Temperature-controllable semiconductor safety moisture-proof device

Abstract

The utility model discloses a temperature-controllable semiconductor safety moisture-proof device which comprises a cabinet body, two fixing plates are arranged in the cabinet body, a plurality of through holes are formed in the fixing plates in a penetrating mode, a plurality of storage frames are fixedly connected to the fixing plates, a drying box is formed in one side of the cabinet body in a penetrating mode, and the drying box is fixedly connected to the cabinet body. An air inlet is formed in the other end of the drying box in a penetrating mode, an open groove is formed in the upper end of the drying box, a dustproof net plate and a drying plate are correspondingly arranged in the open groove, the drying box is arranged at one end of the cabinet door, air entering the cabinet body can be dried, and therefore the damp-proof effect of the whole device is achieved; and meanwhile, a dustproof net plate is arranged in the drying box, so that impurities and dust in the air can be intercepted, the dust is prevented from entering the cabinet body to damage the semiconductor, and the moisture-proof performance and the protection performance of the whole device are improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor safety moisture-proof devices, in particular to a temperature-controllable semiconductor safety moisture-proof device. Background Art

[0002] Semiconductors, as the name implies, are a type of object with conductivity between conductors and insulators. Changing the conductivity of materials by adding impurities is the underlying foundation of semiconductor technology. Semiconductors usually need to be treated with moisture-proof treatment during storage to prevent them from being damaged by moisture.

[0003] The internal space of the existing moisture-proof device is mostly a whole, and generally relies on fans to circulate air inside the device as a whole. The circulating air can indeed dry the semiconductor board, but a little moisture will remain during the drying process, and the moisture-proof effect is not thorough enough;

[0004] In view of the above reasons, it is necessary to design a temperature-controllable semiconductor safety moisture-proof device with better moisture-proof effect. Utility Model Content

[0005] The purpose of the utility model is to provide a temperature-controllable semiconductor safety moisture-proof device, which solves the problem that moisture-proofing by circulating air blowing in the prior art can indeed dry the semiconductor board, but a little moisture will remain during the air drying, and the moisture-proof effect is not thorough enough.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a temperature-controllable semiconductor safety moisture-proof device, comprising a cabinet, two fixing plates are arranged inside the cabinet, a plurality of through holes are opened inside the fixing plates, a plurality of storage frames are fixedly connected to the fixing plates, and a drying box is opened on one side of the cabinet;

[0007] An air inlet is provided through the other end of the drying box, a slot is provided at the upper end of the drying box, and a dustproof screen plate and a drying plate are correspondingly arranged inside the slot.

[0008] As a further description of the above technical solution: a second slide groove is opened at both ends of the dustproof screen plate and the drying plate, and a second slider is fixedly connected to the inner ends of the groove, and the second slider is slidably connected to the inside of the second slide groove.

[0009] As a further description of the above technical solution: the upper ends of the dustproof screen plate and the drying plate are fixedly connected with positioning blocks, the upper end of the slot is provided with a positioning groove, and screw holes are provided on the positioning block and the positioning groove.

[0010] As a further description of the above technical solution: first sliding grooves are provided at both ends of the inner side of the storage frame, and a first sliding block is slidably connected inside the first sliding groove.

[0011] As a further description of the above technical solution: the outer end of the first sliding block is fixedly connected to a limit plate, the two inner ends of the first sliding groove are fixedly connected to springs, and the other end of the spring is fixedly connected to the first sliding block.

[0012] As a further description of the above technical solution: limiting grooves are provided at both ends of the inner side of the cabinet, both ends of the fixing plate are fixedly connected to limiting blocks, and both ends of the cabinet are threadedly connected with positioning bolts.

[0013] As a further description of the above technical solution: a cabinet door is arranged on the outer side of the cabinet body.

[0014] The utility model has the following beneficial effects:

[0015] 1. Compared with the prior art, the temperature-controllable semiconductor safety moisture-proof device can dry the air entering the cabinet by setting a drying box at one end of the cabinet door, thereby achieving the moisture-proof effect of the entire device. At the same time, a dust-proof mesh plate is set inside the drying box to intercept impurities and dust in the air, preventing dust from entering the cabinet to damage the semiconductor, thereby improving the moisture-proof performance and protection performance of the entire device;

[0016] 2. Compared with the prior art, this temperature-controllable semiconductor safety and moisture-proof device can limit the semiconductor by setting a storage frame, a first slider, a first slide groove, a spring and a limit plate, ensuring that the semiconductor can be stably placed inside the cabinet, thereby improving the practicality of the device.

[0017] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present invention is further described below with reference to the accompanying drawings and embodiments;

[0019] Figure 1 It is a schematic diagram of the overall front structure of the utility model.

[0020] Figure 2 It is a schematic diagram of the storage frame structure of the utility model.

[0021] Figure 3 It is a sectional view of a cabinet of the utility model.

[0022] Figure 4 yes Figure 1 Schematic diagram of the structure of A.

[0023] Legend:

[0024] 1. Cabinet body; 2. Drying plate; 3. Positioning block; 4. Dustproof screen; 5. Screw hole; 6. Drying box; 7. Air inlet; 8. Through hole; 9. Cabinet door; 10. Storage frame; 11. Fixing plate; 12. Limiting plate; 13. First slide groove; 14. First slider; 15. Spring; 16. Limiting groove; 17. Positioning bolt; 18. Positioning groove; 19. Limiting block; 20. Second slide groove; 21. Slot; 22. Second slider. DETAILED DESCRIPTION

[0025] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.

[0026] Reference Figure 1-4 The utility model provides an embodiment of a temperature-controllable semiconductor safety and moisture-proof device, comprising a cabinet 1, two fixing plates 11 are arranged inside the cabinet 1, and the fixing plates 11 can realize the separation operation, and a plurality of through holes 8 are opened inside the fixing plates 11, and a plurality of storage frames 10 are fixedly connected to the fixing plates 11, and a drying box 6 is opened on one side of the cabinet 1, and the air circulation function can be realized under the action of the through holes 8, and a corresponding air outlet is opened at the other end of the cabinet 1, and a fan assembly and a heating assembly are arranged inside the drying box 6, and air can be sent into the drying box 6 through the fan assembly, and the air can be heated after passing through the heating assembly, so that the semiconductor inside can be dried, and in order to ensure the temperature controllable operation of the entire device, a temperature sensor and a humidity sensor are arranged inside the cabinet 1 to ensure the placement environment of the internal semiconductor;

[0027] The other end of the drying box 6 is penetrated by an air inlet 7, and the upper end of the drying box 6 is provided with a slot 21, and the inside of the slot 21 is correspondingly provided with a dustproof screen 4 and a drying plate 2. By providing the drying plate 2, the initial drying can be achieved, and the moisture-proof performance can be improved. At the same time, under the action of the dustproof screen 4, the dustproof operation can be achieved, and dust can be prevented from entering the interior of the cabinet 1 to cause damage to the semiconductor;

[0028] The dustproof mesh plate 4 and the drying plate 2 are provided with second slide grooves 20 at both ends, and the inner ends of the grooves 21 are fixedly connected with second sliders 22, and the second sliders 22 are slidably connected to the inside of the second slide grooves 20. The upper ends of the dustproof mesh plate 4 and the drying plate 2 are fixedly connected with positioning blocks 3, and the upper ends of the grooves 21 are provided with positioning grooves 18, and screw holes 5 are provided on the positioning blocks 3 and the positioning grooves 18. By providing the second sliders 22 and the second slide grooves 20, it is convenient for the staff to regularly disassemble, clean and replace the dustproof mesh plate 4 and the drying plate 2, thereby improving the dustproof effect and drying effect of the entire device.

[0029] The storage frame 10 has first slide grooves 13 at both ends of the inner side, and the first slider 14 is slidably connected inside the first slide groove 13. The outer end of the first slider 14 is fixedly connected to the limit plate 12. The inner ends of the first slide groove 13 are fixedly connected to springs 15. The other end of the spring 15 is fixedly connected to the first slider 14. The limit plates 12 at both ends are moved outward to ensure that the semiconductor can be stably placed inside the storage frame 10. Then, the limit plates 12 are released. Under the action of the spring 15, the limit plates 12 can be reset to position and clamp the semiconductor, thereby improving the stability of the semiconductor when it is placed.

[0030] Limiting grooves 16 are provided at both ends of the inner side of the cabinet body 1, and limiting blocks 19 are fixedly connected to both ends of the fixing plate 11. Positioning bolts 17 are threadedly connected to both ends of the cabinet body 1. A cabinet door 9 is provided on the outer side of the cabinet body 1. The action between the limiting grooves 16 and the limiting blocks 19 can facilitate the staff to disassemble the fixing plate 11, and the positioning bolts 17 can lock it to improve its stability during use.

[0031] Working principle: When the device is in use, the staff first opens the cabinet door 9 to place the semiconductor inside the storage frame 10, and moves the limit plates 12 at both ends outward to ensure that the semiconductor can be stably placed inside the storage frame 10. Then, the limit plates 12 are released, and the limit plates 12 are reset under the action of the springs 15 to position and clamp the semiconductor, thereby improving the stability of the semiconductor when it is placed. Then, the fan assembly and the heating assembly inside the drying box 6 are started to heat the air entering the drying box 6 to dry the internal semiconductors. At the same time, when the air passes through the drying box 6, it can achieve its dust-proof and drying effect through the internal dust-proof mesh plate 4 and the drying plate 2, thereby improving the dust-proof effect of the entire device. The air can also be subjected to multiple dehumidification treatments to improve the practicality and convenience of the entire device.

[0032] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. A temperature-controllable semiconductor safety moisture-proof device, comprising a cabinet (1), characterized in that: Two fixing plates (11) are arranged inside the cabinet (1), a plurality of through holes (8) are opened through the inside of the fixing plates (11), a plurality of storage frames (10) are fixedly connected to the fixing plates (11), and a drying box (6) is opened through one side of the cabinet (1); The other end of the drying box (6) is provided with an air inlet (7), the upper end of the drying box (6) is provided with a slot (21), and a dustproof screen plate (4) and a drying plate (2) are correspondingly arranged inside the slot (21).

2. A temperature-controllable semiconductor safety moisture-proof device according to claim 1, characterized in that: The dustproof screen plate (4) and the drying plate (2) are provided with second slide grooves (20) at both ends, and the inner ends of the grooves (21) are fixedly connected with second sliders (22), and the second sliders (22) are slidably connected inside the second slide grooves (20).

3. A temperature-controllable semiconductor safety moisture-proof device according to claim 1, characterized in that: The dustproof screen plate (4) and the upper end of the drying plate (2) are fixedly connected with a positioning block (3), the upper end of the slot (21) is provided with a positioning groove (18), and screw holes (5) are provided on the positioning block (3) and the positioning groove (18).

4. The temperature-controllable semiconductor safety moisture-proof device according to claim 1, characterized in that: The storage frame (10) has first sliding grooves (13) at both ends of its inner side, and a first sliding block (14) is slidably connected inside the first sliding groove (13).

5. A temperature-controllable semiconductor safety moisture-proof device according to claim 4, characterized in that: The outer end of the first sliding block (14) is fixedly connected to the limit plate (12), the inner two ends of the first sliding groove (13) are fixedly connected to springs (15), and the other end of the spring (15) is fixedly connected to the first sliding block (14).

6. The temperature-controllable semiconductor safety moisture-proof device according to claim 1, characterized in that: The cabinet body (1) has limit slots (16) at both ends of its inner side, the fixed plate (11) has limit blocks (19) fixedly connected at both ends, and positioning bolts (17) are threadedly connected at both ends of the cabinet body (1).

7. The temperature-controllable semiconductor safety moisture-proof device according to claim 1, characterized in that: A cabinet door (9) is arranged on the outer side of the cabinet body (1).

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