Discharging device for waste etching liquid

By designing the waste liquid discharge device in the mask wet etching process, and neutralizing the pH of the waste etching liquid by using the buffer bin and cleaning agent supply mechanism, the problem of waste liquid crystal blockage is solved, and the normal operation and cost reduction of the equipment are achieved .

CN222250985UActive Publication Date: 2024-12-27SHENZHEN LONGTU OPTICAL MASK CO LTD
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Patent Information

Application Number
CN202421112368.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-21
Publication Date
2024-12-27
Estimated Expiration
2034-05-21

AI Technical Summary

Technical Problem

In the wet etching process of mask plate, the change in the pH value of the waste etching liquid leads to a decrease in solubility, causing crystallization to block the discharge pipeline, and requires regular cleaning, which is time-consuming and labor-intensive, affecting the normal use of the equipment, and in severe cases, the pipeline needs to be replaced.

Method used

A waste etching liquid discharge device is designed, including waste liquid discharge pipeline, buffer bin and cleaning agent providing mechanism. By providing cleaners that neutralize the pH of waste etching liquid in the buffer bin, the formation of crystals is avoided, and the liquid is used. The position detection module automatically controls the supply of cleaning agents to ensure that the liquid starts or closes the supply of cleaning agents when the liquid level is preset.

Benefits of technology

It effectively avoids blockage of waste liquid discharge pipelines, reduces the cost of manual cleaning and pipeline replacement, and ensures the normal use and operation efficiency of etching equipment.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a waste etching liquid discharge device which comprises a waste liquid discharge pipeline, a buffer bin and a cleaning agent supply mechanism, and the waste liquid discharge pipeline is used for discharging waste etching liquid; a waste liquid inlet, a cleaning agent inlet and a liquid outlet are formed in the side wall of the temporary storage bin, and the waste liquid inlet communicates with a waste liquid discharging pipeline; and the cleaning agent supply mechanism is communicated with the cleaning agent liquid inlet and is used for supplying a cleaning agent for neutralizing the pH value of the waste etching liquid. The temporary storage bin can temporarily store waste etching liquid discharged by the waste liquid discharging pipeline through the waste liquid inlet, and the cleaning agent providing mechanism provides a cleaning agent for the temporary storage bin through the cleaning agent inlet, so that the pH value of the waste etching liquid is neutralized, the waste etching liquid is prevented from generating crystals, the blocking risk is further reduced, normal use of the etching equipment is guaranteed, and the service life of the etching equipment is prolonged. And the use cost of etching equipment is reduced.
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Description

Technical Field

[0001] The utility model belongs to the technical field of waste liquid discharge, and in particular relates to a discharge device for waste etching liquid. Background Art

[0002] The solubility of the main components of the etching solution in the mask wet etching process will decrease when the pH value changes, resulting in the precipitation of crystals. This phenomenon is particularly obvious during the waste liquid discharge process after the etching is completed. The discharge pipe is often blocked by crystallization and needs to be cleaned regularly, which is time-consuming and labor-intensive, and affects the normal use of the etching equipment. In severe cases, the pipeline needs to be replaced. Utility Model Content

[0003] The utility model provides a waste etching liquid discharge device, which is used to neutralize the acidity and alkalinity of the waste etching liquid and avoid the generation of crystals.

[0004] The present application provides a waste etching liquid discharge device, comprising:

[0005] A waste liquid discharge pipeline, used to discharge waste etching liquid;

[0006] A buffer chamber, wherein a waste liquid inlet, a cleaning agent inlet and a liquid discharge port are provided on the side wall of the buffer chamber, and the waste liquid inlet is connected to the waste liquid discharge pipeline;

[0007] A cleaning agent providing mechanism is communicated with the cleaning agent inlet and is used to provide cleaning agent for neutralizing the pH value of the waste etching liquid.

[0008] As a further solution of the waste etching liquid discharge device provided in the present application, it also includes a control unit, which is electrically connected to the cleaning agent providing mechanism and is used to start the cleaning agent providing mechanism when the liquid cached in the cache bin reaches a preset liquid level.

[0009] As a further solution of the waste etching liquid discharge device provided in the present application, the control unit includes a control switch and a liquid level detection module, the control switch is electrically connected to the liquid level detection module, the liquid level detection module is used to detect the liquid level in the buffer bin, and the control switch is connected to the cleaning agent providing mechanism, and the cleaning agent providing mechanism can be turned on or off when the liquid level detection module detects that the liquid level is higher or lower than a preset liquid level.

[0010] As a further solution of the waste etching liquid discharge device provided in the present application, the liquid level detection module is arranged on the inner wall of the buffer bin at a preset height.

[0011] As a further solution of the waste etching liquid discharge device provided in the present application, the height of the liquid level detection module is less than or equal to the height of the cleaning agent inlet.

[0012] As a further solution of the waste etching liquid discharge device provided in the present application, an air inlet hole is also provided on the buffer bin.

[0013] As a further solution of the waste etching liquid discharge device provided in the present application, the air inlet is arranged on the top wall of the buffer bin.

[0014] As a further solution of the waste etching liquid discharge device provided in the present application, it also includes a mixed liquid discharge pipeline, and the mixed liquid discharge pipeline is connected to the liquid discharge port.

[0015] As a further solution of the waste etching liquid discharge device provided in the present application, the height of the waste liquid inlet is greater than the height of the liquid discharge port.

[0016] As a further solution of the waste etching liquid discharge device provided in the present application, the side wall of the buffer bin is also provided with an opening which is kept normally closed, and the opening is used for allowing the dredging structure to enter the buffer bin to dredge the crystals.

[0017] The utility model provides a waste etching liquid discharge device, including a waste liquid discharge pipeline, a buffer chamber and a cleaning agent providing mechanism, wherein the waste liquid discharge pipeline is used to discharge the waste etching liquid; a waste liquid inlet, a cleaning agent inlet and a discharge port are provided on the side wall of the buffer chamber, and the waste liquid inlet is connected to the waste liquid discharge pipeline; the cleaning agent providing mechanism is connected to the cleaning agent inlet, and is used to provide a cleaning agent for neutralizing the pH value of the waste etching liquid. The buffer chamber can cache the waste etching liquid discharged from the waste liquid discharge pipeline through the waste liquid inlet, and the cleaning agent providing mechanism provides the cleaning agent to the buffer chamber through the cleaning agent inlet to neutralize the pH value of the waste etching liquid and avoid the formation of crystals, so as to further reduce the risk of blockage, ensure the normal use of the etching equipment, and reduce the use cost of the etching equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of the structure of a waste etching liquid discharge device provided in this application;

[0019] Figure 2 This is a structural block diagram of a control unit in the waste etching liquid discharge device provided in the present application. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is described below in conjunction with the accompanying drawings and embodiments.

[0021] The waste etching liquid generated by the wet etching process of the mask is usually discharged into the waste liquid pool. Regular manual cleaning of the pipeline is used to reduce the pipeline blockage problem caused by crystallization, which increases labor costs. Of course, in severe cases, the pipeline needs to be replaced, which increases the cost of emission equipment.

[0022] See also Figure 1 As shown, the waste etching liquid discharge device provided in this embodiment includes: a waste liquid discharge pipeline 10, a buffer chamber 20 and a cleaning agent providing mechanism 30.

[0023] The waste liquid discharge pipeline 10 is used to discharge waste etching liquid, which is waste liquid generated by the wet etching process of the mask. The mask is a mold composed of a metal layer film or a photoresist layer film with information such as graphics and text recorded on the surface, and a glass carrier plate made of high-purity fused quartz or other materials. The etching liquid is usually a mixture of perchloric acid, ammonium cerium nitrate and water, which can be used to undergo an oxidation-reduction reaction with the chromium metal layer without photoresist protection after the mask is developed, and the chromium metal is oxidized into a chromium ion sol and then separated from the mask.

[0024] The side wall of the buffer chamber 20 is provided with a waste liquid inlet 21, a cleaning agent inlet 22 and a discharge port 23, wherein the waste liquid inlet 21 is connected to the waste liquid discharge pipeline 10, and the waste etching liquid discharged from the waste liquid discharge pipeline 10 enters the buffer chamber 20 for buffering. The cleaning agent inlet 22 is connected to the cleaning agent providing mechanism 30, and the cleaning agent providing mechanism 30 is used to provide a cleaning agent for neutralizing the pH value of the waste etching liquid. The waste etching liquid buffered in the buffer chamber 20 can be neutralized by the cleaning agent provided by the cleaning agent providing mechanism 30 to avoid crystallization.

[0025] In one embodiment of the present application, the cleaning agent provided by the cleaning agent providing mechanism 30 is CM10 cleaning agent, the specific composition of which is a mixture of ferrous chloride and hydrochloric acid. It is mainly used as an acidic cleaning agent in the electronics industry, which can neutralize the pH value of the waste etching solution and prevent the waste etching solution from crystallizing.

[0026] Combination Figure 2 As shown, the waste etching liquid discharge device provided in this embodiment also includes a control unit 40, which is electrically connected to the cleaning agent providing mechanism 30. The control unit 40 is used to start the cleaning agent providing mechanism 30 when the liquid cached in the buffer bin 20 reaches a preset liquid level, thereby realizing automatic control of starting or shutting down the cleaning agent providing mechanism 30.

[0027] In this embodiment, the control unit 40 includes a control switch 41 and a liquid level detection module 42. The control switch 41 is electrically connected to the liquid level detection module 42. The liquid level detection module 42 is used to detect the liquid level in the buffer bin 20. The control switch 41 is connected to the cleaning agent providing mechanism 30. The control switch 41 can turn on or off the cleaning agent providing mechanism 30 when the liquid level detection module 42 detects that the liquid level is higher or lower than a preset liquid level.

[0028] Specifically, under normal circumstances, when the waste etching liquid cached in the buffer bin 20 is neutralized by the cleaning agent and the pH value is neutralized, the resulting mixed solution is discharged through the drain port 23. When the waste etching liquid cached in the buffer bin 20 is crystallized, the drain port 23 is blocked, causing the liquid level in the buffer bin 20 to rise. When the liquid level detection module 42 detects that the liquid level of the waste etching liquid cached in the buffer bin 20 is higher than the preset liquid level, an on signal is output to the control switch 41, so as to start the cleaning agent supply mechanism 30 through the control switch 41 to supply the cleaning agent to the buffer bin 20, so as to quickly neutralize the pH value of the crystals, form a mixed solution, and discharge it through the drain port 23. When the liquid level detection module 42 detects that the liquid level in the buffer bin 20 is reduced to below the preset liquid level due to the discharge, a off signal is output to the control switch 41, so as to close the cleaning agent supply mechanism 30 through the control switch 41.

[0029] In one embodiment, the liquid level detection module 42 may be an infrared sensor, which may be disposed outside the buffer bin 20 to detect the liquid level in the buffer bin 20 .

[0030] In this embodiment, the liquid level detection module 42 is an inductive sensor, and the liquid level detection module 42 is arranged on the inner wall of the buffer bin 20 along a preset height, wherein the preset height is the height value of the preset liquid level to be detected.

[0031] In one embodiment of the present application, the height at which the liquid level detection module 42 is disposed on the inner wall of the buffer bin 20 is less than or equal to the height at which the cleaning agent inlet 22 is disposed, thereby preventing the liquid from adversely affecting the liquid level detection module 42 .

[0032] In the present application, the buffer chamber 20 is preferably a closed structure, which can prevent odor from polluting the surrounding environment while buffering the waste etching liquid. In order to enable the liquid to be discharged smoothly through the drain port 23, the waste etching liquid discharge device provided in this embodiment is also provided with an air inlet 24 on the buffer chamber 20, and the air inlet 24 can balance the pressure inside the buffer chamber 10 and the external atmosphere.

[0033] At the same time, in order to prevent the waste etching liquid stored in the buffer chamber 20 from leaking through the air inlet 24, in this embodiment, the air inlet 24 is set on the top wall of the buffer chamber 20. It can be understood that the height of the air inlet 24 is higher than the height of the liquid level detection module 42.

[0034] Continue to see Figure 1 As shown, the waste etching liquid discharge device provided in this embodiment also includes a mixed liquid discharge pipeline 50, which is connected to the discharge port 23. The mixed liquid discharge pipeline 50 can be connected to a waste liquid pool. The waste etching liquid mixed with the cleaning agent in the buffer chamber 20 can be discharged into the waste liquid pool for storage through the mixed liquid discharge pipeline 50 for further processing.

[0035] In this embodiment, the height of the waste liquid inlet 21 is higher than the height of the liquid discharge port 23 to ensure the discharge of the mixed liquid. In a preferred embodiment, the liquid discharge port 23 is arranged at the bottom of the buffer chamber 20.

[0036] Here, it should be particularly noted that the waste liquid discharge pipeline 10 and the mixed liquid discharge pipeline 50 are discharge pipelines for the waste etching liquid, which is equivalent to setting a buffer bin in the middle of the waste etching liquid discharge pipeline, and the waste liquid discharge pipeline 10 is close to the equipment for the wet etching process. The close distance can prevent the waste etching liquid from precipitating and producing crystals during the process of being discharged from the waste liquid discharge pipeline 10 to the buffer bin 20, and the setting of the buffer bin 20 and the cleaning agent providing mechanism 30 can neutralize the pH value of the waste etching liquid to avoid the formation of crystals.

[0037] In some cases, when the cleaning agent is used up or is not discharged into the buffer bin 20 in time, the waste etching liquid in the buffer bin 20 will crystallize. To address this problem, in this embodiment, a normally closed opening 25 is provided on the side wall of the buffer bin 20. The opening 25 is used for the clearing structure 50 to enter the buffer bin 20 to clear the crystals.

[0038] In some embodiments, the dredging structure 50 can be, for example, a dredging rod of a solid columnar structure, which is extended into the interior of the buffer bin 20 through the opening 25, and the crystals are knocked in an irregular manner by moving the dredging structure 50, so that the crystals are knocked into fine pieces, so that the sparse crystals can be discharged through the opening 25 or the drain port 23.

[0039] To sum up, the waste etching liquid discharge device provided by the utility model can cache the waste etching liquid discharged from the waste liquid discharge pipeline through the waste liquid inlet, and the cleaning agent providing mechanism provides cleaning agent to the cache bin through the cleaning agent inlet to neutralize the pH value of the waste etching liquid and avoid the formation of crystals, so as to further reduce the risk of blockage, ensure the normal use of the etching equipment, and reduce the use cost of the etching equipment.

[0040] The above contents are further detailed descriptions of the present application in combination with specific implementation methods, and it cannot be determined that the specific implementation of the present application is limited to these descriptions. For ordinary technicians in the technical field to which the present application belongs, several simple deductions or substitutions can be made without departing from the inventive concept of the present application.

Claims

1. A waste etching liquid discharge device, characterized in that: include: A waste liquid discharge pipeline, used to discharge waste etching liquid; A buffer chamber, wherein a waste liquid inlet, a cleaning agent inlet and a liquid discharge port are provided on the side wall of the buffer chamber, and the waste liquid inlet is connected to the waste liquid discharge pipeline; A cleaning agent providing mechanism is communicated with the cleaning agent inlet and is used to provide cleaning agent for neutralizing the pH value of the waste etching liquid.

2. The waste etching liquid discharge device according to claim 1, characterized in that: It also includes a control unit, which is electrically connected to the cleaning agent providing mechanism and is used to start the cleaning agent providing mechanism when the liquid cached in the cache bin reaches a preset liquid level.

3. The waste etching liquid discharge device according to claim 2, characterized in that: The control unit includes a control switch and a liquid level detection module, the control switch is electrically connected to the liquid level detection module, the liquid level detection module is used to detect the liquid level in the buffer bin, the control switch is connected to the cleaning agent providing mechanism, and can turn on or off the cleaning agent providing mechanism when the liquid level detection module detects that the liquid level is higher or lower than a preset liquid level.

4. The waste etching liquid discharge device according to claim 3, characterized in that: The liquid level detection module is arranged on the inner wall of the buffer bin along a preset height.

5. The waste etching liquid discharge device according to claim 4, characterized in that: The height of the liquid level detection module is less than or equal to the height of the cleaning agent inlet.

6. The waste etching liquid discharge device according to claim 1, characterized in that: The cache compartment is also provided with an air inlet.

7. The waste etching liquid discharge device according to claim 6, characterized in that: The air inlet hole is arranged on the top wall of the cache bin.

8. The waste etching liquid discharge device according to claim 1, characterized in that: It also includes a mixed liquid discharge pipeline, which is communicated with the liquid discharge port.

9. The waste etching liquid discharge device according to claim 8, characterized in that: The height of the waste liquid inlet is greater than the height of the liquid discharge port.

10. The waste etching liquid discharge device according to claim 1, characterized in that: The side wall of the buffer bin is also provided with an opening which is kept normally closed, and the opening is used for allowing the dredging structure to enter the buffer bin to dredge the crystals.