Heat dissipation device and electronic equipment
By setting a filler constraint structure in the thermally conductive butt area of the heat dissipation device, providing side support force, the flow deviation problem of the thermally conductive gap filler during rotation or vibration is solved, and effective heat dissipation of the heating component is ensured.
Patent Information
- Application Number
- CN202322447048.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-09-08
- Publication Date
- 2024-12-24
- Estimated Expiration
- 2033-09-08
AI Technical Summary
During rotation or vibration, the thermal gap filler may flow or displace, resulting in the failure of the contact between the heat dissipation device and the heating component, and the failure to maintain a good heat dissipation effect.
A filler restraint structure is provided on the thermally conductive butt area of the heat dissipation device, such as a filler restraint side wall, to provide side support forces to resist centrifugal and inertial forces, and to prevent the flow of the thermal gap filler from being offset.
It effectively avoids the flow deviation of the thermally conductive gap filler during rotation or vibration, ensuring good heat dissipation performance of the heating components.
Smart Images
Figure CN222235327U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of industrial technology, in particular to a heat dissipation device used in a rotating or vibrating application environment and an electronic device comprising an electronic module with a heating component. Background Art
[0002] In some heat dissipation device applications such as cooling plates or heat sinks that use thermally conductive gap fillers such as thermally conductive paste or thermally conductive gel to dissipate heat from heat-generating components, the thermally conductive gap fillers may flow or shift during rotation or vibration with the heat-generating components and fail to maintain their original shape of good contact with the heat-generating components, thereby causing thermal runaway.
[0003] Therefore, those skilled in the art are still working on finding other solutions for heat dissipation devices. Utility Model Content
[0004] In view of this, the embodiments of the utility model provide a heat dissipation device on the one hand, and provide an electronic device on the other hand, for preventing the thermal conductive gap filler between the heat dissipation device and the heat-generating component from flowing in application scenarios such as rotation or vibration.
[0005] A heat dissipation device proposed in an embodiment of the utility model includes: a heat dissipation body and at least one heat-conducting docking area; the at least one heat-conducting docking area is arranged on the heat dissipation body, and the position corresponds to the heat-generating components to be dissipated; wherein, each heat-conducting docking area is provided with at least one filler constraint structure, which is used to provide side support force for the heat-conducting gap filler applied on the heat-conducting docking area.
[0006] In one embodiment, the filler constraining structure is a filler constraining side wall, and the filler constraining side wall provides lateral support force for the thermally conductive gap filler applied on the thermally conductive docking area.
[0007] In one embodiment, the filler-constrained side wall is a filler-constrained side wall whose contour is consistent with the outer contour of the heat-conducting docking area where the filler-constrained side wall is located.
[0008] In one embodiment, the filler-constrained side wall is a rectangular side wall, a circular side wall, an elliptical side wall, a triangular side wall, any other polygonal side wall, a Japanese side wall or a grid side wall.
[0009] In one embodiment, the filler-constrained sidewall is a sidewall with a complete profile, or a sidewall with a discontinuous profile.
[0010] In one embodiment, the heat-conducting docking area includes a heat-conducting docking area presented as a heat-conducting boss and / or a heat-conducting docking area presented as a heat-conducting recessed cavity.
[0011] An electronic device proposed in an embodiment of the utility model includes: an electronic module having a heat-generating component, and the above-mentioned heat dissipation device, wherein the heat dissipation device is used to dissipate heat from the heat-generating component on the electronic module.
[0012] In one embodiment, the electronic module is an electronic module or a printed circuit board assembly.
[0013] It can be seen from the above scheme that in the embodiment of the utility model, a filler restraint structure is provided on the thermally conductive docking area where the thermally conductive gap filler is applied to provide side support for the thermally conductive gap filler to counteract the centrifugal force during rotation and the inertial force during vibration, thereby preventing the thermally conductive gap filler from flowing and deviating to the surroundings along the surface of the thermally conductive docking area. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, so that those skilled in the art will be more aware of the above and other features and advantages of the present invention. In the accompanying drawings:
[0015] Figure 1 and Figure 2 This is an exemplary structural diagram of a heat dissipation device in one embodiment of the utility model. Figure 1 Front view of the heat sink before applying thermal gap filler. Figure 2 Cross-sectional view of the heat sink after application of thermally conductive gap filler.
[0016] Figure 3 The figure is a schematic diagram of the structure of a heat dissipation device in an example of the present utility model.
[0017] The reference numerals are as follows:
[0018] Label meaning 1 Heat dissipation body 2 Thermal Boss 3 Thermally conductive cavity 4 Infill constrained side walls 5 Thermally Conductive Gap Fillers DETAILED DESCRIPTION
[0019] In the embodiment of the utility model, it is considered that in the current heat dissipation device, a plurality of heat-conducting docking areas corresponding to the positions of the heat-generating components are usually provided on the heat dissipation body, such as the heat-conducting docking areas presented by heat-conducting bosses or heat-conducting recessed cavities, and then a heat-conducting gap filler is applied on the upper surface of the heat-conducting docking area, so that the heat dissipation device can fully contact the heat-generating component through the heat-conducting gap filler, thereby achieving good heat dissipation of the heat-generating component. However, when the heat dissipation device rotates or vibrates together with the heat-generating component, the heat-conducting gap filler may flow and deviate to the surroundings along the surface of the heat-conducting docking area under the action of centrifugal force or inertial force during vibration. For this reason, in the embodiment of the utility model, it is considered to provide a filler constraint structure on each heat-conducting docking area to provide lateral support force to the heat-conducting gap filler. The side here refers to the contact plane relative to the heat-conducting docking area.
[0020] In specific implementation, the filler constraint structure may be a filler constraint side wall. In other embodiments, the filler constraint structure may also be a filler constraint net, etc. In the case where the filler constraint structure is a filler constraint side wall, the filler constraint side wall may be a side wall with a complete outline or a side wall with an intermittent outline. For example, the filler constraint side wall may be an arc column arranged at each corner of a polygonal outline (including a triangle, a rectangle, and a polygon with other numbers of sides), or a long strip vertical board arranged at each side of a polygonal outline, or an intermittent side wall arranged on an arbitrary outline.
[0021] In order to make the purpose, technical solution and effect of the utility model more clearly understood, the specific implementation mode of the utility model is now described with reference to the accompanying drawings. The same reference numerals in the drawings represent components with the same structure or similar structures but the same functions.
[0022] In this document, “exemplary” and “illustrative” mean “serving as an example, instance or illustration”, and any illustration or implementation described in this document as “exemplary” or “illustrative” should not be construed as a more preferred or more advantageous technical solution.
[0023] In order to make the drawings concise, each figure only schematically shows the parts related to the utility model, which do not represent the actual structure of the product.
[0024] In this article, "a" or "an" not only means "only one", but also means "more than one". In this article, "first", "second", etc. are only used to distinguish each other, rather than to indicate their importance and order.
[0025] Figure 1 and Figure 2 This is an exemplary structural diagram of a heat dissipation device in one embodiment of the utility model. Figure 1 Front view of the heat sink before applying thermal gap filler. Figure 2 Cross-sectional view of the heat sink after application of thermally conductive gap filler. Figure 3 FIG. 1 is a schematic diagram of the structure of a heat dissipation device in an example of the present utility model. Figures 1 to 3 As shown, the heat dissipation device may include: a heat dissipation body 1 and at least one heat-conducting docking area. In this embodiment, the at least one heat-conducting docking area includes: at least one heat-conducting boss 2 and / or at least one heat-conducting recessed cavity 3 (the number 3 is used to highlight the heat-conducting recessed cavity, Figure 3 Only one of the multiple heat-conducting bosses is labeled with a number).
[0026] Among them, at least one heat-conducting docking area is arranged on the heat dissipation body 1, and its position corresponds to the heat-generating components to be dissipated. At least one filler-constrained side wall 4 is arranged on each heat-conducting docking area, and each filler-constrained side wall 4 is used to provide side support force for the heat-conducting gap filler 5 applied on the heat-conducting docking area. The side surface is relative to the contact plane of the heat-conducting docking area.
[0027] In specific implementation, the filler-constrained side wall 4 can have a variety of implementation structures. For example, it can be a filler-constrained side wall whose contour is consistent with the outer contour of the heat-conducting docking area; it can also be a filler-constrained side wall whose contour is inconsistent with the outer contour of the heat-conducting docking area. For example, the filler-constrained side wall can be a rectangular side wall, a circular side wall, an elliptical side wall, a triangular side wall, other arbitrary polygonal side walls, a Japanese side wall, a Tianzi grid side wall and other structural forms.
[0028] In this embodiment, each filler-constrained sidewall may have a set height h. If the area enclosed by the filler-constrained sidewall is smaller than the outer contour of the heat-generating component, the set height h is lower than the coating thickness t of the thermally conductive gap filler. If the area enclosed by the filler-constrained sidewall is larger than the outer contour of the heat-generating component, the set height h may be lower than the coating thickness t of the thermally conductive gap filler, or may be higher than the coating thickness t of the thermally conductive gap filler.
[0029] For the heat-conducting docking area presented by the heat-conducting concave cavity 3, since the area of the heat-conducting concave cavity 3 is usually larger than the outer contour of the heat-generating component, the side wall height of the heat-conducting concave cavity 3 can be higher than the coating thickness of the heat-conducting gap filler, and of course, the side wall height of the heat-conducting concave cavity 3 can also be lower than the coating thickness of the heat-conducting gap filler. The side wall of the heat-conducting concave cavity 3 can also be considered as a filler-constrained side wall.
[0030] In one example, the filler-constrained sidewalls may be integrally formed on the thermally conductive docking region, or the filler-constrained sidewalls may be obtained by machining an initial thermally conductive docking region without the filler-constrained sidewalls.
[0031] In other embodiments, the filler-constrained sidewall may be a sidewall with a complete outline or a sidewall with a discontinuous outline. When the filler-constrained sidewall is a sidewall with a complete outline, a filler-constrained cavity is enclosed therein. When the filler-constrained sidewall is a sidewall with a discontinuous outline, each discontinuously arranged sidewall component may provide local lateral support for the thermal gap filler.
[0032] In addition, an electronic device is also provided in an embodiment of the utility model, which includes an electronic module such as an electronic module or a printed circuit board assembly having heat-generating components; in addition, the device also includes the above-mentioned heat dissipation device, which is used to dissipate heat from the heat-generating components on the electronic module.
[0033] It can be seen from the above scheme that in the embodiment of the utility model, a filler restraint structure is provided on the thermally conductive platform on which the thermally conductive gap filler is applied to provide side support for the thermally conductive gap filler to counteract the centrifugal force during rotation and the inertial force during vibration, thereby preventing the thermally conductive gap filler from flowing and deviating to the surroundings along the surface of the thermally conductive docking area.
[0034] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. Heat dissipation device, including: A heat dissipation body (1) and at least one heat-conducting docking area (2); The at least one heat-conducting docking area (2) is arranged on the heat dissipation body (1), and the position of the at least one heat-conducting docking area (2) corresponds to the heat-generating components to be dissipated; characterized in that: At least one filler constraint structure is arranged on each heat-conducting docking area (2) and is used to provide side support force for the heat-conducting gap filler applied on the heat-conducting docking area.
2. The heat dissipation device according to claim 1, characterized in that: The filler constraint structure is a filler constraint side wall, and the filler constraint side wall provides lateral support force for the thermally conductive gap filler applied on the thermally conductive docking area.
3. The heat dissipation device according to claim 2, characterized in that: The filler-constrained side wall is a filler-constrained side wall whose contour is consistent with the outer contour of the heat-conducting docking area where the filler-constrained side wall is located.
4. The heat dissipation device according to claim 2, characterized in that: The filler-constrained side wall is a rectangular side wall, a circular side wall, an elliptical side wall, a triangular side wall, any other polygonal side wall, a Japanese side wall or a Tianzi grid side wall.
5. The heat dissipation device according to claim 4, characterized in that: The filler-constrained side wall is a side wall with a complete profile, or a side wall with a discontinuous profile.
6. The heat dissipation device according to any one of claims 1 to 5, characterized in that: The heat-conducting docking area includes a heat-conducting docking area presented as a heat-conducting boss and / or a heat-conducting docking area presented as a heat-conducting recessed cavity.
7. An electronic device comprising an electronic module having a heat generating component; characterized in that: Also includes: The heat dissipation device according to any one of claims 1 to 6, wherein the heat dissipation device is used to dissipate heat from heat-generating components on the electronic module.
8. The electronic device according to claim 7, characterized in that: The electronic module is an electronic module or a printed circuit board assembly.