Wafer polishing solution batching barrel

Abstract

The utility model discloses a wafer polishing solution batching barrel, which belongs to the technical field of polishing solution batching, and comprises a batching barrel, the upper end of the batching barrel is provided with a batching adjusting mechanism, and the batching adjusting mechanism is used for feeding various wafer polishing solution materials and adjusting the feeding speed. A stirring mechanism is installed at the bottom end of the batching barrel and used for stirring wafer polishing liquid, the batching adjusting mechanism comprises a feeding box, the feeding box is fixedly installed on the inner side of the upper end of the batching barrel, and the upper end and one side of the feeding box are open. According to the device, the feeding speed of various wafer polishing solution materials can be conveniently adjusted through the ingredient adjusting mechanism, the proportion of the various wafer polishing solution materials can be conveniently adjusted, the automation level is high, and the practicability of the device is improved.

Description

Technical Field

[0001] The utility model relates to the field of polishing liquid batching, in particular to a wafer polishing liquid batching barrel. Background Art

[0002] When the wafer is subjected to chemical mechanical polishing, the polishing liquid needs to be replaced regularly to ensure the chemical stability and effectiveness of the polishing liquid, to ensure the chemical effect of the polishing liquid on the wafer, and to ensure a good polishing effect on the wafer surface. The wafer polishing liquid needs to be mixed in a batching barrel when mixing the ingredients. When the wafer polishing liquid is produced, a variety of materials need to be mixed to increase the various properties of the wafer polishing liquid, thereby achieving a better grinding and polishing effect on the wafer. The existing wafer polishing liquid batching barrel cannot automatically feed a variety of wafer polishing liquid materials when loading, and cannot adjust the feeding speed of a variety of wafer polishing liquids according to production needs. The practicality is relatively general. How to improve these problems has become an urgent problem to be solved by those skilled in the art. Utility Model Content

[0003] In order to make up for the above shortcomings, the utility model provides a chip polishing liquid dispensing barrel, which aims to improve the problem that the existing chip polishing liquid dispensing barrel cannot automatically feed a variety of chip polishing liquid materials when loading, and cannot adjust the feeding speed of a variety of chip polishing liquids according to production needs, and the practicality is relatively general.

[0004] The utility model is implemented as follows: a wafer polishing liquid dispensing barrel comprises a dispensing barrel, a dispensing regulating mechanism is installed at the upper end of the dispensing barrel, the dispensing regulating mechanism is used to load a variety of wafer polishing liquid materials and adjust the loading speed, and a stirring mechanism is installed at the bottom end of the dispensing barrel, the stirring mechanism is used to stir the wafer polishing liquid.

[0005] In the preferred technical scheme of the present utility model, the ingredient adjustment mechanism includes a feeding box, the feeding box is fixedly installed on the inner side of the upper end of the feeding barrel, the upper end and one side of the feeding box are opened, the upper end of the feeding barrel is fixedly installed with a vertical plate, the upper end of the vertical plate is fixedly installed with a horizontal plate, and one side of the horizontal plate is fixedly installed with a connecting plate, the connecting plate is provided with a mounting hole and a transmission barrel is rotatably installed in the mounting hole, the inner wall of the transmission barrel is transmission-connected with a driven rod, the bottom end of the driven rod is fixedly connected with a baffle, both sides of the baffle are slidingly sealed and fitted with the inner side of the feeding box, the transmission barrel is rotationally limited and installed in the mounting hole of the connecting plate through a bearing, and the rotation of the transmission barrel causes the driven rod to drive the baffle to move up and down, so that the size of the opening formed by the feeding box and the baffle changes, so that the feeding speed of the material changes.

[0006] In the preferred technical solution of the utility model, the transmission barrel is configured as a threaded sleeve barrel, the driven rod is configured as a threaded rod, the transmission barrel and the driven rod are threadedly connected, and the rotation of the transmission barrel causes the driven rod to drive the baffle to rise or fall.

[0007] In the preferred technical solution of the utility model, a rotating shaft is rotatably installed at the bottom end of the horizontal plate, a motor is installed at the upper end of the horizontal plate, the rotating shaft is driven by the motor, a belt is sleeved on the outside of the rotating shaft and the transmission barrel, and the motor drives the rotating shaft to rotate, so that the transmission barrel rotates.

[0008] In the preferred technical solution of the utility model, an inclined plate is obliquely installed on the inner wall of the loading box.

[0009] In the preferred technical solution of the utility model, a sliding block is fixedly installed on one side of the baffle, and a sliding groove is provided on the inner wall of the batching barrel. The sliding block is slidably connected in the sliding groove to enhance the stability of the baffle when it moves.

[0010] In the preferred technical solution of the utility model, a discharge pipe is installed on the outside of the batching barrel, and the discharge pipe is provided with a solenoid valve.

[0011] In the preferred technical solution of the utility model, the stirring mechanism includes a rotating rod, which is rotatably installed at the bottom end of the batching barrel, and a stirring rod is fixedly installed on the outside of the rotating rod. The stirring rod is provided in multiple groups, and a second motor is installed at the bottom end of the batching barrel. The rotating rod is driven by the second motor, and the second motor drives the rotating rod so that the second motor stirs the wafer polishing liquid.

[0012] In the preferred technical solution of the present utility model, a support rod is fixedly installed at the bottom end of the mixing barrel, and the mixing barrel is supported by the support rod and the bottom plate.

[0013] The beneficial effects of the utility model are as follows: the wafer polishing liquid dispensing barrel obtained by the above design of the utility model, when in use, pours the wafer polishing liquid material into multiple groups of feeding boxes, and feeds through the opening formed by the feeding box and the baffle and through the inclined plate. When it is necessary to adjust the feeding speed of a wafer polishing liquid material, the motor drives the rotating shaft, the rotating shaft rotates to rotate the transmission barrel, the transmission barrel rotates to drive the baffle up and down, so that the size of the opening formed by the feeding box and the baffle changes, so that the feeding speed of the wafer polishing liquid material changes, and the rotating rod is driven by the second motor to stir the wafer polishing liquid. The device can conveniently adjust the feeding speed of multiple wafer polishing liquid materials through the dispensing adjustment mechanism, and conveniently adjust the proportion of multiple wafer polishing liquid materials. The automation level is high, and the practicality of the device is enhanced. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solution of the implementation mode of the utility model, the drawings required for use in the implementation mode will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0015] Figure 1 This is a schematic diagram of the structure of a wafer polishing liquid dispensing barrel provided by the embodiment of the utility model;

[0016] Figure 2 A schematic diagram of the internal structure provided for an embodiment of the utility model;

[0017] Figure 3 Another schematic diagram of the internal structure provided for an embodiment of the utility model;

[0018] Figure 4 for Figure 3 Enlarged view of position A in the middle.

[0019] In the figure: 100-dosing barrel; 200-dosing adjustment mechanism; 210-feeding box; 220-baffle; 221-slider; 230-driven rod; 240-transmission barrel; 250-connecting plate; 260-vertical plate; 261-horizontal plate; 270-motor; 271-rotating shaft; 272-belt; 280-inclined plate; 290-discharge pipe; 291-solenoid valve; 300-stirring mechanism; 310-rotating rod; 320-stirring rod; 330-second motor; 340-support rod; 350-bottom plate. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solution and advantages of the implementation of the utility model clearer, the technical solution in the implementation of the utility model will be clearly and completely described below in conjunction with the drawings in the implementation of the utility model. Obviously, the described implementation is a part of the implementation of the utility model, not all of the implementations. Based on the implementation of the utility model, all other implementations obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] See also Figure 1-Figure 4 The utility model provides a technical solution: a wafer polishing liquid dispensing barrel, including a dispensing barrel 100, a dispensing adjustment mechanism 200 is installed on the upper end of the dispensing barrel 100, the dispensing adjustment mechanism 200 is used to load a variety of wafer polishing liquid materials and adjust the loading speed, and a stirring mechanism 300 is installed on the bottom end of the dispensing barrel 100, and the stirring mechanism 300 is used to stir the wafer polishing liquid.

[0022] In some specific embodiments, the ingredient adjustment mechanism 200 includes a loading box 210, which is fixedly mounted on the inner side of the upper end of the ingredient barrel 100, and the upper end and one side of the loading box 210 are opened, and a vertical plate 260 is fixedly mounted on the upper end of the ingredient barrel 100, and a horizontal plate 261 is fixedly mounted on the upper end of the vertical plate 260, and a connecting plate 250 is fixedly mounted on one side of the horizontal plate 261, and the connecting plate 250 is provided with a mounting hole and a transmission barrel 2 is rotatably mounted in the mounting hole. 40, the inner wall of the transmission barrel 240 is transmission-connected with a driven rod 230, and the bottom end of the driven rod 230 is fixedly connected with a baffle 220. Both sides of the baffle 220 are slidingly sealed and fitted with the inner side of the loading box 210. The transmission barrel 240 is installed in the mounting hole of the connecting plate 250 through a bearing rotation limiter. The rotation of the transmission barrel 240 causes the driven rod 230 to drive the baffle 220 to move up and down, so that the size of the opening formed by the loading box 210 and the baffle 220 changes, so that the loading speed of the material changes.

[0023] In some specific embodiments, the transmission barrel 240 is configured as a threaded sleeve barrel, the driven rod 230 is configured as a threaded rod, the transmission barrel 240 and the driven rod 230 are threadedly connected, and the rotation of the transmission barrel 240 causes the driven rod 230 to drive the baffle 220 to rise or fall.

[0024] In some specific embodiments, a rotating shaft 271 is rotatably installed at the bottom end of the horizontal plate 261, and a motor 270 is installed at the upper end of the horizontal plate 261. The rotating shaft 271 is driven by the motor 270. A belt 272 is externally sleeved on the rotating shaft 271 and the transmission barrel 240. The motor 270 drives the rotating shaft 271 to rotate, so that the transmission barrel 240 rotates.

[0025] In some specific embodiments, an inclined plate 280 is obliquely installed on the inner wall of the loading box 210 .

[0026] In some specific embodiments, a slider 221 is fixedly mounted on one side of the baffle 220 , a slide groove is provided on the inner wall of the batching barrel 100 , and the slider 221 is slidably connected in the slide groove to enhance the stability of the baffle 220 when moving.

[0027] In some specific embodiments, the mixing barrel 100 is connected to the outside and is provided with a discharge pipe 290 , and the discharge pipe 290 is provided with a solenoid valve 291 .

[0028] In some specific embodiments, the stirring mechanism 300 includes a rotating rod 310, which is rotatably installed at the bottom end of the batching barrel 100, and a stirring rod 320 is fixedly installed on the outside of the rotating rod 310. The stirring rod 320 is arranged in multiple groups, and a second motor 330 is installed at the bottom end of the batching barrel 100. The rotating rod 310 is driven by the second motor 330, and the second motor 330 drives the rotating rod 310 so that the second motor 330 stirs the wafer polishing liquid.

[0029] In some specific implementation schemes, a support rod 340 is fixedly installed at the bottom end of the mixing barrel 100 , and the mixing barrel 100 is supported by the support rod 340 and the bottom plate 350 .

[0030] Working principle: When in use, the wafer polishing liquid material is poured into multiple groups of loading boxes 210, and the material is loaded through the opening formed by the loading boxes 210 and the baffle 220 and through the inclined plate 280. When the feeding speed of a wafer polishing liquid material needs to be adjusted, the rotating shaft 271 is driven by the motor 270, and the rotation of the rotating shaft 271 causes the transmission barrel 240 to rotate. The rotation of the transmission barrel 240 causes the driven rod 230 to drive the baffle 220 to move up and down, so that the size of the opening formed by the loading boxes 210 and the baffle 220 changes, so that the loading speed of the wafer polishing liquid material changes, and the rotating rod 310 is driven by the second motor 330 so that the rotating rod 310 stirs the wafer polishing liquid.

[0031] The above description is only the preferred implementation of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A wafer polishing liquid batching barrel, characterized in that: It includes a batching barrel, a batching adjustment mechanism is installed on the upper end of the batching barrel, the batching adjustment mechanism is used to feed a variety of wafer polishing liquid materials and adjust the feeding speed, the bottom end of the batching barrel is installed with a stirring mechanism, the stirring mechanism is used to stir the wafer polishing liquid, the batching adjustment mechanism includes a feeding box, the feeding box is fixedly installed on the inner side of the upper end of the batching barrel, the upper end and one side of the feeding box are opened, the upper end of the batching barrel is fixedly installed with a vertical plate, the upper end of the vertical plate is fixedly installed with a horizontal plate, one side of the horizontal plate is fixedly installed with a connecting plate, the connecting plate is provided with a mounting hole and a transmission barrel is rotatably installed in the mounting hole, the inner wall of the transmission barrel is transmission-connected with a driven rod, the bottom end of the driven rod is fixedly connected with a baffle, and both sides of the baffle are slidingly sealed and fitted with the inner side of the feeding box.

2. A wafer polishing liquid dispensing barrel according to claim 1, characterized in that: The transmission barrel is configured as a threaded sleeve barrel, the driven rod is configured as a threaded rod, and the transmission barrel and the driven rod are threadedly connected.

3. A wafer polishing liquid dispensing barrel according to claim 1, characterized in that: A rotating shaft is rotatably mounted on the bottom end of the horizontal plate, a motor is mounted on the upper end of the horizontal plate, the rotating shaft is driven by the motor, and a belt is sleeved on the outside of the rotating shaft and the transmission barrel.

4. A wafer polishing liquid dispensing barrel according to claim 1, characterized in that: An inclined plate is obliquely installed on the inner wall of the loading box.

5. A wafer polishing liquid dispensing barrel according to claim 1, characterized in that: A sliding block is fixedly mounted on one side of the baffle, a sliding groove is arranged on the inner wall of the batching barrel, and the sliding block is slidably connected in the sliding groove.

6. A wafer polishing liquid dispensing barrel according to claim 1, characterized in that: The outside of the batching barrel is connected to a discharge pipe installed, and the discharge pipe is provided with a solenoid valve.

7. A wafer polishing liquid dispensing barrel according to claim 1, characterized in that: The stirring mechanism includes a rotating rod, which is rotatably installed at the bottom end of the mixing barrel. A stirring rod is fixedly installed outside the rotating rod. There are multiple groups of stirring rods. A second motor is installed at the bottom end of the mixing barrel, and the rotating rod is driven by the second motor.

8. A wafer polishing liquid dispensing barrel according to claim 1, characterized in that: A support rod is fixedly installed at the bottom end of the batching barrel, and the batching barrel is supported by the support rod and the bottom plate.

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