Vacuum camera based on water cooling and phase change heat dissipation

Abstract

The utility model discloses a vacuum camera based on water cooling and phase change heat dissipation, a water cooling device and a phase change heat dissipation device are arranged in addition to a conventional semiconductor refrigeration mode, a heat exchange plate in the water cooling device is tightly attached to the hot end of a semiconductor refrigerator, a cooling liquid cavity is tightly attached to the heat exchange plate, heat is conducted to the outside through a cooling liquid loop, and heat dissipation is achieved. One end of a heat pipe in the phase-change heat dissipation device is connected with the hot end of the semiconductor cooler, the other end of the heat pipe extends into the phase-change medium cabin, the phase-change medium cabin is filled with phase-change materials, and the heat pipe conducts heat of the hot end of the semiconductor cooler to the phase-change materials to be absorbed. According to the utility model, a semiconductor refrigeration mode is combined with three heat dissipation modes of water-cooling heat dissipation and phase change heat absorption, so that the working time is effectively prolonged, the working interval is shortened, and the quality of images shot by the vacuum camera and the working efficiency are greatly improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of scientific cameras, and more specifically, relates to a vacuum camera based on water cooling and phase change heat dissipation. Background Art

[0002] Vacuum cameras are a special type of scientific cameras, generally used in vacuum-sealed environments. Vacuum environments have high requirements for the heat of the camera, so the camera needs to be a low-radiation source to reduce the temperature impact of the camera on other equipment. When the camera is in operation, the core device image sensor and internal electronic components of the camera will continue to generate heat, causing the image sensor temperature and the overall temperature to continue to rise, which will also affect the final image quality and other equipment; in order to reduce the impact of thermal noise on image quality and realize the application of long-term exposure, some methods are needed to cool and dissipate heat for the camera.

[0003] At present, most cameras use semiconductor refrigeration to deeply cool the image sensor. The semiconductor cooler is divided into two sides: the cold end and the hot end. If the heat generated by the semiconductor hot end is not transferred in time, the temperature of the hot end will increase, and the temperature of the cold end will also rise. Therefore, in order to maintain the deep cooling effect of the semiconductor cold end on the sensor, the heat generated by the hot end needs to be transferred to maintain the temperature stability of the cold end to ensure image quality. In addition to semiconductor refrigeration, other commonly used heat dissipation methods on the market are to use air cooling and water cooling to dissipate heat from the semiconductor hot end.

[0004] As far as air cooling is concerned, the heat sink fins are usually directly installed on the semiconductor hot end, and the heat conducted by the heat sink fins is taken away by the fan; the heat pipe can also be directly installed on the semiconductor hot end, and then the heat sink fins are connected to the heat pipes, and finally the heat from the heat sink fins is taken away by the fan. When using air cooling, the mechanical vibration of the fan will affect the final imaging and may also affect other equipment in the confined space. At the same time, since the vacuum-sealed environment has strict requirements on the overall space size, there are also certain regulations on the camera size. Due to the different complexity of the camera, the internal layout of the camera will become more dense and complex, so the space left for the air-cooling structure will become less and less, which will reduce the heat dissipation capacity, and there is strict control of heat in the vacuum-sealed environment. Therefore, in general, try not to use the air-cooling structure as much as possible to avoid affecting the temperature of other equipment.

[0005] As for water cooling, this method is to directly remove the heat from the semiconductor hot end through a water cooling pipe. However, in some complex application environments, the water cooling structure may have the risk of coolant leakage. Therefore, it is necessary to consider multiple heat dissipation methods to remove the heat from the semiconductor hot end to ensure image quality. Utility Model Content

[0006] The purpose of the utility model is to overcome the shortcomings of the prior art and provide a vacuum camera based on water cooling and phase change heat dissipation, which combines semiconductor refrigeration with three heat dissipation methods, namely water cooling and phase change heat absorption, effectively prolongs its working time and shortens the working interval, greatly improving the quality of images taken by the vacuum camera and the working efficiency.

[0007] In order to achieve the above-mentioned invention object, the vacuum camera based on water cooling and phase change heat dissipation of the utility model comprises a camera front cover, a cooling rear cabin, an imaging component, a heat-conducting copper block, a semiconductor refrigerator, a water cooling device and a phase change heat dissipation device, wherein:

[0008] The camera front cover is tightly connected to the cooling rear cabin to form the outer shell of the vacuum camera;

[0009] The imaging assembly is installed at the front end of the cooling rear cabin; the imaging assembly includes an image sensor, an imaging circuit board, a data processing board, an interface circuit board and an optical fiber transceiver, wherein the image sensor is welded on the imaging circuit board to realize photoelectric conversion and data output; the data processing board is located on the side of the imaging circuit board and is data-connected to the imaging circuit board for pre-processing the photoelectric data; one end of the interface circuit board is data-connected to the imaging circuit board, and data communication is performed with the data processing board through the imaging circuit board, and the other end is connected to the optical fiber transceiver, and data transmission and reception between the data processing board and the external device are realized through the optical fiber transceiver;

[0010] The two sides of the heat-conducting copper block are respectively in close contact with the imaging circuit board and the cold end of the semiconductor refrigerator, and the semiconductor refrigerator cools the imaging circuit board and the image sensor through the heat-conducting copper block;

[0011] The water cooling device includes a heat exchange plate, a cooling liquid cavity, a cooling liquid inlet and outlet water channel, and a cooling liquid inlet and outlet, wherein the heat exchange plate is close to the hot end of the semiconductor refrigerator, the cooling liquid cavity is close to the heat exchange plate, the cooling liquid inlet and outlet are arranged outside the cooling rear cabin, and the cooling liquid inlet and outlet water channel connects the cooling liquid inlet and outlet and the cooling liquid cavity, so that the external cooling liquid enters the cooling liquid cavity through the cooling liquid inlet and outlet and the cooling liquid inlet and outlet water channel, and is discharged to the outside after heat exchange with the hot end of the semiconductor refrigerator;

[0012] The phase change heat dissipation device includes a heat pipe and a phase change medium cabin, wherein one end of the heat pipe is connected to the hot end side of the semiconductor refrigerator, and the other end extends to the interior of the phase change medium cabin, in which the phase change medium cabin is filled with phase change material. The heat pipe transfers the heat from the hot end of the semiconductor refrigerator to the phase change material for absorption.

[0013] Furthermore, the camera front cover includes a sealed front cover and a detachable light window pressure ring, a glass light window, and a sealing ring gasket, wherein the glass light window is installed at the opening of the sealed front cover, the light window pressure ring is used to fix the glass light window, and the sealing ring gasket is arranged at the connection between the glass light window and the sealed front cover.

[0014] Furthermore, a sealing ring gasket is provided at the connection between the camera front cover and the cooling rear cabin.

[0015] Furthermore, the coolant inlet and outlet in the water cooling device and the interface circuit board and the optical fiber transceiver in the imaging component are respectively arranged on both sides of the cooling rear cabin.

[0016] Furthermore, the heat pipe in the phase change heat dissipation device is connected to the hot end of the semiconductor refrigerator by using a low-temperature reflow soldering process.

[0017] Furthermore, the number of heat pipes in the phase change heat dissipation device is ≥2, and they are arranged on both sides of the semiconductor refrigerator in a dispersed manner.

[0018] Furthermore, the phase change heat dissipation device uses a phase change material with a melting point of 25 to 30° C. and a phase change heat absorption ratio of 200 to 240 joules / gram.

[0019] Furthermore, a heat-conducting baffle connected to the heat pipe is provided in the phase-change medium cabin.

[0020] Furthermore, the heat-conducting baffle is provided with a plurality of holes.

[0021] Furthermore, the compressive strength of the phase change medium cabin is above 0.5 MPa.

[0022] The utility model is a vacuum camera based on water cooling and phase change heat dissipation. In addition to the conventional semiconductor refrigeration method, a water cooling device and a phase change heat dissipation device are arranged, wherein a heat exchange plate in the water cooling device is close to the hot end of the semiconductor refrigerator, and a cooling liquid cavity is close to the heat exchange plate, and heat is transferred to the outside through a cooling liquid circuit. One end of a heat pipe in the phase change heat dissipation device is connected to the hot end of the semiconductor refrigerator, and the other end extends to the interior of a phase change medium cabin, in which phase change material is filled, and the heat pipe transfers the heat of the hot end of the semiconductor refrigerator to the phase change material for absorption.

[0023] The utility model has the following beneficial effects:

[0024] 1) The utility model improves the structure of the vacuum camera, effectively combines the semiconductor refrigerator with water cooling and phase change heat dissipation, improves the heat dissipation efficiency, and thus prolongs the working time of the vacuum camera;

[0025] 2) When the vacuum camera is in a vacuum-sealed environment and water cooling is prohibited, the energy storage material absorbs the heat at the hot end during phase change and maintains a longer cooling working time for the camera, while maintaining the stability of the entire ambient temperature and reducing the impact on other equipment;

[0026] 3) When using water cooling, the coolant directly takes away the heat when it flows through the hot end. The coolant temperature can be adjusted externally to achieve deep cooling of the sensor, effectively reducing the sensor's thermal noise and overall heat, keeping the camera working for a long time without causing the ambient temperature to rise. At the same time, when the coolant temperature is lower than the ambient temperature, it can also assist in cooling the entire system, taking away the heat of other equipment, and increasing the reliability and stability of the system. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a structural diagram of a specific implementation of the vacuum camera based on water cooling and phase change heat dissipation of the utility model;

[0028] Figure 2 is an external structural diagram of the vacuum camera in this embodiment;

[0029] Figure 3 is a cross-sectional view of a vacuum camera based on water cooling and phase change heat dissipation in this embodiment;

[0030] Figure 4 It is a cross-sectional view of the vacuum camera based on water cooling and phase change heat dissipation in this embodiment. DETAILED DESCRIPTION

[0031] The specific implementation of the utility model is described below in conjunction with the accompanying drawings so that those skilled in the art can better understand the utility model. It should be noted that in the following description, when the detailed description of known functions and designs may dilute the main content of the utility model, these descriptions will be omitted here.

[0032] Figure 1 It is a structural diagram of a specific implementation of the vacuum camera based on water cooling and phase change heat dissipation of the utility model. Figure 2 This is a stereogram of the vacuum camera based on water cooling and phase change heat dissipation of the utility model. Figure 1 and Figure 2 As shown, the vacuum camera based on water cooling and phase change heat dissipation in this embodiment includes a camera front cover 1, a cooling rear cabin 2, an imaging component 3, a thermal conductive copper block 4, a semiconductor refrigerator 5, a water cooling device 6 and a phase change heat dissipation device 7, and each component is described in detail below.

[0033] Figure 2 : is the external structure diagram of the vacuum camera in this embodiment. Figure 3As shown, the camera front cover 1 is tightly connected with the cooling rear cabin 2 to form the outer shell of the vacuum camera. In this embodiment, the camera front cover includes a sealed front cover 14 and a detachable light window pressing ring 11, a glass light window 12, and a sealing ring gasket 13, wherein the glass light window 12 is installed at the opening of the sealed front cover 14, the light window pressing ring 11 is used to fix the glass light window 12, and the sealing ring gasket 13 is arranged at the connection between the glass light window 12 and the sealed front cover 14. The purpose of adopting a detachable structure in this embodiment is twofold: 1) When the camera works in an atmospheric environment or other environment that affects the image sensor, the aperture pressing ring 11 fixes the glass light window 12 to the sealed front cover 14, and at the same time forms a sealed environment for the camera front cover part. At the same time, due to the setting of the sealing ring gasket 13, the airtightness of the vacuum camera housing can be increased, and the image sensor can also be sealed to prevent foreign objects from entering and avoid causing sensor damage; 2) When the camera works in a vacuum sealed environment, the light window pressing ring 11 and the glass light window 12 can be removed according to the specific application scenario. In this embodiment, the camera front cover 1 and the cooling rear cabin 2 are connected by a front cover locking screw 15, and a sealing ring gasket can also be provided at the connection between the camera front cover 1 and the cooling rear cabin 2 to enhance the airtightness of the vacuum camera housing.

[0034] Figure 3 is a cross-sectional view of a vacuum camera based on water cooling and phase change heat dissipation in this embodiment. In order to better show the imaging component 3 and the water cooling device 6, Figure 3 Part of the structure of the phase change heat sink 7 is omitted. Figure 1 , Figure 3 As shown, the imaging assembly 3 is installed at the front end of the cooling rear cabin 2. The imaging assembly 3 includes an image sensor 31, an imaging circuit board 32, a data processing board 33, an interface circuit board 34 and an optical fiber transceiver 35, wherein the image sensor 31 is welded on the imaging circuit board 32 to realize photoelectric conversion and data output. The data processing board 33 is located on the side of the imaging circuit board 32 and is data-connected with the imaging circuit board 32 for preprocessing the photoelectric data. One end of the interface circuit board 34 is data-connected with the imaging circuit board 32, and data communication is performed with the data processing board 33 through the imaging circuit board 32. The other end is connected to the optical fiber transceiver 35, and data transmission and reception between the data processing board 33 and the external device are realized through the optical fiber transceiver 35. In this embodiment, the interface circuit board 34 and the data processing board 33 are connected by a sealed electrical connector 36 and a sealed data connection cable 37, so that the position arrangement of the interface circuit board 34 is more flexible and the safety of the circuit can be improved.

[0035] The two sides of the heat-conducting copper block 4 are respectively in close contact with the imaging circuit board 32 and the cold end of the semiconductor refrigerator 5 . The semiconductor refrigerator 5 cools the imaging circuit board 32 and the image sensor 31 through the heat-conducting copper block 4 .

[0036] The water cooling device 6 includes a heat exchange plate 61, a cooling liquid cavity 62, a cooling liquid inlet and outlet water channel 63, and a cooling liquid inlet and outlet 64, wherein the heat exchange plate 61 is close to the hot end of the semiconductor refrigerator 5, the cooling liquid cavity 62 is close to the heat exchange plate 61, the cooling liquid inlet and outlet 64 is arranged outside the cooling rear cabin 2, and the cooling liquid inlet and outlet water channel 63 connects the cooling liquid inlet and outlet 64 and the cooling liquid cavity 62, so that the external cooling liquid enters the cooling liquid cavity 62 through the cooling liquid inlet and outlet 64 and the cooling liquid inlet and outlet water channel 63, and is discharged to the outside after heat exchange with the hot end of the semiconductor refrigerator 5. It can be seen that the temperature of the cooling liquid in the water cooling device 6 can be controlled from the outside, and the operator can set the temperature of the cooling liquid according to the actual situation, so that the camera can work continuously for a long time and be in the deep cooling mode. In this embodiment, the cooling liquid inlet and outlet 64 in the water cooling device 6 and the interface circuit board 34 and the optical fiber transceiver 35 in the imaging component 3 are respectively arranged on both sides of the cooling rear cabin 2, so as to avoid the influence of the cooling liquid on the imaging component 3 when the cooling liquid leaks, and improve the safety of the vacuum camera.

[0037] Figure 4 is a cross-sectional view of a vacuum camera based on water cooling and phase change heat dissipation in this embodiment. In order to better illustrate the structure of the phase change heat dissipation device 7, Figure 4 Part of the water cooling device structure is omitted. Figure 1 and Figure 4 As shown, the phase change heat sink 7 includes a heat pipe 71 and a phase change medium chamber 72, wherein one end of the heat pipe 71 is connected to the hot end side of the semiconductor refrigerator 5, and the other end extends to the inside of the phase change medium chamber 72, and the phase change medium chamber 72 is filled with phase change material. The heat pipe 71 conducts the heat from the hot end of the semiconductor refrigerator 5 to the phase change material for absorption. When the temperature inside the camera rises, the phase change material gradually absorbs the heat, so that the camera is at a stable operating temperature. The phase change heat sink 7 uses the heat pipe 71 as a heat conduction device, which is faster and more efficient than thermally conductive silica gel, thermally conductive gel, thermally conductive silicone grease and other thermally conductive materials.

[0038] In this embodiment, the heat pipe 71 is connected to the hot end of the semiconductor refrigerator 5 by a low-temperature reflow soldering process. Compared with other processes of directly attaching heat-conducting materials to the hot end of the semiconductor refrigerator 5, this welding method greatly improves the heat transfer efficiency of the heat transfer pipe and ensures the connection stability between the hot end of the semiconductor refrigerator 5 and the heat pipe 71. Generally speaking, the number of heat pipes 71 in the phase change heat dissipation device 7 is ≥ 2, and they are arranged on both sides of the semiconductor refrigerator 5 in a dispersed arrangement, which increases the contact area between the heat pipe 71 and the semiconductor refrigerator 5, accelerates its heat dissipation efficiency, and quickly extracts the heat from the hot end of the semiconductor refrigerator 5.

[0039] In addition, considering that the temperature of most vacuum-sealed environments is 0-25°C, a phase change material with a melting point of 25-30°C and a phase change heat absorption ratio of 200-240 J / g is used in this embodiment. In order to increase the heat absorption efficiency of the phase change material, a heat-conducting baffle 73 connected to the heat pipe 71 can also be provided in the phase change medium cabin 7 to increase the contact area with the phase change material. When the heat is transferred through the heat pipe, the heat can be quickly transferred to the phase change material through the heat-conducting baffle 73, thereby accelerating the conduction of heat. On the heat-conducting baffle 73, a number of holes (such as round holes, square holes) can be further provided to maintain the fluidity of the melted phase change material after absorbing heat, so that it can fully absorb heat.

[0040] In order to improve the safety of the vacuum camera, the pressure resistance level of the phase change medium cabin 72 is above 0.5 MPa to ensure that there is no risk of leakage when it is used in a vacuum-sealed environment.

[0041] Although the above describes an illustrative specific implementation manner of the present invention to facilitate technical personnel in this technical field to understand the present invention, it should be clear that the present invention is not limited to the scope of the specific implementation manner. For ordinary technical personnel in this technical field, as long as various changes are within the spirit and scope of the present invention defined and determined by the attached claims, these changes are obvious, and all inventions and creations using the concept of the present invention are protected.

Claims

1. A vacuum camera based on water cooling and phase change heat dissipation, characterized in that The invention comprises a camera front cover (1), a cooling rear cabin (2), an imaging component (3), a heat-conducting copper block (4), a semiconductor refrigerator (5), a water cooling device (6) and a phase-change heat dissipation device (7), wherein: The camera front cover (1) is tightly connected to the cooling rear cabin (2) to form the outer shell of the vacuum camera; The imaging component (3) is installed at the front end of the cooling rear cabin (2); the imaging component (3) comprises an image sensor (31), an imaging circuit board (32), a data processing board (33), an interface circuit board (34) and an optical fiber transceiver (35), wherein the image sensor (31) is welded on the imaging circuit board (32) to realize photoelectric conversion and data output; the data processing board (33) is data-connected with the imaging circuit board (32) to pre-process the photoelectric data; one end of the interface circuit board (34) is data-connected with the imaging circuit board (32) to communicate data with the data processing board (33) through the imaging circuit board (32), and the other end is connected to the optical fiber transceiver (35) to realize data transmission and reception between the data processing board (33) and an external device through the optical fiber transceiver (35); The two sides of the heat-conducting copper block (4) are respectively in close contact with the imaging circuit board (32) and the cold end of the semiconductor refrigerator (5), and the semiconductor refrigerator (5) cools the imaging circuit board (32) and the image sensor (31) through the heat-conducting copper block (4); The water cooling device (6) comprises a heat exchange plate (61), a cooling liquid cavity (62), a cooling liquid inlet and outlet water channel (63), and a cooling liquid inlet and outlet (64), wherein the heat exchange plate (61) is in close contact with the hot end of the semiconductor refrigerator (5), the cooling liquid cavity (62) is in close contact with the heat exchange plate (61), the cooling liquid inlet and outlet (64) is arranged outside the cooling rear cabin (2), and the cooling liquid inlet and outlet water channel (63) connects the cooling liquid inlet and outlet (64) and the cooling liquid cavity (62), so that the external cooling liquid enters the cooling liquid cavity (62) through the cooling liquid inlet and outlet (64) and the cooling liquid inlet and outlet water channel (63), and is discharged to the outside after heat exchange with the hot end of the semiconductor refrigerator (5); The phase change heat dissipation device (7) comprises a heat pipe (71) and a phase change medium cabin (72), wherein one end of the heat pipe (71) is connected to the hot end side of the semiconductor refrigerator (5), and the other end extends into the interior of the phase change medium cabin (72), the phase change medium cabin (72) is filled with phase change material, and the heat pipe (71) conducts the heat of the hot end of the semiconductor refrigerator (5) to the phase change material for absorption.

2. The vacuum camera according to claim 1, characterized in that: The camera front cover comprises a sealing front cover (14), a detachable light window pressing ring (11), a glass light window (12), and a sealing ring gasket (13), wherein the glass light window (12) is installed at the opening of the sealing front cover (14), the light window pressing ring (11) is used to fix the glass light window (12), and the sealing ring gasket (13) is arranged at the connection between the glass light window (12) and the sealing front cover (14).

3. The vacuum camera according to claim 1, characterized in that: A sealing ring is provided at the connection between the camera front cover (1) and the cooling rear compartment (2).

4. The vacuum camera according to claim 1, characterized in that: The cooling liquid inlet and outlet (64) in the water cooling device (6) and the interface circuit board (34) and the optical fiber transceiver (35) in the imaging component (3) are respectively arranged on both sides of the cooling rear cabin (2).

5. The vacuum camera according to claim 1, characterized in that: The heat pipe (71) in the phase-change heat dissipation device (7) is connected to the hot end of the semiconductor refrigerator (5) by using a low-temperature reflow soldering process.

6. The vacuum camera according to claim 1, characterized in that: The number of heat pipes (71) in the phase-change heat dissipation device is ≥2, and they are arranged on both sides of the semiconductor refrigerator (5) in a dispersed arrangement.

7. The vacuum camera according to claim 1, characterized in that: The phase change heat dissipation device (7) uses a phase change material with a melting point of 25-30° C. and a phase change heat absorption ratio of 200-240 joules / gram.

8. The vacuum camera according to claim 1, characterized in that: A heat-conducting baffle (73) connected to the heat pipe (71) is arranged in the phase-change medium cabin (72).

9. The vacuum camera according to claim 8, characterized in that: The heat-conducting baffle (73) is provided with a plurality of holes.

10. The vacuum camera according to claim 1, characterized in that: The pressure resistance level of the phase change medium cabin (72) is above 0.5 MPa.

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