Chip cleaning carrier tool

Abstract

The utility model relates to the technical field of plane detectors, and particularly discloses a chip cleaning carrier tool which comprises a tool plate. A boss is arranged on the tool plate; the boss is provided with a placing groove for horizontally placing a chip; clamping grooves are formed in the positions, on the two sides of the containing groove in the horizontal direction, of the boss. According to the scheme, after the chip is placed on the tool plate, the chip can be wiped through the dust-free cloth; meanwhile, the side edge of the chip can be clamped by clamping tools such as tweezers through the clamping groove, the tip end of the tweezers is prevented from making contact with the end face of the chip, and the problems that in an existing chip cleaning mode, due to the fact that tweezers are adopted for clamping, stability is low, and the surface of the chip is prone to being damaged are effectively solved.

Description

Technical Field

[0001] The present application relates to the field of planar detector technology, and in particular to a chip cleaning carrier tooling. Background Art

[0002] Infrared focal plane detectors have the advantages of high sensitivity, good environmental adaptability, strong anti-interference ability, light weight, and low power consumption. They are widely used in aerospace infrared remote sensing, national defense, meteorology, environment, medicine, and scientific instruments. In the field of monochrome detection, indium antimonide (InSb) focal plane detectors have obvious advantages in production cost, pixel uniformity, and consistency.

[0003] In the back thinning process of the InSb photosensitive element chip of the InSb infrared focal plane detector, the surface of the InSb photosensitive element chip needs to be kept clean after polishing. Therefore, the front and back sides of the chip need to be cleaned after polishing to remove the polishing liquid remaining on the front side of the chip and the wax attached to the back side of the chip.

[0004] The existing method for cleaning InSb photosensitive element chips is to use tweezers to clamp the chip and then wipe it with a dust-free cloth. However, the tweezers clamping method has low stability and is easy to damage the chip surface. Utility Model Content

[0005] In view of this, the purpose of the present application is to provide a chip cleaning carrier tooling to solve the problem that the existing chip cleaning method uses tweezers to clamp the chip, which has low stability and is easy to damage the chip surface.

[0006] In order to achieve the above technical objectives, the present application provides a chip cleaning carrier tool, including: a tooling plate;

[0007] The tooling plate is provided with a boss;

[0008] The boss is provided with a placement groove for horizontal placement of the chip;

[0009] The boss is provided with clamping grooves on both sides of the placement groove in the horizontal direction.

[0010] Furthermore, the groove edge of the placement groove is step-shaped.

[0011] Furthermore, a through hole is provided in the middle of the placement groove.

[0012] Furthermore, a groove is provided in the middle of the placement slot.

[0013] Furthermore, an annular groove is provided on the tooling plate at the outer periphery of the boss.

[0014] Furthermore, the tooling plate is an aluminum alloy plate.

[0015] It can be seen from the above technical solution that the present application provides a chip cleaning carrier tool, including: a tooling plate; a boss is arranged on the tooling plate; a placement groove is arranged on the boss for horizontal placement of the chip; and clamping grooves are arranged on both sides of the placement groove in the horizontal direction of the boss.

[0016] In this solution, the tooling plate can be used for placing the chip and then wiping the chip with a dust-free cloth; at the same time, the clamping groove can be used for clamping tools such as tweezers to clamp the side of the chip to prevent the tip of the tweezers from contacting the end face of the chip, effectively solving the problem of low stability and easy damage to the chip surface in the existing chip cleaning method using tweezers to clamp the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0018] Figure 1 A schematic diagram of the overall structure of a chip cleaning carrier tooling provided in an embodiment of the present application;

[0019] Figure 2 A schematic diagram of a boss of a chip cleaning carrier tooling provided in an embodiment of the present application;

[0020] Figure 3 Schematic diagram of the InSb photosensor chip provided in an embodiment of the present application. DETAILED DESCRIPTION

[0021] The technical solutions of the embodiments of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the specification of the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection requested by the present application.

[0022] In the description of the embodiments of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0023] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a replaceable connection, or an integral connection, it can be a mechanical connection, it can be an electrical connection, it can be a direct connection, it can be indirectly connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0024] See also Figure 1 and Figure 2 A chip cleaning carrier tooling provided in an embodiment of the present application includes: a tooling plate 10; a boss 20 is provided on the tooling plate 10; a placement groove 21 for horizontal placement of the chip is provided on the boss 20; and clamping grooves 22 are provided on both sides of the placement groove 21 in the horizontal direction of the boss 20.

[0025] The tooling plate can be an aluminum alloy plate. In this application, the tooling plate 20 is horizontally placed for illustration. The placement groove 21 on the boss 20 can be used for horizontal placement of the chip, which can improve the stability of the chip during cleaning compared to the method of clamping with hand-held tweezers by the staff.

[0026] The chip can be placed in the placement slot 21 manually by a staff member or can be placed after being clamped by a clamping tool such as tweezers; the chip can be taken out of the placement slot 21 by tweezers through the clamping slot 22 to clamp the side piece of the chip in the horizontal direction. The end face of the chip can be kept away from the tip of the tweezers during the chip placement process, thereby effectively preventing the end face of the chip from being scratched.

[0027] Specifically, the InSb photosensitive element chip 30 is as follows Figure 3 As shown, the back side is connected with a silicon circuit 31. When the InSb photosensitive element chip 30 is placed in the placement slot 21, the front side of the InSb photosensitive element chip 30 can be facing upwards, or the silicon circuit 31 can be facing upwards, and both sides can be wiped clean.

[0028] At the same time, if Figure 3 As shown, the silicon circuit 31 and the InSb photosensitive element chip 30 form a step-like structure. In one embodiment, the groove edge of the placement groove 21 is also step-shaped, which can allow the InSb photosensitive element chip 30 to be firmly inserted, so that the chip will not move during the chip wiping process, avoiding chip damage.

[0029] The depth of the placement groove 21 is equivalent to the thickness of the InSb photosensitive element chip 30 , and the width of the placement groove 21 is slightly larger than the width of the InSb photosensitive element chip 30 , ensuring that the InSb photosensitive element chip 30 can be placed in the placement groove 21 .

[0030] In one embodiment, a through hole 23 or a groove is disposed in the middle of the placement slot 21 .

[0031] The through hole 23 and the groove can prevent the front side of the chip from contacting the boss 20 and keep it suspended after the chip is placed in the placement groove 21 , thereby preventing the front side of the chip from contacting dust on the boss 20 .

[0032] Furthermore, an annular groove 11 is provided on the tooling plate 10 at the outer periphery of the boss 20 .

[0033] The annular groove 11 can make the upper end surface of the boss 20 further away from the tooling plate 10, thereby preventing the dust-free cloth from contacting the end surface of the tooling plate 10 and attaching dust during the chip wiping process.

[0034] The above are only preferred embodiments of the present application and are not intended to limit the present utility model. Although the present application has been described in detail with reference to the examples, those skilled in the art can still modify the technical solutions recorded in the aforementioned examples or make equivalent substitutions for some of the technical features therein. However, any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A chip cleaning carrier tool, characterized in that: include: Tooling plate (10); The tooling plate (10) is provided with a boss (20); The boss (20) is provided with a placement groove (21) for horizontal placement of the chip; The boss (20) is provided with clamping grooves (22) on both sides of the placement groove (21) in the horizontal direction.

2. The chip cleaning carrier tooling according to claim 1, characterized in that: The groove edge of the placement groove (21) is in a step shape.

3. The chip cleaning carrier tooling according to claim 1, characterized in that: A through hole (23) is provided in the middle of the placement groove (21).

4. The chip cleaning carrier tooling according to claim 1, characterized in that: A groove is provided in the middle of the placement groove (21).

5. The chip cleaning carrier tooling according to claim 1, characterized in that: An annular groove (11) is provided on the tooling plate (10) on the outer periphery of the boss (20).

6. The chip cleaning carrier tooling according to claim 1, characterized in that: The tooling plate (10) is an aluminum alloy plate.

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