaces is mature and can be selected from multiple manufacturers, such as ZTE Micro ZX279132 and MediaTek AN7581.

[0055] It is worth noting that MDI stands for: Medium Dependent Interface (Medium Dependent Interface) is a twisted pair connection method. MDI provides physical and electrical connections from the terminal to the network relay device. MDI is an Ethernet port connection using twisted pair. MDI (for Medium Dependent Interface) is a component of the Media Attachment Unit (MAU) that provides physical and electrical connections for the wiring medium.

[0056] In one embodiment, the data exchange module includes: a HSGMII interface, which is electrically connected to the HSGMII interface of the SOC module; and an MDI interface, which is electrically connected to the second network port module.

[0057] Optionally, Figure 3is a schematic diagram of the structure of a switching chip module according to an exemplary embodiment. Figure 3 As shown, the switching chip module uses a highly integrated switching chip, which has an HSGMII interface and an MDI interface. Among them, the number of HSGMII interfaces in the data exchange module is 1-2, and the number of MDI interfaces in the data exchange module is at least 4. In this embodiment, the number of HSGMII interfaces is 2, and the number of MDI interfaces is 4. The switching chip solution with the above-mentioned functional interface is mature, and multiple manufacturers can choose to use it, such as Realtek RTL8367SC, YT9215SC, etc. The two HSGMIIs of the switching chip are respectively connected to the two HSGMIIs of the SOC module, and the four gigabit port data (MDI) of the switching chip completes the XPON data exchange with the SOC module through two HSGMIIs. 2 HSGMIIs can meet the full bandwidth communication of 4 gigabit ports. The switching chip module converts the HSGMII interface signal into an MDI signal to facilitate the communication between the SOC module and the media device. High-speed data transmission is provided through the HSGMII interface, making the connection between the SOC module and the switching chip module very suitable for the rapid transmission of big data. This connection enables high-speed data communication and helps build efficient network systems.

[0058] In one embodiment, the first network port module and the second network port module both include a network transformer and an RJ45 interface;

[0059] A network transformer is used to isolate the MDI signal output by the SOC module or the data exchange module and convert the MDI signal into a format for twisted pair transmission;

[0060] RJ45 interface, used to connect the twisted pair transmission format to the network equipment.

[0061] Optionally, the first network port module and the second network port module both include a network transformer and an RJ45 interface. The network transformer is an electronic component used for network transmission, which has the functions of isolation, voltage transformation and transmission. In network transmission, the network transformer can protect the signal from interference and convert the signal into a format suitable for transmission. Secondly, the RJ45 interface is a common network interface used to connect the twisted pair transmission format with network equipment. The RJ45 interface connects twisted pair cables. Twisted pair is a commonly used network transmission medium, which consists of two wires twisted together, which can effectively reduce signal interference and improve the stability of signal transmission.

[0062] In one embodiment, both the first network port module and the second network port module are Gigabit network ports. The number of network ports of the first network port module and the second network port module are both 2 to 4.

[0063] Optionally, in this embodiment, the number of network ports of the first network port module and the second network port module are both 4. The first network port module (4-port Gigabit network port) is directly led out by the SOC module, and the second network port module (4-port Gigabit network port) is divided into two HSGMII signals through the switching chip and then connected to the SOC. The HSGMII interface rate is 2.5g, so that the device can handle higher data rates, and use chips with lower interface rates (not greater than 2.5G) to solve the internal data exchange bandwidth bottleneck problem, avoid using higher-rate interfaces, and all 8 Gigabit network ports can use Gigabit bandwidth at the same time. There is no bandwidth bottleneck inside the switching core, and 8 ports can enjoy Gigabit bandwidth exclusively.

[0064] In one embodiment, the number of HSGMII interfaces in the SOC module corresponds to the number of HSGMII interfaces in the data exchange module. It is ensured that the HSGMII interfaces in the SOC module correspond to the HSGMII interfaces in the data exchange module.

[0065] In summary, the embodiment of the present application provides a gigabit bandwidth MDU device, in which the SOC module is electrically connected to the first network port module via the MDI interface, and can be connected to the external network at high speed and efficiency, effectively ensuring the network bandwidth capacity. The second network port module is led out through the data exchange module, and the data exchange module is connected to the SOC via the HSGMII interface. The HSGMII interface rate is 2.5g, so that the device can handle higher data rates, and use chips with lower interface rates (not greater than 2.5G) to solve the internal data exchange bandwidth bottleneck problem, avoiding the use of higher-speed interfaces. The device is more common, low-cost, and easy to implement. Solve the bandwidth bottleneck problem of MDU devices in the prior art. Improve the data transmission rate of the MDU device.

[0066] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0067] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A gigabit bandwidth MDU device, characterized in that: include: XPON module, data exchange module, SOC module, first network port module and second network port module; The SOC module is electrically connected to the XPON module; The SOC module is electrically connected to the data exchange module via a HSGMII interface; The SOC module is electrically connected to the first network port module via an MDI interface; The second network port module is electrically connected to the data exchange module.

2. The device according to claim 1, characterized in that The XPON module is movably installed on the MDU device; The XPON module includes a PON optical fiber interface, and the PON optical fiber interface is used to receive / send optical fiber signals; The XPON module is used to convert optical signals into electrical signals or convert electrical signals into optical signals.

3. The device according to claim 1, characterized in that The data exchange module comprises: A HSGMII interface, the HSGMII interface being electrically connected to the HSGMII interface of the SOC module; MDI interface, the MDI interface is electrically connected to the second network port module.

4. The device according to claim 3, characterized in that The number of HSGMII interfaces in the data exchange module is 1-2, and the number of MDI interfaces in the data exchange module is at least 4.

5. The device according to claim 1, characterized in that The SOC module includes: A CPU controller, used to execute related operations of the MDU device; XPON interface, used to connect to the XPON module; HSGMII interface, used to connect to the data exchange module; An MDI interface is used to connect to the first network port module, wherein the MDI interface includes a MAC interface and a PHY interface, the MAC interface is used to implement control and management of media devices, and the PHY interface is used to implement data transmission and signal processing at the physical layer.

6. The device according to claim 5, characterized in that The number of HSGMII interfaces in the SOC module is 1-2, and the number of MDI interfaces in the SOC module is at least 4.

7. The device according to claim 1, characterized in that The first network port module and the second network port module both include a network transformer and an RJ45 interface; The network transformer is used to isolate the MDI signal output by the SOC module or the data exchange module, and convert the MDI signal into a format for twisted pair transmission; The RJ45 interface is used to connect the twisted pair transmission format with the network equipment.

8. The device according to claim 7, characterized in that The first network port module and the second network port module are both Gigabit network ports.

9. The device according to claim 8, characterized in that The number of network ports of the first network port module and the second network port module are both 2 to 4.

10. The device according to claim 1, characterized in that The number of HSGMII interfaces in the SOC module corresponds to the number of HSGMII interfaces in the data exchange module.

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