Temperature control mainboard testing device

Abstract

The utility model discloses a temperature control mainboard testing device, which comprises a device body, a pressing plate device, a display unit and a detection unit, and is characterized in that the detection unit comprises a pre-embedded plate adapter, a to-be-tested plate adapter, a power amplifier simplified element and a temperature detection part; the embedded board adapter, the to-be-tested board adapter and the power amplifier simplified element can be kept in an electric connection state under the condition that a power supply is turned on so as to perform voltage testing operation, and meanwhile, the temperature detection piece starts to detect the testing temperature, forms a corresponding signal and transmits the signal to the display unit, so that the display unit can display the temperature of the to-be-tested board adapter and the to-be-tested board adapter and the to-be-tested board adapter and the to-be-tested board adapter. The display unit displays the voltage test information and the temperature detection information, so that the voltage test operation and the temperature detection operation can be carried out at the same time, and the test efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the field of temperature control mainboard welding quality testing, in particular to a temperature control mainboard testing device. Background Art

[0002] At present, when the staff uses the temperature control mainboard testing device to test the welding quality of the temperature control mainboard, it is necessary to detect whether the voltage display value and the temperature display value of the temperature control mainboard when the power is turned on meet the specific index requirements, so as to judge the quality of the temperature control mainboard.

[0003] However, the existing temperature control motherboard test device generally does not have the ability to perform voltage test operations and temperature test operations at the same time. Therefore, when testing the temperature control motherboard, the staff often use the device for voltage test and the device for temperature test separately to perform separate test operations, but this prolongs the test time. In addition, the temperature control motherboard will be in a state of heating up as a whole during the voltage test. If a temperature test is to be performed later, it is necessary to wait for the temperature control motherboard to drop to normal temperature before performing the temperature test. Otherwise, it will affect the accuracy of the temperature test value of the temperature control motherboard, but this will prolong the overall test time, thereby reducing the overall test efficiency. Utility Model Content

[0004] In order to solve the above technical problems and achieve at least one advantage of the present invention, the present invention provides a temperature control motherboard testing device, wherein the temperature control motherboard testing device comprises:

[0005] The device body comprises a first body, wherein the first body is provided with a test board placement table and an embedded board placement table, wherein the test board placement table is used to place the test board, and the embedded board placement table is used to place the embedded board;

[0006] A pressing plate device, the pressing plate device comprising:

[0007] A first pressing plate assembly, wherein the first pressing plate assembly is arranged on the first body in a manner capable of pressing the plate to be tested;

[0008] a second pressing plate assembly, the second pressing plate assembly being arranged on the first body in a manner capable of pressing the embedded plate;

[0009] A display unit, wherein the display unit is mounted on the first body;

[0010] A detection unit, the detection unit includes an embedded board adapter, a board to be tested adapter, a power amplifier simplification element and a temperature detection element, wherein the embedded board adapter is arranged in the first body of the device body, and the embedded board adapter can be electrically connected to a power supply, the embedded board adapter is also electrically connected to the board to be tested adapter, the board to be tested adapter is arranged in the device body, and the board to be tested adapter is electrically connected to the power amplifier simplification element, the power amplifier simplification element is arranged in the first body of the device body, and the power amplifier simplification element is communicatively connected to the display unit for transmitting voltage test information, the temperature detection element is arranged in the device body, and is communicatively connected to the display unit for detecting the test temperature of the board to be tested and forming a corresponding signal, so that the display unit displays voltage test information and temperature detection information.

[0011] According to one embodiment of the utility model, the first pressure plate assembly includes a first pressure plate and a locking member, wherein the first pressure plate is movably connected to the first body to press the board to be tested placed on the board to be tested placement table, and the locking member is installed on the first body of the device body in a manner capable of locking the first pressure plate, so that the first pressure plate presses the board to be tested.

[0012] According to one embodiment of the utility model, the first pressure plate assembly also includes a handle member, which is installed at a predetermined position of the first pressure plate away from the connection between the first pressure plate and the first body, and the handle member forms an annular opening for the user to insert his hand and allow the user's hand to act on the inner wall forming the annular opening.

[0013] According to an embodiment of the utility model, the first pressure plate assembly also includes a plurality of first protection rods, each of which is set to a predetermined length and is installed in a vertical posture on one side of the first clamping plate for clamping the test plate, and each of the first protection rods is evenly arranged.

[0014] According to an embodiment of the utility model, the second pressure plate assembly includes a second pressure plate, a linkage frame and a force-applying member, wherein the second pressure plate is driven and movably connected to the force-applying member and is located at a predetermined height, and the second pressure plate is movably connected to the linkage frame and aligned with the embedded plate placement table of the first body, the linkage frame is installed on the first body, and the linkage frame is provided with a limiting channel to limit the movement of the second pressure plate, and the force-applying member is arranged at a predetermined height position of the linkage frame to adjust the distance between the second pressure plate and the embedded plate on the embedded plate placement table.

[0015] According to one embodiment of the utility model, the force-applying component includes a driving member, a passive member and a connecting rod, wherein the driving member is movably mounted on the linkage frame to drive the passive member, the two ends of the passive member are respectively movably connected to the driving member and the connecting rod, one end of the connecting rod away from the passive member is connected to the second clamping plate, and the connecting rod can move to the limiting channel of the linkage frame when the driving member drives the passive member.

[0016] According to one embodiment of the utility model, the second pressure plate assembly also includes a plurality of second protection rods, each of which is set to a predetermined length and is installed in a vertical posture on one side of the second clamping plate for clamping the embedded plate, and each of the second protection rods is evenly arranged.

[0017] According to one embodiment of the utility model, the device body also includes a second body, the first body has an opening and a placement cavity connected to the opening, the placement cavity is used to store the circuit control system, and the second body is detachably connected to the first body to cover and open the placement cavity.

[0018] According to one embodiment of the utility model, the temperature control motherboard testing device also includes a supporting assembly, and the supporting assembly includes a first supporting frame and a second supporting frame, wherein the first supporting frame is movably connected to the first body of the device body, and one end of the first supporting frame away from the first body is hinged to one end of the second supporting frame, and the other end of the second supporting frame away from the first supporting frame is hinged to the second body.

[0019] According to an embodiment of the present invention, the first support frame of the support assembly is disposed in the placement cavity, and the second support frame is installed on the second body to cover one side of the placement cavity. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A three-dimensional diagram of the temperature control mainboard testing device of the utility model is shown.

[0021] Figure 2 A sectional view from a side angle of the temperature control mainboard testing device of the utility model is shown.

[0022] Figure 3 The working flow chart of the detection unit of the temperature control mainboard testing device of the utility model is shown. DETAILED DESCRIPTION

[0023] The following description is used to disclose the utility model so that those skilled in the art can implement the utility model. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the utility model defined in the following description can be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not deviate from the spirit and scope of the utility model.

[0024] Those skilled in the art should understand that, in the disclosure of the present invention, the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

[0025] It is to be understood that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" should not be understood as a limitation on the quantity.

[0026] refer to Figures 1 to 3 A temperature control motherboard testing device according to a preferred embodiment of the present invention will be described in detail below. The temperature control motherboard testing device includes a device body 10, a pressure plate device 20, a detection unit 30 and a display unit 40.

[0027] The device body 10 includes a first body 11, and the first body 11 is provided with a test board placement platform 111 and an embedded board placement platform 112, wherein the test board placement platform 111 is used to place the test board. The embedded board placement platform 112 is used to place the embedded board. It should be noted that the embedded board is used for testing the test board.

[0028] The pressing plate device 20 includes a first pressing plate assembly 21 and a second pressing plate assembly 22, wherein the first pressing plate assembly 21 is used to press the board to be tested placed on the board to be tested placement platform 111. The second pressing plate assembly 22 is used to press the embedded board placed on the embedded board placement platform 112.

[0029] The first pressing plate assembly 21 includes a first pressing plate 211 and a locking member 212, wherein the first pressing plate 211 is movably connected to the first body 11 of the device body 10 to press the board to be tested placed on the board to be tested placement table 111. The locking member 212 is installed on the first body 11 of the device body 10 in a manner capable of locking the first pressing plate 211, so that the first pressing plate 211 presses the board to be tested.

[0030] Those skilled in the art can understand that the locking member 212 can adjust the position of the board-to-be-tested placement platform 111 during the process of locking the first clamping plate 211, so that the position of the board-to-be-tested placed on the board-to-be-tested placement platform 111 is adjusted, so that when the board-to-be-tested is adjusted to a predetermined position, the first clamping plate 211 can be locked to the first body 11 of the device body 10 to clamp the board-to-be-tested. Therefore, when it is necessary to make the first clamping plate 211 clamp the board-to-be-tested so as to complete the subsequent operation of testing the board-to-be-tested, the locking member 212 is driven to lock the first clamping plate 211, so that the locked first clamping plate 211 can clamp the board-to-be-tested. Accordingly, when it is necessary to remove the board-to-be-tested from the board-to-be-tested placement platform 111, the locking member 212 is driven again to release the locked state of the first clamping plate 211, that is, the first clamping plate 211 can move and move away from the board-to-be-tested, so that the board-to-be-tested can be removed.

[0031] Preferably, the first pressure plate assembly 21 also includes a handle member 213. Preferably, the handle member 213 is installed at a predetermined position of the first pressure plate 211 away from the connection between the first pressure plate 211 and the first body 11, and the handle member 213 forms an annular opening 21301 for the user to insert his hand and allow the user's hand to act on the inner wall forming the annular opening 21301, so that the first pressure plate 211 can be easily moved by force.

[0032] Preferably, the first pressure plate assembly 21 further includes a plurality of first protection rods 214, each of which is set to a predetermined length and is installed in a vertical posture on one side of the first pressure plate 211 for pressing the board to be tested, and each of the first protection rods 214 is evenly arranged, so that when the first pressure plate 211 presses the board to be tested, each of the first protection rods 214 can abut against the board to be tested to prevent the pins for detection provided on the first pressure plate 211 from being bent when the board to be tested is pressed.

[0033] The second pressing plate assembly 22 includes a second pressing plate 221, a linkage frame 222 and a force member 223, wherein the second pressing plate 221 is driven and movably connected to the force member 223 and is located at a predetermined height, and the second pressing plate 221 is movably connected to the linkage frame 222 and is aligned with the embedded plate placement platform 112 of the first body 11. The linkage frame 222 is installed on the first body 11, and the linkage frame 222 is provided with a limiting channel to limit the movement of the second pressing plate 221. The force member 223 is provided at a predetermined height position of the linkage frame 222 to adjust the distance between the second pressing plate 221 and the embedded plate on the embedded plate placement platform 112.

[0034] It can be understood that when an embedded plate is placed on the embedded plate placement platform 112 of the device body 10 and the embedded plate needs to be pressed, force is applied to the force-applying component 223 to drive the second pressing plate 221 to move, and due to the limiting effect of the linkage frame 222, the second pressing plate 221 can approach and abut against the embedded plate on the embedded plate placement platform 112, thereby pressing the embedded plate.

[0035] Preferably, the force-applying member 223 includes a driving member 2231, a passive member 2232 and a connecting rod 2233, wherein the driving member 2231 is movably mounted on the linkage frame 222 to drive the passive member 2232. The two ends of the passive member 2232 are movably connected to the driving member 2231 and the connecting rod 2233, respectively. One end of the connecting rod 2233 away from the passive member 2232 is connected to the second clamping plate 221, and the connecting rod 2233 can move to the limiting channel of the linkage frame 222 when the driving member 2231 drives the passive member 2232, so that the distance between the first clamping plate 211 and the embedded plate on the embedded plate placement table 112 is adjusted.

[0036] Preferably, the second pressure plate assembly 22 also includes a plurality of second protective rods 224, each of the second protective rods 224 is set to a predetermined length, and is installed in a vertical posture on one side of the second pressure plate 221 for pressing the embedded plate, and each of the second protective rods 224 is evenly arranged, so that when the second pressure plate 221 presses the embedded plate, each of the second protective rods 224 can abut against the embedded plate to prevent the pins for detection provided on the second pressure plate 221 from being bent when the embedded plate is pressed.

[0037] Preferably, the device body 10 further includes a second body 12. Preferably, the first body 11 has an opening 1101 and a placement cavity 1102 connected to the opening 1101, and the placement cavity 1102 is used to store the circuit control system. The second body 12 is detachably connected to the first body 11 to cover and open the placement cavity 1102. It can be understood that when the placement cavity 1102 is closed by the second body 12, the circuit control system in the placement cavity 1102 is not connected to the outside world, so as to prevent the circuit control system from being affected by dust.

[0038] Specifically, the first pressing plate 211 of the first pressing plate assembly 21 is installed on the first body 11 . The linkage frame 222 of the second pressing plate assembly 22 is installed on the second body 12 and is located on the same side of the first body 11 as the first pressing plate 211 .

[0039] Preferably, the first body 11 further has at least one external device hole 1103 for connecting an external detection device, such as a voltmeter.

[0040] The detection unit 30 includes an embedded board adapter 31, a board to be tested adapter 32, a power amplifier simplification element 33 and a temperature detection element 34, wherein the embedded board adapter 31 is arranged on the first body 11 of the device body 10, and the embedded board adapter 31 can be electrically connected to a power supply. In addition, the embedded board adapter 31 is also electrically connected to the board to be tested adapter 32. The board to be tested adapter 32 is arranged on the device body 10, and the board to be tested adapter 32 is electrically connected to the power amplifier simplification element 33. The power amplifier simplification element 33 is arranged on the first body 11 of the device body 10, and the power amplifier simplification element 33 is connected in communication with the display unit 40 to transmit voltage test information. The temperature detection element 34 is arranged on the device body 10, and is connected in communication with the display unit 40 to detect the test temperature of the board to be tested and form a corresponding signal.

[0041] The display unit 40 is used to receive the information transmitted by the power amplifier simplified element 33 and the temperature detection element 34, and display the test data about the board to be tested, such as voltage value and test temperature. Preferably, the display unit 40 is installed on the first body 11 of the device body 10, and is located on the same side of the first body 11 as the first pressing plate 211. Preferably, the display unit 40 is implemented as a display.

[0042] It can be understood that when the board to be tested, the embedded board and the board to be tested are placed on the board to be tested placement platform 111 and the embedded board placement platform 112 respectively, the power switch is turned on to make the embedded board adapter 31, the board to be tested adapter 32 and the power amplifier simplified element 33 electrically connected, so as to test the voltage passing through the board to be tested and transmit it to the display unit 40. At the same time, the temperature detection component 34 detects the test temperature of the board to be tested when the board to be tested is tested, and forms a corresponding signal to be transmitted to the display unit 40. In this way, the voltage test operation and temperature detection operation of the board to be tested are carried out together, thereby improving the test efficiency and ensuring the consistency of the test results.

[0043] It is worth mentioning that the display unit 40 can display the channel temperature value detected by the temperature detection component 34. When the temperature detected by the temperature detection component 34 is lower than a predetermined value, such as lower than 20°C, the display unit 40 displays a numerical value to indicate to the user that the quality of the board to be tested is unqualified.

[0044] Preferably, the power amplifier simplified component 33 is implemented as a single chip board.

[0045] In addition, the temperature control motherboard testing device also includes a supporting assembly 50, which can be supported between the first body 11 and the second body 12 when the first body 11 and the second body 12 are separated to form a predetermined angle, so as to maintain the connection between the placement cavity 1102 and the outside world, thereby facilitating the user to repair the circuit control system in the placement cavity 1102.

[0046] Preferably, the support assembly 50 includes a first support frame 51 and a second support frame 52, wherein the first support frame 51 is movably connected to the first body 11 of the device body 10, and one end of the first support frame 51 away from the first body 11 is hinged to one end of the second support frame 52. The other end of the second support frame 52 away from the first support frame 51 is hinged to the second body 12.

[0047] It can be understood that when the first body 11 and the second body 12 are separated to drive the placement chamber 1102 to be opened, the first support frame 51 is driven, thereby driving the second support frame 52 to move, and when the first body 11 and the second body 12 are separated to form the predetermined angle, the first support frame 51 and the second support frame 52 act together between the first body 11 and the second body 12, and at this time, the placement chamber 1102 remains connected to the outside world.

[0048] In one embodiment, the first support frame 51 of the support assembly 50 is arranged in the placement cavity 1102, and the second support frame 52 is installed on the second body 12 to cover one side of the placement cavity 1102, so that when the second body 12 covers the placement cavity 1102, the support assembly 50 is covered and not in contact with the outside world, so as to prevent the support assembly 50 from being covered with dust and affecting its use.

[0049] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The advantages of the present invention have been fully and effectively realized. The functions and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims

1. Temperature control motherboard testing device, characterized in that, The temperature control mainboard testing device comprises: The device body comprises a first body, wherein the first body is provided with a test board placement table and an embedded board placement table, wherein the test board placement table is used to place the test board, and the embedded board placement table is used to place the embedded board; A pressing plate device, the pressing plate device comprising: A first pressing plate assembly, wherein the first pressing plate assembly is arranged on the first body in a manner capable of pressing the plate to be tested; a second pressing plate assembly, the second pressing plate assembly being arranged on the first body in a manner capable of pressing the embedded plate; A display unit, wherein the display unit is mounted on the first body; A detection unit, the detection unit includes an embedded board adapter, a board to be tested adapter, a power amplifier simplification element and a temperature detection element, wherein the embedded board adapter is arranged in the first body of the device body, and the embedded board adapter can be electrically connected to a power supply, the embedded board adapter is also electrically connected to the board to be tested adapter, the board to be tested adapter is arranged in the device body, and the board to be tested adapter is electrically connected to the power amplifier simplification element, the power amplifier simplification element is arranged in the first body of the device body, and the power amplifier simplification element is communicatively connected to the display unit for transmitting voltage test information, the temperature detection element is arranged in the device body, and is communicatively connected to the display unit for detecting the test temperature of the board to be tested and forming a corresponding signal, so that the display unit displays voltage test information and temperature detection information.

2. The temperature control motherboard testing device according to claim 1, characterized in that: The first pressure plate assembly includes a first pressure plate and a locking member, wherein the first pressure plate is movably connected to the first body to press the board to be tested placed on the board to be tested placement table, and the locking member is installed on the first body of the device body in a manner capable of locking the first pressure plate, so that the first pressure plate presses the board to be tested.

3. The temperature control motherboard testing device according to claim 2, characterized in that: The first pressure plate assembly also includes a handle member, which is installed at a predetermined position of the first pressure plate away from the connection between the first pressure plate and the first body, and the handle member forms an annular opening for the user to insert his hand and allow the user's hand to act on the inner wall forming the annular opening.

4. The temperature control motherboard testing device according to claim 3, characterized in that: The first pressing plate assembly further includes a plurality of first protection bars, each of which is set to a predetermined length and is installed in a vertical manner on one side of the first pressing plate for pressing the plate to be tested, and each of the first protection bars is evenly arranged.

5. The temperature control motherboard testing device according to claim 4, characterized in that: The second pressure plate assembly includes a second pressure plate, a linkage frame and a force-applying member, wherein the second pressure plate is driven and movably connected to the force-applying member and is located at a predetermined height, and the second pressure plate is movably connected to the linkage frame and aligned with the embedded plate placement table of the first body, the linkage frame is installed on the first body, and the linkage frame is provided with a limiting channel to limit the movement of the second pressure plate, and the force-applying member is arranged at a predetermined height position of the linkage frame to adjust the distance between the second pressure plate and the embedded plate on the embedded plate placement table.

6. The temperature control mainboard testing device according to claim 5, characterized in that: The force-applying component includes a driving member, a passive member and a connecting rod, wherein the driving member is movably mounted on the linkage frame to drive the passive member, two ends of the passive member are movably connected to the driving member and the connecting rod respectively, one end of the connecting rod away from the passive member is connected to the second clamping plate, and the connecting rod can move to the limiting channel of the linkage frame when the driving member drives the passive member.

7. The temperature control motherboard testing device according to claim 6, characterized in that: The second pressing plate assembly further includes a plurality of second protection bars, each of which is set to a predetermined length and is installed in a vertical manner on one side of the second pressing plate for pressing the embedded plate, and each of the second protection bars is evenly arranged.

8. The temperature control motherboard testing device according to claim 1 or 7, characterized in that: The device body also includes a second body, the first body has an opening and a placement cavity connected to the opening, the placement cavity is used to store the circuit control system, and the second body is detachably connected to the first body to cover and open the placement cavity.

9. The temperature control mainboard testing device according to claim 8, characterized in that: The temperature-controlled motherboard testing device also includes a supporting assembly, which includes a first supporting frame and a second supporting frame, wherein the first supporting frame is movably connected to the first body of the device body, and one end of the first supporting frame away from the first body is hinged to one end of the second supporting frame, and the other end of the second supporting frame away from the first supporting frame is hinged to the second body.

10. The temperature control mainboard testing device according to claim 9, characterized in that: The first support frame of the support assembly is disposed in the placement cavity, and the second support frame is installed on the second body to cover one side of the placement cavity.

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