Snow thickness detection device with automatic heating function
By introducing automatic heating function and angle measurement module in the snow thickness detection device, the error problem of laser measurement equipment in bad weather and installation is solved, high-precision and stable snow thickness measurement are achieved, installation conditions are simplified, and the installation conditions are simplified. Ensure measurement accuracy in low temperature environments.
Patent Information
- Application Number
- CN202421132941.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-23
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-05-23
AI Technical Summary
Existing laser snow depth measurement equipment is prone to large errors in bad weather or incorrect installation, and has high installation accuracy and conditions.
A snow thickness detection device with automatic heating function was designed, including laser ranging module, MCU, heating module and angle measurement module. It communicates through UART and IIC interfaces, and uses thermistor and MOS tube to realize automatic heating control to ensure laser. The ranging module operates in a low temperature environment and achieves more uniform heating through distributed heating.
It realizes high-precision snow thickness measurement in harsh environments, no need for vertical installation, automatic control of heating, ensuring the accuracy and stability of measurement data.
Smart Images

Figure CN222258148U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of meteorological monitoring equipment and relates to a snow thickness detection device with an automatic heating function. Background Art
[0002] The existing snow depth detection methods are mainly divided into manual observation methods and automatic observation methods. The manual observation method obtains snow depth data by manually reading the snow scale scale. Although it is simple and convenient to use, it has the disadvantages of low spatiotemporal density and poor data continuity. Automatic observation methods include ultrasonic ranging, laser ranging, image vision processing, etc. Among them, ultrasonic ranging is greatly affected by the environment and its measurement accuracy is not as good as laser measurement; the image vision measurement method also has problems such as complex algorithms, high requirements for collectors, and cumbersome image storage and transmission; laser ranging technology has the characteristics of high precision, high stability, and high reliability. Therefore, laser ranging is currently the most commonly used snow depth automatic observation method.
[0003] At present, most of the laser snow depth measurement equipment on the market adopts vertical measurement. The measurement requires that the light emitted by the equipment is perpendicular to the ground, which places certain requirements on installation accuracy and installation conditions. In addition, when encountering bad weather such as strong winds or improper installation, the equipment deflects and cannot be perpendicular to the ground, which will cause large errors in the measurement data. Summary of the invention
[0004] In order to achieve the above-mentioned purpose, the utility model provides a snow thickness detection device with automatic heating function, which solves the problem that the existing laser snow depth measurement equipment adopts a vertical measurement method, resulting in high requirements on installation accuracy and conditions, and is prone to large errors in bad weather.
[0005] In order to solve the above technical problems, the technical solution adopted by the utility model is a snow thickness detection device with automatic heating function, including a laser ranging module, an MCU and a heating module, the laser ranging module is connected to the MCU and the MCU in the heating module through a UART interface; the MCU is electrically connected to the angle measurement module; the laser ranging module, the MCU and the heating module, and the angle measurement module are all fixed inside the shell; the MCU and the heating module in the heating module include a resistor R1, one end of the resistor R1 is connected to the power supply, and the other end is grounded after passing through a thermistor R12; and the thermistor R12 is connected to the single-chip computer TempAD through a resistor R8; one end of the resistor R13 is connected to the single-chip computer HEATER_EN pin, and the other end of the resistor R13 is connected to the MOS tube gate through a current limiting resistor R14; the source of the MOS tube is grounded, and the drain is electrically connected to the heating part.
[0006] Furthermore, the heating part includes 9 chip resistors, and every three resistors of the 9 resistors are connected in series and then in parallel.
[0007] Furthermore, the model of the MCU is HC32F005, wherein P3.4 is the HEATER_EN pin, P3.5 and P3.6 are UART interfaces, P3.3 is the TempAD pin, and P2.5 and P2.4 are connected to the angle measurement module 5.
[0008] Furthermore, the MOS tube model is SI2310.
[0009] Furthermore, the laser ranging module model is PLS-K-100.
[0010] Furthermore, the angle measurement module adopts a six-axis posture sensor MPU6050.
[0011] Furthermore, it also includes a snowfall detection module, which uses a rain and snow sensor with a model of RX-YX.
[0012] Furthermore, a thermally conductive silicone pad is provided between the MCU and the heating module and the laser ranging module.
[0013] The beneficial effects of the utility model are:
[0014] 1. Easy to install and no special requirements for the installation angle. No need to set it vertically to the ground, and high measurement accuracy.
[0015] 2. The heating can be automatically turned on at the target temperature, and automatically turned off when the temperature reaches the requirement. The whole process is automatically controlled by the hardware circuit.
[0016] 3. Distributed heating, larger heating area and more uniform heating. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0018] Figure 1 It is a structural schematic diagram of a snow thickness detection device of the utility model.
[0019] Figure 2 It is a side view of the snow thickness detection device of the utility model.
[0020] Figure 3It is a schematic diagram of the measurement process of the snow thickness detection device of the utility model.
[0021] Figure 4 It is a circuit diagram of the MCU of the utility model and the MCU in the heating module.
[0022] Figure 5 It is a circuit diagram of the angle measurement module of the utility model.
[0023] Figure 6 The utility model is a circuit diagram of a laser distance measuring module.
[0024] Figure 7 This is a circuit diagram of a heating module of the utility model.
[0025] In the figure, 1. housing, 2. MCU and heating module, 3. laser ranging module, 4. first supporting column, 5. angle measurement module, 6. second supporting column, 7. laser ranging module receiving lens, 8. laser ranging module transmitting lens. DETAILED DESCRIPTION
[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0027] like Figure 1 to Figure 7 As shown, the utility model provides a snow thickness detection device with automatic heating function, which includes a laser distance measurement module 3, an angle measurement module 5, a snowfall detection module, an MCU and a heating module 2.
[0028] The laser ranging module 3 communicates with the MCU module through the UART interface; the angle measurement module 5 communicates with the MCU through the IIC interface; the signal output of the snowfall detection module is connected to the MCU pin, and the output switch signal is detected by the MCU; the heating module in the MCU and the heating module 2 is automatically controlled by the circuit.
[0029] Among them, the laser ranging module 3 emits a laser at a certain angle to the ground through the laser ranging module transmitting lens 8, and is received by the laser ranging module receiving lens 7; the angle measurement module 5 is kept parallel to the laser ranging module 3, and the measured inclination angle is the inclination angle of the laser ranging module 3. The MCU and the heating module 2 are close to the laser ranging module 3 to provide heating for it. The laser ranging module 3, the MCU and the heating module 2, and the angle measurement module 5 are fixed inside the metal housing 1 through a mechanical structure, and the laser ranging module 3 is supported by the first support column 4 and the second support column 6.
[0030] Among them, the laser ranging module 3 is used to measure the distance from the laser emission point to the ground, the angle measurement module 5 is used to measure the horizontal angle between the laser beam and the ground, the heating module ensures that the entire system works within the appropriate temperature range, the MCU controls the operation of the entire system, and intervenes in time when the heating is out of control, and calculates the change in snow thickness by collecting laser ranging and inclination measurement data. The snow detection module is used to determine whether there is snow accumulation at present, and the snow detection module can prevent the snow thickness detection device from making misjudgments.
[0031] The laser ranging module 3 is produced by Shanghai Paiou Electromechanical Co., Ltd. and its model is PLS-K-100; the angle measurement module 5 adopts the six-axis posture sensor MPU6050.
[0032] The snowfall detection module uses a rain and snow sensor model RX-YX produced by Handan Yunnong Smart Agriculture Technology Co., Ltd.
[0033] MCU and heating module 2 complete the control and heating functions of the system. The scene that requires snow thickness measurement usually requires a low temperature environment. In some scenes, the ambient temperature may reach -40°C. The semiconductor devices used in the laser ranging module 3 are greatly affected by the ambient temperature. In order to ensure the measurement accuracy, the heating function is required in a low temperature environment to ensure that the laser ranging module works at a reasonable temperature.
[0034] The heating module utilizes the low temperature characteristics of thermistor R12 and the switching characteristics of the MOS tube. Thermistor R12 uses NCP15WF104F03RC, with a B value of 4250K, which is sensitive to changes in ambient temperature. One end of resistor R1 is connected to a 3.3V power supply, and the other end is grounded after passing through thermistor R12. At the same time, it is connected to the TempAD pin of the microcontroller through resistor R8 to monitor the current temperature. At the same time, it is connected to the HEATER_EN pin of the microcontroller through resistor R13, and to the gate of the MOS tube SI2310 through the current limiting resistor R14. The source of the MOS tube is grounded, and the drain is electrically connected to the heating part. In the event of abnormal heating out of control, the heating can be forced to shut down to prevent heating out of control.
[0035] The MOS tube model is SI2310, and the switch voltage is about 1.025V at 25℃. By consulting the manual, it can be known that when the temperature is 10℃, the resistance of thermistor R12 is 209.489k, and the SI2310 turn-on voltage is 1.07V. At this time, after the voltage is divided by the resistor R1, the MOS tube gate voltage is 1.08V, reaching the MOS tube turn-on voltage, the MOS tube is turned on, and the heating is started. When the temperature is 15℃, the resistance of thermistor R12 is 162.559k, and the SI2310 turn-on voltage is 1.055V. At this time, after the voltage is divided by the resistor R1, the MOS tube gate voltage is 0.905V, which is less than the MOS tube turn-on voltage, the MOS tube is turned off, and the heating is stopped.
[0036] like Figure 7 As shown, the heating part utilizes the characteristics of thermistor R12 at low temperatures and the switching characteristics of the MOS tube. When the ambient temperature is lower than a certain value, the resistance of thermistor R12 increases, causing the voltage divider at CTL to increase and reach the turn-on voltage of the MOS tube Q1. At this time, the MOS tube is turned on, and current flows through R2-R11, and heating begins. When heated to the target temperature, the resistance of thermistor R12 decreases, causing the gate voltage of the MOS tube to decrease. When it is lower than the turn-on voltage, the MOS tube is turned off, and no current flows through R2-R11, thereby turning off the heating. This circuit can automatically turn on the heating at the target temperature and automatically turn off the heating when the temperature reaches the requirement. The entire hardware circuit is automatically controlled. The control part can force the MOS tube to be turned off when the heating is out of control as a safety measure.
[0037] The combination of the two and the appropriate voltage-dividing resistor can realize the automatic start of heating when the temperature is lower than the target temperature, and the shutdown of heating when the temperature is higher than the target temperature. Since the laser ranging module 3 has a certain area and the area of a single resistor is small, in order to expand the heating area and ensure the appropriate heating power at the same time, this embodiment uses 9 chip resistors with a resistance of 20 ohms and 2010 package in the heating part. These 9 resistors are mounted on the control circuit board in a 3×3 matrix form. After every three resistors are connected in series, they are connected in parallel. The total resistance is still 20 ohms, which not only ensures sufficient heating area, but also disperses the heating power on the 9 resistors, realizing uniform distributed heating, which is more stable and reliable. This circuit can realize automatic start of heating at the target temperature, and automatically shut down heating after the temperature reaches the requirement. Full hardware circuit automatic control. The MCU can force the MOS tube to shut down when the heating is out of control as a safety measure. A thermal conductive silicone pad is placed between the MCU and the heating module 2 and the laser ranging module 3 to improve the heat transfer efficiency during heating. Ensure that the system can operate normally under low temperature conditions.
[0038] The MCU uses HC32F005 produced by HuaDa Semiconductor. P3.4 is the HEATER_EN pin, which is connected to the gate of the MOS tube through resistors R13 and R14, and is used to intervene in time when the heating is out of control and stop heating; P3.5 and P3.6 are UART interfaces, which are connected to the laser ranging module 3 for communication; P3.3 TempAD pin is connected to one end of the thermistor to monitor the current temperature; P2.5 and P2.4 are connected to the MPU6050 of the angle measurement module 5 to realize IIC communication.
[0039] The detection process of the utility model is as follows:
[0040] In the absence of snow, the laser ranging module 3 obtains the distance L1 between the ground and the laser receiving lens, and the angle measurement module 5 obtains the horizontal angle α between the current laser emission direction and the road surface, and the vertical height H=L1×sinα; if the snow thickness detection device is deflected, it can be considered that the height H remains unchanged, and the angle α between the laser direction and the horizontal plane and the distance L1 between the ground and the laser ranging module receiving lens 7 change.
[0041] When snow accumulation is detected, the distance between the ground and the receiving lens is L2, and the snow thickness D = (L1-L2) × sinα; that is, the snow thickness D = H-L2 × sinα; among them, angle α is the real-time angle, L2 is the real-time measurement distance, and H is a constant. At this time, the measurement of snow thickness is not affected by the deflection of the snow thickness detection device.
[0042] It should be noted that the circuit connection methods not described in the present invention are all connection methods that can be easily implemented by those skilled in the art based on their professional knowledge.
[0043] Each embodiment in this specification is described in a related manner, and the same or similar parts between the embodiments can be referenced to each other, and each embodiment focuses on the differences from other embodiments.
[0044] The above description is only a preferred embodiment of the present invention and is not intended to limit the protection scope of the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention are included in the protection scope of the present invention.
Claims
1. A snow thickness detection device with automatic heating function, comprising a laser ranging module (3), characterized in that: It also comprises an MCU and a heating module (2), wherein the laser distance measuring module (3) is communicatively connected to the MCU and the MCU in the heating module (2) via a UART interface; the MCU is electrically connected to the angle measuring module (5); the laser distance measuring module (3), the MCU, the heating module (2), and the angle measuring module (5) are all fixed inside the housing (1); the heating module in the MCU and the heating module (2) comprises a resistor R1, one end of the resistor R1 is connected to a power supply, and the other end is connected to ground via a thermistor R12; and the thermistor R12 is connected to a single-chip computer TempAD via a resistor R8; one end of the resistor R13 is connected to a HEATER_EN pin of the single-chip computer, and the other end of the resistor R13 is connected to a MOS tube gate via a current limiting resistor R14; the source of the MOS tube is grounded, and the drain is electrically connected to the heating part.
2. A snow thickness detection device with automatic heating function according to claim 1, characterized in that: The heating part includes 9 chip resistors, and every three resistors of the 9 resistors are connected in series and then in parallel.
3. The snow thickness detection device with automatic heating function according to claim 1, characterized in that: The model of the MCU is HC32F005, wherein P3.4 is a HEATER_EN pin, P3.5 and P3.6 are UART interfaces, P3.3 is a TempAD pin, and P2.5 and P2.4 are connected to an angle measurement module (5).
4. The snow thickness detection device with automatic heating function according to claim 1, characterized in that: The MOS tube model is SI2310.
5. The snow thickness detection device with automatic heating function according to claim 1, characterized in that: The model of the laser ranging module (3) is PLS-K-100.
6. The snow thickness detection device with automatic heating function according to claim 1, characterized in that: The angle measurement module (5) adopts a six-axis posture sensor MPU6050.
7. The snow thickness detection device with automatic heating function according to claim 1, characterized in that: It also includes a snowfall detection module, which uses a rain and snow sensor with a model of RX-YX.
8. The snow thickness detection device with automatic heating function according to claim 1, characterized in that: A heat-conducting silicone pad is provided between the MCU and the heating module (2) and the laser ranging module (3).