Flame detection device for resisting low-temperature interference

Abstract

The utility model discloses a flame detection device for resisting low-temperature interference, which comprises a flame detector, and the flame detector comprises a constant-temperature shell, a front end sealing cover, a rear end sealing cover, a detection unit main body, a control unit and a circuit board, the front end sealing cover and the rear end sealing cover respectively seal and seal two ends of the constant-temperature shell to form a constant-temperature space, the circuit board is arranged in the constant-temperature space, the constant-temperature shell comprises an outer layer, an interlayer and an inner layer which are sequentially connected from outside to inside, a semiconductor chilling plate is arranged in the interlayer and is electrically connected with the control unit, and the control unit is electrically connected with the circuit board. The control unit and the detection unit main body are arranged on the circuit board. The constant-temperature space can be heated or cooled in a limited space by arranging the constant-temperature shell and matching the constant-temperature shell with the semiconductor chilling plate, so that the detection unit main body is in a proper temperature environment, normal detection precision can be realized, and the influence of a low-temperature environment is effectively resisted.

Description

Technical Field

[0001] The utility model relates to the technical field of flame detection, in particular to a flame detection device for resisting low-temperature interference. Background Art

[0002] The torch is a standing structure in a chemical plant, which is used to convert various flammable, explosive, toxic, and corrosive gases generated during the production process into harmless carbon dioxide, water, or other non-toxic or less toxic substances through combustion, thereby ensuring safety. In order to ensure the normal operation of the torch and to detect abnormal conditions in time and respond quickly, the torch usually needs to be used with a flame detector. The function of the flame detector is to detect the combustion conditions in real time according to the combustion characteristics of the flame. Once the flame combustion state does not meet normal conditions or is extinguished, a signal is given in a certain way. The flame detector commonly used for the torch is a remote ultraviolet flame detector for the torch disclosed in application number CN202023329793.1. However, the flame detector is easily affected by fog or frosting of the window in a low-temperature environment. At the same time, since the flame detector is often made of a metal shell with good thermal conductivity, the internal electrical components cannot work normally due to the low temperature, resulting in the accuracy being affected. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes a flame detection device for resisting low temperature interference, which can reduce the influence of low temperature environment on the flame detection device and ensure the normal operation of the flame detection device.

[0004] According to the first aspect of the utility model, a flame detection device for resisting low-temperature interference includes a flame detector, which includes a constant temperature shell, a front end cover, a rear end cover, a detection unit body, a control unit and a circuit board. The two ends of the constant temperature shell are open, and the front end cover and the rear end cover respectively seal the two ends of the constant temperature shell to form a constant temperature space. The circuit board is arranged in the constant temperature space. The constant temperature shell includes an outer layer, an interlayer and an inner layer which are connected and arranged in sequence from the outside to the inside. A semiconductor refrigeration plate is arranged in the interlayer, and the semiconductor refrigeration plate is electrically connected to the control unit. The control unit and the detection unit body are both arranged on the circuit board.

[0005] The flame detection device for resisting low-temperature interference according to the embodiment of the utility model has at least the following beneficial effects: by setting a constant temperature shell as the detection unit body, the influence of the external temperature on the inside of the constant temperature space is mitigated, and at the same time, when used in conjunction with a semiconductor refrigeration sheet, the constant temperature space can be heated or cooled within a limited space, so that the detection unit body is in a suitable temperature environment, thereby being able to achieve normal detection accuracy and effectively resist the influence of the low temperature environment.

[0006] According to some embodiments of the utility model, the semiconductor refrigeration plate includes a first substrate, multiple groups of PN junction semiconductor couples and a second substrate which are arranged in sequence from the outside to the inside, and the multiple groups of PN junction semiconductor couples are electrically connected to the control unit.

[0007] According to some embodiments of the utility model, the outer layer and the inner layer are both provided with a plurality of heat exchange protrusions respectively adapted to the PN junction semiconductor couple, the heat exchange protrusions in the outer layer extend away from the center of the constant temperature shell, and the heat exchange protrusions in the inner layer extend toward the center of the constant temperature shell.

[0008] According to some embodiments of the utility model, heat-conducting rods are embedded in the heat exchange protrusions in a one-to-one correspondence.

[0009] According to some embodiments of the present invention, the heat conducting rod in the outer layer is connected to the first substrate, and the heat conducting rod in the inner layer is connected to the second substrate.

[0010] According to some embodiments of the present invention, the thermal conductivity of the thermally conductive rod is greater than the thermal conductivity of the first substrate and the thermal conductivity of the second substrate.

[0011] According to some embodiments of the present invention, the thermal conductivity of the heat-conducting rod is greater than the thermal conductivity of the outer layer and the thermal conductivity of the inner layer.

[0012] According to some embodiments of the present invention, transparent glass is sealed in the front end cover.

[0013] According to some embodiments of the utility model, a wire is provided on the circuit board, and the control unit and the detection unit body are electrically connected to an external power source through the wire passing through the rear end cover.

[0014] According to some embodiments of the utility model, the control unit includes a DC control circuit and a temperature sensor electrically connected to the DC control circuit, the temperature sensor is exposedly arranged in the constant temperature space, and multiple groups of PN junction semiconductor couples are electrically connected to the DC control circuit.

[0015] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present invention is further described below with reference to the accompanying drawings and embodiments, wherein:

[0017] Figure 1This is a schematic structural diagram of a flame detection device for resisting low temperature interference according to an embodiment of the utility model.

[0018] Figure 2 for Figure 1 Schematic diagram of the enlarged structure of part A in the middle.

[0019] Figure 3 This is a schematic structural diagram of a flame detection device for resisting low temperature interference according to another embodiment of the utility model.

[0020] 110, outer layer; 121, first substrate; 122, PN junction semiconductor couple; 123, second substrate; 124, conductive metal sheet; 125, heat-insulating and flame-retardant material; 130, inner layer; 140, heat-exchanging protrusion; 141, heat-conducting rod; 210, front end cover; 211, transparent glass; 220, rear end cover; 310, detection unit body; 321, DC control circuit; 322, temperature sensor; 330, circuit board. DETAILED DESCRIPTION

[0021] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0022] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0023] In the description of the present utility model, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0024] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0025] refer to Figure 1 as well as Figure 2 As shown, according to an embodiment of the utility model, a flame detection device for resisting low-temperature interference includes a flame detector, which includes a constant temperature shell, a front cover 210, a rear cover 220, a detection unit body 310, a control unit and a circuit board 330. The two ends of the constant temperature shell are open, and the front cover 210 and the rear cover 220 respectively seal the two ends of the constant temperature shell to form a constant temperature space. The circuit board 330 is arranged in the constant temperature space. The constant temperature shell includes an outer layer 110, an interlayer and an inner layer 130 which are connected and arranged in sequence from the outside to the inside. A semiconductor refrigeration plate is arranged in the interlayer, and the semiconductor refrigeration plate is electrically connected to the control unit. The control unit and the detection unit body 310 are both arranged on the circuit board 330.

[0026] During actual use, a constant temperature shell is set for the detection unit body 310 to reduce the impact of the external temperature on the constant temperature space. At the same time, it is used in conjunction with a semiconductor refrigeration sheet to achieve heating or cooling of the constant temperature space within a limited space, so that the detection unit body 310 is in a suitable temperature environment so that normal detection accuracy can be achieved, effectively resisting the influence of high and low temperature environments, and the cooling and heating of semiconductor refrigeration sheets are more environmentally friendly and energy-saving than other heating technology solutions.

[0027] Specifically, the semiconductor refrigeration plate includes a first substrate 121, a plurality of PN junction semiconductor couples 122 and a second substrate 123 arranged in sequence from the outside to the inside, and the plurality of PN junction semiconductor couples 122 are electrically connected to the control unit. At this time, the plurality of PN junction semiconductor couples 122 can be arranged in sequence in the gap between the first substrate 121 and the second substrate 123, and the plurality of PN junction semiconductor couples 122 can be electrically connected in series or thermally connected in parallel. The total number of PN junction semiconductor couples 122 may be 2K, including K N-type semiconductor couples and K P-type semiconductor couples; multiple groups of semiconductor couples are arranged in sequence between the first substrate 121 and the second substrate 123, which means that the 2K semiconductor couples can be arranged in any form commonly used in the art, for example, the N-type semiconductor couples and the P-type semiconductor couples are arranged at intervals; further, adjacent N-type semiconductor couples and P-type semiconductor couples are connected in series through conductive metal sheets 124 (for example, copper sheets), so that when a DC voltage is applied to the semiconductor couples, the Peltier effect of the semiconductor material can be used to form a cold end and a hot end at both ends of the PN junction semiconductor couple 122, so that the side where the first substrate 121 is located forms a cold end substrate with a lower temperature, and the side where the second substrate 123 is located forms a hot end substrate with a lower temperature, or the side where the first substrate 121 is located forms a hot end substrate with a higher temperature, and the side where the second substrate 123 is located forms a cold end substrate with a lower temperature. The cold end and the hot end are relative, that is, the temperature of the hot end is higher than the temperature of the cold end.

[0028] refer to Figure 3 More preferably, the space between two adjacent PN junction semiconductor couples 122 is filled with heat insulating flame retardant material 125, thereby further improving the overall thermal insulation effect. The heat insulating flame retardant material 125 can be polyurethane foam, or various heat insulating flame retardant technical solutions commonly used in the prior art.

[0029] In some specific embodiments of the utility model, a plurality of heat exchange protrusions 140 respectively matched with the PN junction semiconductor couples 122 are arranged on the outer layer 110 and the inner layer 130. The heat exchange protrusions 140 in the outer layer 110 extend in a direction away from the center of the thermostatic housing, and the heat exchange protrusions 140 in the inner layer 130 extend in a direction close to the center of the thermostatic housing. The heat exchange protrusions 140 can contact the surrounding environment, and the heat exchange protrusions 140 increase the contact area with the surrounding environment relative to the flat surface, thereby improving the heat exchange efficiency.

[0030] Preferably, heat-conducting rods 141 are embedded in the heat-exchanging protrusions 140 one by one. More preferably, the heat-conducting rods 141 in the outer layer 110 are connected to the first substrate 121 , and the heat-conducting rods 141 in the inner layer 130 are connected to the second substrate 123 .

[0031] Specifically, the thermal conductivity of the heat conducting rod 141 is greater than the thermal conductivity of the first substrate 121 and the thermal conductivity of the second substrate 123. More specifically, the thermal conductivity of the heat conducting rod 141 is greater than the thermal conductivity of the outer layer 110 and the thermal conductivity of the inner layer 130.

[0032] By setting the above-mentioned heat exchange protrusions 140 and heat conductive rods 141, heat exchange can be mainly performed through the heat exchange protrusions 140 and heat conductive rods 141, thereby ensuring that the heat exchange efficiency is greatly increased in the case of active heat exchange (i.e., the semiconductor refrigeration plate is turned on) compared with the case of passive heat exchange (i.e., the semiconductor refrigeration plate is turned off), and at this time, both the outer layer 110 and the inner layer 130 can be made of non-metallic materials.

[0033] In some specific embodiments, a transparent glass 211 is sealed in the front cover 210. The transparent glass 211 serves as a viewing window of the flame sensor.

[0034] Specifically, a wire (not shown) is provided on the circuit board 330, and the control unit and the detection unit body 310 are electrically connected to the external power supply through the wire passing through the rear cover 220. Preferably, the rear cover 220 is sealed and connected to the wire.

[0035] Furthermore, the control unit includes a DC control circuit 321 and a temperature sensor 322 electrically connected to the DC control circuit 321. The temperature sensor 322 is exposed and arranged in the constant temperature space, and a plurality of groups of PN junction semiconductor couples 122 are electrically connected to the DC control circuit 321. The temperature in the constant temperature space is identified by the temperature sensor 322 to control the opening and closing of the DC circuit, the current magnitude and the current direction, thereby completing the heating or cooling of the constant temperature space and controlling the temperature change speed.

[0036] Specifically, it should be noted that in addition to the above-mentioned structure, the flame detector also includes other structures commonly used in the prior art to meet the conditions for its normal use. These other structures belong to the prior art and are not the focus of improvement of this application, so they will not be described here.

[0037] At the same time, the detection unit body 310, the DC control circuit 321, the temperature sensor 322, and the PN junction semiconductor couple 122 can all be obtained by consulting reference books according to the parameters of actual needs and purchased on the market. Their specific structures and principles will not be repeated here.

[0038] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A flame detection device for resisting low temperature interference, comprising a flame detector, characterized in that: The flame detector comprises a constant temperature shell, a front end cover (210), a rear end cover (220), a detection unit body (310), a control unit and a circuit board (330); both ends of the constant temperature shell are open; the front end cover (210) and the rear end cover (220) respectively seal and close the two ends of the constant temperature shell to form a constant temperature space; the circuit board (330) is arranged in the constant temperature space; the constant temperature shell comprises an outer layer (110), an interlayer and an inner layer (130) which are connected and arranged in sequence from the outside to the inside; a semiconductor refrigeration plate is arranged in the interlayer; the semiconductor refrigeration plate is electrically connected to the control unit; the control unit and the detection unit body (310) are both arranged on the circuit board (330).

2. The flame detection device for resisting low temperature interference according to claim 1 is characterized in that: The semiconductor refrigeration plate comprises a first substrate (121), a plurality of groups of PN junction semiconductor couples (122) and a second substrate (123) which are arranged in sequence from the outside to the inside, and the plurality of groups of PN junction semiconductor couples (122) are electrically connected to the control unit.

3. The flame detection device for resisting low temperature interference according to claim 2 is characterized in that: The outer layer (110) and the inner layer (130) are both provided with a plurality of heat exchange protrusions (140) respectively matched with the PN junction semiconductor couples (122); the heat exchange protrusions (140) in the outer layer (110) extend in a direction away from the center of the thermostatic shell, and the heat exchange protrusions (140) in the inner layer (130) extend in a direction close to the center of the thermostatic shell.

4. The flame detection device for resisting low temperature interference according to claim 3 is characterized in that: Heat-conducting rods (141) are embedded in the heat-exchange protrusions (140) in a one-to-one correspondence.

5. The flame detection device for resisting low temperature interference according to claim 4 is characterized in that: The heat conducting rod (141) in the outer layer (110) is connected to the first substrate (121), and the heat conducting rod (141) in the inner layer (130) is connected to the second substrate (123).

6. The flame detection device for resisting low temperature interference according to claim 5 is characterized in that: The thermal conductivity of the heat-conducting rod (141) is greater than the thermal conductivity of the first substrate (121) and the thermal conductivity of the second substrate (123).

7. The flame detection device for resisting low temperature interference according to claim 6 is characterized in that: The thermal conductivity of the heat-conducting rod (141) is greater than the thermal conductivity of the outer layer (110) and the thermal conductivity of the inner layer (130).

8. The flame detection device for resisting low temperature interference according to claim 1 is characterized in that: Transparent glass (211) is sealed in the front end cover (210).

9. The flame detection device for resisting low temperature interference according to claim 1, characterized in that: The circuit board (330) is provided with a wire, and the control unit and the detection unit body (310) are both electrically connected to an external power source through the wire passing through the rear end cover (220).

10. The flame detection device for resisting low temperature interference according to claim 2, characterized in that: The control unit comprises a DC control circuit (321) and a temperature sensor (322) electrically connected to the DC control circuit (321); the temperature sensor (322) is exposed and arranged in the constant temperature space; and a plurality of groups of PN junction semiconductor couples (122) are electrically connected to the DC control circuit (321).

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