Computer mainboard with active heat dissipation function

Abstract

The computer mainboard with the active heat dissipation function comprises a substrate, the top end of the substrate is fixedly connected with a heat absorption dustproof shell, the top end of the heat absorption dustproof shell is connected with a cooling pipe in a clamped mode, and one end of the cooling pipe is connected with a cooling liquid storage box in a penetrating mode; according to the utility model, when the cooling liquid flowing pipe leaks, the cooling liquid flows into the transparent outer pipe and is mixed with the dyeing powder in the transparent outer pipe, so that an operator can find the leakage problem of the cooling liquid in time so as to take corresponding measures to repair loopholes and prevent further damage to equipment or potential safety hazards; the substrate can be protected through the heat absorption dustproof shell, the phenomenon that dust and particulate matter in the air are accumulated on the substrate is reduced, heat generated by the substrate in the substrate is absorbed, the contact area of the heat absorption dustproof shell and the cooling pipe can be increased through the pipeline fixing groove, the heat dissipation effect is improved, the cooling pipe can be fixed through the pipeline fixing piece, and the cooling effect is improved. The cooling pipe is attached to the side end of the heat absorption dustproof shell.

Description

Technical Field

[0001] The utility model relates to the technical field of computer equipment, in particular to a computer mainboard with an active heat dissipation function. Background Art

[0002] A computer is an electronic device that can execute programs and process data. It can perform a variety of tasks, from simple calculations and text processing to complex graphics rendering and scientific computing. A computer is usually composed of multiple hardware and software, including a central processing unit, memory, hard drive, graphics card, motherboard, operating system, etc. The computer motherboard is a large electronic circuit board and the central hub of the computer system, connecting and supporting the operation of various hardware components. The motherboard is usually a rectangular plate covered with various slots, sockets and connectors for installing and connecting the CPU, memory, graphics card, storage device, expansion card and various other peripheral devices.

[0003] Since the computer motherboard carries the CPU and other key components, a large amount of heat is generated on the motherboard when the computer is running. Therefore, existing computer motherboards will be equipped with cooling fans for heat dissipation. However, the operation of the fan will drive the air flow, causing dust and particles in the air to accumulate on the surface of the radiator and the motherboard, affecting the heat dissipation effect and possibly causing overheating of the motherboard and other hardware components. Utility Model Content

[0004] The purpose of the utility model is to provide a computer motherboard with active heat dissipation function in order to solve the problem that a cooling fan is installed on the existing computer motherboard for heat dissipation, but the operation of the fan drives the air to flow, causing dust and particles in the air to accumulate on the surface of the radiator and the motherboard, affecting the heat dissipation effect, and possibly causing overheating of the motherboard and other hardware components.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a computer motherboard with active heat dissipation function, comprising: a base plate, a heat-absorbing dustproof shell fixedly connected to the top of the base plate, a cooling pipe clamped on the top of the heat-absorbing dustproof shell, one end of the cooling pipe is through-connected to a coolant storage tank, the other end of the cooling pipe is fixedly connected to a water pump, the other end of the water pump is through-connected to the coolant storage tank, one end of the outer side of the water pump is fixedly connected to a cooling device, the side end of the heat-absorbing dustproof shell is fixedly connected to a pipe fixing piece, and the pipe fixing piece is clamped to the cooling pipe.

[0006] As a further solution of the utility model: the cooling tube includes a transparent outer tube, a cooling liquid flow tube and dyeing powder.

[0007] As a further solution of the utility model: the coolant flow tube is arranged inside the transparent outer tube, the end surfaces of both ends of the transparent outer tube are sealed and connected to the outside of the coolant flow tube, and dyeing powder is arranged between the transparent outer tube and the coolant flow tube.

[0008] As a further solution of the utility model: the cooling device includes a heat conducting plate, a heat sink, a fan fixing plate and a cooling fan.

[0009] As a further solution of the utility model: the heat conduction plate is fixedly connected to the side end of the coolant storage tank, the heat sink is provided with multiple groups, evenly distributed on the side end of the heat conduction plate, and fixedly connected to the heat conduction plate, the fan fixing plate is provided at the upper end of the heat sink, and fixedly connected to the heat conduction plate, and the cooling fan is provided with multiple groups, and fixedly connected to the fan fixing plate.

[0010] As a further solution of the utility model: the heat-absorbing dustproof shell includes a bottom plate, a shell, an access groove and a pipeline fixing groove.

[0011] As a further solution of the utility model: the bottom plate is fixedly connected to the outer side of the shell, two groups of access grooves are provided and opened at the side end of the shell, and the pipeline fixing groove is opened at the top end of the shell.

[0012] As a further solution of the utility model: the pipeline fixing member includes a fixing rod, a mounting groove, a connecting block and a C-shaped fixing ring.

[0013] As a further solution of the utility model: the fixing rod is fixedly connected to the base plate, the mounting groove is opened at the side end of the fixing rod, the connecting block is plugged into the mounting groove, the C-shaped fixing ring is fixedly connected to the connecting block, and four groups of pipe fixings are arranged, which are symmetrically distributed on the side end of the shell.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] In the utility model, when leakage occurs in the coolant flow pipe through dyeing powder, the coolant will flow into the transparent outer tube and mix with the dyeing powder therein, so that the operator can find the leakage problem of the coolant in time, so as to take corresponding measures to repair the leakage and prevent further damage to the equipment or safety hazards. The heat of the coolant in the coolant storage box can be exchanged through the cooling device, so that the coolant always maintains a suitable temperature, and the temperature of the coolant is prevented from gradually rising during long-term use, thereby improving the cooling effect of the coolant on the substrate. The substrate can be protected by the heat-absorbing dustproof shell, the accumulation of dust and particulate matter in the air on the substrate can be reduced, and the heat generated by the internal substrate can be absorbed. The contact area between the heat-absorbing dustproof shell and the cooling tube can be increased by the pipeline fixing groove, thereby improving the heat dissipation effect. The cooling tube can be fixed by the pipeline fixing piece, so that the cooling tube fits the side end of the heat-absorbing dustproof shell. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of a computer motherboard with active heat dissipation function described in the utility model;

[0017] Figure 2 It is a cross-sectional view of the overall structure of a computer motherboard with active heat dissipation function described in the utility model;

[0018] Figure 3 This is a schematic diagram of the structure of location A in a computer motherboard with active heat dissipation function described in the utility model;

[0019] Figure 4 It is a structural schematic diagram of a cooling device in a computer motherboard with active heat dissipation function described in the utility model;

[0020] Figure 5 It is a structural schematic diagram of a heat-absorbing dustproof shell in a computer motherboard with an active heat dissipation function described in the utility model;

[0021] Figure 6 It is a structural schematic diagram of a pipe fixing part in a computer mainboard with active heat dissipation function described in the utility model.

[0022] In the figure: 1. substrate; 2. heat-absorbing dustproof shell; 21. bottom plate; 22. shell; 23. access slot; 24. pipe fixing slot; 3. cooling pipe; 31. transparent outer tube; 32. coolant flow pipe; 33. dyeing powder; 4. coolant storage tank; 5. water pump; 6. cooling device; 61. heat conduction plate; 62. heat sink; 63. fan fixing plate; 64. cooling fan; 7. pipe fixing piece; 71. fixing rod; 72. mounting slot; 73. connecting block; 74. C-type fixing ring. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] In the description of the present utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, which are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation of the present utility model. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "set" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal connection of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances. The following is an explanation of the embodiments of the present utility model based on the overall structure of the present utility model.

[0025] Reference Figure 1 to Figure 2 In an embodiment of the utility model, a computer motherboard with active heat dissipation function includes: a base plate 1, a heat absorbing dustproof shell 2 is fixedly connected to the top of the base plate 1, a cooling pipe 3 is clamped on the top of the heat absorbing dustproof shell 2, one end of the cooling pipe 3 is connected to a coolant storage tank 4, the other end of the cooling pipe 3 is fixedly connected to a water pump 5, the other end of the water pump 5 is connected to the coolant storage tank 4, one end of the water pump 5 is fixedly connected to a cooling device 6, and a side end of the heat absorbing dustproof shell 2 is fixedly connected to a pipe fixing member 7, and the pipe fixing member 7 is clamped with the cooling pipe 3.

[0026] Reference Figure 3 The cooling tube 3 includes a transparent outer tube 31, a cooling liquid flow tube 32 and a dyeing powder 33. The cooling liquid flow tube 32 is arranged inside the transparent outer tube 31. The end surfaces of both ends of the transparent outer tube 31 are sealed and connected to the outside of the cooling liquid flow tube 32. The dyeing powder 33 is arranged between the transparent outer tube 31 and the cooling liquid flow tube 32.

[0027] By adopting the above scheme, when the coolant flow pipe 32 leaks through the dyeing powder 33, the coolant will flow into the transparent outer tube 31 and mix with the dyeing powder 33 therein, so that the operator can discover the coolant leakage problem in time and take appropriate measures to repair the leak to prevent further damage to the equipment or cause safety hazards.

[0028] Reference Figure 4The cooling device 6 includes a heat conducting plate 61, a heat sink 62, a fan fixing plate 63 and a cooling fan 64. The heat conducting plate 61 is fixedly connected to the side end of the coolant storage tank 4. The heat sink 62 is provided with a plurality of groups, which are evenly distributed on the side end of the heat conducting plate 61 and fixedly connected to the heat conducting plate 61. The fan fixing plate 63 is provided at the upper end of the heat sink 62 and fixedly connected to the heat conducting plate 61. The cooling fan 64 is provided with a plurality of groups, which are fixedly connected to the fan fixing plate 63.

[0029] By adopting the above scheme, the heat of the coolant in the coolant storage tank 4 can be exchanged through the cooling device 6, so that the coolant always maintains a suitable temperature, prevents the coolant from gradually increasing in temperature during long-term use, and improves the cooling effect of the coolant on the substrate 1.

[0030] Reference Figure 5 and Figure 6 The heat-absorbing dustproof shell 2 includes a bottom plate 21, a shell 22, an access groove 23 and a pipe fixing groove 24. The bottom plate 21 is fixedly connected to the outer side of the shell 22. The access groove 23 is provided with two groups, which are opened at the side end of the shell 22. The pipe fixing groove 24 is opened at the top of the shell 22. The pipe fixing part 7 includes a fixing rod 71, a mounting groove 72, a connecting block 73 and a C-type fixing ring 74. The fixing rod 71 is fixedly connected to the bottom plate 21, the mounting groove 72 is opened at the side end of the fixing rod 71, the connecting block 73 is plugged into the mounting groove 72, and the C-type fixing ring 74 is fixedly connected to the connecting block 73. The pipe fixing part 7 is provided with four groups, which are symmetrically distributed at the side end of the shell 22.

[0031] By adopting the above scheme, the substrate 1 can be protected by the heat-absorbing dustproof shell 2, the accumulation of dust and particulate matter in the air on the substrate 1 can be reduced, and the heat generated by the substrate 1 inside can be absorbed. The contact area between the heat-absorbing dustproof shell 2 and the cooling pipe 3 can be increased by the pipe fixing groove 24, thereby improving the heat dissipation effect. The cooling pipe 3 can be fixed by the pipe fixing piece 7 so that the cooling pipe 3 fits the side end of the heat-absorbing dustproof shell 2.

[0032] The working principle of the utility model is as follows: when in use, the water pump 5 is first started to extract the coolant in the coolant storage tank 4, so that it flows in the cooling pipe 3 and flows back into the coolant storage tank 4. When the substrate 1 is in use, the heat-absorbing dustproof shell 2 will absorb the heat generated by it, and the coolant in the cooling pipe 3 coiled on the outside of the heat-absorbing dustproof shell 2 will take away the heat on the heat-absorbing dustproof shell 2 to cool the substrate 1. When the coolant that absorbs a certain amount of heat returns to the coolant storage tank 4, its heat will be conducted to the heat sink 62 by the heat conduction plate 61, and the air flow is driven by the cooling fan 64 to cool the heat sink 62. The coolant with the reduced temperature continues to be extracted to cool the substrate 1. When the coolant flow pipe 32 leaks through the dyeing powder 33, the coolant will flow into the transparent outer tube 31 and mix with the The dyeing powder 33 is mixed so that the operator can find the leakage of the coolant in time, so as to take corresponding measures to repair the leak and prevent further damage to the equipment or safety hazards. The heat of the coolant in the coolant storage tank 4 can be exchanged through the cooling device 6, so that the coolant always maintains a suitable temperature, prevents the coolant from gradually increasing in temperature during long-term use, and improves the cooling effect of the coolant on the substrate 1. The heat-absorbing dustproof shell 2 can protect the substrate 1, reduce the accumulation of dust and particulate matter in the air on the substrate 1, and absorb the heat generated by the internal substrate 1. The contact area between the heat-absorbing dustproof shell 2 and the cooling pipe 3 can be increased through the pipe fixing groove 24 to improve the heat dissipation effect. The cooling pipe 3 can be fixed by the pipe fixing member 7 so that the cooling pipe 3 fits the side end of the heat-absorbing dustproof shell 2.

[0033] What is described above is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A computer motherboard with active heat dissipation function, characterized in that: include: A substrate (1), wherein the top of the substrate (1) is fixedly connected to a heat-absorbing dustproof shell (2), the top of the heat-absorbing dustproof shell (2) is clamped with a cooling pipe (3), one end of the cooling pipe (3) is connected to a coolant storage tank (4), the other end of the cooling pipe (3) is fixedly connected to a water pump (5), the other end of the water pump (5) is connected to the coolant storage tank (4), one end of the outer side of the water pump (5) is fixedly connected to a cooling device (6), and the side end of the heat-absorbing dustproof shell (2) is fixedly connected to a pipe fixing piece (7), and the pipe fixing piece (7) is clamped with the cooling pipe (3).

2. A computer motherboard with active heat dissipation function according to claim 1, characterized in that: The cooling tube (3) comprises a transparent outer tube (31), a cooling liquid flow tube (32) and dyeing powder (33).

3. A computer motherboard with active heat dissipation function according to claim 2, characterized in that: The cooling liquid flow tube (32) is arranged inside the transparent outer tube (31), the end surfaces at both ends of the transparent outer tube (31) are sealedly connected to the outside of the cooling liquid flow tube (32), and dyeing powder (33) is arranged between the transparent outer tube (31) and the cooling liquid flow tube (32).

4. A computer motherboard with active heat dissipation function according to claim 1, characterized in that: The cooling device (6) comprises a heat conducting plate (61), a heat sink (62), a fan fixing plate (63) and a cooling fan (64).

5. The computer motherboard with active heat dissipation function according to claim 4, characterized in that: The heat conducting plate (61) is fixedly connected to the side end of the coolant storage tank (4); the heat sink (62) is provided in a plurality of groups, evenly distributed on the side end of the heat conducting plate (61) and fixedly connected to the heat conducting plate (61); the fan fixing plate (63) is provided at the upper end of the heat sink (62) and fixedly connected to the heat conducting plate (61); the cooling fan (64) is provided in a plurality of groups, fixedly connected to the fan fixing plate (63).

6. The computer motherboard with active heat dissipation function according to claim 1, characterized in that: The heat-absorbing dustproof housing (2) comprises a bottom plate (21), a shell (22), an access groove (23) and a pipeline fixing groove (24).

7. A computer motherboard with active heat dissipation function according to claim 6, characterized in that: The bottom plate (21) is fixedly connected to the outside of the shell (22); two groups of access grooves (23) are provided and opened at the side end of the shell (22); and the pipeline fixing groove (24) is opened at the top end of the shell (22).

8. The computer motherboard with active heat dissipation function according to claim 1, characterized in that: The pipeline fixing member (7) comprises a fixing rod (71), a mounting groove (72), a connecting block (73) and a C-shaped fixing ring (74).

9. A computer motherboard with active heat dissipation function according to claim 8, characterized in that: The fixing rod (71) is fixedly connected to the bottom plate (21), the mounting groove (72) is provided at the side end of the fixing rod (71), the connecting block (73) is plugged into the mounting groove (72), the C-shaped fixing ring (74) is fixedly connected to the connecting block (73), and four groups of the pipe fixing parts (7) are provided and symmetrically distributed at the side end of the shell (22).

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