Heat dissipation device with heat pipe combined with vapor chamber
By adding capillary structures and through-hole design on the plate of the temperature equalization plate, the problem of heat transfer obstruction between the heat pipe and the temperature equalization plate is solved, and good contact and combination between the heat pipe and the temperature equalization plate is achieved, which improves heat dissipation efficiency and stability.
Patent Information
- Application Number
- CN202420820405.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-19
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-04-19
AI Technical Summary
In the existing heat pipe and temperature uniform plate combination heat dissipation device, the open end of the heat pipe is inserted into the temperature uniform plate and abuts on the bottom plate, resulting in blockage of heat transfer and affecting the continuity of the capillary structure and bonding strength.
By adding a capillary structure to the upper plate of the temperature equalization plate, the heat pipe is directly in contact with the capillary on the upper plate, and a convex part and a receptacle part are arranged at the through holes. The capillary structure is in contact with the capillary layer of the heat pipe, so as to avoid the heat pipe from abutting to the bottom plate, thus Maintain capillary continuity and improve binding strength.
Good interoperability and heat transfer between the heat pipe and the uniform temperature plate are achieved, the bonding strength is enhanced, the obstruction of heat transfer is avoided, and the continuity of the capillary structure is maintained.
Smart Images
Figure CN222257864U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a radiator, in particular to a heat dissipation device combining a heat pipe with a temperature equalizing plate. Background Art
[0002] The existing heat dissipation device composed of a heat pipe and a temperature equalizing plate is usually inserted into the temperature equalizing plate after one end of the heat pipe is opened, and the capillary structure in the heat pipe contacts the capillary structure in the temperature equalizing plate, thereby providing a capillary continuity effect. At the same time, in order to increase the bonding between the heat pipe and the temperature equalizing plate, the open end of the heat pipe is abutted against the bottom plate in the temperature equalizing plate. On the one hand, as mentioned above, the capillary structure in the heat pipe can contact the capillary structure in the temperature equalizing plate, and on the other hand, the bonding between the heat pipe and the temperature equalizing plate can be more stable.
[0003] However, since the open end of the heat pipe is inserted into the temperature-averaging plate and abuts against the bottom plate of the temperature-averaging plate, it will hinder the heat transfer in the temperature-averaging plate. In particular, an opening must be added at the location where the heat pipe is inserted into the temperature-averaging plate. The opening actually reduces the internal connection area between the heat pipe and the temperature-averaging plate. Therefore, even if the continuity of the internal capillaries can be maintained, there will still be some obstacles in heat transfer. Utility Model Content
[0004] The main purpose of the utility model is to provide a heat dissipation device combining a heat pipe with a temperature averaging plate, which adds a capillary structure to the upper plate of the temperature averaging plate so that the heat pipe can directly contact the capillary structure on the upper plate of the temperature averaging plate to maintain its continuity, while also providing the bonding strength between the heat pipe and the temperature averaging plate.
[0005] In order to achieve the above-mentioned purpose, the utility model provides a heat dissipation device combining a heat pipe with a temperature averaging plate, comprising a temperature averaging plate and at least one heat pipe; the temperature averaging plate has a bottom plate and an upper plate, the bottom plate and the upper plate are covered together to form a chamber, and an upper plate capillary layer covering the upper plate is provided in the chamber, and at least one through hole is provided in the upper plate; the heat pipe has a tube body and a tube capillary layer provided in the tube body, the tube body has a closed end and an open end away from the closed end, the open end is fixed in the through hole, and the tube capillary layer has a connecting portion exposed at the open end; wherein, the upper plate is provided with at least one convex portion protruding outwardly corresponding to the outside of the through hole, the convex portion has a recessed accommodating portion in the upper plate, and a capillary structure is provided in the accommodating portion, and the capillary structure is in contact with the connecting portion and the upper plate capillary layer.
[0006] In some embodiments, the upper plate is concavely provided with a plurality of abutting portions abutting toward the bottom plate.
[0007] In some embodiments, the upper capillary layer covers below the capillary structure.
[0008] In some embodiments, a bottom plate capillary layer coated on the bottom plate is further disposed in the chamber, and the bottom plate capillary layer is connected to the upper plate capillary layer.
[0009] In some embodiments, a plurality of support structures are disposed within the chamber.
[0010] In some embodiments, each of the support structures is columnar.
[0011] In some embodiments, there are plural through holes, and the protrusions correspond to the through holes and are connected as one, so that the receiving portions corresponding to the through holes are interconnected.
[0012] In some embodiments, the capillary structure is a sintered powder.
[0013] In some embodiments, the open end of the heat pipe body abuts against the capillary structure.
[0014] In some embodiments, the open end of the heat pipe is formed into a sawtooth shape or a partially perforated shape. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a three-dimensional exploded view of the first embodiment of the utility model.
[0016] Figure 2 It is a three-dimensional combination diagram of the first embodiment of the utility model.
[0017] Figure 3 This is a three-dimensional exploded view of the upper plate of the first embodiment of the utility model.
[0018] Figure 4 It is a partial cross-sectional exploded schematic diagram of the first embodiment of the utility model.
[0019] Figure 5 It is a schematic cross-sectional view of the assembly of the first embodiment of the utility model with additional fins.
[0020] Figure 6 It is a three-dimensional exploded view of the second embodiment of the utility model.
[0021] Figure 7 This is a schematic cross-sectional view of a second embodiment of the utility model with additional fins.
[0022] Figure 8 This is a schematic cross-sectional view of a third embodiment of the utility model with additional fins.
[0023] In the figure:
[0024] 1: temperature equalizing plate; 10: bottom plate; 10a: bottom plate capillary layer; 100: chamber; 11: upper plate; 11a: upper plate capillary layer; 11b: capillary structure; 110: through hole; 111: convex portion; 111a: accommodating portion; 112: abutting portion; 12: supporting structure; 2: heat pipe; 20: pipe body; 200: closed end; 201: open end; 21: pipe capillary layer; 210: connecting portion; 3: fin. DETAILED DESCRIPTION
[0025] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.
[0026] See also Figure 1 and Figure 2 , are respectively a three-dimensional exploded view and a three-dimensional combined view of the first embodiment of the utility model. The utility model provides a heat dissipation device combining a heat pipe with a temperature averaging plate, comprising a temperature averaging plate 1 and at least one heat pipe 2; wherein:
[0027] The temperature plate 1 has a bottom plate 10 and an upper plate 11, and the bottom plate 10 and the upper plate 11 are covered to form a chamber 100, and a plurality of support structures 12 are arranged in the chamber 100; and in this embodiment, each support structure 12 can be a columnar body and distributed in the chamber 100 to support between the bottom plate 10 and the upper plate 11. In addition, please also refer to Figure 3 As shown, the chamber 100 is provided with plate capillary layers 10a and 11a, and the plate capillary layers 10a and 11a may include a bottom plate capillary layer 10a coated on the bottom plate 10 and an upper plate capillary layer 11a coated on the upper plate 11, and the bottom plate capillary layer 10a and the upper plate capillary layer 11a may be connected at the junction where the bottom plate 10 and the upper plate 11 overlap. In addition, the bottom plate capillary layer 10a and the upper plate capillary layer 11a may be formed of a woven mesh.
[0028] like Figure 4 and Figure 5 As shown, the heat pipe 2 has a tube body 20 and a capillary layer 21 disposed on the inner wall of the tube body 20, wherein the tube body 20 also has a closed end 200 and an open end 201 away from the closed end 200, the capillary layer 21 is attached to the tube body 20 and extends from the closed end 200 to the open end 201, and the capillary layer 21 has a connecting portion 210 protruding from the open end 201. In addition, the capillary layer 21 can also be composed of a woven mesh.
[0029] Please see again Figure 1 , Figure 2 and Figure 4As shown, the upper plate 11 of the above-mentioned temperature averaging plate 1 is provided with at least one through hole 110, so that the open end 201 of the tube body 20 of the above-mentioned heat pipe 2 is fixed in the through hole 110, and the heat pipe 2 is connected with the chamber 100 of the temperature averaging plate 1. Figure 5 As shown. Figures 1 to 5 As shown, the utility model mainly has a convex portion 111 protruding outwardly on the upper plate 11 of the above-mentioned temperature-averaging plate 1, and the convex portion 111 forms a recessed receiving portion 111a in the upper plate 11, and a capillary structure 11b is provided in the receiving portion 111a of each convex portion 111. The capillary structure 11b can be sintered powder, and the convex portion 111 corresponds to the outside of the through hole 110 and is connected with the through hole 110, so that the connecting portion 210 of the tube capillary layer 21 can contact the capillary structure 11b by protruding from the open end 201 of the tube body 20, and the upper plate capillary layer 11a coated on the upper plate 11 covers under the capillary structure 11b, so that the tube capillary layer 21 in the heat pipe 2 can be continuous and uninterrupted with the upper plate capillary layer 11a in the temperature-averaging plate 1 in capillary transmission.
[0030] Therefore, by means of the above-mentioned structure, the heat dissipation device of the utility model combining the heat pipe with the temperature equalizing plate can be obtained.
[0031] According to this, if Figure 5 As shown, since the upper plate 11 has the above-mentioned accommodation portion 111a at the position corresponding to each through hole 110, and a capillary structure 11b is provided in each accommodation portion 111a, the capillary structure 11b can be provided to contact the connecting portion 210 protruding outside the opening end 201. At the same time, the upper plate capillary layer 11a in the upper plate 11 covers the lower part of the capillary structure 11b, so that the pipe capillary layer 21 in the heat pipe 2 can be continuous and uninterrupted with the upper plate capillary layer 11a in the temperature evaporating plate 1 in capillary transmission, and the pipe body 20 of the heat pipe 2 does not need to abut against the bottom plate 10 of the temperature evaporating plate 1, so as to maintain good intercommunication between the heat pipe 2 and the temperature evaporating plate 1 for heat transfer. Furthermore, the open end 201 of the tube body 20 of each heat pipe 2 may be in contact with the capillary structure 11 b to improve the bonding strength between the tube body 20 and the through hole 110 . A plurality of fins 3 may also be provided on the tube body 20 of each heat pipe 2 .
[0032] In addition, Figure 6 and Figure 7As shown, in the second embodiment of the present invention, when the protrusions 111 correspond to the plurality of through holes 110 (i.e., the number of heat pipes 2 is plural), the plurality of protrusions 111 can be connected together so that the accommodating parts 111a therein are interconnected. In addition, the opening end 201 of the tube body 20 of each heat pipe 2 can also be formed into a sawtooth shape or a partial hole shape (not shown) so that the connecting part 210 of the capillary layer 21 can partially protrude from the sawtooth-shaped opening end 201, and at the same time, the capillary structure 11b can still be in contact with the connecting part 210 through the sawtooth-shaped concave part.
[0033] Furthermore, if Figure 8 As shown, in the third embodiment of the present invention, the upper plate 11 may be provided with a plurality of abutting portions 112 facing toward the bottom plate 10 to replace the supporting structure 12 disposed in the chamber 100 .
[0034] The above-described embodiments are only preferred embodiments for fully illustrating the present utility model, and the protection scope of the present utility model is not limited thereto. Equivalent substitutions or changes made by technicians in the technical field on the basis of the present utility model are all within the protection scope of the present utility model. The protection scope of the present utility model shall be subject to the claims.
Claims
1. A heat dissipation device combining a heat pipe with a temperature homogenizing plate, characterized in that: include: A temperature-averaging plate, comprising a bottom plate and an upper plate, wherein the bottom plate and the upper plate are covered to form a chamber, wherein an upper plate capillary layer covering the upper plate is disposed in the chamber, and wherein the upper plate is provided with at least one through hole; and At least one heat pipe has a tube body and a tube capillary layer arranged in the tube body, the tube body has a closed end and an open end away from the closed end, the open end is fixed in the through hole, and the tube capillary layer has a connecting portion exposed at the open end; The upper plate is provided with at least one convex portion protruding outwardly corresponding to the outside of the through hole, the convex portion has a recessed accommodation portion in the upper plate, and a capillary structure is provided in the accommodation portion, and the capillary structure is in contact with the connecting portion and the capillary layer of the upper plate.
2. The heat dissipation device of heat pipe combined with temperature homogenizing plate according to claim 1, characterized in that: The upper plate is concavely provided with a plurality of abutting portions which abut toward the bottom plate.
3. The heat dissipation device of heat pipe combined with temperature homogenizing plate according to claim 1, characterized in that: The upper plate capillary layer covers below the capillary structure.
4. The heat dissipation device of heat pipe combined with temperature homogenizing plate according to claim 1, characterized in that: A bottom plate capillary layer covering the bottom plate is further arranged in the chamber, and the bottom plate capillary layer is connected to the upper plate capillary layer.
5. The heat dissipation device of heat pipe combined with temperature homogenizing plate according to claim 1, characterized in that: A plurality of support structures are arranged in the chamber.
6. The heat dissipation device of heat pipe combined with temperature homogenizing plate according to claim 5, characterized in that: Each of the supporting structures is in a columnar shape.
7. The heat dissipation device of heat pipe combined with temperature homogenizing plate according to claim 1, characterized in that: There are plural through holes, and the convex parts correspond to the through holes and are connected integrally, so that the accommodating parts corresponding to the through holes are connected to each other.
8. The heat dissipation device of heat pipe combined with temperature homogenizing plate according to claim 1, characterized in that: The capillary structure is sintered powder.
9. The heat dissipation device of heat pipe combined with temperature homogenizing plate according to claim 1, characterized in that: The open end of the heat pipe body abuts against the capillary structure.
10. The heat dissipation device of heat pipe combined with temperature homogenizing plate according to claim 1, characterized in that: The open end of the heat pipe is formed into a sawtooth shape or a partially perforated shape.