Self-cleaning press-fitting equipment for semiconductor device

Abstract

The utility model discloses self-cleaning press-fitting equipment for a semiconductor device. The self-cleaning press-fitting equipment comprises a dustproof box; the hydraulic telescopic rod is communicated with an external hydraulic pipeline, and the outer wall of the hydraulic telescopic rod is fixedly connected with the inner wall of the dustproof box; the outer walls of the rotating plates are rotationally connected with the inner wall of the dustproof box through rotating shafts, and the rotating plates are symmetrically mounted on the two sides of the inner cavity of the dustproof box; the outer wall of the motor driving rod is fixedly connected with an external motor, the device relates to the technical field of press fitting, the dustproof box, the outer barrier strip, the inner barrier strip, the cover plate and the adhesive tape film are arranged, the probability that semiconductor components are polluted during press fitting can be effectively avoided, meanwhile, the device is of a detachable structure, and the device is convenient to use. Quick-wear parts can be quickly replaced, disassembled and assembled, the influence of shutdown replacement on normal production of equipment is reduced, the angle of the connecting arm is adjustable, and the universality and flexibility of use of the equipment are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of press-assembly, in particular to a self-cleaning press-assembly device for semiconductor devices. Background Art

[0002] As precision components, semiconductor components have high requirements for the pressing process during the pressing process. Traditional pressing methods are mostly manual pressing or mechanical pressing. Traditional manual pressing has unstable pressing pressure, and the direct pressing of components by human hands is prone to dust, sweat and other dirt on the surface of components, affecting the pressing efficiency and quality. Although traditional mechanical pressing can effectively avoid the shortcomings of manual pressing, the mechanical pressing head is directly exposed to the outside and in direct contact with the components, it is still easy to cause contamination to the components. Utility Model Content

[0003] In view of the deficiencies of the prior art, the technical solution adopted by the utility model to solve the technical problems is: a semiconductor device self-cleaning press-fitting device, comprising: a dustproof box; a hydraulic telescopic rod, the hydraulic telescopic rod is connected to an external hydraulic pipeline, the outer wall of the hydraulic telescopic rod is fixedly connected to the inner wall of the dustproof box; a rotating plate, the outer wall of the rotating plate is rotatably connected to the inner wall of the dustproof box through a rotating shaft, and the rotating plate is symmetrically installed on both sides of the inner cavity of the dustproof box; a motor driving rod, the outer wall of the motor driving rod is fixedly connected to an external motor;

[0004] The outer wall of the bottom of the rotating plate is fixedly connected with an outer baffle, and the inner wall of the bottom of the rotating plate is fixedly connected with an inner baffle. The outer baffle and the inner baffle are arranged alternately. The outer wall of the motor driving rod is slidably connected to the inner wall of the dustproof box through an arc groove. The arc groove is opened on the inner walls on both sides of the dustproof box. The bottom end of the hydraulic telescopic rod is fixedly connected with a pressing mechanism.

[0005] Preferably, a compression spring is symmetrically arranged on the top of the pressing mechanism, the bottom end of the compression spring is fixedly connected to a marking rod, the inner wall of the bottom end of the marking rod is rollingly connected to a ball, and the side wall of the marking rod is slidably connected to a cover plate.

[0006] Preferably, the top end of the compression spring is slidably connected to the inner wall of the top of the dustproof box, the side wall of the marking rod is slidably connected to the inner wall of the dustproof box through a slide groove, the slide groove is opened in the wall of the dustproof box, and the outer wall of the top of the dustproof box is slidably connected to the bottom of the cover plate.

[0007] Preferably, the pressing mechanism includes a pressing plate, the four corners of the top of the pressing plate are fixedly connected with inclined top blocks, the outer wall of the inclined top block is rotatably connected with a connecting arm, the inner wall of the top of the connecting arm is rotatably connected with a roller, the two sides of the outer wall of the roller are fixedly connected with side plates, and the outer wall of the side plate is slidably connected with a tape film.

[0008] Preferably, the adhesive side of the tape film is wrapped around the outer wall of the drum, the top of the pressure plate is fixedly connected to the bottom end of the hydraulic telescopic rod, the inner walls on both sides of the bottom of the pressure plate are rotatably connected to rollers, the rollers are made of a sparse rubber material, and the outer wall of the roller is rollingly connected to the adhesive side of the tape film.

[0009] Preferably, the inner wall of the motor drive rod is plugged into the outer wall of the roller near the arc groove side through a cross block, the cross block is fixedly connected to the two ends of the roller near the arc groove side, the inner wall of the motor drive rod is provided with a cross groove, the inner wall of the top end of the connecting arm is plugged with a pin, the outer wall of the pin is slidably connected to the outer wall of the roller, the top end of the pin passes through the roller and extends to the outside of the roller.

[0010] The beneficial effects of the utility model are as follows:

[0011] The utility model can effectively avoid the probability of semiconductor components being contaminated during press-fitting by arranging a dustproof box, an outer baffle, an inner baffle, a cover plate and a tape film. At the same time, the equipment adopts a detachable structure, which can quickly complete the rapid replacement and disassembly of wearing parts, reduce the impact of shutdown replacement on the normal production of the equipment, and the angle of the connecting arm is adjustable, which increases the versatility and flexibility of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is the front view of the utility model;

[0013] Figure 2 It is a cross-sectional view of the utility model;

[0014] Figure 3 It is a structural schematic diagram of the press-fitting mechanism of the utility model;

[0015] Figure 4 It is a schematic diagram of the structure of the utility model at A;

[0016] Figure 5 It is a schematic diagram of the structure of the utility model at B;

[0017] In the figure: 1. dustproof box; 2. hydraulic telescopic rod; 3. rotating plate; 4. arc groove; 5. outer baffle; 8. motor drive rod; 6. inner baffle; 7. pressing mechanism; 9. roller; 20. pressing plate; 21. inclined top block; 22. connecting arm; 23. side plate; 24. roller; 25. tape film; 10. slide groove; 11. cover plate; 12. marking rod; 13. compression spring; 14. ball bearing; 26. cross block; 27. latch. DETAILED DESCRIPTION

[0018] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations are obvious to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and design various embodiments with various modifications suitable for specific purposes.

[0019] Example:

[0020] See also Figure 1 - Figure 5 The utility model provides a technical solution: a semiconductor device self-cleaning press-fitting device, comprising:

[0021] A dustproof box 1; a hydraulic telescopic rod 2, the hydraulic telescopic rod 2 is connected to an external hydraulic pipeline, and the outer wall of the hydraulic telescopic rod 2 is fixedly connected to the inner wall of the dustproof box 1; a rotating plate 3, the outer wall of the rotating plate 3 is rotatably connected to the inner wall of the dustproof box 1 through a rotating shaft, and the rotating plate 3 is symmetrically installed on both sides of the inner cavity of the dustproof box 1; a motor driving rod 8, the outer wall of the motor driving rod 8 is fixedly connected to the external motor; the outer wall of the bottom of the rotating plate 3 is fixedly connected with an outer baffle 5, and the inner wall of the bottom of the rotating plate 3 is fixedly connected with an inner baffle 6, the outer baffle 5 and the inner baffle 6 are arranged alternately, the outer wall of the motor driving rod 8 is slidably connected to the inner wall of the dustproof box 1 through an arc groove 4, and the arc groove 4 is opened on the inner wall on both sides of the dustproof box 1, and the bottom end of the hydraulic telescopic rod 2 is fixedly connected with a pressing mechanism 7. A compression spring 13 is symmetrically arranged on the top of the pressing mechanism 7, and a marking rod 12 is fixedly connected to the bottom end of the compression spring 13. A ball 14 is rollingly connected to the inner wall of the bottom end of the marking rod 12, and a cover plate 11 is slidably connected to the side wall of the marking rod 12.

[0022] The top of the compression spring 13 is slidably connected to the inner wall of the top of the dustproof box 1, and the side wall of the marking rod 12 is slidably connected to the inner wall of the dustproof box 1 through the slide groove 10. The slide groove 10 is opened in the wall of the dustproof box 1, and the outer wall of the top of the dustproof box 1 is slidably connected to the bottom of the cover plate 11. The pressing mechanism 7 includes a pressing plate 20, and the four corners of the top of the pressing plate 20 are fixedly connected to the inclined top block 21, and the outer wall of the inclined top block 21 is rotatably connected to the connecting arm 22, and the inner wall of the top of the connecting arm 22 is rotatably connected to the roller 24, and the two sides of the outer wall of the roller 24 are fixedly connected to the side disc 23, and the outer wall of the side disc 23 is slidably connected to the tape film 25.

[0023] The adhesive side of the tape film 25 is wound around the outer wall of the drum 24, the top of the pressing plate 20 is fixedly connected to the bottom end of the hydraulic telescopic rod 2, and the inner walls on both sides of the bottom of the pressing plate 20 are rotatably connected with rollers 9, the rollers 9 are made of a sparse rubber material, and the outer walls of the rollers 9 are rollingly connected to the adhesive side of the tape film 25. The inner wall of the motor drive rod 8 is plugged into the outer wall of the drum 24 near the arc groove 4 through a cross block 26, the cross block 26 is fixedly connected to the two ends of the drum 24 near the arc groove 4, the inner wall of the motor drive rod 8 is provided with a cross groove, the inner wall of the top end of the connecting arm 22 is plugged with a latch 27, the outer wall of the latch 27 is slidably connected to the outer wall of the drum 24, and the top end of the latch 27 passes through the drum 24 and extends to the outside of the drum 24.

[0024] Working principle:

[0025] When the device is in use, the semiconductor device to be press-fitted enters the dustproof box 1 from the bottom of the rotating plate 3 on the side away from the arc groove 4, and stops after moving to the bottom of the pressing mechanism 7. The hydraulic telescopic rod 2 pushes the pressing mechanism 7 downward to press the semiconductor device to be press-fitted under the control of the external hydraulic pipeline. After the semiconductor device is press-fitted, the hydraulic telescopic rod 2 drives the pressing mechanism 7 to move upward, separates from the semiconductor component after press-fitting, and then takes it out from the bottom of the rotating plate 3 on the side close to the arc groove 4. During the whole process, since the outer baffle 5 and the inner baffle 6 are staggered at the bottom of the rotating plate 3, the probability of dust entering the dustproof box 1 can be effectively reduced.

[0026] Then repeat the above steps, the semiconductor components to be pressed enter from the bottom of the rotating plate 3 on the side away from the arc groove 4, and then, the motor drive rod 8 is inserted into the outside of the cross block 26 under the push of the motor. Under the connection between the cross block 26 and the cross groove, the motor drive rod 8 drives the roller 24 to rotate a certain angle, and the section of the tape film 25 that is in contact with the pressed component is shrunk and wound to the outside of the roller 24, and the new tape film 25 is drawn out from the outside of the roller 24 on the side away from the arc groove 4 until it moves to the bottom of the pressing plate 20. The side plate 23 prevents the tape film 25 from deviating during the process of drawing out and winding in. At this time, the equipment completes the preparation work before the secondary pressing, and a pressing process is completed. It only needs to press the hydraulic telescopic rod 2 again, and then repeat the above steps to complete the subsequent repeated pressing work.

[0027] During the pressing process of the equipment, the bottom of the pressing plate 20 inside the equipment is indirectly in contact with the semiconductor components to be pressed through the tape film 25, and after the tape film 25 completes one pressing, the pressing plate 20 moves up and resets, and the motor driving rod 8 is connected to the roller 24 again to control the new tape film 25 to be drawn out, and the tape film 25 that has been pressed and contacted is rolled up, ensuring that the semiconductor components to be pressed are always in contact with the clean tape film 25. At the same time, the inner baffle 6 and the outer baffle 5 are staggered, which can further effectively prevent the external dust and hand sweat and oil from contaminating the components during manual pressing. When the pressing plate 20 is pressed down, the motor driving rod 8 is separated from the roller 24;

[0028] As the equipment continues to press-fit, the adhesive tape film 25 wound around the outside of the roller 24 on one side close to the motor drive rod 8 gradually increases, while the adhesive tape film 25 wound around the outside of the roller 24 on the other side gradually decreases. At this time, the adhesive tape film 25 wound around the outside of the roller 24 on one side close to the motor drive rod 8 rolls in contact with the bottom of the ball 14, forcing the marking rod 12 on its top to gradually rise, and the compression spring 13 gradually squeezes and contracts, and the marking rod 12 moves up relative to the cover plate 11, and the scale on its outside indicates the degree of winding. When the winding reaches the maximum degree, the marking value of the marking rod 12 returns to zero, and the equipment is stopped from pressing, and a new adhesive tape film 25 is replaced to prevent the equipment from idling and causing pressing pollution.

[0029] When it is necessary to replace the new adhesive tape film 25, the latch 27 is pulled out obliquely upward, and the two rollers 24 are taken out from the connecting arm 22. Then, the roller 24 on the side away from the motor drive rod 8 is installed first, and the latch 27 on its outside is plugged in. Then, the roller 24 on the side close to the motor drive rod 8 is installed, and the latch 27 is also plugged in. Then, the adhesive tape film 25 on the outside of the roller 24 on the side away from the motor drive rod 8 is pulled out, and it is wound obliquely upward along the bottom of the two rollers 9 to the outside of the roller 24 on the side close to the motor drive rod 8. Since the side of the adhesive tape film 25 in contact with the roller 24 is sticky, it can effectively prevent it from falling off.

[0030] In order to adapt to tape films 25 of different thicknesses and press-fitted semiconductor components of different specifications, and at the same time, to ensure that the tape film 25 has a certain degree of tension to prevent it from falling off the roller 9, the screws at the bottom of the connecting arm 22 can be loosened before the equipment is used, and the relative angle between the connecting arm 22 and the inclined top block 21 can be adjusted, and then the screws can be tightened. During this process, the motor drive rod 8 changes its position relative to the arc groove 4. In order to ensure that the marking rod 12 is always within the marking interval, the marking rod 12 slides left and right along the inside of the slide groove 10 to ensure that the ball 14 is at the top of the roller 24. The cover plate 11 prevents external dust from falling into the equipment through the slide groove 10.

[0031] Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field and related fields without creative work should fall within the scope of protection of the present invention. Structures, devices and operating methods not specifically described and explained in the present invention shall be implemented according to conventional means in the field unless otherwise specified and limited.

Claims

1. A semiconductor device self-cleaning press-assembly equipment, characterized in that: include: Dustproof box (1); A hydraulic telescopic rod (2), the hydraulic telescopic rod (2) being connected to an external hydraulic pipeline, and the outer wall of the hydraulic telescopic rod (2) being fixedly connected to the inner wall of the dustproof box (1); A rotating plate (3), the outer wall of the rotating plate (3) being rotatably connected to the inner wall of the dustproof box (1) via a rotating shaft, and the rotating plate (3) being symmetrically mounted on both sides of the inner cavity of the dustproof box (1); A motor drive rod (8), the outer wall of which is fixedly connected to an external motor; The outer wall of the bottom of the rotating plate (3) is fixedly connected to an outer baffle (5), and the inner wall of the bottom of the rotating plate (3) is fixedly connected to an inner baffle (6). The outer baffle (5) and the inner baffle (6) are arranged alternately. The outer wall of the motor drive rod (8) is slidably connected to the inner wall of the dustproof box (1) through an arc groove (4). The arc groove (4) is provided on the inner walls of both sides of the dustproof box (1). The bottom end of the hydraulic telescopic rod (2) is fixedly connected to a pressing mechanism (7).

2. A semiconductor device self-cleaning press-assembly equipment according to claim 1, characterized in that: A compression spring (13) is symmetrically arranged on the top of the pressing mechanism (7); the bottom end of the compression spring (13) is fixedly connected to a marking rod (12); a ball (14) is rollingly connected to the inner wall of the bottom end of the marking rod (12); and a cover plate (11) is slidably connected to the side wall of the marking rod (12).

3. A semiconductor device self-cleaning press-assembly device according to claim 2, characterized in that: The top end of the compression spring (13) is slidably connected to the inner wall of the top of the dustproof box (1), the side wall of the marking rod (12) is slidably connected to the inner wall of the dustproof box (1) via a slide groove (10), the slide groove (10) is opened in the wall of the dustproof box (1), and the outer wall of the top of the dustproof box (1) is slidably connected to the bottom of the cover plate (11).

4. The semiconductor device self-cleaning press-assembly equipment according to claim 1, characterized in that: The pressing mechanism (7) comprises a pressing plate (20), the four corners of the top of the pressing plate (20) are fixedly connected to inclined top blocks (21), the outer wall of the inclined top block (21) is rotatably connected to a connecting arm (22), the inner wall of the top of the connecting arm (22) is rotatably connected to a roller (24), the two sides of the outer wall of the roller (24) are fixedly connected to side plates (23), and the outer wall of the side plate (23) is slidably connected to a tape film (25).

5. A semiconductor device self-cleaning press-assembly equipment according to claim 4, characterized in that: The adhesive side of the adhesive tape film (25) is wound around the outer wall of the roller (24); the top of the pressure plate (20) is fixedly connected to the bottom end of the hydraulic telescopic rod (2); the inner walls on both sides of the bottom of the pressure plate (20) are rotatably connected to rollers (9); the rollers (9) are made of a sparse rubber material; the outer walls of the rollers (9) are rollingly connected to the adhesive side of the adhesive tape film (25).

6. A semiconductor device self-cleaning press-assembly equipment according to claim 4, characterized in that: The inner wall of the motor drive rod (8) is plugged into the outer wall of the roller (24) on the side close to the arc groove (4) through a cross block (26); the cross block (26) is fixedly connected to the two ends of the roller (24) on the side close to the arc groove (4); the inner wall of the motor drive rod (8) is provided with a cross groove; the inner wall of the top end of the connecting arm (22) is plugged with a latch (27); the outer wall of the latch (27) is slidably connected to the outer wall of the roller (24); the top end of the latch (27) passes through the roller (24) and extends to the outside of the roller (24).

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